Electroplating processing jig for semiconductor electronic component

Abstract

The utility model discloses a semiconductor electronic component electroplating processing jig, which comprises a jig bedplate, a plurality of placing grooves are arranged on the front end surface of the jig bedplate, a cover plate is arranged at the front end of the jig bedplate, a plurality of round holes are arranged in the cover plate, and a plurality of clamping grooves are arranged on the front end surface of the jig bedplate. A plurality of round holes are formed in the cover plate, the number of the round holes is the same as that of the placing grooves, the positions of the round holes correspond to the placing grooves, pressing rings are fixedly installed in the round holes, edge blocks are symmetrically and fixedly installed on the two sides of the cover plate respectively, groove holes are formed in the edge blocks, and track plates are symmetrically arranged on the two sides of the cover plate respectively. According to the wafer electroplating device, the capability of improving the machining efficiency is achieved, the practicability is improved, and therefore the problems that when wafer electroplating machining is carried out, the efficiency is low, wafers are inconvenient to feed and discharge, and the practicability is poor are solved.

Description

Technical Field

[0001] This utility model relates to the field of fixture technology, specifically to a fixture for electroplating semiconductor electronic components. Background Technology

[0002] Semiconductor electronic components are the core components of modern electronic devices. For example, wafers, as the basic material for semiconductor manufacturing, need to be electroplated on their surface to form metal layers to form interconnects and conductive layers inside the chip. Semiconductor electronic component electroplating processing fixtures are special tools used to fix, support and protect components during the electroplating process of semiconductor electronic components, such as wafers, to ensure the deposition of the electroplated layer.

[0003] For example, the patent with publication number CN 207811901 U (a wafer electroplating fixture) includes: a fixture body with a groove; an elastic conductive ring at the bottom of the groove for supporting the lower surface of the wafer; a cover plate with an elastic gasket ring; a cavity is formed when the cover plate presses against the upper surface of the wafer; and an opening is provided on the cover plate to allow the electroplating solution to flow into the cavity.

[0004] While the aforementioned existing technologies improve electroplating quality, the fixture only has a single wafer mounting slot, and the cover plate is installed using a threaded method to restrict the wafer. Consequently, the efficiency of wafer electroplating is low, and it is not convenient for easy loading and unloading of wafers, resulting in poor practicality. Therefore, there is an urgent need in the market to develop a semiconductor electronic component electroplating fixture to help people solve the existing problems. Utility Model Content

[0005] The purpose of this utility model is to provide a semiconductor electronic component electroplating processing fixture to solve the problems mentioned in the background art, such as low efficiency, inconvenience in easy loading and unloading of wafers, and poor practicality.

[0006] To achieve the above objectives, this utility model provides the following technical solution: a semiconductor electronic component electroplating processing fixture, including a fixture platform, a plurality of mounting slots provided on the front end surface of the fixture platform, a cover plate provided on the front end of the fixture platform, a plurality of circular holes provided inside the cover plate, the plurality of circular holes being the same number and corresponding in position to the plurality of mounting slots, and a pressure ring being fixedly installed inside the circular holes.

[0007] Preferably, side blocks are symmetrically fixedly installed on both sides of the cover plate, and slots are provided inside the side blocks. Track plates are symmetrically arranged on both sides of the cover plate. The track plates slide through the side blocks through the slots. Limit plates are fixedly installed at both ends of the track plates, and the limit plates are fixedly connected to the fixture platform.

[0008] Preferably, a handwheel is provided on one side of the edge block, and a threaded rod is fixedly installed on the side of the handwheel facing the edge block. The threaded rod is threadedly connected to the edge block, and one end of the threaded rod extends into the interior of the slot and contacts the track plate.

[0009] Preferably, the side block has a side groove along one side of the cover plate, the side groove has a spring plate inside, the spring plate is fixedly connected to the cover plate, and a compression spring is fixedly installed below the spring plate, the lower end of the compression spring is fixedly connected to the side block.

[0010] Preferably, a groove is provided inside the side block along the lower part of the compression spring, and a guide post is provided inside the groove. The upper end of the guide post extends into the interior of the compression spring and is fixedly connected to the spring plate.

[0011] Preferably, the fixture platform has a through hole along the rear end of the mounting groove, and the through hole communicates with the mounting groove. A conductive ring is fixedly installed inside the mounting groove of the fixture platform.

[0012] Preferably, a rubber pad is fixedly installed below the pressure ring.

[0013] Compared with the prior art, the beneficial effects of this utility model are:

[0014] 1. This utility model improves the efficiency of electroplating by setting multiple placement slots on the fixture platform, which can simultaneously place multiple wafers. At the same time, the cover plate has circular holes with the same number and corresponding positions as the placement slots, and pressure rings are fixedly installed in the circular holes to press down and limit the wafers in the placement slots. This design not only simplifies the wafer fixing method and avoids the complexity of threaded installation, but also makes wafer loading and unloading more convenient, thereby improving the practicality of the electroplating fixture for semiconductor electronic components.

[0015] 2. This utility model features a design that symmetrically installs side blocks on both sides of the cover plate and sets slots, and the track plate slides through the slots to pass through the side blocks and is fixedly connected to the limiting plate. This design makes the connection between the cover plate and the fixture platform more stable, able to withstand the vibration and impact that may occur during the electroplating process, ensuring the stability of the electroplating process. Furthermore, the sliding design of the track plate makes the opening and closing of the cover plate smoother, facilitating the insertion and removal of wafers.

[0016] 3. This utility model features a side groove inside the side block, and a spring plate and compression spring inside the side groove. The elastic contraction force of the compression spring allows the pressure ring to be stably pressed onto the wafer, thereby achieving the limiting and fixing of the wafer and increasing its practicality. Attached Figure Description

[0017] Figure 1 This is a top view of a semiconductor electronic component electroplating processing fixture according to the present invention;

[0018] Figure 2 This is a front sectional view of the cover plate of this utility model;

[0019] Figure 3 This is a cross-sectional view of the edge block of this utility model.

[0020] In the diagram: 1. Fixture platform; 101. Mounting slot; 102. Through hole; 2. Conductive ring; 3. Cover plate; 301. Round hole; 4. Pressure ring; 401. Rubber pad; 5. Side block; 501. Slot hole; 502. Side groove; 503. Column groove; 6. Track plate; 7. Limiting plate; 8. Spring plate; 9. Compression spring; 10. Guide column; 11. Threaded rod; 12. Handwheel. Detailed Implementation

[0021] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0022] Please see Figure 1-3 An embodiment of this utility model provides a semiconductor electronic component electroplating processing fixture, including a fixture platform 1. A mounting groove 101 is provided on the front end surface of the fixture platform 1. Multiple mounting grooves 101 are provided. A cover plate 3 is provided at the front end of the fixture platform 1. A circular hole 301 is provided inside the cover plate 3. Multiple circular holes 301 are provided. The number of circular holes 301 is the same as the number of mounting grooves 101 and their positions are corresponding. A pressure ring 4 is fixedly installed inside the circular hole 301.

[0023] By setting multiple mounting slots 101, multiple wafers can be placed, improving the efficiency of electroplating. At the same time, a circular hole 301 is set, and a pressure ring 4 is fixedly installed in the circular hole 301 to facilitate the downward pressure and limiting of the wafers in the mounting slots 101. This design not only simplifies the wafer fixing method and avoids the complexity of threaded installation, but also makes wafer loading and unloading more convenient, thereby improving the practicality of the electroplating fixture for semiconductor electronic components.

[0024] Furthermore, side blocks 5 are symmetrically fixedly installed on both sides of the cover plate 3, and slots 501 are provided inside the side blocks 5. Track plates 6 are symmetrically arranged on both sides of the cover plate 3. The track plates 6 slide through the side blocks 5 through the slots 501. Limiting plates 7 are fixedly installed at both ends of the track plates 6, and the limiting plates 7 are fixedly connected to the fixture platform 1.

[0025] The sliding design of the track plate 6 makes the opening and closing of the cover plate 3 smoother, facilitating the insertion and removal of wafers. The setting of the limiting plate 7 effectively prevents the cover plate 3 from accidentally falling off, improving operational safety. This, in turn, helps the pressure ring 4 to be accurately aligned each time the cover is closed, increasing practicality.

[0026] Furthermore, a handwheel 12 is provided on one side of the edge block 5, and a threaded rod 11 is fixedly installed on the side of the handwheel 12 facing the edge block 5. The threaded rod 11 is threadedly connected to the edge block 5, and one end of the threaded rod 11 extends into the interior of the slot 501 and contacts the track plate 6.

[0027] By turning the handwheel 12, the threaded rod 11 can be easily extended or retracted, which facilitates the stable stopping or sliding of the side block 5 on the track plate 6, realizing the opening and closing of the cover plate 3 and increasing its practicality.

[0028] Furthermore, a side groove 502 is provided inside the side block 5 along one side of the cover plate 3, and a spring plate 8 is provided inside the side groove 502. The spring plate 8 is fixedly connected to the cover plate 3, and a compression spring 9 is fixedly installed below the spring plate 8. The lower end of the compression spring 9 is fixedly connected to the side block 5.

[0029] When the cover plate 3 needs to be moved above the wafer, the cover plate 3 is lifted, and the compression spring 9 is stretched, causing the pressure ring 4 to move away from the fixture platform 1. Then, after the cover plate 3 is moved above the wafer, the cover plate 3 is released. Through the elastic contraction force of the compression spring 9, the pressure ring 4 can be stably pressed on the wafer, thereby achieving the limiting and fixing of the wafer and increasing its practicality.

[0030] Furthermore, a groove 503 is provided inside the side block 5 along the lower part of the compression spring 9, and a guide post 10 is provided inside the groove 503. The upper end of the guide post 10 extends into the interior of the compression spring 9 and is fixedly connected to the spring plate 8.

[0031] The guide post 10 can provide guidance for the movement of the spring plate 8 and the compression spring 9, ensuring that the spring plate 8 and the compression spring 9 maintain a stable movement trajectory during compression and extension, and avoiding problems such as unstable fixture structure or loose wafer fixation caused by movement deviation.

[0032] Furthermore, a through hole 102 is provided inside the fixture platform 1 along the rear end of the placement groove 101, and the through hole 102 communicates with the placement groove 101. A conductive ring 2 is fixedly installed inside the placement groove 101 of the fixture platform 1, and a rubber pad 401 is fixedly installed below the pressure ring 4.

[0033] The rubber pad 401 is designed to prevent the pressure ring 4 from directly contacting the wafer, thus preventing direct damage to the wafer.

[0034] Working principle: During use, in the electroplating process of semiconductor electronic components, multiple wafers can be placed simultaneously by setting multiple placement slots 101 on the fixture table 1. The sliding cover plate 3 enables rapid loading and unloading. When the cover plate 3 moves above the wafer, the pressure ring 4 inside it applies uniform downward pressure to the wafer under the elastic action of the compression spring 9. The rubber pad 401 achieves non-destructive fixing. The guide post 10 ensures that the vertical movement trajectory of the pressure ring 4 is accurate. The threaded rod 11 adjusted by the handwheel 12 can fix the position of the side block 5, which facilitates efficient and stable wafer electroplating processing and increases practicality.

[0035] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

Claims

1. A semiconductor electronic component electroplating processing fixture, comprising a fixture platform (1), characterized in that: The jig platform (1) has a mounting slot (101) on its front end surface. Multiple mounting slots (101) are provided. The jig platform (1) has a cover plate (3) on its front end. The cover plate (3) has a round hole (301) inside. Multiple round holes (301) are provided. The number of round holes (301) is the same as the number of mounting slots (101) and their positions are corresponding. A pressure ring (4) is fixedly installed inside the round hole (301).

2. The electroplating fixture for semiconductor electronic components according to claim 1, characterized in that: Side blocks (5) are symmetrically fixedly installed on both sides of the cover plate (3). The side blocks (5) have slots (501) inside. Track plates (6) are symmetrically installed on both sides of the cover plate (3). The track plates (6) slide through the side blocks (5) through the slots (501). Limiting plates (7) are fixedly installed at both ends of the track plates (6). The limiting plates (7) are fixedly connected to the fixture platform (1).

3. The electroplating fixture for semiconductor electronic components according to claim 2, characterized in that: A handwheel (12) is provided on one side of the side block (5). A threaded rod (11) is fixedly installed on the side of the handwheel (12) facing the side block (5). The threaded rod (11) is threadedly connected to the side block (5), and one end of the threaded rod (11) extends into the interior of the slot (501) and contacts the track plate (6).

4. The electroplating fixture for semiconductor electronic components according to claim 3, characterized in that: The side block (5) has a side groove (502) inside along one side of the cover plate (3). The side groove (502) has a spring plate (8) inside, and the spring plate (8) is fixedly connected to the cover plate (3). A compression spring (9) is fixedly installed below the spring plate (8), and the lower end of the compression spring (9) is fixedly connected to the side block (5).

5. The electroplating fixture for semiconductor electronic components according to claim 4, characterized in that: The inside of the side block (5) is provided with a column groove (503) below the compression spring (9), and a guide post (10) is provided inside the column groove (503). The upper end of the guide post (10) extends into the inside of the compression spring (9) and is fixedly connected to the spring plate (8).

6. The electroplating fixture for semiconductor electronic components according to claim 1, characterized in that: The fixture platform (1) has a through hole (102) along the rear end of the placement groove (101) inside, and the through hole (102) is connected to the placement groove (101). A conductive ring (2) is fixedly installed inside the placement groove (101) of the fixture platform (1).

7. The electroplating fixture for semiconductor electronic components according to claim 1, characterized in that: A rubber pad (401) is fixedly installed below the pressure ring (4).

Images