Hot transfer RFID tag

Abstract

The utility model relates to a hot transfer RFID tag, and relates to the technical field of tags, the hot transfer RFID tag comprises a printed and cured release layer, a functional layer for providing an RFID function and a glue layer for connecting an attached article which are arranged in sequence, the functional layer comprises a conductive silver paste antenna, an RFID chip and chip protection oil which are arranged on the release layer, and the chip protection oil is covered on the RFID chip. As the thickness of a paper base material in a traditional label accounts for most of the thickness of the label, the film base material is used for replacing the traditional paper base material, and the release layer is peeled off after the label is subjected to hot transfer and installation, so that the label left on an attached object only comprises the release layer, the functional layer and the glue layer, and the label is convenient to use. Protrusions of the label on an attached object are greatly reduced, and the surface flatness of the attached object is better.

Description

A hot-transfer RFID tag Technical Field

[0001] This application relates to the technical field of tags, and in particular to a method for using a heat transfer RFID tag and the tag itself. Background Technology

[0002] With the development of IoT technology, paper RFID hot stamping labels have been widely used in book management, product traceability, and logistics packaging due to their advantages such as low cost and high printability. In existing technologies, the production of paper RFID hot stamping labels typically uses a paper substrate as the antenna substrate. Variable or non-variable barcode information, logo patterns, etc., are printed on one side, while the other side is printed in alignment to form the electronic tag antenna surface. This is then laminated and pressed with a PET film coated with an insulating layer to form the antenna. A chip is then bonded to the laminated antenna to form the electronic tag inlay layer. After coating the inlay surface with adhesive film, the finished product is obtained through positioning die-cutting and winding.

[0003] However, the paper RFID hot stamping labels produced by the above-mentioned production method have a noticeably raised surface due to the presence of a paper base layer, resulting in a strong tactile feel. This raised shape also affects the adhesion between the label and the surface of the item it is attached to, limiting its use in scenarios where flatness is critical. Therefore, there is an urgent need to improve the existing production method to address these issues. Summary of the Invention

[0004] In order to improve the flatness of the surface of the attached item, the purpose of this application is to provide a heat transfer RFID tag.

[0005] The hot-transfer RFID tag provided in this application adopts the following technical solution:

[0006] A heat transfer RFID tag includes a printed and cured release layer, a functional layer for providing RFID functionality, and an adhesive layer for attaching to an object, arranged sequentially. The functional layer includes a conductive silver paste antenna, an RFID chip, and a chip protective oil disposed on the release layer, with the chip protective oil covering the RFID chip.

[0007] By adopting the above technical solution, since the thickness of the paper substrate accounts for most of the thickness of the traditional label, this application uses a film substrate instead of the traditional paper substrate, and peels off the release layer after the label is hot-stamped and installed, so that the label left on the attached item is only the release layer, functional layer and adhesive layer, which greatly reduces the protrusion of the label on the attached item and makes the surface flatness of the attached item better.

[0008] Optionally, the functional layer may also include an electro-optical recognition tag disposed on the release layer.

[0009] By adopting the above technical solution, the presence of the photoelectric identification tag allows the subsequent tag to be installed on the attached item. The photoelectric identification tag can also provide positioning function for the installation of the electroplated antenna and RFID chip on the attached item, thereby effectively improving the installation positioning accuracy of the electroplated antenna and RFID chip.

[0010] Optionally, the label may also include a film substrate that needs to be peeled off during actual use.

[0011] By adopting the above technical solutions, the film substrate provides a more rigid foundation for label manufacturing during the production process, thereby improving the overall stability and positional accuracy of the label.

[0012] Optionally, the film substrate is provided with at least one set of release layer, functional layer and adhesive layer.

[0013] By adopting the above technical solution, multiple sets of conductive silver paste antennas and RFID chips can be installed on a single film substrate during production, which can effectively improve the production efficiency of tags. Although an additional slitting process is required, the overall time efficiency is still significantly higher in the case of mass production.

[0014] Optionally, the film substrate is PET film.

[0015] By adopting the above technical solutions, PET has the characteristics of low cost and easy recycling, reducing costs while ensuring label effectiveness.

[0016] Optionally, the chip protective oil is printed with UV varnish.

[0017] By adopting the above technical solution, in the actual testing process, when there is only one release layer on the PET film substrate and no UV varnish is printed, the push force test of the chip solder joint is only 1 to 2N. After UV varnish is printed, the push force test of the chip can reach 6.5 to 7N. This makes the chip less prone to breakage during subsequent heat transfer, resulting in more stable products and higher yield.

[0018] Optionally, the release layer is cured using a water-based release agent.

[0019] By adopting the above technical solution, the water-based release agent itself is easy to separate from the film substrate, making production and use convenient.

[0020] Optionally, the adhesive layer is made by air-drying hot melt adhesive.

[0021] By adopting the above technical solution, the heating and air drying method can accelerate the drying of hot melt adhesive, thereby improving the production efficiency of labels.

[0022] In summary, this application includes at least one of the following beneficial technical effects:

[0023] 1. Since the thickness of the paper substrate accounts for most of the thickness of the traditional label, this application uses a film substrate instead of the traditional paper substrate, and peels off the release layer after the label is heat-transfer and installed, so that the label left on the attached item is only the release layer, functional layer and adhesive layer, which greatly reduces the protrusion of the label on the attached item and makes the surface of the attached item smoother.

[0024] 2. With the presence of the photoelectric sensor tag, the subsequent tag is installed on the attached item. The photoelectric sensor tag can also provide positioning function for the installation of the electroplated antenna and RFID chip on the attached item, thereby effectively improving the installation positioning accuracy of the electroplated antenna and RFID chip.

[0025] 3. The film substrate provides a relatively rigid foundation for label manufacturing during the production process, thereby improving the overall stability and positional accuracy of the label. Attached Figure Description

[0026] Figure 1 is a schematic diagram of the structure of the heat transfer RFID tag according to an embodiment of this application;

[0027] Figure 2 is a schematic diagram of a structure with multiple functional layers on a thin film substrate according to an embodiment of this application;

[0028] Figure 3 is a schematic diagram of the structure of the label installed on the item according to an embodiment of this application.

[0029] In the diagram: A, label; 1, film substrate; 2, release layer; 3, functional layer; 4, adhesive layer; B, the item to be attached. Detailed Implementation

[0030] The present application will be further described in detail below with reference to Figures 1-3.

[0031] This application discloses a heat transfer RFID tag A, which is mainly used to attach to items B such as packaging boxes, especially for deplasticized digital RFID packaging boxes.

[0032] Referring to Figures 1 and 2, a heat transfer RFID tag A includes a film substrate 1, a release layer 2, a functional layer 3, and an adhesive layer 4 stacked sequentially. During mass production of tag A, the film substrate 1 may have at least one set of release layer 2, functional layer 3, and adhesive layer 4. Then, a slitting machine cuts the film substrate 1 into a state with only a single set of release layer 2, functional layer 3, and adhesive layer 4 for application on items. In this embodiment, for ease of description, the film substrate 1 is described as having only a single set of release layer 2, functional layer 3, and adhesive layer 4.

[0033] The film substrate 1 is made of PET film or other film materials with similar properties, and it exhibits good stability at at least 150°C. It should be noted that the film substrate 1 replaces the paper substrate of the traditional paper label A, not the paper layer on the packaging box used to adhere label A; that paper layer is part of the item to which the label is attached. In actual use, to reduce the protrusion of label A on the attached item B, the film substrate 1 is peeled off, leaving only a release layer 2, a functional layer 3, and an adhesive layer 4 on the attached item B.

[0034] Release layer 2 is formed by printing onto the film substrate 1 and then curing. The material forming release layer 2 is commonly referred to in the industry as a water-based release agent or water-based polyurethane resin. Release layer 2 softens easily when heated, but its other properties remain stable. When softened, release layer 2 is easier to separate from the film substrate 1.

[0035] Functional layer 3 provides RFID functionality. Specifically, functional layer 3 includes a photocell tag, a conductive silver paste antenna, an RFID chip, and chip protective oil. The photocell tag is printed onto release layer 2. The photocell tag's main purpose is to provide positioning for tag A during subsequent installation, and it also positions the conductive silver paste antenna and RFID chip. The conductive silver paste antenna is created by screen printing conductive silver paste onto release layer 2 and requires heating and curing at 100-120°C for 25-35 minutes. The RFID chip, after pre-entering the necessary information, is bound using an RFID binding machine. Chip protective oil protects functional layer 3. The chip protective oil uses UV varnish, which needs to cover the RFID chip during printing. Notably, especially when using a digital printing press, the UV varnish provides more uniform and effective protection for the printed surface.

[0036] Adhesive layer 4 is used to attach the item B. Adhesive layer 4 is formed by air-drying hot melt adhesive printed on functional layer 3. Adhesive layer 4 becomes sticky when heated to adhere label A to item B.

[0037] This application provides a method for using a heat transfer RFID tag A:

[0038] S1. Referring to Figures 1 and 2, obtain label A. Label A can be self-produced or purchased as a finished product. Taking self-production as an example, the steps include:

[0039] S11. Obtain thin film substrate 1;

[0040] S12. Set release layer 2: Print water-based release agent on film substrate 1, and the water-based release agent cures to form release layer 2;

[0041] S13, Set up functional layer 3:

[0042] S131. Print photocell tags on the cured release layer 2. The photocell tags provide positioning guidance for the conductive silver paste antenna and RFID chip, and also provide positioning guidance for the subsequent placement of the conductive silver paste antenna and RFID chip on the attached item B.

[0043] S132. Conductive silver paste is screen-printed onto the cured release layer 2 to form a conductive silver paste antenna. The release layer 2 is heated to fix the conductive silver paste antenna to the release layer 2. The heating time of the release layer 2 is 25~35 minutes and the heating temperature is 100~120℃.

[0044] S133. Bind an RFID chip onto the cured release layer 2;

[0045] S134. Use a digital printing press to print chip protective oil made of UV varnish, the chip protective oil covers the RFID chip, and then use UV light to cure the chip protective oil.

[0046] S14. Set the adhesive layer 4: Use a flexographic printing press to print hot melt adhesive on the functional layer 3. The hot melt adhesive is dried by heating and air drying to form the adhesive layer 4.

[0047] S15 (This step is only required when there are multiple functional layers 3 on the thin film substrate 1) Slit the thin film substrate 1 so that the thin film substrate 1 has only one set of conductive silver paste antenna and RFID chip.

[0048] S2. Referring to Figures 1 and 3, install label A.

[0049] S21. Positioning label A: Using a hot stamping machine to identify the electric eye mark, the position of label A and the item B to be attached is located, thereby achieving the goal of positioning label A at the target position of the item B to be attached.

[0050] S22, Pressing Label A: Using the heated hot stamping plate of the hot stamping machine, label A and the pre-positioned item B are pressed together. The adhesive layer 4 regains its tackiness due to the heating of label A, thus allowing label A to adhere to item B. At the same time, the heated release layer 2 softens, allowing the film substrate 1 to separate from the release layer 2.

[0051] S23, Recycled thin film substrate 1.

[0052] The embodiments described herein are preferred embodiments of this application and are not intended to limit the scope of protection of this application. Identical components are represented by the same reference numerals. It should be noted that the terms "front," "rear," "left," "right," "up," and "down" used in the following description refer to directions in the accompanying drawings, while the terms "inner" and "outer" refer to directions toward or away from the geometric center of a specific component. Therefore, all equivalent changes made to the structure, shape, and principle of this application should be included within the scope of protection of this application.

Claims

1. A hot transfer RFID label, characterized by The product includes a printed and cured release layer (2), a functional layer (3) for providing RFID functionality, and an adhesive layer (4) for connecting the attached item (B) in sequence. The functional layer (3) includes a conductive silver paste antenna, an RFID chip, and a chip protective oil disposed on the release layer (2), with the chip protective oil covering the RFID chip.

2. The iron-on transfer RFID tag of claim 1, wherein, The functional layer (3) also includes an electro-optical recognition mark disposed on the release layer (2).

3. The iron-on transfer RFID tag of claim 1, wherein, The label also includes a film substrate (1) that needs to be peeled off during actual use.

4. The iron-on transfer RFID tag of claim 3, wherein, The film substrate (1) is provided with at least one set of release layer (2), functional layer (3) and adhesive layer (4).

5. The iron-on transfer RFID tag of claim 3, wherein, The film substrate (1) is a PET film.

6. The iron-on transfer RFID tag of claim 1, wherein, The chip protective oil is printed with UV varnish.

7. The iron-on transfer RFID tag of claim 1, wherein, The release layer (2) is made by curing an aqueous release agent.

8. The heat transfer RFID tag according to claim 1, characterized in that, The adhesive layer (4) is made by air-drying hot melt adhesive.

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