Desktop computer mainboard on-board BGA central processing unit DDR6 memory structure

Abstract

The utility model discloses a desktop computer mainboard on-board BGA central processing unit DDR6 memory structure, which belongs to the technical field of desktop computer mainboard structures, and comprises a mainboard, an on-board BGA central processing unit is arranged in the middle of the upper end of the upper surface of the mainboard, a heat conduction plate is arranged above the on-board BGA central processing unit, and the heat conduction plate is connected with the mainboard. The mainboard comprises an onboard BGA central processing unit, a DDR6 memory slot is formed in one side of the onboard BGA central processing unit, a 24PIN power supply interface is formed in one side of the DDR6 memory slot, a plurality of vertically-arranged SATA interfaces are formed below the 24PIN power supply interface, and a startup jumper needle port and a Type-C needle port are sequentially formed in the lower edge position of the upper surface of the mainboard from right to left. The CPU of the mainboard is integrally packaged by adopting the BGA, and meanwhile, a special DDR6 slot is designed to be matched with a relevant IO interface and a mainboard needle port, so that the mainboard has better transmission rate, higher stability, lower power consumption and larger capacity, can meet the requirement of a current computer for large throughput data volume of AI large model operation, and is externally connected with a plurality of electronic devices.

Description

Technical Field

[0001] This utility model relates to the technical field of desktop motherboard structure, and more specifically, to a desktop motherboard onboard BGA central processing unit DDR6 memory structure. Background Technology

[0002] In the current technology, the central processing unit (CPU) on the desktop motherboard mostly adopts a detachable connection method. The pins are located on the motherboard, and the CPU is fixed to the corresponding pins by clips to achieve connection. In actual use, due to improper installation and multiple disassemblies, the pins on the motherboard are easily damaged, resulting in high repair costs.

[0003] BGA packaging technology, used in laptop motherboards, connects chips to the circuit board via solder balls to achieve signal transmission. Its advantages include: 1. High I / O density: BGA packaging utilizes the space on the back of the chip, achieving higher pin density and meeting the needs of high-performance electronic products; 2. Good heat dissipation performance: Using solder balls results in lower thermal resistance and a larger heat dissipation area, improving heat dissipation; 3. High reliability: It reduces stress caused by differences in thermal expansion coefficients, lowers the risk of warping and cracking, avoids solder nodules, and improves reliability; 4. Self-alignment capability: During reflow soldering, BGA packaging can automatically align with the pads on the circuit board, simplifying the manufacturing process and improving production line efficiency; 5. Easy to automate production: Automated mechanical assembly improves production efficiency and is suitable for large-scale production.

[0004] Secondly, the mainstream DDR5 memory on desktop motherboards currently has a maximum frequency of 6400MHz, a speed of 3200MT / s to 8800MT / s, a bandwidth of 64-bit, 32 banks, 2 sub-channels, a voltage of 1.1V, a maximum DIMM capacity of 128GB, and a latency of CL36 to CL40. Although these figures are good, due to the current demand for large-throughput data in AI model computation, their performance is still insufficient to meet the needs of AI creation.

[0005] DDR6 is a new generation of computer memory specifications. Compared with DDR5 memory, DDR6 has a frequency of up to 12800 to 21000 MHz, a speed of 12800 MT / s to 21000 MT / s, a bandwidth of 128-bit, 64 banks, 4 sub-channels, a voltage of 1.0V, a maximum DIMM capacity of 256GB, and better latency as well as various new features such as dynamic voltage and frequency adjustment technology.

[0006] There is no existing desktop motherboard design structure that uses the aforementioned technology. Utility Model Content

[0007] The purpose of this invention is to provide a desktop motherboard with an onboard BGA CPU DDR6 memory structure. The CPU of this motherboard adopts a BGA integrated package and is designed with a dedicated DDR6 slot. With the relevant I / O interface and motherboard pins, it has a good transmission rate, high stability, low power consumption, and larger capacity, which can meet the current computer's demand for large throughput data for AI large model calculations and connect to multiple external electronic devices.

[0008] To achieve the above objectives, the technical solution adopted by this utility model is as follows:

[0009] A desktop motherboard with an onboard BGA CPU and DDR6 memory structure includes a motherboard. An onboard BGA CPU is located at the center of the upper top surface of the motherboard. A heatsink is mounted above the onboard BGA CPU. A DDR6 memory slot is located on one side of the onboard BGA CPU. A 24-pin power connector is located on one side of the DDR6 memory slot. Several vertically arranged SATA interfaces are located below the 24-pin power connector. From right to left, the lower edge of the motherboard's upper surface features a power-on jumper, a Type-C connector, a TPM connector, a USB 2.0 connector, a USB 3.0 connector, a DUG connector, a system fan connector, a COM connector, and an audio connector.

[0010] As a further optimization of this solution, the motherboard below the onboard BGA central processing unit is provided with three PCIe 5.0×4 M.2 interfaces arranged vertically and horizontally. The middle M.2 interface is provided with a graphics card interface above it, and the lower M.2 interface is provided with a PCIe 4.0×4 interface below it.

[0011] As a further optimization of this solution, an 8-pin power supply interface is provided on the motherboard on the other side above the onboard BGA central processing unit.

[0012] As a further optimization of this solution, an I / O interface panel is provided on the other edge of the upper surface of the motherboard. A DP1.4 interface is located on the far left of the I / O interface panel. Below the DP1.4 interface are dual HDMI2.0 interfaces. To the right of the HDMI2.0 interface on the right side is a clear CMOS button. To the right of the clear CMOS button are two stacked sets of four USB 3.2 Gen 1 interfaces. To the right of the USB 3.2 Gen 1 interfaces on the right side is a Type-C interface. To the right of the Type-C interface are two stacked USB 2.0 interfaces, and above these two USB 2.0 interfaces is a network interface. To the right of the two USB 2.0 interfaces is a Wi-Fi antenna, and to the right of the Wi-Fi antenna is an audio interface.

[0013] Compared with existing technologies, the beneficial effects of this utility model are as follows:

[0014] In this invention, the motherboard uses an onboard BGA CPU combined with DDR6 memory slots and other related electronic components. Compared to the detachable CPU and DDR5 memory on traditional desktop motherboards, the data transfer rate of the memory is twice that of DDR5 modules, potentially reaching a theoretical limit of 21,000 MT / s. In comparison, DDR6's higher data channels offer an effective bandwidth of 47GB per second, significantly increasing bandwidth. DDR6 also boasts higher capacity, lower voltage, and lower latency, making it particularly suitable for the high-throughput data demands of AI large-scale model computations. Furthermore, the CAMM2 memory module, designed for DDR6 memory slots, reduces circuit distance by half compared to traditional SO-DIMM designs, to only 1.5 inches, reducing power consumption and increasing data transfer speed, providing powerful computing support for AI applications.

[0015] This invention features a rich array of I / O interface panels and motherboard headers for motherboards with onboard BGA CPUs and DDR6 memory slots, including multiple commonly used USB 3.2 Gen 1 interfaces, USB 2.0 interfaces, and Type-C interfaces. This facilitates the expansion of the computer with more external devices, enabling the computer to utilize the results of large-scale AI model calculations and improve the working efficiency of external devices. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the motherboard structure of this utility model;

[0017] Figure 2 This is a schematic diagram of the motherboard I / O interface structure of this utility model;

[0018] In the diagram: 1. Motherboard; 2. Heatsink; 3. DDR6 memory slot; 4. 24-pin power connector; 5. SATA connector; 6. Power jumper; 7. Type-C connector; 8. TPM connector; 9. USB 2.0 connector; 10. USB 3.0 connector; 11. DUG connector; 12. System fan connector; 13. COM connector; 14. Audio connector; 15. PCIe 4.0 x4 interface; 16. M.2 interface; 17. Graphics card interface; 18. 8-pin power connector; 19. DP 1.4 interface; 20. HDMI 2.0 interface; 21. Clear CMOS button; 22. USB 3.2 Gen 1 interface; 23. Type-C interface; 24. USB 2.0 interface; 25. Network interface; 26. WIFI antenna; 27. Audio interface. Detailed Implementation

[0019] To make the technical means, creative features, objectives and effects of this utility model easier to understand, the following description, in conjunction with specific illustrations, further elaborates on this utility model.

[0020] To address the issues of easily damaged pins on existing desktop motherboards, high repair costs, and the inability of existing DDR5 memory to meet the high throughput of AI large model data computing;

[0021] like Figure 1 As shown, this application includes a motherboard 1. An onboard BGA CPU is located at the middle of the upper part of the upper surface of the motherboard 1. A heat dissipation plate 2 is installed above the onboard BGA CPU. A DDR6 memory slot 3 is located on one side of the onboard BGA CPU. A 24-pin power supply interface 4 is located on one side of the DDR6 memory slot 3. Several vertically arranged SATA interfaces 5 are located below the 24-pin power supply interface 4. From right to left, the lower edge of the upper surface of the motherboard 1 has a power-on jumper 6, a Type-C interface 7, a TPM interface 8, a USB 2.0 interface 9, a USB 3.0 interface 10, a DUG interface 11, a system fan interface 12, a COM interface 13, and an audio interface 14.

[0022] The motherboard 1 below the onboard BGA central processing unit has three PCIe 5.0×4 M.2 interfaces 16 arranged vertically. The middle M.2 interface 16 is located above a graphics card interface 17, and the bottom M.2 interface 16 is located below a PCIe 4.0×4 interface 15.

[0023] An 8-pin power connector 18 is located on the motherboard 1 on the other side above the onboard BGA central processing unit;

[0024] like Figure 2As shown, an I / O interface panel is located on the other side edge of the upper surface of the motherboard 1. On the far left of the I / O interface panel is a DP1.4 interface 19. Below the DP1.4 interface 19 are two HDMI2.0 interfaces 20. To the right of the HDMI2.0 interface 20 on the right side is a clear CMOS button 21. To the right of the clear CMOS button 21 are two stacked USB3.2 gen1 interfaces 22, totaling four. To the right of the USB3.2 gen1 interfaces 22 on the right side is a Type-C interface 23. To the right of the Type-C interface 23 are two stacked USB 2.0 interfaces 24, and above the two USB 2.0 interfaces 24 is a network interface 25. To the right of the two USB 2.0 interfaces 24 is a WIFI antenna 26, and to the right of the WIFI antenna 26 is an audio interface 27.

[0025] Specifically, the motherboard uses an onboard BGA CPU combined with DDR6 memory slot 3 and other related electronic components. Compared to the detachable CPU and DDR5 memory on traditional desktop motherboards, the memory's data transfer rate is twice that of DDR5 modules, potentially reaching a theoretical limit of 21,000MT / s. In comparison, DDR6's higher data channels offer an effective bandwidth of up to 47GB per second, significantly increasing bandwidth. DDR6 also boasts higher capacity, lower voltage, and lower latency, making it particularly suitable for the high-throughput data demands of AI large-scale model computations. Secondly, the CAMM2 memory module designed for DDR6 memory slot 3 has a circuit distance halved compared to the traditional SO-DIMM design, at only 1.5 inches, reducing power consumption and increasing data transfer speed, providing powerful computing support for AI applications.

[0026] The computer features a rich array of I / O ports and motherboard headers, including multiple commonly used USB 3.2 Gen 1 ports 22, USB 2.0 ports 24, and Type-C ports 23. This allows for easy expansion of the computer with more external devices, enabling the use of the computer's large-scale AI model calculations to improve the efficiency of external devices. For example, the latest NVIDIA 5090 graphics card can be connected via the PCIe 5.0 x16 graphics card port 17 to perform large-scale AI model calculations on the computer for game frame interpolation. Combined with the Thunderbolt 5-supporting Type-C port 23, an external monitor can be connected to achieve an 8K HDR display, providing gamers with a maximum refresh rate of 540Hz.

[0027] All standard parts used in this utility model can be purchased from the market, and irregular parts can be customized according to the description and drawings. The specific connection methods of each part adopt conventional methods such as bolts, rivets, and welding that are mature in the prior art. The machinery, parts and equipment adopt conventional models in the prior art, and the circuit connection adopts conventional connection methods in the prior art, which will not be described in detail here.

[0028] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A desktop motherboard onboard BGA central processing unit DDR6 memory structure, comprising a motherboard, characterized in that: The motherboard has an onboard BGA CPU located at the top center of its upper surface. A heatsink is mounted above the onboard BGA CPU. A DDR6 memory slot is located to one side of the onboard BGA CPU, and a 24-pin power connector is located to the same side. Several vertically arranged SATA connectors are located below the 24-pin power connector. From right to left, the lower edge of the motherboard's upper surface has a power-on jumper, a Type-C connector, a TPM connector, a USB 2.0 connector, a USB 3.0 connector, a DUG connector, a system fan connector, a COM connector, and an audio connector.

2. The desktop motherboard onboard BGA central processing unit DDR6 memory structure according to claim 1, characterized in that: The motherboard below the onboard BGA central processing unit has three PCIe 5.0×4 M.2 interfaces arranged vertically and horizontally. The middle M.2 interface is located above a graphics card interface, and the bottom M.2 interface is located below a PCIe 4.0×4 interface.

3. The desktop motherboard onboard BGA central processing unit DDR6 memory structure according to claim 2, characterized in that: An 8-pin power supply interface is located on the motherboard on the other side above the onboard BGA central processing unit.

4. The desktop motherboard onboard BGA central processing unit DDR6 memory structure according to claim 1, characterized in that: The motherboard has an I / O interface panel on the other side edge of its upper surface. A DP 1.4 port is located on the far left of the I / O interface panel. Below the DP 1.4 port are two HDMI 2.0 ports. To the right of the right HDMI 2.0 port is a clear CMOS button. To the right of the clear CMOS button are two stacked sets of four USB 3.2 Gen 1 ports. To the right of the right USB 3.2 Gen 1 ports is a Type-C port. To the right of the Type-C port are two stacked USB 2.0 ports, with a network port above them. To the right of the two USB 2.0 ports is a Wi-Fi antenna, and to the right of the Wi-Fi antenna is an audio jack.

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