Biochip structure

Abstract

The utility model discloses a biological chip structure. The biological chip structure comprises a conductive base layer, the plurality of conductive salient points are distributed in an array and are formed on the surface of one side of the conductive base layer, and the conductive salient points and the conductive base layer are integrally formed; the insulating layer covers the surface of one side of the conductive base layer with the conductive salient points, an opening for exposing a part of the conductive salient points is formed in the insulating layer, the exposed part serves as an electrode point, and a gold plating layer can also be formed on the electrode point. According to the structure, electric field focusing is achieved through the array design of the conductive salient points, the working voltage requirement is lowered, and energy loss is reduced; the integrated design eliminates interface contact resistance and improves the current transmission efficiency; the design of the opening of the insulating layer accurately controls the electric field action range and enhances the space targeting; the design of a transition layer and a groove is omitted, the manufacturing complexity and cost are reduced, and the device is suitable for efficient transdermal delivery of active ingredients and is not limited to beauty and drug treatment scenes.

Description

Technical Field

[0001] This utility model relates to the field of biochips, and in particular to a biochip structure. Background Technology

[0002] Electroporation is a unique physical phenomenon of cells. Under the influence of an electric field, especially when the field strength exceeds a certain threshold, the dense structure composed of keratinocytes and the intercellular lipid layer physically rearranges to form transient channels, enabling efficient transdermal delivery of drugs / ingredients. However, traditional monopolar / bipolar electroporation technology still faces the following technical bottlenecks in practical applications:

[0003] 1. Low energy utilization efficiency

[0004] Existing bipolar electroporation systems rely on voltage gradients of over 100V to generate an effective electric field strength, but only 10%-20% of the energy actually acts on the target tissue. A large amount of energy is wasted in the form of heat loss or non-specific ionization, resulting in high power consumption, poor battery life, and the potential safety risks such as skin burns from continuous high voltage output.

[0005] 2. Insufficient space targeting capability

[0006] Traditional electrode configurations employ single-point or bipolar planar arrangements, resulting in a diffuse electric field distribution. Non-target areas, such as subcutaneous nerves and blood vessels, are easily exposed to high-intensity electric fields, leading to a narrow treatment window. Experimental data show that conventional dual-electrode systems at 1.5 J / cm²... 2 At the specified energy density, the electric field strength on the skin surface is only 30 V / cm, and the field strength decay is exponentially correlated with tissue depth.

[0007] 3. Limited penetration depth

[0008] Due to the limitations of electric field attenuation, the field strength retention rate of monopolar electroporation at a frequency of 1 Hz in the dermis is less than 20%. When the electric field penetrates to a depth of 4 mm under the skin, the field strength has attenuated to below 10 V / cm, which is insufficient to meet the treatment needs of deep lesions (such as scar tissue and hair follicle units).

[0009] Chinese Patent Publication No. CN115637225A discloses a microelectrode structure and its fabrication method, comprising: a base layer; a transition layer located on one side of the base layer, with a groove penetrating the transition layer; an electrode layer located on the side of the transition layer opposite to the base layer, the electrode layer covering the bottom and sidewalls of the groove, and covering the surface of the transition layer opposite to the base layer; an insulating layer located within the groove and on the side of the electrode layer opposite to the base layer, the insulating layer exposing a portion of the electrode layer on the side of the transition layer opposite to the base layer to form multiple microelectrode units; and an array of multiple microelectrode units. This microelectrode structure is based on a high-density, regular array arrangement of multiple small-sized microelectrode units, resulting in a large number of microelectrodes per unit area. The micro-scale and regular arrangement of the electrodes allows for a more uniform electric field distribution. The micro-scale electric field can be effectively focused onto cells, and the multilayer composite structure of the microelectrode structure has advantages such as strong inertness, good stability, and good biocompatibility. Although multiple microelectrode units are formed to achieve electroporation technology, the complex multilayer composite structure (including a substrate layer, transition layer, electrode layer, and insulating layer) makes the fabrication process cumbersome and costly. Furthermore, the interfaces of the multilayer materials may exhibit poor adhesion or stress concentration, affecting long-term stability and thus impacting the lifespan of products using this structure.

[0010] Therefore, overcoming the aforementioned shortcomings has become an important issue that urgently needs to be addressed by those skilled in the art. Utility Model Content

[0011] To address the problems of low energy utilization efficiency, insufficient spatial targeting, limited penetration depth, complex structure, cumbersome fabrication process, and high cost of existing biochips, this invention provides a biochip structure. To achieve the above objectives, this invention adopts the following technical solution:

[0012] A biochip structure, comprising:

[0013] Conductive base layer 1;

[0014] Multiple conductive bumps 2 are formed on one side surface of the conductive base layer 1;

[0015] An insulating layer 3 covers one side surface of the conductive base layer 1 with conductive bumps 2;

[0016] An opening 4 is formed on the insulating layer 3 to expose a portion of the conductive bump 2.

[0017] Preferably, the multiple conductive bumps 2 are arranged in an array.

[0018] Preferably, the conductive bumps 2 are integrally formed with the conductive base layer 1.

[0019] Preferably, a portion of each conductive bump 2 exposed outside the insulating layer 3 serves as an electrode point 21.

[0020] Preferably, it also includes a gold plating layer 5 formed on the electrode point 21.

[0021] Preferably, a portion of the exposed surface of the conductive bump 2 is planar.

[0022] Preferably, the spacing between two adjacent conductive bumps 2 is 1-999 micrometers.

[0023] Preferably, the multiple conductive bumps 2 are distributed in a circular array.

[0024] Preferably, the conductive bump 2 is truncated conical in shape, and the opening 4 is circular.

[0025] Compared with the prior art, the beneficial effects of this utility model are:

[0026] 1. This design utilizes an array of conductive bumps to focus the electric field on tiny local electrode points, achieving electric field focusing. Compared to existing large planar electrodes, this results in higher current density and lower operating voltage requirements. This allows for a stronger electric field even at lower voltages, enabling electroporation through the stratum corneum to ensure the delivery of active ingredients. The reduced voltage also prevents skin irritation, erythema, and other discomforts, improving the user experience. Furthermore, the focused electric field reduces energy diffusion to non-target areas, lowering the overall thermal effect and preventing the deactivation of active substances due to excessive heat. The conductive substrate and conductive bumps are integrally molded, eliminating the interfacial contact resistance of traditional multi-layer structures, reducing overall impedance, improving current transmission efficiency, and minimizing ineffective energy loss during transmission. The open design of the insulating layer allows for precise control of the electric field's range, preventing exposure of non-target tissues and enhancing spatial targeting. Additionally, the direct formation of conductive bumps on the substrate eliminates the need for transition layers and grooves, reducing manufacturing complexity and cost. Attached Figure Description

[0027] Figure 1 This is a schematic diagram of the structure of the biochip in Embodiment 1 of this case.

[0028] Figure 2 yes Figure 1 Enlarged diagram of point A.

[0029] Figure 3 yes Figure 1 A schematic diagram of the structure under the AA cross-sectional view.

[0030] Figure 4 yes Figure 3 Enlarged diagram of point B.

[0031] Figure 5 This is Example 2 of the case. Figure 4 A schematic diagram showing the addition of a gold plating layer to the base material. Detailed Implementation

[0032] The following examples provide a more detailed description of the features and other related characteristics of this utility model, to facilitate understanding by those skilled in the art:

[0033] Example 1

[0034] like Figures 1 to 4 As shown, a biochip structure includes: a conductive base layer 1, multiple conductive bumps 2, and an insulating layer 3; the conductive base layer 1 is made of conductive metal or conductive semiconductor material. Multiple arrayed conductive bumps 2 are formed on one side surface of the conductive base layer 1. The conductive bumps 2 are manufactured by electrochemical etching or laser engraving of the conductive base layer, and the conductive base layer 1 and the conductive bumps 2 are integrally formed. The insulating layer 3 is pressed onto one side surface of the conductive base layer 1 with the conductive bumps 2, covering both the side of the conductive base layer 1 with the conductive bumps 2 and the surface of the conductive bumps 2. Then, through a polishing process, the insulating layer of the conductive bumps 2 is polished away, exposing a portion of the conductive structure of the conductive bumps 2 as electrode points 21 that contact human skin.

[0035] As described above, this design utilizes an array of conductive bumps to focus the electric field on tiny local electrode points, achieving electric field focusing. Compared to existing large planar electrodes, this results in higher current density and reduces the required operating voltage. This allows for a stronger electric field even at lower operating voltages (e.g., at 50V, the local electric field strength at the electrode point can reach 200-300V / cm). Since this allows for electroporation through the stratum corneum, ensuring the delivery of active ingredients, it also reduces voltage, preventing skin irritation, erythema, and other discomfort, thus improving the user experience. Furthermore, the focused electric field reduces energy diffusion loss to non-target areas, thereby reducing the overall thermal effect and preventing the inactivation of active substances on the body due to excessive heat. The conductive base layer 1 and conductive bumps 2 are integrally molded, eliminating the interfacial contact resistance of traditional multi-layer structures, reducing overall impedance, improving current transmission efficiency, and reducing ineffective energy loss during transmission. The opening 4 of the insulating layer 3 allows for precise control of the electric field's effective range, avoiding exposure of non-target tissues and enhancing spatial targeting. Furthermore, by forming conductive bumps directly on the substrate, the transition layer and groove design are eliminated, reducing manufacturing complexity and cost.

[0036] In one preferred embodiment, a portion of the exposed surface of the conductive bump 2 is planar. Thus, the electrode points 21 exposed by the polishing process of the conductive bump 2 have a planar structure, resulting in uniform pressure distribution upon contact with the skin and preventing localized current concentration.

[0037] As a preferred implementation, the spacing between two adjacent conductive bumps 2 is 1-999 μm, preferably 20-600 μm. The height of each conductive bump ranges from 10-200 μm, preferably 100-200 μm; the diameter of each opening 4 ranges from 10-500 μm, preferably 50-200 μm. Thus, by limiting the spacing between adjacent conductive bumps and the opening diameter (i.e., the exposed top diameter of the conductive bump), a far greater number of conductive bumps than existing large electrodes can be integrated within the same unit area. When the same voltage or current is applied, the current can be more evenly distributed across the conductive bumps, effectively increasing the current density. The 1-999 μm, 10-200 μm, and 10-500 μm size ranges allow for flexible adaptation to different cell sizes or experimental requirements.

[0038] As a preferred implementation, multiple conductive bumps 2 are arranged in a circular array. Each conductive bump 2 is truncated conical in shape, and the opening 4 is circular. This circular array arrangement ensures that the electric field superposition area of ​​adjacent conductive bumps 2 is symmetrically distributed in a ring, optimizing the electric field focusing effect and avoiding localized hotspots. The truncated conical design of the conductive bumps 2 creates a gradually narrowing geometric structure, allowing the electric field to gradually increase from the bottom to the top, achieving a gradient distribution of the electric field. This avoids the localized high field strength (which can easily lead to cell damage) of traditional sharp conical electrodes, and enhances the electric field strength of deep tissues through geometric focusing. The circular opening design, with its smooth, non-sharp edges, matches the geometric symmetry of the truncated cone, uniformly dispersing thermal or mechanical stress between the insulating layer and the bumps, thus improving structural durability.

[0039] Example 2

[0040] like Figure 5 As shown, Embodiment 2 further includes, based on Embodiment 1, a gold plating layer 5 formed on electrode point 21. This improves the biocompatibility between the electrode and the skin.

[0041] In summary, the biochip structure of this invention significantly solves the core problems of traditional electroporation technology, such as low energy efficiency, high thermal effect, poor targeting and insufficient penetration depth, through the following innovative design. It is especially suitable for the efficient transdermal delivery of active ingredients and is not limited to cosmetic and drug treatment scenarios.

[0042] As stated above, this case protects a biochip structure, and all technical solutions that are the same as or similar to this case should be considered to fall within the scope of protection of this case.

Claims

1. A biochip structure, characterized in that, include: Conductive base layer (1); Multiple conductive bumps (2) are formed on one side surface of the conductive base layer (1); An insulating layer (3) is applied to one side surface of a conductive base layer (1) with conductive bumps (2); An opening (4) is formed on the insulating layer (3) to expose a portion of the conductive bump (2).

2. The biochip structure according to claim 1, characterized in that, Multiple conductive bumps (2) are distributed in an array.

3. The biochip structure according to claim 1, characterized in that, The conductive bumps (2) and the conductive base layer (1) are integrally formed.

4. The biochip structure according to claim 1, characterized in that, Each conductive bump (2) has a portion exposed outside the insulating layer (3) as an electrode point (21).

5. The biochip structure according to claim 4, characterized in that, Also includes: A gold plating layer (5) is formed on the electrode point (21).

6. The biochip structure according to claim 1, characterized in that, The surface of the conductive bump (2) that is exposed is a plane.

7. The biochip structure according to claim 1, characterized in that, The spacing between two adjacent conductive bumps (2) is 1-999 micrometers.

8. The biochip structure according to claim 1 or 2, characterized in that, Multiple conductive bumps (2) are distributed in a circular array.

9. The biochip structure according to claim 1, characterized in that, The conductive bump (2) is truncated cone-shaped, and the opening (4) is circular.

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