Silicon wafer processing carrier capable of accurately positioning

Abstract

The utility model relates to the technical field of silicon wafer processing, in particular to a silicon wafer processing carrier capable of accurately positioning, which comprises a placing plate. The device further comprises positioning assemblies and an auxiliary assembly, the positioning assemblies are slidably connected to the left side and the right side of the top end of the containing plate, the auxiliary assembly is movably connected to the middle position in the containing plate, each positioning assembly comprises a sliding groove, the sliding grooves are oppositely formed in the top end of the containing plate, and sliding ways are installed at the bottom ends of the sliding grooves and arranged in the containing plate. Rolling wheels are slidably connected into the sliding ways. When the rollers slide on the slide ways, the limiting blocks can be driven to horizontally move, so that the silicon wafer clamping device is convenient to adapt to silicon wafers with different sizes and specifications, the silicon wafers can be clamped and disassembled, the replacement time of the silicon wafers among different processing procedures is greatly shortened, the production efficiency is improved, meanwhile, the silicon wafers are uniformly stressed in the processing process, and the service life of the silicon wafers is prolonged. And deformation of the silicon wafer caused by overlarge local stress is avoided.

Description

Technical Field

[0001] This utility model relates to the field of silicon wafer processing technology, and in particular to a silicon wafer processing carrier that can be precisely positioned. Background Technology

[0002] As a key basic material for semiconductor manufacturing, the processing precision of silicon wafers directly affects the performance and yield of semiconductor devices. In the silicon wafer processing process, such as cutting, grinding, and photolithography, carriers are required to accurately position and stably clamp the silicon wafers to ensure the accuracy and consistency of the processing.

[0003] Existing silicon wafer processing carriers lack positioning devices, and most of them place the silicon wafers directly on the surface, which cannot accurately limit the position of the silicon wafers. This not only increases the difficulty and time cost of operation, but may also lead to accelerated wear and tear of the equipment due to frequent adjustments, reducing the service life of the equipment. In addition, the silicon wafers are prone to displacement or shaking under the action of external forces, which seriously affects the quality of the final product.

[0004] Therefore, in response to the problem that the aforementioned silicon wafer processing carrier lacks a positioning device, and the silicon wafer is prone to displacement or shaking under external force, which seriously affects the quality of the final product, a silicon wafer processing carrier with precise positioning can be designed. Utility Model Content

[0005] To overcome the problem that silicon wafers are prone to displacement or shaking under external force due to the lack of positioning devices in silicon wafer processing carriers, which seriously affects the quality of the final product.

[0006] The technical solution of this utility model is as follows: a silicon wafer processing carrier that can be precisely positioned includes a placement plate; it also includes a positioning component and an auxiliary component. The positioning components are slidably connected to the left and right sides of the top of the placement plate, and the auxiliary component is movably connected to the middle position inside the placement plate. The positioning component includes a slide groove, which is opened inside the top of the placement plate. A slide rail is installed at the bottom of the slide groove and is located inside the placement plate. A roller is slidably connected inside the slide rail.

[0007] Preferably, the roller slides in the slide rail, causing the limiting blocks to move closer to each other, so that the limiting blocks and the two sides of the silicon wafer abut against each other, and the fixing groove is engaged with the two sides of the silicon wafer to limit and fix the silicon wafer.

[0008] Preferably, the roller is fitted with a side lug facing away from the other side, and a base plate is provided at the top of the side lug, with the base plate sliding on the surface of the placement plate.

[0009] Preferably, a fixing seat is provided at the middle position of the top of the base plate, and a connecting rod is connected between the fixing seats.

[0010] Preferably, a limiting block is slidably connected to the outer side of the connecting rod, and the limiting block slides on the surface of the placement plate, with a fixing groove provided on the surface of the limiting block on the opposite side.

[0011] Preferably, the auxiliary component includes a circular fixing plate, which is movably connected to the interior of the placement plate. The bottom end of the circular fixing plate is provided with an electric telescopic rod, which is located at the bottom end inside the placement plate.

[0012] Preferably, the circular fixing plate has grooves symmetrically formed at its center, and a movable block is movably connected inside the grooves. A limit groove is formed at the bottom inside the movable block.

[0013] Preferably, the movable block has a screw installed inside, and a pressing plate is slidably connected to the outside of the screw, with the telescopic end of the pressing plate made of rubber.

[0014] The beneficial effects of this utility model are as follows: When the roller slides on the slide rail, it can drive the limiting block to move horizontally, which is convenient to adapt to silicon wafers of different sizes and specifications, and realizes the clamping and disassembly of silicon wafers, greatly shortening the changeover time between different processing steps and improving production efficiency. At the same time, it ensures that the silicon wafer is subjected to uniform force during processing, avoiding deformation of the silicon wafer due to excessive local force. The limiting block can apply appropriate pressure to the edge or specific position of the silicon wafer, ensuring that the silicon wafer remains flat throughout the entire processing process and improving the processing quality of the silicon wafer. Attached Figure Description

[0015] Figure 1 The diagram shown is a first three-dimensional structural schematic of the silicon wafer processing carrier that can be precisely positioned according to this utility model.

[0016] Figure 2 The diagram shown is a three-dimensional cross-sectional view of the silicon wafer processing carrier that can be precisely positioned according to this utility model.

[0017] Figure 3 The diagram shown is a three-dimensional cross-sectional view of the auxiliary components in the silicon wafer processing carrier that can be precisely positioned according to this utility model.

[0018] Figure 4 The diagram shown is a three-dimensional cross-sectional view of the positioning component in the silicon wafer processing carrier that can be precisely positioned according to this utility model.

[0019] Figure 5 This invention presents a silicon wafer processing carrier capable of precise positioning. Figure 1 Schematic diagram of the three-dimensional structure of part A in the middle.

[0020] Explanation of reference numerals in the attached drawings: 1. Placement plate; 201. Slide groove; 202. Slide track; 203. Roller; 204. Side lug; 205. Base plate; 206. Fixing seat; 207. Connecting rod; 208. Limiting block; 209. Fixing groove; 301. Circular fixing plate; 302. Electric telescopic rod; 303. Groove; 304. Movable block; 305. Limiting groove; 306. Screw; 307. Pressing plate. Detailed Implementation

[0021] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0022] Please see Figures 1-5 This utility model provides an embodiment: a silicon wafer processing carrier with precise positioning, including a placement plate 1; it also includes a positioning component and an auxiliary component. The positioning component is slidably connected to the left and right sides of the top of the placement plate 1, and the auxiliary component is movably connected to the middle position inside the placement plate 1. The positioning component includes a slide groove 201, which is opened inside the top of the placement plate 1. A slide rail 202 is installed at the bottom of the slide groove 201 and is disposed inside the placement plate 1. A roller 203 is slidably connected inside the slide rail 202.

[0023] Please see Figures 3-4 In this embodiment, a side ear 204 is installed on the back side of the roller 203, and a base plate 205 is provided at the top of the side ear 204. The base plate 205 slides on the surface of the placement plate 1. A fixing seat 206 is provided at the middle position of the top of the base plate 205. A connecting rod 207 is connected between the fixing seats 206. A limiting block 208 is slidably connected to the outside of the connecting rod 207. The limiting block 208 slides on the surface of the placement plate 1. A fixing groove 209 is opened on the surface of the limiting block 208 on the opposite side. The spacing between the limiting blocks 208 is adjusted according to the size of the silicon wafer. The roller 203 slides in the slide 202, which drives the limiting blocks 208 to move closer to each other, so that the limiting blocks 208 and the two sides of the silicon wafer abut against each other. The fixing groove 209 is engaged with the two sides of the silicon wafer to limit and fix the silicon wafer. The carrier is placed on the processing device to perform processing operations on the silicon wafer.

[0024] Please see Figure 2 , Figure 5In this embodiment, the auxiliary component includes a circular fixing plate 301, which is movably connected to the interior of the placement plate 1. An electric telescopic rod 302 is provided at the bottom end of the circular fixing plate 301, and the electric telescopic rod 302 is located at the bottom end inside the placement plate 1. A groove 303 is symmetrically formed at the center of the interior of the circular fixing plate 301. A movable block 304 is movably connected inside the groove 303. A limiting groove 305 is formed at the lower part of the interior of the movable block 304. The interior of the movable block 304 is relatively... A screw 306 is provided, and a pressing plate 307 is slidably connected to the outside of the screw 306. The telescopic end of the pressing plate 307 is made of rubber. When the electric telescopic rod 302 is activated, the circular fixing plate 301 is pushed upward, and the movable block 304 rises upward. The circular silicon wafer is engaged in the limiting groove 305 for initial positioning. The pressing plate 307 is slid downward according to the specifications of the silicon wafer, so that the pressing plate 307 slides on the screw 306 to fix the silicon wafer a second time, thereby improving the positioning stability of the silicon wafer.

[0025] During operation, a square silicon wafer is placed on the surface of the placement plate 1. The spacing between the limiting blocks 208 is adjusted according to the size of the silicon wafer. The roller 203 slides in the slide rail 202, causing the limiting blocks 208 to move closer to each other, so that the limiting blocks 208 and the two sides of the silicon wafer abut against each other. The fixing groove 209 is engaged with the two sides of the silicon wafer to limit and fix the silicon wafer. The carrier is placed on the processing device to process the silicon wafer. When it is necessary to clamp and limit the circular silicon wafer, the electric telescopic rod 302 is activated to push the circular fixing plate 301 upward. At the same time, the movable block 304 rises upward, and the circular silicon wafer is engaged in the limiting groove 305 for initial limiting and placement. According to the size of the silicon wafer, the pressing plate 307 is slid downward, so that the pressing plate 307 slides on the screw 306 to fix the silicon wafer a second time, thereby improving the positioning stability of the silicon wafer.

[0026] Through the above steps, when the roller 203 slides on the slide rail 202, it can drive the limiting block 208 to move horizontally. After the limiting block 208 limits and fixes the silicon wafer, it can enhance the stability of the silicon wafer, making it better resist these external force interferences, and prevent the silicon wafer from shifting or shaking during processing. At the same time, it can make the silicon wafer be subjected to uniform force during processing, and avoid deformation of the silicon wafer due to excessive local force. The limiting block 208 can apply appropriate pressure to the edge or specific position of the silicon wafer, ensuring that the silicon wafer remains flat throughout the entire processing process, thus improving the processing quality of the silicon wafer. This solves the problem that the silicon wafer processing carrier lacks a positioning device, and the silicon wafer is prone to shifting or shaking under the action of external force, which seriously affects the quality of the final product.

[0027] The embodiments of the present invention have been described in detail above with reference to the accompanying drawings. However, the present invention is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of the present invention.

Claims

1. A silicon wafer processing carrier capable of precise positioning, comprising a placement plate (1); characterized in that: It also includes positioning components and auxiliary components. Positioning components are slidably connected to the left and right sides of the top of the placement plate (1). An auxiliary component is movably connected to the middle position inside the placement plate (1). The positioning components include a slide groove (201). The slide groove (201) is opened inside the top of the placement plate (1). A slide rail (202) is installed at the bottom of the slide groove (201). The slide rail (202) is located inside the placement plate (1). A roller (203) is slidably connected inside the slide rail (202).

2. The silicon wafer processing carrier capable of precise positioning according to claim 1, characterized in that: The roller (203) has a side lug (204) mounted on one side facing away from the roller. The top of the side lug (204) is provided with a base plate (205), and the base plate (205) slides on the surface of the placement plate (1).

3. The silicon wafer processing carrier capable of precise positioning according to claim 2, characterized in that: A fixing seat (206) is provided at the middle position of the top of the base plate (205), and a connecting rod (207) is connected between the fixing seats (206).

4. The silicon wafer processing carrier capable of precise positioning according to claim 3, characterized in that: A limiting block (208) is slidably connected to the outside of the connecting rod (207), and the limiting block (208) slides on the surface of the placement plate (1). A fixing groove (209) is provided on the surface of the limiting block (208) on the opposite side.

5. The silicon wafer processing carrier capable of precise positioning according to claim 1, characterized in that: The auxiliary components include a circular fixing plate (301), which is movably connected to the interior of the placement plate (1). An electric telescopic rod (302) is provided at the bottom end of the circular fixing plate (301), and the electric telescopic rod (302) is located at the bottom end inside the placement plate (1).

6. The silicon wafer processing carrier capable of precise positioning according to claim 5, characterized in that: The circular fixing plate (301) has a groove (303) symmetrically opened in the center of the interior. The groove (303) is movably connected to a movable block (304). A limit groove (305) is opened in the lower part of the movable block (304).

7. The silicon wafer processing carrier capable of precise positioning according to claim 6, characterized in that: The movable block (304) has a screw (306) arranged inside it, and a pressing plate (307) is slidably connected to the outside of the screw (306), and the telescopic end of the pressing plate (307) is made of rubber.

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