Inductor with high heat dissipation performance

Abstract

The utility model relates to the technical field of inductors, in particular to an inductor with high heat dissipation performance, which comprises a circuit board, a lower mounting rack, an upper mounting rack, a heat dissipation fin cover, a miniature electric fan, a shielding cover and an inductor body, the top of the circuit board is clamped with the lower mounting rack, and the top of the lower mounting rack is clamped with the upper mounting rack; a heat dissipation fin cover is clamped between the upper mounting frame and the lower mounting frame, a micro electric fan is arranged at the top of the upper mounting frame, a shielding cover is clamped on the inner side of the heat dissipation fin cover, and an inductor body is arranged in the shielding cover. According to the utility model, the dual modes of passive heat dissipation and active air cooling are realized through the synergistic effect of the heat dissipation fin cover and the micro electric fan; a limiting group consisting of a spring and a clamping ball is arranged in the clamping seat, and the clamping ball is embedded into a pin groove to form mechanical occlusion, so that the pin is prevented from loosening or falling off in a vibration environment; the pins are tightly matched with the hole sites of the circuit board, and the bottom end of the clamping seat is flush with the reinforcing guide columns, so that stress is dispersed, and stable contact between the pins and the circuit board is ensured.

Description

Technical Field

[0001] This utility model relates to the field of inductor technology, and in particular to an inductor with high heat dissipation performance. Background Technology

[0002] As the core energy storage component of power electronic systems, the performance of inductors directly affects circuit stability and energy conversion efficiency.

[0003] Traditional inductors typically use straight metal leads to be fixed to the circuit board via through-hole soldering or crimping, relying on the friction between the leads and the mounting holes to maintain the connection.

[0004] However, in high-vibration environments such as automotive electronics and industrial equipment, the pure frictional contact between the pins and the circuit board can easily generate micron-level displacement. Under long-term cyclic stress, the contact surface gradually wears down, leading to increased contact resistance and causing local overheating or even the risk of circuit breakage. In addition, the Joule heat generated by the windings when the inductor is working is mainly conducted to the surrounding air through the magnetic core and frame. However, the traditional structure does not have a dedicated heat dissipation channel, and heat is easily accumulated in the gap between the magnetic cores, causing the local temperature rise to exceed the tolerance limit of the insulation material.

[0005] Therefore, there is an urgent need to develop an inductor with high heat dissipation performance. Utility Model Content

[0006] In order to overcome the shortcomings of the existing technology, the present invention provides an inductor with high heat dissipation performance.

[0007] The technical solution of this utility model is as follows: a high heat dissipation performance inductor, including a circuit board, a lower mounting bracket, an upper mounting bracket, a heat dissipation fin cover, a miniature fan, a shielding cover, an inductor body, wires, pins, a mounting bracket, and a controller. The lower mounting bracket is snapped onto the top of the circuit board, and the upper mounting bracket is snapped onto the top of the lower mounting bracket. A heat dissipation fin cover is snapped between the upper and lower mounting brackets. A miniature fan is provided on the top of the upper mounting bracket. A shielding cover is snapped onto the inside of the heat dissipation fin cover. The inductor body is located inside the shielding cover. The wires of the inductor body pass through the heat dissipation fin cover and the shielding cover and are inserted into both sides of the inside of the circuit board. The pins at both ends of the wires of the inductor body are inserted into the inside of the circuit board, and the pin ends penetrate the circuit board. Mounting brackets are provided on both sides of the bottom of the circuit board corresponding to the through ends of the pins. The pin ends are snapped into the mounting brackets. A limiting group is provided inside the mounting brackets, and the limiting group engages with the pins. A controller is provided on one side of the top of the upper mounting bracket, and the controller is connected to the wires of each power component.

[0008] Optionally, the limiting assembly includes a spring and a retaining ball. Positioning grooves are provided on both sides of the retaining seat, and springs are connected in each positioning groove. The two springs inside the retaining seat are connected to the retaining ball at their closest ends, and grooves adapted to the ends of the retaining balls are provided on both sides of the lower part of the pin.

[0009] Optionally, it also includes limiting blocks. Multiple limiting blocks are provided on the top of the circuit board corresponding to the periphery of the lower mounting bracket, and the multiple limiting blocks are all in close contact with the outer surface of the lower mounting bracket.

[0010] Optionally, it also includes a temperature sensor, which is mounted on one side of the bottom of the upper mounting bracket, close to the heat sink fin cover.

[0011] Optionally, it also includes a reinforcing guide post, with the bottom of the lower fixing frame having a reinforcing guide post that is inserted into and protrudes from the bottom of the circuit board.

[0012] Optionally, the bottom end of the card holder and the bottom end of the reinforcing guide post are at the same plane height.

[0013] The present invention has the following advantages: 1. The present invention achieves both passive heat dissipation and active air cooling modes through the synergistic effect of heat dissipation fin cover and miniature fan; the card holder is equipped with a limiting group composed of spring and ball, and the ball is embedded in the pin groove to form a mechanical engagement, preventing the pin from loosening or falling out under vibration; the pin and the circuit board hole are tightly matched, and the bottom of the card holder is flush with the reinforcing guide post to disperse stress and ensure stable contact between the pin and the circuit board.

[0014] 2. This utility model simplifies the installation process and facilitates maintenance and replacement by using a snap-fit ​​assembly of the lower mounting bracket, upper mounting bracket and heat sink fin cover; the circuit board serves as an integrated carrier, and the mounting bracket is laterally limited and longitudinally rigidly supported by limiting blocks and reinforcing guide posts, thereby enhancing the overall structural vibration resistance.

[0015] 3. This utility model uses a spring to provide continuous pressure, allowing the ball to adapt to the insertion depth of the pin, ensuring reliable engagement under different vibration intensities; multiple limit blocks are in close contact with the outer surface of the lower mounting bracket, limiting the horizontal displacement of the mounting bracket and avoiding misalignment caused by assembly tolerances or external forces.

[0016] 4. This utility model uses a temperature sensor to monitor the temperature of the heat sink fin cover in real time, and the controller dynamically starts and stops the miniature fan according to the feedback, so as to achieve a precise balance between heat dissipation intensity and energy consumption; the reinforced guide post is embedded in the bottom of the circuit board, which increases the connection strength between the mounting bracket and the circuit board, disperses vibration energy, and prevents fatigue breakage at the connection. Attached Figure Description

[0017] Figure 1 This is a three-dimensional structural diagram of the present invention.

[0018] Figure 2 This is a cross-sectional view of the circuit board, lower mounting bracket, and heat sink cover of this utility model.

[0019] Figure 3 This is a cross-sectional schematic diagram of the shielding cover, inductor body, and wires of this utility model.

[0020] Figure 4 This is a cross-sectional view of the pins, card holder, and spring components of this utility model.

[0021] Figure 5 This is a cross-sectional schematic diagram of the components of this utility model, including the card holder, spring, and ball.

[0022] Figure 6 This is a cross-sectional schematic diagram of the card holder, pins, and ball bearings of this utility model.

[0023] The markings in the attached diagram are: 1-Circuit board, 2-Lower mounting bracket, 21-Upper mounting bracket, 3-Heat sink cover, 4-Miniature fan, 5-Shielding cover, 6-Inductor body, 7-Wire, 8-Pin, 9-Card holder, 10-Spring, 11-Card ball, 12-Reinforced guide post, 13-Limit block, 14-Temperature sensor, 15-Controller. Detailed Implementation

[0024] The embodiments of this utility model will be described below with reference to the accompanying drawings.

[0025] Example: An inductor with high heat dissipation performance, such as Figures 1-6 As shown, the device includes a circuit board 1, a lower mounting bracket 2, an upper mounting bracket 21, a heat sink fin cover 3, a miniature fan 4, a shielding cover 5, an inductor body 6, wires 7, pins 8, a mounting socket 9, and a controller 15. The circuit board 1 serves as the basic mounting carrier, providing electrical connections and mechanical support. The lower mounting bracket 2 is snapped onto the top of the circuit board 1, and the upper mounting bracket 21 is snapped onto the top of the lower mounting bracket 2. The heat sink fin cover 3 is snapped between the upper mounting bracket 21 and the lower mounting bracket 2. The heat sink fin cover 3 serves as a passive heat dissipation and heat conduction medium, increasing the heat dissipation surface area through the fin structure. A miniature fan 4 is mounted on the top of the upper mounting bracket 21. A shielding cover 5 is snapped onto the inside of the heat sink fin cover 3. The shielding cover 5 is used for electromagnetic interference protection, and an inductor is installed inside the shielding cover 5. The inductor body 6 has a heat sink fin cover 3 as the mounting base for the shielding cover 5, achieving integrated electromagnetic shielding and heat dissipation. The wires 7 of the inductor body 6 pass through the heat sink fin cover 3 and the shielding cover 5 and are inserted into both sides of the inside of the circuit board 1. The pins 8 at both ends of the wires 7 of the inductor body 6 are inserted into the inside of the circuit board 1. The wires 7 serve as the electrical connection medium, transmitting the current between the inductor body 6 and the circuit board 1. The ends of the pins 8 penetrate the circuit board 1. The bottom sides of the circuit board 1 are provided with a retainer 9 corresponding to the through ends of the pins 8. The ends of the pins 8 are snapped into the retainer 9. The retainer 9 is provided with a limiting group inside, which is engaged with the pins 8. A controller 15 is provided on one side of the top of the upper mounting bracket 21. The controller 15 is connected to the wires of each power component.

[0026] like Figure 4 , Figure 5 and Figure 6As shown, the limiting group includes a spring 10 and a retaining ball 11. Positioning grooves are provided on both sides of the retaining base 9, and springs 10 are connected in each positioning groove. The two springs 10 inside the retaining base 9 are connected to the retaining ball 11 at their closest ends. Grooves adapted to the ends of the retaining balls 11 are provided on both sides of the lower part of the pin 8. The retaining ball 11 contacts the groove of the pin 8 through its spherical surface. The spring 10 provides continuous pressure to push the retaining ball 11 to engage with the groove of the pin 8, and absorbs vibration and impact energy and self-resets.

[0027] like Figure 1 As shown, it also includes limit blocks 13. Multiple limit blocks 13 are provided on the top of the circuit board 1 corresponding to the periphery of the lower mounting frame. The limit blocks 13 serve as lateral displacement limiters. Multiple limit blocks 13 are all in close contact with the outer surface of the lower mounting frame 2 to prevent horizontal displacement and ensure that the lower mounting frame 2 is vertically aligned with the circuit board 1.

[0028] like Figure 1 As shown, it also includes a temperature sensor 14. The temperature sensor 14 is installed on one side of the bottom of the upper mounting bracket 21. The temperature sensor 14 serves as a temperature rise monitoring element, which detects the surface temperature of the heat sink fin cover 3 in real time and sends a signal back to the controller 15 to trigger active heat dissipation. The temperature sensor 14 is close to the heat sink fin cover 3 and is connected to the controller 15 through a flexible cable.

[0029] like Figure 4 As shown, it also includes a reinforcing guide post 12. The bottom of the lower fixing frame is provided with a reinforcing guide post 12. The reinforcing guide post 12 serves as a vibration-resistant longitudinal support. The reinforcing guide post 12 is inserted into and protrudes from the bottom of the circuit board 1. The bottom end of the card holder 9 and the bottom end of the reinforcing guide post 12 are at the same plane height, so that the force is evenly distributed.

[0030] In use, circuit board 1 serves as the basic carrier, with pre-set slots on its surface to receive the lower mounting bracket 2. The lower mounting bracket 2 is embedded into circuit board 1 through bottom latches, and lateral displacement is limited by peripheral limiting blocks 13 to ensure vertical alignment between the mounting bracket and circuit board 1. Reinforcing guide posts 12 extend from the bottom of the lower mounting bracket 2 and are embedded inside circuit board 1 to further increase structural stability. The inductor body 6 is enclosed in shielding cover 5, which is fixed to the inside of heat sink fin cover 3 by snap-fit ​​to prevent electromagnetic interference from spreading outward. The inductor's wires 7 extend from the shielding cover. The pre-drilled holes of the cover 5 and the heat sink fin cover 3 extend to both sides of the circuit board 1. The pin 8 at the end of the wire 7 is inserted downward into the corresponding hole of the circuit board 1. After the pin 8 passes through the circuit board 1, its end is inserted into the inside of the card holder 9. The spring 10 in the limiting group pushes the retaining ball 11 to squeeze inward. The retaining ball 11 is embedded in the groove at the bottom of the pin 8 to form a mechanical engagement, preventing the pin 8 from dislodging due to vibration or external force. The bottom end of the card holder 9 is flush with the bottom end of the reinforcing guide post 12 to ensure that the overall structure is subjected to uniform force. When the inductor body 6 is running, the current generates heat through the winding. Heat is transferred through the shield 5 to the outer heat dissipation fin cover 3. The heat dissipation fin cover 3 increases the contact area with the air through its fin structure, and diffuses the heat to the surrounding environment by natural convection. The temperature sensor 14 monitors the temperature near the heat dissipation fin cover 3 in real time and feeds the data back to the controller 15. When the temperature exceeds the set threshold, the controller 15 starts the miniature fan 4. The miniature fan 4 generates forced airflow, which accelerates the airflow on the surface of the heat dissipation fin cover 3 and improves the heat dissipation efficiency. At the same time, the limiting block 13 fits tightly against the outer surface of the lower mounting bracket 2, which limits the slight displacement of the mounting bracket in the horizontal direction. After the reinforcing guide post 12 is embedded in the circuit board 1, it disperses the vibration energy through its longitudinal rigid support to prevent the connection between the mounting bracket and the circuit board 1 from loosening. When external vibration is transmitted to the pin 8, the limiting group in the card holder 9 absorbs the impact force through the elastic deformation of the spring 10. At the same time, the ball 11 and the groove of the pin 8 always remain engaged to prevent the pin 8 from falling out or making poor contact. The tight fit between the pin 8 and the hole of the circuit board 1 further reduces the shaking space and ensures the stability of the electrical connection.

[0031] It should be understood that this embodiment is for illustrative purposes only and is not intended to limit the scope of the present invention. Furthermore, it should be understood that after reading the teachings of this invention, those skilled in the art can make various alterations or modifications to the invention, and these equivalent forms also fall within the scope defined by the appended claims.

Claims

1. An inductor with high heat dissipation performance, characterized in that: The device includes a circuit board (1), a lower mounting bracket (2), an upper mounting bracket (21), a heat sink cover (3), a miniature fan (4), a shielding cover (5), an inductor body (6), wires (7), pins (8), a mounting bracket (9), and a controller (15). The lower mounting bracket (2) is snapped onto the top of the circuit board (1), the upper mounting bracket (21) is snapped onto the top of the lower mounting bracket (2), the heat sink cover (3) is snapped between the upper mounting bracket (21) and the lower mounting bracket (2), the miniature fan (4) is mounted on the top of the upper mounting bracket (21), the shielding cover (5) is snapped onto the inside of the heat sink cover (3), and the inductor body (6) is located inside the shielding cover (5). The wires (7) of the inductor body (6) pass through the heat sink fin cover (3) and the shield cover (5) and are inserted into the inside of the circuit board (1). The pins (8) at both ends of the wires (7) of the inductor body (6) are inserted into the inside of the circuit board (1), and the ends of the pins (8) penetrate the circuit board (1). The bottom sides of the circuit board (1) are provided with slots (9) corresponding to the through ends of the pins (8). The ends of the pins (8) are inserted into the slots (9). The slots (9) are provided with a limiting group inside. The limiting group is engaged with the pins (8). A controller (15) is provided on one side of the top of the upper mounting bracket (21). The controller (15) is connected to the wires of each power component.

2. The high heat dissipation performance inductor according to claim 1, characterized in that: The limiting group includes a spring (10) and a ball (11). The card holder (9) has positioning grooves on both sides, and each positioning groove is connected to a spring (10). The two springs (10) inside the card holder (9) are connected to a ball (11) at their closest ends. The pin (8) has grooves on both sides at the bottom that are adapted to the end of the ball (11).

3. The high heat dissipation performance inductor according to claim 1, characterized in that: It also includes limit blocks (13). Multiple limit blocks (13) are provided on the top of the circuit board (1) corresponding to the outer periphery of the lower mounting frame. The multiple limit blocks (13) are all in close contact with the outer surface of the lower mounting frame (2).

4. The high heat dissipation performance inductor according to claim 1, characterized in that: It also includes a temperature sensor (14), which is mounted on one side of the bottom of the upper mounting bracket (21) and is close to the heat sink fin cover (3).

5. The high heat dissipation performance inductor according to claim 1, characterized in that: It also includes a reinforcing guide post (12), and the bottom of the lower fixing frame is provided with a reinforcing guide post (12), which is inserted into and protrudes from the bottom of the circuit board (1).

6. The high heat dissipation performance inductor according to claim 1, characterized in that: The bottom end of the card holder (9) and the bottom end of the reinforcing guide post (12) are at the same plane height.

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