Dispensing machine with anti-solidification function for semiconductor chip packaging

Abstract

The utility model relates to the technical field of semiconductor packaging, and discloses a semiconductor chip packaging glue dispenser with an anti-solidification function, which comprises a glue storage barrel, the bottom end of the glue storage barrel is hermetically communicated with a glue dispensing pump, the outlet end of the glue dispensing pump is connected with a glue conveying pipe through a flange, and one end, far away from the glue dispensing pump, of the glue conveying pipe is connected with a glue dispensing head. According to the dispensing machine with the anti-solidification function for semiconductor chip packaging, efficient anti-sticking and precise temperature control in the glue liquid conveying process are achieved through the synergistic effect of the ceramic heating piece arranged on the inner wall of the glue conveying pipe and the Teflon coating, local overheating is avoided through the PTC self-temperature-limiting characteristic of the ceramic heating piece, and by combining efficient heat preservation of the nano aerogel felt, the anti-solidification function is achieved. The temperature fluctuation of the glue solution in the conveying process is effectively reduced, the residual rate of the glue solution is reduced due to the ultra-low surface energy and mirror surface smoothness of the Teflon coating, the pipeline blockage risk caused by glue solution curing is remarkably reduced, and the stable operation of semiconductor wafer packaging and dispensing is ensured.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor packaging technology, specifically to a dispensing machine for semiconductor wafer packaging with anti-solidification function. Background Technology

[0002] In semiconductor wafer packaging processes, dispensing is a crucial step in achieving chip fixation, electrical connection, and protection. As semiconductor devices develop towards miniaturization and high precision, higher requirements are placed on the accuracy, stability, and fluidity of the dispensing solution.

[0003] The existing patent document CN217797085U provides a semiconductor packaging dispensing machine. This utility model uses a vacuum pump to extract the air from the vacuum glue tank, which facilitates vacuum mixing of the glue by the stirring blades. This helps to mix the glue evenly and prevents the glue from coming into contact with air during the mixing process, thus avoiding the formation of air bubbles. Combined with the electric heating rod, the glue is heated evenly during mixing, which helps to improve the heating efficiency of the glue.

[0004] However, existing dispensing machines for semiconductor wafer packaging have significant deficiencies in adhesive temperature control and delivery. Most existing equipment temperature control systems only locally heat the adhesive storage tank, neglecting the temperature control of the dispensing pipeline. This results in a significant temperature drop in the adhesive during delivery due to the low ambient temperature. When operating at low temperatures, the adhesive temperature can drop by 8-12°C, reducing its fluidity and directly causing dispensing defects such as stringing and adhesive breakage. This seriously affects the airtightness and product yield of semiconductor wafer packaging. At the same time, the dispensing pipelines of traditional dispensing machines are mostly made of ordinary stainless steel or rubber, which have high inner wall roughness, making it easy for the adhesive to adhere and solidify. As the usage time increases, adhesive residue gradually accumulates, frequently causing pipeline blockage problems. This requires frequent shutdowns for cleaning and maintenance, greatly affecting production efficiency and continuity. Utility Model Content

[0005] (a) Technical problems to be solved

[0006] The purpose of this invention is to provide a dispensing machine for semiconductor wafer packaging with anti-coagulation function, so as to solve the problems mentioned in the background art regarding the defects of existing dispensing machines for semiconductor wafer packaging in terms of adhesive temperature control and delivery.

[0007] (II) Technical Solution

[0008] To achieve the above objectives, the present invention provides the following technical solution: a dispensing machine for semiconductor wafer packaging with anti-coagulation function, comprising a glue storage cylinder, the bottom end of which is sealed and connected to a dispensing pump, the outlet end of which is connected to a glue delivery pipe via a flange, and the end of the glue delivery pipe away from the dispensing pump is connected to a dispensing head.

[0009] The inner wall of the dispensing tube is fixedly provided with a nano-aerogel felt, and a ceramic heating element is provided on the inner side of the nano-aerogel felt. The inner side of the ceramic heating element is coated with a Teflon coating.

[0010] Furthermore, the nano-aerogel felt is closely attached to the inner wall of the glue delivery tube to provide thermal insulation for the ceramic heating element. The ceramic heating element is evenly distributed along the axial direction of the glue delivery tube to heat the glue liquid inside the tube.

[0011] Furthermore, a sealing cap is detachably connected to the top of the glue storage cylinder via a sealing ring, and a stirring motor is fixedly installed in the middle of the upper surface of the glue storage cylinder.

[0012] Furthermore, the output shaft of the stirring motor is coaxially connected to a stainless steel stirring shaft via a coupling, and the stirring shaft has a hollow structure and a built-in heating rod.

[0013] Furthermore, the outer surface of the stirring shaft is provided with stirring blades, the stirring blades are embedded with through-type copper heat-conducting rods, and the outer surface of the stirring shaft is provided with spiral blades below the stirring blades.

[0014] Furthermore, the heat generated by the heating rod is conducted to the stirring blades through the stirring shaft and the heat-conducting rod to provide auxiliary heating for the adhesive liquid.

[0015] Furthermore, an annular heating element is embedded circumferentially in the inner wall of the gel storage cylinder, and an insulation plate is wrapped around the outside of the annular heating element. The insulation plate is made of alumina fiber and aerogel composite.

[0016] Compared with the prior art, the beneficial effects of this utility model are:

[0017] 1. This semiconductor wafer packaging dispensing machine with anti-coagulation function achieves efficient anti-sticking and precise temperature control during the glue delivery process through the synergistic effect of the ceramic heating element and Teflon coating installed on the inner wall of the glue delivery tube. The PTC self-limiting temperature characteristic of the ceramic heating element avoids local overheating, and combined with the efficient heat preservation of the nano aerogel felt, it effectively reduces the temperature fluctuation of the glue during the delivery process. The ultra-low surface energy and mirror finish of the Teflon coating reduce the glue residue rate, significantly reducing the risk of pipeline blockage caused by glue curing, and ensuring the stable dispensing of semiconductor wafer packaging.

[0018] 2. This semiconductor wafer packaging dispensing machine with anti-coagulation function achieves uniform heat exchange during the glue storage stage through a dual heating system consisting of a heating rod built into the stirring shaft and an annular heating plate on the inner wall of the glue storage tank. The heat from the heating rod is conducted to the surface of the stirring blades through a copper heat-conducting rod. Combined with the axial flow guiding effect of the spiral blades, the temperature gradient inside the glue storage tank is less than 2°C. The radiant heating of the annular heating plate and the forced convection of the stirring system effectively prevent the glue from depositing and coagulating at the bottom of the glue storage tank, ensuring the fluidity of high-viscosity glue. Attached Figure Description

[0019] Figure 1 This is a three-dimensional structural diagram of the present invention;

[0020] Figure 2 This is a three-dimensional structural diagram of the glue delivery tube of this utility model;

[0021] Figure 3 This is a three-dimensional structural diagram of the glue storage cylinder of this utility model;

[0022] Figure 4 This is a magnified structural diagram showing a partial detail of the stirring shaft of this utility model.

[0023] In the diagram: 1. Glue storage tank; 2. Glue dispensing pump; 3. Glue delivery pipe; 4. Glue dispensing head; 5. Nano aerogel felt; 6. Ceramic heating element; 7. Teflon coating; 8. Sealing cap; 9. Stirring motor; 10. Stirring shaft; 11. Heating rod; 12. Stirring blade; 13. Heat conducting rod; 14. Spiral blade; 15. Annular heating element; 16. Heat insulation plate. Detailed Implementation

[0024] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0025] Please see Figure 1 - Figure 4 This utility model provides a technical solution: a dispensing machine for semiconductor wafer packaging with anti-coagulation function, including a glue storage cylinder 1, a glue pump 2 sealed and connected to the bottom end of the glue storage cylinder 1, a glue delivery pipe 3 connected to the outlet end of the glue pump 2 through a flange, and a glue dispensing head 4 connected to the end of the glue delivery pipe 3 away from the glue pump 2.

[0026] A nano-aerogel felt 5 is fixedly installed on the inner wall of the glue delivery tube 3. A ceramic heating element 6 is installed on the inner side of the nano-aerogel felt 5. The inner side of the ceramic heating element 6 is coated with a Teflon coating 7. The nano-aerogel felt 5 is tightly attached to the inner wall of the glue delivery tube 3 to provide heat insulation for the ceramic heating element 6. The ceramic heating element 6 is evenly distributed along the axial direction of the glue delivery tube 3 to heat the glue liquid in the glue delivery tube 3.

[0027] During the adhesive dispensing process, the ceramic heating elements 6 on the inner wall of the dispensing tube 3 play a crucial role. They are evenly distributed along the axial direction of the dispensing tube 3, continuously heating the adhesive liquid inside the tube to ensure that the adhesive liquid maintains a suitable temperature and fluidity during delivery. The nano-aerogel felt 5 is tightly adhered to the inner wall of the dispensing tube 3. Due to its extremely low thermal conductivity, it can efficiently insulate the heat generated by the ceramic heating elements 6, reducing heat loss to the external environment and preventing a drop in adhesive liquid temperature due to heat loss. The inner side of the ceramic heating elements 6 is coated with a Teflon coating 7. Utilizing its ultra-low surface energy and smooth properties, it prevents the adhesive from adhering to the inner wall of the dispensing tube 3, avoiding pipe blockage caused by adhesive residue curing, and ensuring smooth adhesive delivery. After the adhesive is delivered to the dispensing head 4 through the dispensing tube 3, the dispensing volume of the dispensing head 4 can be precisely controlled by controlling the operating parameters (such as flow rate and pressure) of the dispensing pump 2, thereby achieving precise dispensing of semiconductor wafers. After dispensing is completed, the dispensing pump 2 stops working and waits for the next dispensing instruction. This cycle is repeated to complete the dispensing operation of semiconductor wafer packaging.

[0028] The top of the glue storage cylinder 1 is detachably connected to the sealing cover 8 via a sealing ring. A stirring motor 9 is fixedly installed in the middle of the upper surface of the glue storage cylinder 1. The output shaft of the stirring motor 9 is coaxially connected to a stainless steel stirring shaft 10 via a coupling. The stirring shaft 10 has a hollow structure and a built-in heating rod 11. A stirring blade 12 is provided on the outer surface of the stirring shaft 10. A through-type copper heat-conducting rod 13 is embedded inside the stirring blade 12. A spiral blade 14 is provided on the outer surface of the stirring shaft 10 below the stirring blade 12. The heat generated by the heating rod 11 is conducted to the stirring blade 12 through the stirring shaft 10 and the heat-conducting rod 13 to provide auxiliary heating for the glue liquid. A ring heating plate 15 is embedded circumferentially on the inner wall of the glue storage cylinder 1. A heat insulation plate 16 is wrapped around the outside of the ring heating plate 15. The heat insulation plate 16 is made of alumina fiber and aerogel composite.

[0029] The sealing cap 8 is tightly connected to the glue storage cylinder 1 via a sealing ring, forming a sealed space to prevent the glue from evaporating. After the stirring motor 9 starts, it drives the stirring shaft 10 to rotate, and the stirring blades 12 rotate accordingly to stir the glue in the glue storage cylinder 1, preventing the glue from settling and separating. At the same time, the heating rod 11 built into the hollow structure of the stirring shaft 10 starts to work. The heat generated is conducted through the stirring shaft 10 and further transferred to the stirring blades 12 through the heat conduction rod 13, so that the stirring blades 12 heat the glue simultaneously during the stirring process. The annular heating plate 15 embedded in the inner wall of the glue storage cylinder 1 also continuously heats the glue. The two work together to achieve uniform heating of the adhesive. The alumina fiber and aerogel composite heat insulation plate 16 covering the outer side of the annular heating plate 15 can effectively reduce heat loss, ensure the temperature stability inside the adhesive storage cylinder 1, and maintain good fluidity of the adhesive. The spiral blade 14 located on the outer surface of the stirring shaft 10 below the stirring blade 12 will generate a downward thrust when the stirring shaft 10 rotates, pushing the adhesive to flow to the bottom of the adhesive storage cylinder 1, further enhancing the convection effect of the adhesive and ensuring uniform heating of the adhesive. When dispensing is required, the dispensing pump 2 starts, extracts the adhesive from the adhesive storage cylinder 1, and delivers it to the dispensing head 4 through the dispensing pipe 3 connected by the flange.

[0030] Working principle: The sealing cap 8 is tightly connected to the glue storage cylinder 1 through a sealing ring, forming a sealed space to prevent glue evaporation. After the stirring motor 9 starts, it drives the stirring shaft 10 to rotate, and the stirring blade 12 rotates accordingly to stir the glue in the glue storage cylinder 1, preventing sedimentation and stratification. At the same time, the heating rod 11 built into the hollow structure of the stirring shaft 10 starts to work. The heat generated is conducted through the stirring shaft 10 and further transferred to the stirring blade 12 through the heat conduction rod 13, so that the stirring blade 12 heats the glue simultaneously during the stirring process. The inner wall of the glue storage cylinder 1 is circumferentially heated. The embedded annular heating element 15 also continuously heats the adhesive liquid. The two work together to achieve uniform heating of the adhesive liquid. The alumina fiber and aerogel composite insulation plate 16 covering the outer side of the annular heating element 15 effectively reduces heat loss, ensuring stable temperature inside the adhesive storage cylinder 1 and maintaining good fluidity of the adhesive liquid. The spiral blades 14 located below the stirring blades 12 on the outer surface of the stirring shaft 10 generate a downward thrust when the stirring shaft 10 rotates, pushing the adhesive liquid towards the bottom of the adhesive storage cylinder 1, further enhancing the convection effect of the adhesive liquid and ensuring uniform heating of the adhesive liquid. When dispensing is required, the dispensing process is completed. Pump 2 starts, drawing out the adhesive from the storage tank 1 and delivering it to the dispensing head 4 via the flange-connected dispensing pipe 3. During the dispensing process, the ceramic heating elements 6 on the inner wall of the dispensing pipe 3 play a crucial role. They are evenly distributed along the axial direction of the dispensing pipe 3, continuously heating the adhesive inside the pipe to ensure that the adhesive maintains a suitable temperature and fluidity during delivery. The nano-aerogel felt 5 is tightly bonded to the inner wall of the dispensing pipe 3. Due to its extremely low thermal conductivity, it can efficiently insulate the heat generated by the ceramic heating elements 6, reducing heat loss to the external environment and preventing the adhesive temperature from dropping due to heat loss. The Teflon coating 7 on the inner side of the ceramic heating element 6 utilizes its ultra-low surface energy and smooth properties to prevent the adhesive from adhering to the inner wall of the dispensing tube 3, avoiding pipe blockage caused by adhesive residue curing, and ensuring smooth adhesive delivery. After the adhesive is delivered to the dispensing head 4 through the dispensing tube 3, the dispensing volume of the dispensing head 4 can be precisely controlled by controlling the operating parameters (such as flow rate and pressure) of the dispensing pump 2, thereby achieving precise dispensing of semiconductor wafers. After dispensing is completed, the dispensing pump 2 stops working and waits for the next dispensing instruction. This cycle is repeated to complete the dispensing operation of semiconductor wafer packaging.

[0031] Finally, it should be noted that the above content is only used to illustrate the technical solution of this utility model, and is not intended to limit the scope of protection of this utility model. Simple modifications or equivalent substitutions made by those skilled in the art to the technical solution of this utility model do not depart from the essence and scope of the technical solution of this utility model.

Claims

1. A dispensing machine for semiconductor wafer packaging with anti-coagulation function, comprising a glue reservoir (1), characterized in that: The bottom end of the glue storage cylinder (1) is sealed and connected to the glue pump (2). The outlet end of the glue pump (2) is connected to the glue delivery pipe (3) through a flange. The end of the glue delivery pipe (3) away from the glue pump (2) is connected to the glue head (4). The inner wall of the glue delivery tube (3) is fixedly provided with a nano aerogel felt (5), and a ceramic heating plate (6) is provided on the inner side of the nano aerogel felt (5). The inner side of the ceramic heating plate (6) is coated with a Teflon coating (7).

2. The dispensing machine for semiconductor wafer packaging with anti-coagulation function according to claim 1, characterized in that: The nano aerogel felt (5) is closely attached to the inner wall of the glue delivery tube (3) and is used to keep the ceramic heating plate (6) warm. The ceramic heating plate (6) is evenly distributed along the axial direction of the glue delivery tube (3) and is used to heat the glue liquid in the glue delivery tube (3).

3. The dispensing machine for semiconductor wafer packaging with anti-coagulation function according to claim 1, characterized in that: The top of the glue storage cylinder (1) is detachably connected to the sealing cover (8) via a sealing ring, and a stirring motor (9) is fixedly installed in the middle of the upper surface of the glue storage cylinder (1).

4. A dispensing machine for semiconductor wafer packaging with anti-coagulation function according to claim 3, characterized in that: The output shaft of the stirring motor (9) is coaxially connected to the stainless steel stirring shaft (10) via a coupling. The stirring shaft (10) has a hollow structure and a built-in heating rod (11).

5. A dispensing machine for semiconductor wafer packaging with anti-coagulation function according to claim 4, characterized in that: The outer surface of the stirring shaft (10) is provided with stirring blades (12), and a through-type copper heat-conducting rod (13) is embedded inside the stirring blades (12). A spiral blade (14) is provided on the outer surface of the stirring shaft (10) below the stirring blades (12).

6. A dispensing machine for semiconductor wafer packaging with anti-coagulation function according to claim 4, characterized in that: The heat generated by the heating rod (11) is conducted to the stirring blade (12) through the stirring shaft (10) and the heat-conducting rod (13) to provide auxiliary heating for the adhesive liquid.

7. A dispensing machine for semiconductor wafer packaging with anti-coagulation function according to claim 1, characterized in that: The inner wall of the gel storage cylinder (1) is circumferentially embedded with an annular heating element (15), and the outer side of the annular heating element (15) is covered with a heat insulation plate (16), which is made of alumina fiber and aerogel composite.

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