Photoelectric material multi-field coupling measurement experiment system based on hyperspectral technology

Abstract

The utility model discloses a photoelectric material multi-field coupling measurement experiment system based on a hyperspectral technology, which can simultaneously apply tensile deformation, a temperature field and an electric field. The method solves the problem that the spectrum change caused by the microstructure and chemical component change of the to-be-tested material under the action of multiple fields cannot be obtained at the same time, and meanwhile, the relationship among the microstructure change, chemical component change and mechanical property evolution of the to-be-tested material is considered; dynamic and real-time observation is carried out on the testing process of the to-be-tested material under the multi-field action through an electronic eyepiece and hyperspectral imaging, the stress and strain conditions are collected through Vic-2D, and a new means is provided for life prediction and reliability evaluation of semiconductor materials and photoelectric materials.

Description

Technical Field

[0001] This utility model belongs to the technical field of materials mechanics testing devices, specifically relating to an experimental system for multi-field coupling measurement of optoelectronic materials based on hyperspectral technology. Background Technology

[0002] Materials mechanical property testing technology has been refined over hundreds of years. With the continuous innovation of materials mechanical property testing instruments, researchers are expanding their research on the mechanical properties of materials applied in real-world conditions, resulting in significant progress in various aspects of research. Compared to traditional non-in-situ testing, in-situ testing has greater advantages in materials property research, allowing for more in-depth studies of the influence of material microstructure on material properties. Currently, in-situ testing mainly uses microscopic imaging instruments, such as optical microscopes, to continuously observe and record the microstructure of materials in real time during the testing process. Image analysis is then performed using digital image correlation (DIC) matching algorithms to calculate the material's full-field displacement and strain response. However, it is currently impossible to achieve real-time non-destructive testing of the mechanical properties, microstructure, and spectral changes caused by compositional variations of the tested material under multi-field conditions. Summary of the Invention

[0003] To address the shortcomings of existing technologies, the purpose of this invention is to provide a multi-field coupling measurement experimental system for optoelectronic materials based on hyperspectral technology. This system integrates a hyperspectral camera and an electronic eyepiece for real-time observation of the hyperspectral images and microstructure of the material under test. Simultaneously, it can acquire real-time spectral information arising from the surface stress and internal chemical composition changes of the material. By simulating the complex environment of the material under test using an electrochemical workstation and temperature and tension regulators, the system can control the temperature, applied voltage, and tensile stress in real time, obtaining electrical signal data and stress-strain contour maps, among other data.

[0004] The purpose of this utility model is achieved through the following technical solutions.

[0005] An experimental system for multi-field coupling measurement of optoelectronic materials based on hyperspectral technology includes: a microscope and a hyperspectral camera mounted on the trinocular tube of the microscope; the eyepiece of the microscope is an electronic eyepiece; the stage of the microscope is a one-dimensional displacement platform, on which a micro-tension testing component is fixedly mounted, the one-dimensional displacement platform being used to move the micro-tension testing component along a horizontal plane, and the material to be tested being fixed on the micro-tension testing component; a temperature and tension regulator connected to the micro-tension testing component, used to control the temperature of the material to be tested within the micro-tension testing component and the tension on the material to be tested; an electrochemical workstation electrically connected to the material to be tested on the micro-tension testing component, used to test the current-voltage curve of the material to be tested; and the hyperspectral camera being used to acquire hyperspectral images of the material to be tested.

[0006] In the above technical solution, the electrochemical workstation and the material to be tested on the micro-tension testing component are electrically connected via gold electrodes.

[0007] In the above technical solution, the electronic eyepiece is connected to the computer.

[0008] Compared with the prior art, the present invention has the following beneficial effects:

[0009] This invention relates to a multi-field coupling measurement experimental system for optoelectronic materials that can simultaneously apply tensile deformation, temperature field, and electric field. This allows for in-depth study of the physicochemical properties of the test material under thermo-electric-mechanical multi-physics coupling conditions. It solves the problem of not being able to simultaneously obtain the spectral changes caused by changes in the microstructure and chemical composition of the test material under multiple fields. This invention also considers the relationship between changes in the microstructure, chemical composition, and mechanical properties of the test material. It uses an electronic eyepiece and hyperspectral imaging to dynamically and in real-time observe the testing process of the test material under thermo-electric-mechanical multi-physics coupling conditions. Attached Figure Description

[0010] Figure 1 This is a schematic diagram of the overall structure of the multi-field coupling measurement experimental system for optoelectronic materials.

[0011] Figure 2 To acquire electrical signal data of perovskite thin films under different tensile lengths using a multi-field coupling measurement experimental system for optoelectronic materials;

[0012] Figure 3 To acquire microstructure images of perovskite thin films before stretching using a multi-field coupling measurement experimental system for optoelectronic materials;

[0013] Figure 4 To acquire strain contour maps of perovskite thin films before and after stretching using a multi-field coupling measurement experimental system for optoelectronic materials;

[0014] Figure 5To acquire hyperspectral images of perovskite thin films before stretching using a multi-field coupling measurement experimental system for optoelectronic materials;

[0015] Figure 6 To acquire spectral curves of perovskite thin films under different tensile lengths using a multi-field coupling measurement experimental system for optoelectronic materials.

[0016] Among them, 1: microscope, 2: hyperspectral camera, 3: electronic eyepiece, 4: one-dimensional displacement platform, 5: micro-tension testing assembly, 6: temperature and tension regulator, 7: electrochemical workstation, 8: computer. Detailed Implementation

[0017] The technical solution of this utility model will be further described in detail below with reference to the accompanying drawings and embodiments.

[0018] Example 1

[0019] like Figure 1 As shown, an experimental system for multi-field coupling measurement of optoelectronic materials based on hyperspectral technology includes: a microscope 1 (manufacturer: Nikon, model: Eclipse E100) and a hyperspectral camera 2 (manufacturer: Spectral Imaging, model: FX10) mounted on the trinocular tube of the microscope. The eyepiece of the microscope 1 is an electronic eyepiece 3 (manufacturer: Nikon, model: DS-Fi3). The stage of the microscope 1 is a one-dimensional displacement platform 4 (manufacturer: SigmaTech, model: ST-100). A micro-tension testing component 5 (manufacturer: Shenzhen Maijie Technology, model: MJ-TS-500) is fixed on the one-dimensional displacement platform 4. The one-dimensional displacement platform 4 is used to move the micro-tension testing component 5 along the horizontal plane, and the material to be tested is fixed on the micro-tension testing component 5. The hyperspectral camera 2 is used to acquire hyperspectral images of the material under test. The temperature and tension regulator 6 (manufacturer: Shenzhen Maijie Technology, model: MJ-TS-500) is connected to the micro-tension testing component 5 and is used to control the temperature and tension of the material under test in the micro-tension testing component 5. The electrochemical workstation 7 (manufacturer: Shanghai Chenhua Instruments, model: CHI600E) is electrically connected to the material under test on the micro-tension testing component 5 (electrically connected through gold electrodes) and is used to test the current-voltage curve of the material under test.

[0020] A perovskite film was fixed as the test material on the micro-tension testing component 5 of the aforementioned optoelectronic material multi-field coupling measurement experimental system. The temperature of the perovskite film on the micro-tension testing component 5 was set to 25℃ using a temperature and tension regulator 6, and the perovskite film was stretched to a stretch length of 0.98 mm. During the stretching process, the temperature and tensile stress were recorded in real time. When the stretch length reached L (0 mm, 0.08 mm, 0.18 mm, 0.28 mm, 0.68 mm, and 0.98 mm), electrical signal data (current-voltage curves) at different stretch lengths were acquired using an electrochemical workstation 7. Figure 2 As shown.

[0021] The electronic eyepiece 3 is connected to the computer 8. During the stretching process described above, the electronic eyepiece 3 is used to observe and acquire microstructure images at different stretching lengths in real time. The microstructure image before stretching (L=0mm) is shown below. Figure 3 As shown; the microstructure images before and after stretching were processed by Vic-2D to obtain strain contour maps, as shown. Figure 4 As shown, hyperspectral images and spectral curves of the perovskite thin film at different stretching lengths were acquired using a hyperspectral camera 2. The hyperspectral image before stretching (L = 0 mm) is shown below. Figure 5 As shown, the spectral curves under different stretching lengths are as follows: Figure 6 As shown.

[0022] The present invention has been described above by way of example. It should be noted that any simple modifications, alterations or other equivalent substitutions that can be made by those skilled in the art without creative effort without departing from the core of the present invention fall within the protection scope of the present invention.

Claims

1. A multi-field coupling measurement experimental system for optoelectronic materials based on hyperspectral technology, characterized in that, include: The microscope and a hyperspectral camera mounted on its trinocular tube are included. The microscope eyepiece is an electronic eyepiece. The microscope stage is a one-dimensional displacement platform, on which a micro-tension testing component is fixed. The one-dimensional displacement platform is used to move the micro-tension testing component along a horizontal plane, and the test material is fixed on the micro-tension testing component. A temperature and tension regulator is connected to the micro-tension testing component to control the temperature and tension of the test material within the micro-tension testing component. An electrochemical workstation is electrically connected to the test material on the micro-tension testing component to test the current-voltage curve of the test material. The hyperspectral camera is used to acquire hyperspectral images of the test material.

2. The optoelectronic material multi-field coupling measurement experimental system according to claim 1, characterized in that, The electrochemical workstation is electrically connected to the material under test on the micro-tension testing assembly via gold electrodes.

3. The optoelectronic material multi-field coupling measurement experimental system according to claim 1, characterized in that, The electronic eyepiece is connected to a computer.

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