Gas supply pipeline device of silicon wafer coating process furnace

Abstract

The utility model relates to the technical field of gas supply pipelines, in particular to a gas supply pipeline device of a silicon wafer coating process furnace, which comprises an inner pipe, an outer pipe and sealing pieces, the outer pipe is sleeved outside the inner pipe, and the two ends of the outer pipe and the inner pipe are respectively connected with the sealing pieces, so that a sealing cavity is formed among the outer pipe, the inner pipe and the sealing pieces at the two ends; one ends of the connecting holes of the two sealing pieces are communicated with the end part of the inner pipe, so that the connecting joints of the inner pipe and the connecting holes are positioned in the sealing cavity, and the other ends of the connecting holes of the two sealing pieces are respectively suitable for being communicated with an air supply device and a silicon wafer coating process furnace. According to the gas supply pipeline device, the closed sealing cavity is formed in cooperation with the sealing piece, the connecting joint of the inner pipe is located in the sealing cavity, and therefore a sealing barrier can be formed outside the inner pipe used for conveying process gas, and the sealing effect of the gas supply pipeline device is greatly improved; and the use safety and reliability of the process furnace using the gas supply pipeline device are improved.

Description

Technical Field

[0001] This utility model relates to the technical field of gas supply pipelines, and in particular to a gas supply pipeline device for a silicon wafer coating process furnace. Background Technology

[0002] ALD (Atomic Layer Deposition) silicon wafer deposition furnaces are devices specifically designed for atomic layer deposition in semiconductor manufacturing processes. ALD technology can form highly uniform, dense, and precisely controllable thin films on substrate surfaces, which is crucial for the miniaturization and performance improvement of semiconductor devices.

[0003] During the coating process, process gases, such as TMA (trimethylaluminum) gas, need to be introduced into the silicon wafer coating furnace. However, this gas will burn when it comes into contact with air, so it is necessary to strictly ensure the airtightness of the gas supply pipeline to ensure production safety.

[0004] In the existing technology, the gas supply pipeline for supplying TMA to the silicon wafer coating process furnace is a simple single-layer pipe. It only avoids gas leakage by improving the sealing of the connection nodes. However, as the sealing ring ages, gas leakage is still likely to occur, which is not conducive to improving the safety of the silicon wafer coating process. Utility Model Content

[0005] (a) Technical problems to be solved

[0006] In view of the above-mentioned shortcomings and deficiencies of the prior art, the present invention provides a gas supply pipeline device for a silicon wafer coating process furnace, which solves the technical problem that gas leakage is prone to occur at the connection nodes in the single-layer structure pipeline of the prior art, which is not conducive to improving the safety of the silicon wafer coating process.

[0007] (II) Technical Solution

[0008] To achieve the above objectives, the main technical solutions adopted by this utility model include:

[0009] In a first aspect, this utility model provides a gas supply pipeline device for a silicon wafer coating process furnace, suitable for connecting a gas supply device to supply process gas to the silicon wafer coating process furnace. The device includes an inner tube, an outer tube, and sealing components. The outer tube is sleeved outside the inner tube, and both ends of the two tubes are connected to sealing components to form a sealed cavity between the outer tube, the inner tube, and the sealing components at both ends. The two sealing components are respectively connected to the gas supply device and the silicon wafer coating process furnace. The sealing components have connection holes, one end of each connection hole of the two sealing components is connected to the end of the inner tube, so that the connection node between the inner tube and the connection hole is located within the sealed cavity. The other ends of the connection holes of the two sealing components are respectively adapted to connect to the gas supply device and the silicon wafer coating process furnace.

[0010] In one technical solution of this utility model, the sealing component includes an end connector and a plug. One end of the end connector is sealed to one end of the outer tube, and the other end of the end connector is sealed by the plug. A connection hole is provided on the plug or the end connector.

[0011] In one technical solution of this utility model, a pressure sensor is also included. The detection end of the pressure sensor is connected to the sealed cavity and is suitable for detecting the pressure inside the sealed cavity. The pressure sensor is supported on the end connector.

[0012] In one technical solution of this utility model, two sealing joints are also included, and both ends of the inner tube are connected to the corresponding connecting holes through the corresponding sealing joints.

[0013] In one technical solution of this utility model, the sealing joint is set as a VCR sealing joint.

[0014] In one technical solution of this utility model, both the inner tube and the outer tube are configured as flexible tubes.

[0015] In one technical solution of this utility model, a mounting plate is also included, which is fixedly connected to the closure; the side wall of the end joint away from the inner tube forms a first sealing surface, and one side wall of the mounting plate is in sealing contact with the first sealing surface.

[0016] In one technical solution of this utility model, the mounting plate is provided with a mounting hole that matches the plug, and the circumferential outer wall of the plug forms a second sealing surface, which is in sealing contact with the inner wall of the mounting hole.

[0017] In one technical solution of this utility model, a limiting member is also included, which is suitable for limiting the axial position of the mounting plate relative to the plug; a limiting groove is provided on the plug, and the limiting member is connected to the mounting plate in an axially fixed manner and is inserted into the limiting groove to limit the axial movement of the mounting plate relative to the plug.

[0018] In one technical solution of this utility model, the plug and the end connector, as well as the mounting plate and the plug and the end connector, are sealed by sealing rings.

[0019] In one technical solution of this utility model, the mounting plate is fixedly connected to a predetermined frame to support both ends of the gas supply pipeline device.

[0020] (III) Beneficial Effects

[0021] The beneficial effects of this utility model are as follows: by nesting the inner and outer tubes, a closed sealing cavity is formed in conjunction with the sealing component, and the connection node of the inner tube is located inside the sealing cavity. Therefore, a sealing barrier can be formed outside the inner tube used to transport process gas. Combined with the sealing structure of the connection node between the inner tube and the connection hole, a double sealing effect is achieved, which greatly improves the sealing effect of the gas supply pipeline device and improves the safety and reliability of the process furnace using the gas supply pipeline device.

[0022] Furthermore, the double seal not only improves the sealing performance but also effectively prevents external contaminants from entering the process gas flow, thereby ensuring the quality of silicon wafer coating.

[0023] The combination of end connectors and plugs allows for quick replacement or repair, improving equipment maintenance efficiency. This piping system also provides the hardware foundation for expanding cooling or heating functions, significantly enhancing the flexibility of the gas supply piping system. Attached Figure Description

[0024] Figure 1 One of the structural schematic diagrams of the gas supply pipeline device for the silicon wafer coating process furnace of this utility model;

[0025] Figure 2 This is the second schematic diagram of the gas supply pipeline device for the silicon wafer coating process furnace of this utility model.

[0026] Figure 3 This utility model Figure 1 A magnified schematic diagram of the local structure at point X;

[0027] Figure 4 This utility model Figure 2 A magnified schematic diagram of the structure at point Y in the middle.

[0028] [Explanation of Labels in the Attached Images]

[0029] 1: Inner tube;

[0030] 2: Outer tube;

[0031] 100: Sealed cavity;

[0032] 3: Sealing component; 31: End connector; A: First sealing surface; 32: Plug; B: Second sealing surface; C: Limiting groove; D: Connecting hole;

[0033] 4: Pressure sensor;

[0034] 5: Sealed joint;

[0035] 6: Mounting plate;

[0036] 7: Limiting components;

[0037] 8: Sealing ring. Detailed Implementation

[0038] To better explain and facilitate understanding of this utility model, the following description is provided in conjunction with the appendix. Figures 1-4 This invention will be described in detail through specific embodiments. Wherein, directional terms such as "upper" and "lower" are used in this document. Figure 1 The orientation is used as a reference.

[0039] Example 1:

[0040] Reference Figures 1-4 This utility model provides a gas supply pipeline device for a silicon wafer coating process furnace, suitable for connecting a gas supply device to supply process gas to the silicon wafer coating process furnace. It includes an inner tube 1, an outer tube 2, and a sealing member 3. The outer tube 2 is sleeved outside the inner tube 1 to form a sealed cavity 100 between the two. Both ends of the sealed cavity 100 are sealed by the sealing member 3. The two sealing members 3 are respectively connected to the gas supply device and the silicon wafer coating process furnace. The sealing member 3 is provided with a connection hole D. One end of the connection hole D of the two sealing members 3 is connected to the end of the inner tube 1 so that the connection node between the inner tube 1 and the connection hole D is located inside the sealed cavity 100. The other ends of the connection holes D of the two sealing members 3 are respectively suitable for connecting the gas supply device and the silicon wafer coating process furnace.

[0041] The closure 3 includes an end connector 31 and a plug 32. One end of the end connector 31 is sealed to one end of the outer tube 2, and the other end of the end connector 31 is sealed by the plug 32. A connection hole D is provided on the plug 32 or the end connector 31.

[0042] In this embodiment, the gas supply pipeline device forms a closed sealing cavity 100 through nested inner tube 1 and outer tube 2, in conjunction with sealing member 3. The connection node of inner tube 1 is located inside the sealing cavity 100. Therefore, a sealing barrier can be formed outside the inner tube 1 used to transport process gas. Combined with the sealing structure of the connection node between inner tube 1 and connection hole D, a double sealing effect is achieved, which greatly improves the sealing effect of the gas supply pipeline device and enhances the safety and reliability of the process furnace using the gas supply pipeline device.

[0043] Furthermore, the double seal not only improves the sealing performance but also effectively prevents external contaminants from entering the process gas flow, thereby ensuring the quality of silicon wafer coating.

[0044] The combined use of end connector 31 and plug 32 allows for quick replacement or repair, improving equipment maintenance efficiency. If the process gas has specific temperature requirements, a heating or cooling system can be integrated inside the sealed cavity 100 to maintain a suitable operating temperature and ensure that the gas state meets process requirements. In other words, this pipeline device also provides the hardware foundation for expanding cooling or heating functions, greatly improving the flexibility of the gas supply pipeline device.

[0045] Both the inner tube 1 and the outer tube 2 are made of flexible hoses so that the gas supply pipeline device can be flexibly bent as needed. This provides a basis for its integration onto the cable chain of the furnace door, which can be opened and closed, and for one end to be fixedly connected to the furnace door, ensuring the adaptability of the gas supply pipeline device to the furnace.

[0046] During assembly, the end connector 31 can be connected after the inner tube 1, sealing joint 5 and plug 32 are connected, which facilitates assembly.

[0047] Example 2:

[0048] Reference Figures 1-4 In addition to possessing all the technical solutions of the above embodiments, the embodiments of this utility model further possess the following technical solutions:

[0049] The gas supply pipeline device also includes a pressure sensor 4, the detection end of which is connected to the sealing cavity 100 and is suitable for detecting the pressure inside the sealing cavity 100; the pressure sensor 4 is supported on the end connector 31.

[0050] In this embodiment, by connecting the detection end of the pressure sensor 4 to the sealed cavity 100, pressure changes within the sealed cavity 100 can be monitored in real time. This allows for timely feedback on process gas leaks, as any unexpected pressure changes could signal a system problem. This further improves the reliability and safety of the gas supply pipeline device.

[0051] The end connector 31 must have sufficient structural strength and stability to support the installation of the sensor. In addition, this arrangement also facilitates maintenance and repair.

[0052] Pressure sensor 4 can be connected to a central control system that can analyze pressure data in real time and automatically trigger alarms or take corresponding measures based on preset safety parameters.

[0053] Example 3:

[0054] Reference Figures 1-4 In addition to possessing all the technical solutions of the above embodiments, the embodiments of this utility model further possess the following technical solutions:

[0055] The gas supply pipeline device also includes two sealing joints 5, with both ends of the inner pipe 1 connected to the corresponding connection holes D via the corresponding sealing joints 5. The sealing joints 5 are set as VCR sealing joints.

[0056] In this embodiment, the sealing reliability of the gas supply pipeline device can be improved and the safety of the gas supply pipeline device can be improved by connecting the inner tube 1 and the connecting hole D through the sealing joint 5.

[0057] By setting the sealing joint 5 as a VCR sealing joint, which is called Vacuum Coupling Radiation sealing joint, a high-performance metal surface sealing joint designed for high-pressure, vacuum and ultrapure gas delivery systems, the sealing performance between the two ends of the inner tube 1 and the connecting hole D can be further improved, ensuring that the process gas will not leak during the entire transmission process.

[0058] Both ends of the inner tube 1 are connected to the connection holes D on the end connector 31 via corresponding VCR sealing connectors. This method not only ensures the integrity of the gas transmission path but also simplifies the assembly and disassembly process of the system, facilitating maintenance or component replacement.

[0059] Since the plug 32 and the end connector 31 are detachable, the plug 32 and the end connector 31 can be set as separate structures when maintaining the sealing joint, thereby improving maintenance efficiency.

[0060] VCR connectors also effectively prevent external contaminants from entering the system, which is especially important for silicon wafer coating processes that require extremely high purity. They help ensure the purity of process gases, thereby improving the quality of the final product.

[0061] Example 4:

[0062] Reference Figures 1-4 In addition to possessing all the technical solutions of the above embodiments, the embodiments of this utility model further possess the following technical solutions:

[0063] The gas supply pipeline device also includes a mounting plate 6, which is fixedly connected to the sealing member 3; the side wall of the end joint 31 away from the inner pipe 1 forms a first sealing surface A, and one side wall of the mounting plate 6 is in sealing contact with the first sealing surface A.

[0064] In this embodiment, the sidewall of the end connector 31 away from the inner tube 1 is designed to form a first sealing surface A, which achieves a tight and effective sealing contact with the sidewall of the mounting plate 6. In this way, possible leakage paths can be further sealed off, ensuring that the process gas will not leak during the entire transportation process, thereby ensuring the safety and reliability of the gas supply pipeline device.

[0065] Mounting plate 6 is fixedly connected to the predetermined frame to support both ends of the gas supply pipeline device, thereby providing a solid support foundation for the gas supply pipeline device, ensuring its stability throughout the operation, and preventing pipeline displacement or seal failure due to vibration, external impact or other mechanical factors.

[0066] Specifically, one mounting plate 6 can be fixed to the door of the silicon wafer coating process furnace that can be opened and closed, and another mounting plate 6 can be fixedly connected to the gas supply device.

[0067] Example 5:

[0068] Reference Figures 1-4 In addition to possessing all the technical solutions of the above embodiments, the embodiments of this utility model further possess the following technical solutions:

[0069] The mounting plate 6 has a mounting hole that matches the plug 32. The circumferential outer wall of the plug 32 forms a second sealing surface B, which is in sealing contact with the inner wall of the mounting hole.

[0070] In this embodiment, the sealing contact between the second sealing surface B and the inner wall of the mounting hole provides an additional layer of sealing protection, thereby further improving the sealing performance of the gas supply pipeline device and also further improving its safety and reliability in use.

[0071] Example 6:

[0072] Reference Figures 1-4 In addition to possessing all the technical solutions of the above embodiments, the embodiments of this utility model further possess the following technical solutions:

[0073] The gas supply pipeline device also includes a limiting member 7, which is suitable for limiting the axial position of the mounting plate 6 relative to the plug 32; the plug 32 has a limiting groove C, and the limiting member 7 is connected to the mounting plate 6 in an axially fixed manner and is inserted into the limiting groove C to limit the axial movement of the mounting plate 6 relative to the plug 32.

[0074] In this embodiment, a limiting groove C is formed on the plug 32, providing a precise positioning reference for the limiting member 7, allowing the limiting member 7 to be securely connected to the plug 32 while effectively restricting the axial movement of the mounting plate 6. The limiting member 7 is connected to the mounting plate 6 in an axially fixed manner and engages with the limiting groove C. This connection method is simple and reliable, facilitating installation and disassembly, and also reducing the possibility of loosening due to vibration or other external forces. The limiting member 7 can be configured as a plate, which is fixedly connected to the mounting plate 6 by bolts to ensure the ease of maintenance of the air supply pipeline device.

[0075] When the limiting member 7 is engaged with the limiting groove C, since the limiting member 7 cannot move axially relative to the mounting plate 6, after the plug 32 is stably connected to the end connector 31, the distance between the limiting member 7 and the first sealing surface A is fixed. In this way, the thickness of the mounting plate 6 can be set within the size range that ensures the first sealing surface A and one side wall of the mounting plate 6 maintain sealed contact.

[0076] The plug 32 and the end connector 31, as well as the mounting plate 6 and the plug 32 and the end connector 31, are sealed by the sealing ring 8, so that the sealing element 3 forms a multiple sealing form, thereby further improving the sealing performance of the gas supply pipeline device.

[0077] Specifically, the seal between the plug 32 and the end connector 31 is a single-layer seal structure, while the seal at the first sealing surface A and the seal at the second sealing surface B are double-layer seal structures.

[0078] It can be understood that, except for conflicting parts, the above embodiments 1-6 can be freely combined to form other embodiments of this utility model.

[0079] In the description of this utility model, it should be understood that the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, "a plurality of" means two or more, unless otherwise explicitly specified.

[0080] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. For those skilled in the art, the specific meaning of the above terms in this utility model can be understood according to the specific circumstances.

[0081] In this utility model, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "beneath" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0082] The term "comprising" or any other similar term is intended to cover non-exclusive inclusion, such that a process, article, or apparatus / device that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to those processes, articles, or apparatus / devices.

[0083] The technical solution of this utility model has been described in conjunction with the preferred embodiments shown in the accompanying drawings. However, it will be readily understood by those skilled in the art that the protection scope of this utility model is obviously not limited to these specific embodiments. Without departing from the principle of this utility model, those skilled in the art can make equivalent changes or substitutions to the relevant technical features, and the technical solutions after these changes or substitutions will all fall within the protection scope of this utility model.

Claims

1. A gas supply pipeline device for a silicon wafer coating process furnace, suitable for connecting a gas supply device to supply process gas to the silicon wafer coating process furnace, characterized in that: It includes an inner tube (1), an outer tube (2) and a sealing member (3). The outer tube (2) is sleeved outside the inner tube (1), and the sealing member (3) is connected to both ends of the two tubes respectively, so as to form a sealed cavity (100) between the outer tube (2), the inner tube (1) and the sealing members (3) at both ends; The two enclosures (3) are respectively connected to the gas supply device and the silicon wafer coating process furnace; The sealing member (3) is provided with a connection hole (D). One end of the connection hole (D) of the two sealing members (3) is connected to the end of the inner tube (1) so that the connection node between the inner tube (1) and the connection hole (D) is located in the sealing cavity (100). The other end of the connection hole (D) of the two sealing members (3) is respectively adapted to connect the gas supply device and the silicon wafer coating process furnace.

2. The gas supply pipeline device for the silicon wafer coating process furnace as described in claim 1, characterized in that: The closure (3) includes an end connector (31) and a plug (32). One end of the end connector (31) is sealed to one end of the outer tube (2), and the other end of the end connector (31) is closed by the plug (32). The plug (32) or the end connector (31) is provided with a connection hole (D).

3. The gas supply pipeline device for the silicon wafer coating process furnace as described in claim 2, characterized in that: It also includes a pressure sensor (4), the detection end of which is connected to the sealed cavity (100) and is suitable for detecting the pressure inside the sealed cavity (100); The pressure sensor (4) is supported on the end connector (31).

4. The gas supply pipeline device for the silicon wafer coating process furnace as described in claim 2, characterized in that: It also includes two sealing joints (5), and both ends of the inner tube (1) are connected to the corresponding connecting holes (D) through the corresponding sealing joints (5); the sealing joints (5) are set as VCR sealing joints.

5. The gas supply pipeline device for the silicon wafer coating process furnace as described in claim 1, characterized in that: Both the inner tube (1) and the outer tube (2) are configured as flexible tubes.

6. The gas supply pipeline device for the silicon wafer coating process furnace as described in claim 2, characterized in that: It also includes a mounting plate (6), which is fixedly connected to the closure (3); The side wall of the end connector (31) away from the inner tube (1) forms a first sealing surface (A), and one side wall of the mounting plate (6) is in sealing contact with the first sealing surface (A).

7. The gas supply pipeline device for the silicon wafer coating process furnace as described in claim 6, characterized in that: The mounting plate (6) has a mounting hole that matches the plug (32). The circumferential outer wall of the plug (32) forms a second sealing surface (B), which is in sealing contact with the inner wall of the mounting hole.

8. The gas supply pipeline device for the silicon wafer coating process furnace as described in claim 7, characterized in that: It also includes a limiting member (7) adapted to limit the axial position of the mounting plate (6) relative to the plug (32); The plug (32) has a limiting groove (C), and the limiting member (7) is connected to the mounting plate (6) in an axially fixed manner and is inserted into the limiting groove (C) to restrict the axial movement of the mounting plate (6) relative to the plug (32).

9. The gas supply pipeline device for the silicon wafer coating process furnace as described in claim 8, characterized in that: The plug (32) and the end connector (31) are sealed by a sealing ring (8), as are the mounting plate (6) and the plug (32) and the end connector (31).

10. The gas supply pipeline device for the silicon wafer coating process furnace as described in any one of claims 6-9, characterized in that: The mounting plate (6) is fixedly connected to the predetermined frame to support both ends of the gas supply pipeline device.

Images