Straight-through module circuit board
By staggering the arrangement of terminal connection holes and gold pin holes, and setting crosstalk groups on both sides of the circuit board, the circuit board design was optimized, the port crosstalk problem was solved, and the signal transmission quality and system performance were improved.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- COBTEL PRECISION ELECTRONICS CO LTD
- Filing Date
- 2025-04-17
- Publication Date
- 2026-05-05
AI Technical Summary
Crosstalk between ports on existing through-module circuit boards leads to poor signal transmission quality and affects system performance.
Design a through-module circuit board with staggered terminal connection holes and gold pin holes to increase terminal density, and set ten different crosstalk groups between wire pairs on both sides of the circuit board to optimize line width and layout to reduce crosstalk.
It improves the accuracy and reliability of signal transmission, reduces insertion loss, return loss and propagation delay, and enhances the characteristic impedance of printed circuit boards.
Smart Images
Figure CN224205303U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of network module technology, specifically a through module circuit board. Background Technology
[0002] With the rapid development of high-speed network communication technology, the passthrough module, as a core component of data centers, communication equipment and industrial control systems, directly affects system performance through its signal transmission quality and reliability. The core function of the passthrough module is to achieve low-loss and low-latency direct transmission of signals through a high-density gold pin terminal array on the circuit board (PCB). However, the existing modules have large crosstalk between ports on the circuit board, which affects the overall propagation rate. Utility Model Content
[0003] The purpose of this utility model is to provide a through-module circuit board and a crystal head using the protective sleeve, so as to solve the technical problems in the background art.
[0004] To achieve the aforementioned objectives, this utility model provides the following technical solution:
[0005] A through-module circuit board includes a terminal hole group and a gold pin connection hole group formed on the circuit board body. The terminal hole group is located at the upper end of the circuit board body, and the gold pin connection hole group is located at the lower end of the circuit board body. The terminal hole group includes eight terminal connection holes arranged in two rows, one above the other. The terminal connection hole group includes four upper row terminal holes and four lower row terminal holes arranged horizontally. The four upper row terminal holes are located above the four lower row terminal holes and are staggered in position with the four lower row terminal holes. The gold pins... The connection hole group includes eight gold pin connection holes, which are arranged in two rows, one above the other. The gold pin connection hole group includes four upper row gold pin holes and four lower row gold pin holes arranged horizontally. The four upper row gold pin holes are located above the lower row gold pin holes and are staggered with the four lower row gold pin holes. The eight terminal connection holes are electrically connected to the eight gold pin connection holes through wires. The front of the circuit board body has two sets of crosstalk groups between wire pairs, and the back of the circuit board body has eight sets of crosstalk groups between wire pairs.
[0006] The center distance between the terminal connection holes in the upper row and the terminal connection holes in the lower row is 2.0-2.5mm, and the center distance between the gold needle connection holes in the upper row and the gold needle connection holes in the lower row is 2.0-2.5mm.
[0007] The two sets of crosstalk groups on the front of the circuit board body are the first crosstalk group and the second crosstalk group. The first crosstalk group is located above the upper row of terminal connection holes, and the second crosstalk group is located below the lower row of gold pin holes.
[0008] The eight pairs of crosstalk groups on the back of the circuit board body are designated as the third, fourth, fifth, sixth, seventh, eighth, ninth, and tenth pairs of crosstalk groups. The third and fourth pairs of crosstalk groups are located above the upper row of terminal connection holes and distributed on the left and right sides of the back of the circuit board body. The fifth and sixth pairs of crosstalk groups are located below the lower row of terminal connection holes and distributed on the left and right sides of the back of the circuit board body. The seventh and eighth pairs of crosstalk groups are located above the upper row of gold pin holes and distributed on the left and right sides of the back of the circuit board body. The ninth and tenth pairs of crosstalk groups are located below the lower row of gold pin holes and distributed on the left and right sides of the back of the circuit board body.
[0009] The line widths of the first, second, third, fourth, fifth, sixth, seventh, eighth, ninth, and tenth line-pair crosstalk groups are 0.25-0.3 mm.
[0010] The eight terminal connection holes are designated as a first terminal connection hole, a second terminal connection hole, a third terminal connection hole, a fourth terminal connection hole, a fifth terminal connection hole, a sixth terminal connection hole, a seventh terminal connection hole, and an eighth terminal connection hole. The seventh terminal connection hole, the fifth terminal connection hole, the third terminal connection hole, and the first terminal connection hole are arranged sequentially to form the upper row of terminal connection holes, while the eighth terminal connection hole, the sixth terminal connection hole, the fourth terminal connection hole, and the second terminal connection hole are arranged sequentially to form the lower row of terminal connection holes. Similarly, the eight gold needle connection holes are designated as a first gold needle connection hole, a second gold needle connection hole, a third gold needle connection hole, a fourth gold needle connection hole, a fifth gold needle connection hole, a sixth gold needle connection hole, a seventh gold needle connection hole, and an eighth gold needle connection hole. The second gold needle connection hole, the fourth gold needle connection hole, the sixth gold needle connection hole, and the eighth gold needle connection hole are arranged sequentially to form the upper row of gold needle connection holes, while the first gold needle connection hole, the third gold needle connection hole, the fifth gold needle connection hole, and the seventh gold needle connection hole are arranged sequentially to form the lower row of gold needle connection holes.
[0011] Compared with the prior art, the through module circuit board provided by this utility model has staggered terminal connection holes and gold pin holes, which can make full use of space and increase terminal density. It is suitable for scenarios with a large number of pins or limited space. The horizontal spacing between adjacent terminals is larger, reducing the risk of crosstalk. This application has a cross-crosstalk group arrangement design between ten different wire pairs on both sides of the circuit board body, thereby achieving the functions of low insertion loss, low return loss, low propagation delay, and reduced crosstalk, and improving the characteristic impedance of the printed circuit board. Attached Figure Description
[0012] Figure 1 : A schematic diagram of the circuit structure on the front side of the circuit board body of this application;
[0013] Figure 2 : A schematic diagram of the circuit structure on the back of the circuit board body of this application. Detailed Implementation
[0014] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention.
[0015] Specific Implementation Example 1: Please refer to Figure 1 and Figure 2 In this embodiment of the present invention, a through-module circuit board includes a terminal hole group 2 and a gold pin connection hole group 3 formed on the circuit board body 1. The terminal hole group 2 is located at the upper end of the circuit board body 1, and the gold pin connection hole group 3 is located at the lower end of the circuit board body 1. The terminal hole group 2 includes eight terminal connection holes arranged in two rows, upper and lower. The terminal connection hole group includes four upper row terminal holes and four lower row terminal holes arranged horizontally. The four upper row terminal holes are located above the four lower row terminal holes and are staggered with the four lower row terminal holes. The gold pin connection hole group 3 includes eight gold pin connection holes. Eight gold pin connection holes are arranged in two rows, one above the other. The gold pin connection hole group 3 includes four upper row gold pin holes and four lower row gold pin holes arranged horizontally. The four upper row gold pin holes are above the lower row gold pin holes and are staggered with the four lower row gold pin holes. The eight terminal connection holes are electrically connected to the eight gold pin connection holes through wires. The front of the circuit board body 1 is provided with two sets of wire pair crosstalk groups, and the back of the circuit board body 1 is provided with eight sets of wire pair crosstalk groups. Corresponding wire through holes are provided on the front and back of the circuit board body 1 to connect the gold pin connection hole group 3 with the terminal hole group 24 one by one.
[0016] The center-to-center distance D1 between the terminal connection holes in the upper row and the terminal connection holes in the lower row is 2.0-2.5 mm, and the center-to-center distance D2 between the gold pin connection holes in the upper row and the gold pin connection holes in the lower row is 2.0-2.5 mm. In this embodiment, the center-to-center distance D1 between the terminal connection holes in the upper row and the terminal connection holes in the lower row is 2.1 mm, and the center-to-center distance D2 between the gold pin connection holes in the upper row and the gold pin connection holes in the lower row is 2.1 mm.
[0017] The two sets of crosstalk groups on the front of the circuit board body 1 are the first crosstalk group A1 and the second crosstalk group A2. The first crosstalk group A1 is above the upper row of terminal connection holes, and the second crosstalk group A2 is below the lower row of gold pin holes.
[0018] The eight pairs of crosstalk groups on the back of the circuit board body 1 are designated as the third pair crosstalk group A3, the fourth pair crosstalk group A4, the fifth pair crosstalk group A5, the sixth pair crosstalk group A6, the seventh pair crosstalk group A7, the eighth pair crosstalk group A8, the ninth pair crosstalk group A9, and the tenth pair crosstalk group A10. The third pair crosstalk group A3 and the fourth pair crosstalk group A4 are located above the upper row of terminal connection holes and distributed on the circuit board. On the left and right sides of the back of the circuit board body 1, the fifth line-pair crosstalk group A5 and the sixth line-pair crosstalk group A6 are located below the lower row of terminal connection holes and distributed on the left and right sides of the back of the circuit board body 1; the seventh line-pair crosstalk group A7 and the eighth line-pair crosstalk group A8 are located above the upper row of gold pin holes and distributed on the left and right sides of the back of the circuit board body 1; the ninth line-pair crosstalk group A9 and the tenth line-pair crosstalk group A10 are located below the lower row of gold pin holes and distributed on the left and right sides of the back of the circuit board body 1.
[0019] The first pair-to-pair crosstalk group A1, the second pair-to-pair crosstalk group A2, the third pair-to-pair crosstalk group A3, the fourth pair-to-pair crosstalk group A4, the fifth pair-to-pair crosstalk group A5, the sixth pair-to-pair crosstalk group A6, the seventh pair-to-pair crosstalk group A7, the eighth pair-to-pair crosstalk group A8, the ninth pair-to-pair crosstalk group A9, and the tenth pair-to-pair crosstalk group A10 are all formed by interlocking transmission lines in a U-shape. The line width of the ten pairs-to-pair crosstalk groups in this application is 0.25-0.3mm. The pair-to-pair crosstalk groups can effectively suppress crosstalk, allowing the signal to maintain its original characteristics during transmission, such as... Accurate amplitude, phase, and timing are crucial to ensure the receiver can interpret the signal transmitted from the transmitter accurately, thus improving data transmission accuracy. In this embodiment, the line width of each of the ten crosstalk pairs is 0.27mm. Wider lines increase capacitance effects. For high-frequency signals, the capacitive reactance of the capacitor decreases, causing some of the signal energy to be diverted by the capacitor, resulting in signal attenuation. At the same time, different line widths change the characteristic impedance of the line. If the characteristic impedance is mismatched, the signal will be reflected during transmission, causing signal distortion and affecting signal integrity. Therefore, it is necessary to precisely control the line width to ensure accurate transmission of high-frequency signals.
[0020] The eight terminal connection holes are designated as terminal connection hole 201, terminal connection hole 202, terminal connection hole 203, terminal connection hole 204, terminal connection hole 205, terminal connection hole 206, terminal connection hole 207, and terminal connection hole 208. Terminal connection holes 207, 205, 203, and 201 are arranged sequentially, forming the upper row of terminal connection holes. Terminal connection holes 208, 206, 204, and 202 are arranged sequentially, forming the lower row of terminal connection holes. The eight gold needle connection holes are designated as the first gold needle connection hole 301, the second gold needle connection hole 302, the third gold needle connection hole 303, the fourth gold needle connection hole 304, the fifth gold needle connection hole 305, the sixth gold needle connection hole 306, the seventh gold needle connection hole 307, and the eighth gold needle connection hole 308. The second gold needle connection hole 302, the fourth gold needle connection hole 304, the sixth gold needle connection hole 306, and the eighth gold needle connection hole 308 are arranged in sequence, forming the upper row of gold needle connection holes. The first gold needle connection hole 301, the third gold needle connection hole 303, the fifth gold needle connection hole 305, and the seventh gold needle connection hole 307 are arranged in sequence, forming the lower row of gold needle connection holes.
[0021] Compared with the prior art, the through module circuit board provided by this utility model has staggered terminal connection holes and gold pin holes, which can make full use of space and increase terminal density. It is suitable for scenarios with a large number of pins or limited space. The horizontal spacing between adjacent terminals is larger, reducing the risk of crosstalk. This application has a cross-crosstalk group arrangement design between ten different wire pairs on both sides of the circuit board body, thereby achieving the functions of low insertion loss, low return loss, low propagation delay, and reduced crosstalk, and improving the characteristic impedance of the printed circuit board.
[0022] It will be apparent to those skilled in the art that this invention is not limited to the details of the foregoing exemplary embodiments, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.
[0023] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.
Claims
1. A through-module circuit board, characterized in that: The circuit board includes a terminal hole group and a pin connection hole group on the circuit board body. The terminal hole group is located at the upper end of the circuit board body, and the pin connection hole group is located at the lower end of the circuit board body. The terminal hole group includes eight terminal connection holes arranged in two rows, one above the other. The terminal connection hole group includes four upper row terminal holes and four lower row terminal holes arranged horizontally. The four upper row terminal holes are above the four lower row terminal holes and are staggered with each other. The pin connection hole group includes eight pin connection holes arranged in two rows, one above the other. The pin connection hole group includes four upper row pin holes and four lower row pin holes arranged horizontally. The four upper row pin holes are above the four lower row pin holes and are staggered with each other. The eight terminal connection holes are electrically connected to the eight pin connection holes via wires. The front of the circuit board body has two sets of crosstalk groups between wire pairs, and the back of the circuit board body has eight sets of crosstalk groups between wire pairs.
2. A through-module circuit board according to claim 1, characterized in that: The center distance between the terminal connection holes in the upper row and the terminal connection holes in the lower row is 2.0-2.5mm, and the center distance between the gold needle connection holes in the upper row and the gold needle connection holes in the lower row is 2.0-2.5mm.
3. A through-module circuit board according to claim 2, characterized in that: The two sets of crosstalk groups on the front of the circuit board body are the first crosstalk group and the second crosstalk group. The first crosstalk group is located above the upper row of terminal connection holes, and the second crosstalk group is located below the lower row of gold pin holes.
4. A through-module circuit board according to claim 3, characterized in that: The eight pairs of crosstalk groups on the back of the circuit board body are designated as the third, fourth, fifth, sixth, seventh, eighth, ninth, and tenth pairs of crosstalk groups. The third and fourth pairs of crosstalk groups are located above the upper row of terminal connection holes and distributed on the left and right sides of the back of the circuit board body. The fifth and sixth pairs of crosstalk groups are located below the lower row of terminal connection holes and distributed on the left and right sides of the back of the circuit board body. The seventh and eighth pairs of crosstalk groups are located above the upper row of gold pin holes and distributed on the left and right sides of the back of the circuit board body. The ninth and tenth pairs of crosstalk groups are located below the lower row of gold pin holes and distributed on the left and right sides of the back of the circuit board body.
5. A through-module circuit board according to claim 4, characterized in that: The line widths of the first, second, third, fourth, fifth, sixth, seventh, eighth, ninth, and tenth line-pair crosstalk groups are 0.25-0.3 mm.
6. A through-module circuit board according to claim 5, characterized in that: The eight terminal connection holes are designated as a first terminal connection hole, a second terminal connection hole, a third terminal connection hole, a fourth terminal connection hole, a fifth terminal connection hole, a sixth terminal connection hole, a seventh terminal connection hole, and an eighth terminal connection hole. The seventh terminal connection hole, the fifth terminal connection hole, the third terminal connection hole, and the first terminal connection hole are arranged sequentially to form the upper row of terminal connection holes, while the eighth terminal connection hole, the sixth terminal connection hole, the fourth terminal connection hole, and the second terminal connection hole are arranged sequentially to form the lower row of terminal connection holes. Similarly, the eight gold needle connection holes are designated as a first gold needle connection hole, a second gold needle connection hole, a third gold needle connection hole, a fourth gold needle connection hole, a fifth gold needle connection hole, a sixth gold needle connection hole, a seventh gold needle connection hole, and an eighth gold needle connection hole. The second gold needle connection hole, the fourth gold needle connection hole, the sixth gold needle connection hole, and the eighth gold needle connection hole are arranged sequentially to form the upper row of gold needle connection holes, while the first gold needle connection hole, the third gold needle connection hole, the fifth gold needle connection hole, and the seventh gold needle connection hole are arranged sequentially to form the lower row of gold needle connection holes.