Liquid cooling case with local enhanced heat dissipation

Abstract

The utility model relates to the field of heat dissipation of electronic components, in particular to a liquid cooling case with locally reinforced heat dissipation. Comprising an upper cold plate cover plate, an upper cold plate runner plate, a rear panel, a right side plate, a left side plate, a front panel, a lower cold plate runner plate and a lower cold plate cover plate, according to the design, the case is artificially divided into a high-power heat dissipation area and a low-power heat dissipation area by optimizing the flow channel design. The flow channel mode of the working medium is a streaming mode. A cooling working medium enters a high-power heat dissipation area, flow channels in the high-power heat dissipation area are dense, the heat dissipation area is increased, and then the local heat dissipation capacity of the high-power heat dissipation area is enhanced. And then entering a low-power heat dissipation area. Through the flow channel design, local heat dissipation of the case can be achieved, and then the heat dissipation requirements of different power board cards are met.

Description

Technical Field

[0001] This utility model relates to the field of heat dissipation of electronic components, and specifically to a liquid-cooled chassis with enhanced local heat dissipation. Background Technology

[0002] With the increasing integration and complexity of aerospace electronics, higher demands are being placed on heat dissipation devices for electronic equipment. Currently, common heat dissipation chassis systems use upper and lower cooling plates to cool the internal circuit boards. This method is effective for boards with evenly distributed heat sources, but it is difficult to meet the heat dissipation requirements of boards with uneven heat generation and large differences in heat dissipation. Utility Model Content

[0003] Utility Model Purpose

[0004] To address the aforementioned technical issues, this utility model provides a liquid-cooled chassis with enhanced local heat exchange, which can meet the heat dissipation requirements of boards with different heat dissipation power consumption. At the same time, it achieves one-time overall brazing of the chassis. This structure has good welding processability, high welding yield, and low manufacturing cost, and can meet the requirements of mass production.

[0005] Technical solution

[0006] A liquid-cooled chassis with enhanced localized heat dissipation, such as Figure 1 As shown, the device is characterized by comprising an upper cold plate cover, an upper cold plate flow channel plate, a rear panel, a right side panel, a left side panel, a front panel, a lower cold plate flow channel plate, and a lower cold plate cover. The upper cold plate cover is connected to the upper cold plate flow channel plate by brazing, and the lower cold plate flow channel plate is connected to the lower cold plate cover by brazing. Both the upper and lower cold plate flow channel plates are divided into high-power heat dissipation areas and low-power heat dissipation areas by deflectors. The flow channels in both the high-power and low-power heat dissipation areas are spiral-shaped. The right side panel and the left side panel are provided with parallel flow channels. The upper and lower ends of the left side panel are connected to the upper cold plate cover by tenon and mortise structures. The upper and lower cold plate flow channels are assembled and brazed, with the right side plate having the same connection method as the left side plate. The cooling medium enters the high-power heat dissipation zone of the upper cold plate flow channel through the inlet. Part of the upper cold plate flow channel and part of the lower cold plate flow channel are connected through the left side plate to form a spiral flow channel, which is called the high-power heat dissipation zone. The low-power heat dissipation zone is composed of the same principle as the high-power heat dissipation zone. The flow channel density of the high-power heat dissipation zone is greater than that of the low-power heat dissipation zone. The high-power heat dissipation zone and the low-power heat dissipation zone are connected through the flow channels on the upper cold plate flow channel and discharged through the outlet on the upper cold plate flow channel.

[0007] Furthermore, both the right side plate and the left side plate are provided with parallel flow channels, which are specifically circular through holes.

[0008] Furthermore, the mortise and tenon structure specifically refers to the assembly of a circular hole on the upper cold plate flow channel plate with a boss on the left side plate.

[0009] Furthermore, the high-power heat dissipation area has a flow channel depth of 10mm, a flow channel width of 6mm, and a rib width of 1.5mm.

[0010] Furthermore, the flow channel depth of the low-power heat dissipation area is 10mm, the width is 13mm, and the rib width is 2mm.

[0011] Furthermore, both the upper cold plate flow channel plate 2 and the lower cold plate flow channel plate 9 have flow-around bosses in their deflection areas.

[0012] Furthermore, the density of flow-around protrusions in the high-power heat dissipation zone is greater than that in the low-power heat dissipation zone.

[0013] The beneficial effects of this application are as follows:

[0014] This design optimizes the airflow path, artificially dividing the chassis into high-power and low-power cooling zones. The cooling fluid flows in a bypass pattern. The cooling fluid first enters the high-power cooling zone, where the denser flow path increases the heat dissipation area and enhances localized heat dissipation. It then flows into the low-power cooling zone. This airflow design enables localized cooling of the chassis, thus meeting the cooling requirements of different power boards. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0016] Figure 2 This is a schematic diagram of the working fluid flow inside the liquid cooling unit casing;

[0017] Figure 3 This is a schematic diagram of the left side panel structure;

[0018] Figure 4 This is a schematic diagram of the mortise and tenon structure of the left and right side panels;

[0019] Figure 5 This is a schematic diagram of the connection structure between the upper and lower cold plates and the left and right side plates;

[0020] Figure 1 This is a schematic diagram of the overall structure of the product in this utility model. The icons represent: 1-upper cold plate cover, 2-upper cold plate flow channel plate, 3-low heat dissipation board, 4-rear panel, 5-right side panel, 6-left side panel, 7-high heat dissipation board, 8-front panel, 9-lower cold plate flow channel plate, 10-lower cold plate flow cover. Detailed Implementation

[0021] To make the objectives, technical solutions, and advantages of this utility model clearer, the technical solutions in the embodiments of this utility model will be described in more detail below with reference to the embodiments of this utility model. In the examples, the same or similar reference numerals denote the same or similar components or elements having the same or similar functions throughout. The described embodiments are some, but not all, embodiments of this utility model. The embodiments described below with reference to the embodiments are exemplary and intended to explain this utility model, and should not be construed as limiting this utility model. All other embodiments obtained by those skilled in the art based on the embodiments of this utility model without creative effort are within the scope of protection of this utility model. The embodiments of this utility model will be described in detail below with reference to their specific implementation.

[0022] To enhance heat exchange in specific areas of the chassis, the liquid flow divides the chassis into left and right sections: the left side is a high-heat-dissipation area, and the right side is a low-heat-dissipation area. The initial inlet liquid temperature is low. Through the flow channel design, the high-heat-dissipation area on the left side of the chassis is first cooled by a spiral flow, and then the low-heat-dissipation area on the right side is cooled by the same spiral flow.

[0023] To enhance heat exchange on the left side of the chassis, the flow channels on the left side of the upper and lower cold plates were densified to increase the secondary heat exchange area. The flow channel depth on the left side of the upper and lower cold plates is 10mm, the channel width is 6mm, and the rib width is 1.5mm. The flow channels on the right side of the upper and lower cold plates have a channel depth of 10mm, a width of 13mm, and a rib width of 2mm. Figure 2 As shown, the left side of the liquid-cooled chassis's cold plate is where high-thermal-power (TDP) circuit boards are installed, with a quantity of 8 boards and a heat load of 1000W. The right side of the liquid-cooled chassis's cold plate is where low-TDP circuit boards are installed, with a quantity of 10 boards and a heat load of 500W.

[0024] To enhance heat exchange in the left side of the chassis, the internal liquid first circulates in a spiral pattern around eight high-heat-dissipation circuit boards in the left side area for cooling. For example... Figure 2 As shown, the liquid first enters the left side of the upper cooling plate, then flows through the side plate to the left side of the lower cooling plate for circulation, then enters the side plate again, and finally flows back to the left side of the upper cooling plate for the next stage of circulation. After the high heat dissipation board area on the left side of the chassis is cooled, the liquid enters the right side of the chassis through the upper cooling plate for cooling, and the circulation pattern is the same as on the left side, finally flowing out through the upper cooling plate.

[0025] Both the left and right side panels of the chassis have circular perforated channels that run through the entire side panel. The circular perforated channels on the left and right side panels are all centered on the rectangular channels of the upper and lower cooling plates, and each rectangular channel on the upper and lower cooling plates corresponds one-to-one with the left and right side panels of the chassis.

[0026] To achieve a one-time integral brazing of the chassis, the upper and lower cold plates and the left side plate of the chassis are designed to be connected by a mortise and tenon structure with an insertion depth of not less than 2mm.

[0027] There are many other methods for localized enhanced heat dissipation, including but not limited to placing fins in the high heat dissipation area on the left side of the chassis, such as rectangular serrated fins, rectangular straight-through fins, and triangular fins. This case uses a denser local flow channel to increase the secondary heat dissipation area to achieve enhanced heat transfer.

[0028] First, the upper cold plate flow channel plate 3 and the lower flow channel plate 9 of the chassis are machined. The flow channel depth on the left side of the upper and lower cold plates is 10mm, the flow channel width is 6mm, and the rib width is 1.5mm. The flow channel on the right side of the upper and lower cold plates has a channel depth of 10mm, a width of 13mm, and a rib width of 2mm. The flow channel plate mounting surface is machined in one step, leaving a 2mm machining allowance on all four sides of the flow channel plate. After the chassis is brazed as a whole, the chassis is then machined around its perimeter.

[0029] The upper cold plate flow channel plate 3 has a turbulence platform at the liquid inlet, with dimensions of 6mm*2mm*10. After being turbulent, the liquid flows evenly into the cold plate, then flows through the left side plate into the lower flow channel plate 9, flows through the lower cold plate and enters the left side plate, and then flows back to the upper cold plate, thus repeating the cycle.

[0030] The liquid cooling inlet and outlet connectors of the chassis are all located in the middle area of ​​the upper cold plate. They adopt an integrated design. Before brazing, the inlet and outlet are machined into 6mm diameter holes. After the entire chassis is brazed, the inlet and outlet holes are enlarged to ensure the accuracy of the inlet and outlet hole positions.

[0031] like Figure 5 As shown, the left and right side panels and the upper and lower cold plates are brazed using a tenon and mortise structure. To ensure the airtightness of the weld, the weld thickness on each side is no less than 3mm. In this case, the height of the cylindrical tenon inserted into the side panel is 2mm, the diameter of the inner channel is 4mm, and the wall thickness of the cylindrical tenon is 2mm. The overlap weld surface between the side panel and the upper and lower cold plates is 3mm. During welding, solder is applied to the welding surfaces of the upper and lower cold plates and the joints between the left and right side panels and the cold plates for welding. After welding, the chassis is precision machined.

[0032] Working principle:

[0033] This chassis utilizes a flow channel design that creates a spiral flow pattern, first cooling the high-power boards and then the low-power boards, thus achieving localized enhanced cooling. The coolant first enters the high-power area of ​​the upper cooling plate, then flows through the side plate to the high-power area of ​​the lower cooling plate, repeating the spiral flow. Finally, the coolant flows through the upper cooling plate to the low-power boards for cooling, following the same flow pattern, and ultimately exits from the upper cooling plate outlet.

[0034] It will be understood by those skilled in the art that, unless otherwise defined, all terms used herein (including technical and scientific terms) have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. It should also be understood that terms such as those defined in general dictionaries should be understood to have the same meaning as in the context of the prior art, and should not be interpreted in an idealized or overly formal sense unless defined as herein. The specific embodiments described above further illustrate the purpose, technical solution, and beneficial effects of this invention. It should be understood that the above descriptions are merely specific embodiments of this invention and are not intended to limit this invention. Within the spirit and principles of this invention, any person skilled in the art may modify or alter the disclosed technical content to create equivalent embodiments applicable to other fields. However, any simple modifications, equivalent changes, alterations, modifications, equivalent substitutions, improvements, etc., made to the above embodiments based on the technical essence of this invention without departing from the content of the technical solution of this invention should be included within the protection scope of this invention.

Claims

1. A liquid-cooled chassis with locally enhanced heat dissipation, characterized in that, The system includes an upper cold plate cover, an upper cold plate flow channel plate, a rear panel, a right side panel, a left side panel, a front panel, a lower cold plate flow channel plate, and a lower cold plate cover. The upper cold plate cover is connected to the upper cold plate flow channel plate by brazing, and the lower cold plate flow channel plate is connected to the lower cold plate cover by brazing. Both the upper and lower cold plate flow channel plates are divided into high-power heat dissipation areas and low-power heat dissipation areas by deflectors. The flow channels in both the high-power and low-power heat dissipation areas are spiral-shaped. The right side panel and the left side panel both have parallel flow channels. The upper and lower ends of the left side panel are connected to the upper cold plate flow channel plate by tenon and mortise structures. The lower cold plate flow channel is assembled and brazed, and the connection method of the right side plate is the same as that of the left side plate. The cooling medium enters the high-power heat dissipation area of ​​the upper cold plate flow channel through the inlet. Part of the upper cold plate flow channel and part of the lower cold plate flow channel are connected through the left side plate to form a spiral flow channel, which is called the high-power heat dissipation area. The low-power heat dissipation area is composed of the same principle as the high-power heat dissipation area. The flow channel density of the high-power heat dissipation area is greater than that of the low-power heat dissipation area. The high-power heat dissipation area and the low-power heat dissipation area are connected through the flow channel on the upper cold plate flow channel and discharged through the outlet on the upper cold plate flow channel.

2. The chassis as described in claim 1, characterized in that, Both the right side plate and the left side plate are provided with parallel flow channels, which are specifically circular through holes.

3. The chassis as described in claim 2, characterized in that, The mortise and tenon structure specifically refers to the assembly of a circular hole on the upper cold plate flow channel and a boss on the left side plate.

4. The cabinet of claim 3, wherein, The high-power heat dissipation area has a flow channel depth of 10mm, a flow channel width of 6mm, and a rib width of 1.5mm.

5. The chassis as described in claim 4, characterized in that, The flow channel depth of the low-power heat dissipation area is 10mm, the width is 13mm, and the rib width is 2mm.

6. The cabinet of claim 5, wherein, Both the upper and lower cold plate flow channels are equipped with flow-around bosses in their deflection areas.

7. The cabinet of claim 6, wherein, The density of flow-around protrusions in the high-power heat dissipation zone is greater than that in the low-power heat dissipation zone.

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