Semiconductor chip testing device

Abstract

The utility model discloses a semiconductor chip testing device, which relates to the field of chip testing and comprises a testing mainboard, a base is arranged at the top of the testing mainboard in a protruding manner, an accommodating cavity is formed in the top of the base, a testing cavity is formed in the center of the accommodating cavity, and a limiting frame seat is arranged on the accommodating cavity in an accommodating manner; limiting blocks are symmetrically arranged on the side edges of the limiting frame base in a protruding mode, limiting grooves are symmetrically formed in the two inner side edges of the containing cavity, the limiting grooves and the limiting blocks are connected in a matched and inserted mode, positioning cavities are formed in the positions, corresponding to the limiting grooves, in the base, positioning assemblies are installed at the positioning cavities, positioning holes are formed in the limiting blocks, and the positioning holes and the positioning assemblies are positioned in a matched mode. According to the utility model, before working, the corresponding limiting frame seats can be selected according to different sizes of corresponding chips, so that the corresponding chips with the corresponding sizes can be effectively fixed, and the chips with the different sizes can be stably clamped at the corresponding positions without dislocation and the like in a test state.

Description

Technical Field

[0001] This utility model relates to the field of chip testing, specifically a semiconductor chip testing device. Background Technology

[0002] With the continuous development of the semiconductor industry and the advancement of technology, the application of semiconductor chip testing equipment will continue to expand and deepen. In the future, testing equipment will become more intelligent, automated, and efficient, enabling faster testing of chip performance and quality issues, and providing more detailed and accurate test data and analysis reports. Simultaneously, with the continuous emergence of new materials and the application of new processes, testing equipment also needs constant updating and upgrading to adapt to new testing requirements. In summary, semiconductor chip testing equipment plays a crucial role in the semiconductor industry. Chip positioning frames, also known as IC positioning frames or test sockets, are standard testing equipment used to test the electrical performance and electrical connections of IC devices to check for manufacturing defects and component malfunctions.

[0003] Existing semiconductor chip testing equipment typically uses a fixed-size test area. Due to this fixed area, when testing semiconductor chips of different sizes, parts of the chip may detach from the test area, affecting the test results. This makes the equipment less adaptable to different work requirements, resulting in poor overall practicality. Therefore, a new semiconductor chip testing equipment is needed to address this issue. Utility Model Content

[0004] Based on this, the purpose of this utility model is to provide a semiconductor chip testing device to solve the problem that the test areas used for testing in existing semiconductor chip testing devices are mostly of fixed size. Because the test areas are fixed, when testing semiconductor chips of different sizes, it is easy for parts of the semiconductor chip to detach from the test area, affecting the test results. Therefore, the device cannot adapt well to different working requirements, and the overall practicality of the testing device is poor, failing to meet the technical problem of different working requirements.

[0005] To achieve the above objectives, the present invention provides the following technical solution: a semiconductor chip testing device, including a test motherboard, a base protruding from the top of the test motherboard, a receiving cavity formed at the top of the base, a test cavity formed at the center of the receiving cavity, and a limiting frame seat accommodating the receiving cavity;

[0006] The limiting frame is symmetrically provided with limiting blocks on its side, and the two inner sides of the receiving cavity are symmetrically provided with limiting grooves. The limiting grooves and the limiting blocks are fitted together. The base is provided with a positioning cavity corresponding to the limiting groove. A positioning component is installed in the positioning cavity. The limiting block is provided with a positioning hole. The positioning hole and the positioning component are fitted together for positioning.

[0007] The present invention is further configured such that the positioning component includes an embedding disk rotatably mounted on the base, a lead screw horizontally fixed on one side of the embedding disk, a positioning pin sleeved on the lead screw, the positioning pin and the lead screw being threadedly engaged, and the lead screw being inserted into the positioning hole.

[0008] The present invention is further configured such that the vertical cross-sections of the positioning post and the positioning hole are both hexagonal.

[0009] The present invention is further configured such that a top seat is fixed to one end of the base by a pin, and a pressure plate is protruding from one side of the top seat facing the base.

[0010] The present invention is further configured such that a slot is provided at the front end of the base, a tension rod is fixed at the slot, a tension groove is provided at the end of the top seat away from the pin, a tensioning assembly is installed at the tension groove, and the tension rod and the tensioning assembly are fixed together.

[0011] The present invention is further configured such that the tensioning assembly includes a first tensioning block and a second tensioning block. A protruding plate is provided at one end of the first tensioning block facing the second tensioning block. An insertion groove for the protruding plate to be inserted is provided inside the second tensioning block. The second tensioning block is hingedly installed in the tensioning groove. A first connecting seat is provided at the top of the first tensioning block. A second connecting seat is provided at the top of the second tensioning block. An adjusting rod is installed through the second connecting seat. One end of the adjusting rod is rotatably embedded in the first connecting seat. The second connecting seat and the adjusting rod are threadedly engaged. A rotating rod is fixed at the end of the adjusting rod away from the first connecting seat.

[0012] The present invention is further configured such that mounting holes are provided at all four corners of the test motherboard, and the mounting holes penetrate the test motherboard.

[0013] In summary, the present invention has the following advantages: Through the cooperation between the detachable limiting frame, positioning hole, and positioning components, the present invention allows for the selection of the appropriate limiting frame according to the different chip sizes before operation. The limiting frame is then inserted into the receiving cavity, and the limiting block is inserted into the cavity. Rotating the embedding disc causes the lead screw to rotate, and the threaded engagement between the positioning pin and the lead screw causes the positioning pin to move and insert into the positioning hole, thus completing the overall positioning and fastening of the limiting frame. After installation, the limiting frame facilitates the effective fixing of chips of corresponding sizes, ensuring that chips of different sizes can be stably clamped in their corresponding positions during testing, without misalignment.

[0014] By cooperating with the tension rod on the base and the tensioning assembly on the top seat, the top seat cover is installed on the top of the base. The bottom of the first tension block is snapped into the tension rod. As the tension rod rotates, it drives the adjusting rod to rotate as a whole. The second connecting seat is threadedly engaged with the adjusting rod, thereby causing the adjusting rod to move the first tension block as a whole. As the first tension block moves, it pulls the tension rod, thus ensuring a stable and tight connection between the base and the top seat. This minimizes the possibility of poor contact between the chip and the test cavity due to incomplete connection between the base and the top seat during testing, which could lead to testing problems. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the structure of this utility model;

[0016] Figure 2 This is a structural schematic diagram of the disassembly limiting frame seat of this utility model;

[0017] Figure 3 This is a longitudinal sectional view of the positioning component corresponding to the base of this utility model;

[0018] Figure 4 This is a longitudinal sectional view of the tensioning assembly of this utility model.

[0019] In the diagram: 1. Test mainboard; 2. Base; 3. Receiving cavity; 4. Limiting groove; 5. Limiting frame seat; 51. Test cavity; 6. Limiting block; 61. Positioning hole; 7. Positioning assembly; 8. Embedding plate; 9. Positioning insert; 10. Lead screw; 11. Top seat; 111. Pressure plate; 12. Tensioning rod; 13. Tensioning assembly; 14. First tensioning block; 141. Protruding plate; 15. Second tensioning block; 151. Insertion groove; 16. First connecting seat; 17. Second connecting seat; 18. Adjusting rod; 19. Rotating rod; 20. Mounting hole. Detailed Implementation

[0020] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0021] A semiconductor chip testing device, such as Figure 1 , Figure 2 and Figure 3 As shown, the test motherboard 1 has mounting holes 20 at each of its four corners, which penetrate the test motherboard 1 and allow it to be fixed in place. A base 2 protrudes from the top of the test motherboard 1, and a receiving cavity 3 is formed at the top of the base 2. A test cavity 51 is located at the center of the receiving cavity 3. A limiting frame 5 is installed on the receiving cavity 3, and limiting blocks 6 are symmetrically protruding from the sides of the limiting frame 5. Limiting grooves 4 are symmetrically formed on the two inner sides of the receiving cavity 3. The limiting groove 4 and the limiting block 6 are connected by an insertion. A positioning cavity is provided inside the base 2 corresponding to the limiting groove 4. A positioning component 7 is installed in the positioning cavity. A positioning hole 61 is provided on the limiting block 6. The positioning hole 61 and the positioning component 7 are connected by an insertion. The positioning component 7 includes an embedding plate 8 that is rotatably embedded on the base 2. A lead screw 10 is horizontally fixed on one side of the embedding plate 8. A positioning pin 9 is sleeved on the lead screw 10. The positioning pin 9 and the lead screw 10 are threaded together. The lead screw 10 and the positioning hole 61 are connected by an insertion.

[0022] Through the cooperation between the detachable limiting frame 5, the positioning hole 61, and the positioning component 7, the corresponding limiting frame 5 can be selected according to the different chip sizes before operation. The limiting frame 5 is inserted into the receiving cavity 3, and the limiting block 6 is inserted into the receiving cavity 3. The embedding plate 8 is rotated, which drives the lead screw 10 to rotate as a whole. The positioning pin 9 is threadedly engaged with the lead screw 10, thereby moving the positioning pin 9 as a whole and inserting it into the positioning hole 61. This completes the overall positioning and fastening of the limiting frame 5. After the limiting frame 5 is installed, it is convenient to effectively fix the corresponding chip size, ensuring that chips of different sizes can be stably locked in the corresponding positions during testing, without misalignment.

[0023] The vertical cross-sections of the aforementioned positioning pin 9 and positioning hole 61 are both hexagonal. Through the positioning pin 9 with its hexagonal vertical cross-section, it can be ensured that the positioning pin 9 can only move laterally during the adjustment process and will not rotate with the rotation of the lead screw 10.

[0024] Reference Figure 1 , Figure 2 and Figure 4As shown, a top seat 11 is fixed to one end of the base 2 by a pin. A pressure plate 111 protrudes from one side of the top seat 11 facing the base 2. A slot is provided at the front of the base 2, and a tension rod 12 is fixed in the slot. A tension groove is provided at the end of the top seat 11 away from the pin, and a tensioning assembly 13 is installed in the tension groove. The tension rod 12 and the tensioning assembly 13 are fixed together. The tensioning assembly 13 includes a first tensioning block 14 and a second tensioning block 15. A protruding plate 141 protrudes from the end of the first tensioning block 14 facing the second tensioning block 15. The second tension block 15 has an insertion groove 151 inside for the protruding plate 141 to be inserted. The second tension block 15 is hinged in the tension groove. The first tension block 14 has a first connecting seat 16 protruding from its top. The second tension block 15 has a second connecting seat 17 protruding from its top. An adjusting rod 18 is installed through the second connecting seat 17. One end of the adjusting rod 18 is rotatably embedded in the first connecting seat 16. The second connecting seat 17 and the adjusting rod 18 are threaded together. A rotating rod 19 is fixed to the end of the adjusting rod 18 away from the first connecting seat 16.

[0025] By cooperating with the tension rod 12 on the base 2 and the tension assembly 13 on the top seat 11, the top seat 11 is installed over the top of the base 2. The bottom of the first tension block 14 is snapped into the tension rod 12 and rotated. Rotating the rotating rod 19 causes the adjusting rod 18 to rotate as a whole. The second connecting seat 17 is threadedly engaged with the adjusting rod 18, thereby causing the adjusting rod 18 to move the first tension block 14 as a whole. During the movement of the first tension block 14, the first tension block 14 pulls the tension rod 12, thus ensuring a stable and tight connection between the base 2 and the top seat 11. This can minimize the possibility of problems such as poor contact between the chip and the test cavity 51 due to incomplete connection between the base 2 and the top seat 11 during testing.

[0026] The working principle of this utility model:

[0027] When different sizes of chips need to be installed, the corresponding limiting frame 5 is selected according to the size of the corresponding chip. The limiting frame 5 is inserted into the receiving cavity 3, and the limiting block 6 is inserted into the receiving cavity 3. The embedding disk 8 is rotated, which drives the lead screw 10 to rotate as a whole. The positioning pin 9 is threadedly engaged with the lead screw 10, thereby moving the positioning pin 9 as a whole and inserting it into the positioning hole 61, thus completing the overall positioning and fastening of the limiting frame 5.

[0028] When testing a semiconductor chip, the chip is placed in the test chamber 51, and the top seat 11 is installed on top of the base 2. The bottom of the first tensioning block 14 is snapped onto the tensioning rod 12. Rotating the rotating rod 19 causes the adjusting rod 18 to rotate as a whole. The second connecting seat 17 is threadedly engaged with the adjusting rod 18, thereby causing the adjusting rod 18 to move the first tensioning block 14 as a whole. During the movement of the first tensioning block 14, the first tensioning block 14 moves as a whole, thereby pulling the tensioning rod 12, thus stably tightening the connection between the base 2 and the top seat 11.

[0029] Although embodiments of the present invention have been shown and described, these specific embodiments are merely explanations of the present invention and are not intended to limit the invention. The specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. After reading this specification, those skilled in the art may make modifications, substitutions, and variations to the embodiments as needed without departing from the principles and spirit of the present invention, provided that such modifications, substitutions, and variations are within the scope of the claims of the present invention and are protected by patent law.

Claims

1. A semiconductor chip testing apparatus, comprising a test motherboard (1), characterized in that: The test motherboard (1) has a base (2) protruding from the top, and a receiving cavity (3) is opened at the top of the base (2). A test cavity (51) is provided at the center of the receiving cavity (3), and a limiting frame seat (5) is provided on the receiving cavity (3). The limiting frame (5) has symmetrically protruding limiting blocks (6) on its side. The two inner sides of the receiving cavity (3) have symmetrically opened limiting grooves (4). The limiting grooves (4) and the limiting blocks (6) are fitted together. The base (2) has a positioning cavity corresponding to the limiting grooves (4) inside. A positioning component (7) is installed in the positioning cavity. The limiting block (6) has a positioning hole (61). The positioning hole (61) and the positioning component (7) are fitted together for positioning.

2. The semiconductor chip testing apparatus according to claim 1, characterized in that: The positioning component (7) includes an embedding disc (8) rotatably mounted on the base (2). A lead screw (10) is horizontally fixed on one side of the embedding disc (8). A positioning pin (9) is sleeved on the lead screw (10). The positioning pin (9) and the lead screw (10) are threaded together. The lead screw (10) is inserted into the positioning hole (61).

3. The semiconductor chip testing apparatus according to claim 2, characterized in that: The vertical cross-sections of the positioning pin (9) and the positioning hole (61) are both hexagonal.

4. The semiconductor chip testing apparatus according to claim 1, characterized in that: The top end of the base (2) is fixed with a top seat (11) by a pin, and a pressure plate (111) is provided on the side of the top seat (11) facing the base (2).

5. A semiconductor chip testing apparatus according to claim 4, characterized in that: The base (2) has a slot at the front end, and a tension rod (12) is fixed in the slot. The top seat (11) has a tension groove at the end away from the pin, and a tensioning assembly (13) is installed in the tension groove. The tension rod (12) and the tensioning assembly (13) are fixed together.

6. The semiconductor chip testing apparatus according to claim 5, characterized in that: The tensioning assembly (13) includes a first tensioning block (14) and a second tensioning block (15). The first tensioning block (14) has a protruding plate (141) protruding from one end toward the second tensioning block (15). The second tensioning block (15) has an insertion groove (151) for the protruding plate (141) to be inserted into. The second tensioning block (15) is hinged in the tensioning groove. The top of the first tensioning block (14) has a first connecting seat (16) protruding from the top. The top of the second tensioning block (15) has a second connecting seat (17) protruding from the top. An adjusting rod (18) is installed through the second connecting seat (17). One end of the adjusting rod (18) is rotatably embedded in the first connecting seat (16). The second connecting seat (17) and the adjusting rod (18) are threaded together. A rotating rod (19) is fixed to the end of the adjusting rod (18) away from the first connecting seat (16).

7. A semiconductor chip testing apparatus according to claim 1, characterized in that: The test motherboard (1) has mounting holes (20) at each of its four corners, and the mounting holes (20) penetrate the test motherboard (1).

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