Plastic package device with NTC (Negative Temperature Coefficient)

Abstract

The name of the utility model is a plastic package device with NTC. Belongs to the technical field of plastic package device manufacturing. The plastic package device mainly solves the problem that the existing plastic package device is not provided with temperature protection and is easy to damage due to overheating in the use process. The utility model is mainly characterized by comprising a frame, frame pins connected with the frame, a chip and an NTC (Negative Temperature Coefficient) resistor which are arranged on the frame, and a plastic package body for packaging the frame, the chip, the NTC resistor and part of the frame pins, wherein the chip is electrically connected with the frame pins through metal wires; the NTC resistor is arranged on the frame, the frame pins comprise resistor frame pins corresponding to the NTC resistor, and the NTC resistor is electrically connected with the resistor frame pins through metal wires. The over-temperature protection circuit has the characteristics of carrying out temperature detection and over-temperature control on a device in real time and realizing over-temperature protection on a product and a used circuit, and is mainly used for plastic package devices.

Description

Technical Field

[0001] This utility model belongs to the field of plastic encapsulation device manufacturing technology, specifically relating to the design and packaging of a plastic encapsulation device with NTC. Background Technology

[0002] Traditional plastic-encapsulated devices typically consist of a frame, chip, molded body, aluminum wire, and solder, lacking internal NTC resistors for temperature control. During use, these devices generate heat; continuing operation beyond the chip junction temperature can lead to overload. If the circuit load current is high, this can cause a rapid temperature rise and damage the device, potentially even resulting in circuit board burnout or explosion. Utility Model Content

[0003] The purpose of this invention is to provide a simple yet reliable and practical plastic-encapsulated power device package to address the aforementioned shortcomings.

[0004] The technical solution of this utility model is: a plastic-encapsulated device with NTC, including a frame and frame pins connected to the frame, a chip disposed on the frame, and a plastic encapsulation body that encapsulates the frame, chip, NTC resistor and part of the frame pins, wherein the chip and the frame pins are electrically connected by a metal wire, characterized in that: it also includes an NTC resistor; the NTC resistor is disposed on the frame, the frame pins include resistor frame pins corresponding to the NTC resistor, and the NTC resistor and the resistor frame pins are electrically connected by a metal wire.

[0005] The NTC resistor described in the technical solution of this utility model is an NTC resistor with a negative temperature coefficient.

[0006] The NTC resistor described in the technical solution of this utility model is a surface mount structure, with the lower surface being the surface for soldering and the upper surface being the surface for aluminum wire bonding.

[0007] In the technical solution of this utility model, the bottom surface of the NTC resistor is soldered onto the frame, and the top surface is led out to the resistor frame pins via metal wires.

[0008] In the technical solution of this utility model, the frame, chip, and NTC resistor are connected by soldering; the chip, NTC resistor, and frame pins are connected by ultrasonic bonding with metal wires.

[0009] The metal wire described in the technical solution of this utility model is an aluminum wire.

[0010] The frame described in the technical solution of this utility model is formed by machining.

[0011] The wire diameter of the metal wire described in the technical solution of this utility model is 12-20 mil.

[0012] The encapsulation body described in the technical solution of this utility model is made of epoxy resin material.

[0013] The advantages of this invention are: the product has a built-in negative temperature coefficient NTC resistor, which can perform real-time temperature detection and over-temperature control. When the internal temperature rises during product use, the resistance value of the NTC resistor decreases with the temperature increase. The external protection circuit can promptly issue an early warning or disconnect based on the change in the NTC resistance value, thus achieving over-temperature protection for the product and the circuit in use.

[0014] This invention is mainly used for plastic-encapsulated devices. Attached Figure Description

[0015] Figure 1 This is the main structural view of this utility model.

[0016] Figure 2 This is a left view of the structure of this utility model.

[0017] In the diagram: 1-Frame; 2-Chip; 3-NTC resistor; 4-Aluminum wire; 5-Plastic package; 6-Solder; 7-Frame pins. Detailed Implementation

[0018] The embodiments of this utility model will now be described in full with reference to the accompanying drawings. Obviously, the described embodiments are merely some, not all, of the embodiments of this utility model. Any other embodiments based on the embodiments of this utility model, obtained by those skilled in the art without inventive effort, are within the scope of protection of this utility model.

[0019] The following examples illustrate the implementation of this utility model.

[0020] like Figure 1 As shown, one embodiment of this utility model is a plastic-encapsulated device with NTC, which consists of a frame 1, frame pins 7, chip 2, NTC resistor 3, aluminum wire 4, solder 6 and plastic encapsulation body 5.

[0021] Except for the mounting positions for chip 2 and NTC resistor 3, frame 1 is the same as the existing frame. Frame pin 7 has one more resistor frame pin than the existing frame, including four pins arranged side by side, which are fixedly connected to one of the longitudinal ends of frame 1.

[0022] Chip 2 is mounted on the left side of frame 1, and chip 2 is connected to frame 1 by soldering. Chip 2 is electrically connected to the leftmost pin and the rightmost pin of frame pin 7 via aluminum wire 4.

[0023] NTC resistor 3 is a surface-mount device with a lower surface for soldering and an upper surface for aluminum wire bonding. The mounting position for NTC resistor 3 is located on the right side of frame 1, and NTC resistor 3 is connected to frame 1 by soldering. NTC resistor 3 is electrically connected to the rightmost pin of frame pin 7 (i.e., the resistor frame pin) via aluminum wire 4.

[0024] The molding compound 5 encapsulates the frame 1, chip 2, NTC resistor 3, and some of the frame pins 7.

[0025] The device in this utility model is first processed and shaped according to the design requirements of the frame 1, the chip 2 and NTC resistor 3 are soldered onto the frame 1, the chip 2 and NTC resistor 3 are internally bonded to the frame pins 7 by aluminum wire 4, and finally encapsulated and cured to complete the encapsulation.

[0026] Frame 1 is formed by machining.

[0027] Frame 1 is connected to chip 2 and NTC resistor 3 by soldering with solder 6. During the soldering process, nitrogen and hydrogen gas protection is required to prevent oxidation of chip 2, NTC resistor 3, or frame 1. If chip 2 or frame 1 is contaminated during the process, plasma cleaning is required before molding.

[0028] Chip 2 and NTC resistor 3 are connected by aluminum wire 4 via ultrasonic bonding. Typically, 12-20 mil diameter aluminum wire is used, and the number of aluminum wires is 1-4.

[0029] The molding compound 4 is made of epoxy resin, which is mainly used to protect important components such as chips from external environmental corrosion and to achieve insulation between the pins.

[0030] The above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model in any way. Therefore, any modifications, equivalent substitutions, equivalent changes, and alterations made to the above embodiments based on the technical essence of this utility model without departing from its scope shall still fall within the protection scope of this utility model.

Claims

1. A plastic-encapsulated device with NTC, comprising a frame (1) and frame pins (7) connected to the frame (1), a chip (2) disposed on the frame (1), and a plastic encapsulation body (5) encapsulating the frame (1), the chip (2) and part of the frame pins (7), wherein the chip (2) is electrically connected to the frame pins (7) via a metal wire, characterized in that: It also includes an NTC resistor (3) with a negative temperature coefficient; the NTC resistor (3) is disposed on the frame (1), the frame pin (7) includes four pins arranged side by side, including the resistor frame pin corresponding to the NTC resistor (3), the NTC resistor (3) and the resistor frame pin are electrically connected by a metal wire; the NTC resistor (3) is a surface mount structure, the lower surface is a surface for soldering, and the upper surface is a surface for aluminum wire bonding.

2. The plastic-encapsulated device with NTC according to claim 1, characterized in that: The NTC resistor (3) is soldered to the frame (1) on its lower surface and led out to the resistor frame pins by a metal wire on its upper surface.

3. A plastic-encapsulated device with NTC according to claim 1 or 2, characterized in that: The frame (1) is connected to the chip (2) and the NTC resistor (3) by soldering with solder (6); the chip (2) and the NTC resistor (3) are connected to the frame pins (7) by ultrasonic bonding with metal wire.

4. A plastic-encapsulated device with NTC according to claim 1 or 2, characterized in that: The metal wire is aluminum wire (4).

5. A plastic-encapsulated device with NTC according to claim 3, characterized in that: The metal wire is aluminum wire (4).

6. A plastic-encapsulated device with NTC according to claim 1, 2 or 5, characterized in that: The frame (1) is formed by machining.

7. A plastic-encapsulated device with NTC according to claim 1, 2 or 5, characterized in that: The diameter of the metal wire is 12-20 mil.

8. A plastic-encapsulated device with NTC according to claim 1, 2 or 5, characterized in that: The encapsulation body (5) is made of epoxy resin.

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