Electronic device packaging structure, electronic device assembly and cooking utensil
By designing a glue injection port and a glue flow channel structure on the supporting protrusion inside the electronic device housing, the problem of poor waterproof performance of electronic devices was solved, achieving better sealing and production efficiency.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- ZHEJIANG SHAOXING SUPOR DOMESTIC ELECTRICAL APPLIANCE CO LTD
- Filing Date
- 2025-03-26
- Publication Date
- 2026-05-05
AI Technical Summary
In the existing technology, the waterproof performance of electronic devices is not good. Water can easily enter the bottom of the electronic device from the shell and the gap of the colloid, affecting the solder joints and the overall waterproof performance.
The design incorporates an internal cavity within the shell, with the glue inlet on the top surface and the supporting protrusion on the bottom wall, forming a glue flow channel. The glue flows into the channel at intervals to wrap around the edges of electronic components. Combined with a guiding structure and limiting components, this ensures uniform filling and sealing of the glue.
It improves the waterproof performance of electronic components, enhances sealing, protects solder joints, reduces failure rate, lowers production costs, and adapts to the needs of automated production.
Smart Images
Figure CN224205406U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of small household appliance technology, specifically to an electronic device packaging structure, an electronic device assembly, and a cooking appliance. Background Technology
[0002] Currently, to ensure the waterproof performance of electronic devices, they generally need to be encapsulated. This involves placing the electronic device into a housing and then encapsulating the housing with potting compound.
[0003] In related technologies, when encapsulating electronic devices with potting compound, the space between the upper surface of the electronic device and the side wall of the housing above the upper surface of the electronic device is filled with the compound. This can easily cause water to enter the lower part of the electronic device through the gap between the housing and the compound, and affect the solder joints on the lower part of the electronic device. In other words, the above method can easily cause water to enter the lower part of the electronic device, thereby affecting the waterproof performance of the electronic device. Utility Model Content
[0004] The main objective of this invention is to provide an electronic device packaging structure, electronic device assembly, and cooking appliance to solve the problem of poor waterproof performance of electronic devices in related technologies.
[0005] To achieve the above objectives, according to one aspect of the present invention, an electronic device packaging structure is provided, comprising: a housing body having an inner cavity; a glue injection port disposed on the top surface of the housing body and communicating with the inner cavity, the glue injection port allowing the electronic device to pass through for installation into the inner cavity, a gap being formed between the electronic device and the side wall of the housing body; and a support protrusion disposed on the bottom wall of the housing body for supporting the electronic device, a glue flow groove being formed between the support protrusion and the side wall of the inner cavity.
[0006] The present invention utilizes a shell body with an inner cavity, and an adhesive injection port is located on the top surface of the shell body and communicates with the inner cavity. Electronic devices can be installed into the inner cavity through the adhesive injection port. A gap exists between the electronic device and the sidewall of the inner cavity, and a supporting protrusion is provided on the bottom wall of the inner cavity. This supporting protrusion supports the electronic device, and a flow channel is formed between the supporting protrusion and the sidewall of the inner cavity. With this configuration, after the electronic device is installed into the inner cavity through the adhesive injection port, the supporting protrusion supports the electronic device. When adhesive is injected through the injection port, the adhesive flows from the upper surface of the electronic device to its edge. Due to the gap between the electronic device and the sidewall of the inner cavity, the adhesive flows down through the gap and into the flow channel. Once the flow channel is full, the adhesive overflows and wraps around the edge of the electronic device. In other words, the adhesive can wrap both the upper surface and the edge of the electronic device, effectively improving its waterproof performance. Therefore, the technical solution of this application effectively solves the problem of poor waterproof performance of electronic devices in related technologies.
[0007] Furthermore, the adhesive flow channel is arranged circumferentially along the shell body. This arrangement ensures that all edges of the electronic device can be coated with adhesive.
[0008] Furthermore, the depth of the glue delivery groove is between 0.8 mm and 1.5 mm, and / or the width of the glue delivery groove is between 0.8 mm and 1.5 mm. These dimensional settings ensure that the glue delivery groove can hold sufficient glue, thereby allowing the glue to better coat the edges of the electronic device.
[0009] Furthermore, the supporting protrusion is an annular support rib, which is disposed on the bottom wall of the shell body. The annular support rib is located below the electronic device and abuts against the electronic device. The adhesive flow groove is formed between the side wall of the shell body, the annular support rib, and the bottom wall of the shell body. The annular support rib has a simple structure, is easy to install, and can protect the solder joints on the electronic device, preventing the adhesive from contacting the solder joints and thus preventing damage to the solder joints.
[0010] Furthermore, the height of the annular support rib is between 1mm and 1.5mm. This design prevents the weld points from contacting the bottom wall of the inner cavity.
[0011] Furthermore, the electronic device packaging structure also includes a guide structure, which is disposed on the inner sidewall of the housing body. The guide structure makes the installation of electronic devices easier.
[0012] Furthermore, the guiding structure includes multiple guide ribs spaced circumferentially along the shell body. Each guide rib has a guide slope, and the distance between the guide slope and the side wall of the shell body gradually increases from the glue injection port to the bottom wall of the shell body. The guide ribs have a simple structure, are easy to install, and the guide slope can effectively guide the electronic components, thereby ensuring accurate placement of the electronic components and maintaining a gap between the electronic components and the side wall of the inner cavity.
[0013] Furthermore, the electronic device packaging structure also includes a wire fixing section, which is located on the upper part of the housing body and is higher than the housing body. The wire fixing section can effectively fix the wires of the electronic device and can prevent the wires from interfering with the glue injection port, thus avoiding affecting the glue injection.
[0014] Furthermore, the electronic device packaging structure also includes a limiting member, which is disposed on the side wall of the housing body and located inside the cavity. The limiting member can limit the position of the electronic device, thereby making the position of the electronic device more stable.
[0015] Furthermore, the electronic device packaging structure also includes an abutment portion, which is disposed on the bottom wall of the housing body and corresponds to the limiting member. The electronic device can be inserted between the abutment portion and the limiting member. The abutment portion provides a stable contact surface for the electronic device, thereby making the position of the electronic device more stable and better securing the electronic device in conjunction with the limiting member.
[0016] According to a second aspect of this utility model, an electronic device assembly is provided, comprising an electronic device packaging structure and electronic devices mounted within the electronic device packaging structure, wherein the electronic device packaging structure is as described above. The aforementioned electronic device packaging structure improves the waterproof performance of the electronic devices; therefore, the electronic device assembly having the aforementioned electronic device packaging structure also possesses the aforementioned advantages.
[0017] Furthermore, the electronic components protrude from the supporting protrusions towards the sidewall of the housing. This arrangement allows the colloid to wrap around the edges of the lower surface of the electronic components, thereby improving their waterproof performance.
[0018] According to a third aspect of this utility model, a cooking appliance is provided, which includes an electronic component, the electronic component being the one described above. The electronic component described above has good waterproof performance; therefore, the cooking appliance having the electronic component described above also has the aforementioned advantages. Attached Figure Description
[0019] The accompanying drawings, which form part of this application, are used to provide a further understanding of the present invention. The illustrative embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an undue limitation of the present invention. In the drawings:
[0020] Figure 1 A three-dimensional structural schematic diagram of an embodiment of the electronic device packaging structure according to the present invention is shown;
[0021] Figure 2 It shows Figure 1 A three-dimensional structural diagram of the electronic device packaging structure from another perspective;
[0022] Figure 3 It shows Figure 1 A top view of the electronic device packaging structure;
[0023] Figure 4 A three-dimensional structural schematic diagram of an embodiment of an electronic device assembly according to the present invention is shown;
[0024] Figure 5 It shows Figure 4 A cross-sectional view of the electronic device assembly along its length;
[0025] Figure 6 It shows Figure 4 A cross-sectional view of the electronic device assembly in the width direction.
[0026] The above figures include the following reference numerals:
[0027] 1. Electronic components; 10. Shell body; 11. Inner cavity; 20. Glue injection port; 30. Support protrusion; 31. Annular support rib; 40. Glue flow channel; 50. Guide structure; 51. Guide rib; 511. Guide slope; 60. Wire fixing part; 70. Limiting part; 80. Abutment part. Detailed Implementation
[0028] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. The following description of at least one exemplary embodiment is merely illustrative and is in no way intended to limit the present utility model or its application or use. All other embodiments obtained by those skilled in the art based on the embodiments of the present utility model without creative effort are within the scope of protection of the present utility model.
[0029] It should be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the exemplary embodiments according to this application. As used herein, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise. Furthermore, it should be understood that when the terms "comprising" and / or "including" are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.
[0030] Unless otherwise specifically stated, the relative arrangement, numerical expressions, and values of the components and steps described in these embodiments do not limit the scope of this invention. It should also be understood that, for ease of description, the dimensions of the various parts shown in the drawings are not drawn to actual scale. Techniques, methods, and devices known to those skilled in the art may not be discussed in detail, but where appropriate, such techniques, methods, and devices should be considered part of the specification. In all examples shown and discussed herein, any specific values should be interpreted as merely exemplary and not as limitations. Therefore, other examples of exemplary embodiments may have different values. It should be noted that similar reference numerals and letters in the following drawings denote similar items; therefore, once an item is defined in one drawing, it need not be further discussed in subsequent drawings.
[0031] like Figures 1 to 3As shown, in this embodiment, the electronic device packaging structure includes: a housing body 10, a glue injection port 20, and a support protrusion 30. The housing body 10 has an inner cavity 11. The glue injection port 20 is disposed on the top surface of the housing body 10 and communicates with the inner cavity 11. The glue injection port 20 allows the electronic device 1 to pass through so as to install the electronic device 1 into the inner cavity 11. There is a gap between the electronic device 1 and the side wall of the housing body 10. The support protrusion 30 is disposed on the bottom wall of the housing body 10 and is used to support the electronic device 1. A glue flow groove 40 is formed between the support protrusion 30 and the side wall of the inner cavity 11.
[0032] Using the technical solution of this embodiment, the shell body 10 has an inner cavity 11, and the glue injection port 20 is disposed on the top surface of the shell body 10 and communicates with the inner cavity 11. The electronic device 1 can be installed into the interior of the inner cavity 11 through the glue injection port 20. There is a gap between the electronic device 1 and the side wall of the inner cavity 11, and a support protrusion 30 is provided on the bottom wall of the inner cavity 11. The support protrusion 30 can support the electronic device 1, and a glue flow groove 40 is formed between the support protrusion 30 and the side wall of the inner cavity 11. With the above configuration, after the electronic device 1 is installed into the inner cavity 11 through the glue injection port 20, the support protrusion 30 can support the electronic device 1. When glue is injected through the glue injection port 20, the glue can flow through the upper surface of the electronic device 1 to the edge of the electronic device 1. And because there is a gap between the electronic device 1 and the side wall of the inner cavity 11, the glue can flow down through the gap and enter the glue flow groove 40. After the glue fills the glue flow groove 40, it will overflow and wrap around the edge of the electronic device 1. The colloid can completely coat the upper surface and edges of electronic device 1, thus effectively improving its waterproof performance. Therefore, the technical solution of this embodiment effectively solves the problem of poor waterproof performance of electronic devices in related technologies.
[0033] Specifically, the supporting protrusion 30 provides stable support for the electronic device 1, while the structure of the adhesive flow channel 40 ensures that the adhesive is evenly filled on the electronic device 1 and in the gap between the electronic device 1 and the side wall of the housing body 10 during adhesive injection, thereby forming an effective seal. Simultaneously, the positioning of the electronic device 1 within the housing is more accurate, the sealing performance is significantly enhanced, effectively preventing the intrusion of steam and moisture, and improving the service life and reliability of the electronic device 1.
[0034] In this embodiment, the electronic device 1 mentioned above refers to the electronic control board.
[0035] It should be noted that the top surface and bottom wall mentioned above are relative positions. Specifically, when injecting glue, the position of the glue injection port 20 is the top surface, and the position away from the glue injection port 20 is the bottom wall of the inner cavity 11.
[0036] like Figure 3As shown, in this embodiment, the adhesive delivery groove 40 is arranged circumferentially along the shell body 10. This arrangement ensures that all edges of the electronic device 1 are completely enveloped by the adhesive. That is, it ensures that the adhesive completely covers the electronic device 1 during dispensing, forming a complete sealing ring. This results in a more uniform sealing effect, improves overall airtightness and waterproofness, and reduces the failure rate caused by poor local sealing.
[0037] like Figures 1 to 3 As shown, in this embodiment, the depth of the adhesive delivery groove 40 is between 0.8 mm and 1.5 mm, and the width of the adhesive delivery groove 40 is between 0.8 mm and 1.5 mm. These dimensions ensure that the adhesive delivery groove 40 can hold sufficient adhesive, allowing the adhesive to better coat the edges of the electronic device 1. Specifically, by precisely controlling the depth and width of the adhesive delivery groove 40, it is ensured that the adhesive can quickly fill and form a stable sealing layer during dispensing, while avoiding overflow and waste caused by excessive adhesive. This also improves adhesive filling efficiency, accelerates the formation of the sealing layer, reduces adhesive usage, and lowers production costs.
[0038] Specifically, in this embodiment, the depth of the glue flow groove 40 is 1 mm, but it can also be 0.9 mm, 1.1 mm, 1.2 mm, 1.3 mm, 1.4 mm or other sizes.
[0039] The width of the glue flow groove 40 is 1mm, but it can also be 0.9mm, 1.1mm, 1.2mm, 1.3mm, 1.4mm or other sizes.
[0040] like Figures 1 to 3 As shown, in this embodiment, the supporting protrusion 30 is an annular supporting rib 31, which is disposed on the bottom wall of the shell body 10. The annular supporting rib 31 is located below the electronic device 1 and abuts against the electronic device 1. The adhesive flow groove 40 is formed between the side wall of the shell body 10, the annular supporting rib 31, and the bottom wall of the shell body 10. The annular supporting rib 31 has a simple structure and is easy to install. Furthermore, the annular supporting rib 31 can protect the solder joints on the electronic device 1, preventing the adhesive from contacting the solder joints on the electronic device 1, thereby preventing damage to the solder joints. Specifically, the annular supporting rib 31 can provide uniform support for the electronic device 1 within the shell body 10, ensuring that the electronic device 1 will not shift during the adhesive injection process. The design of the adhesive flow groove 40 ensures that the adhesive can be uniformly filled in the gap between the electronic device 1 and the shell body 10, forming a complete sealing ring.
[0041] like Figures 1 to 3As shown, in this embodiment, the height of the annular support rib 31 is between 1 mm and 1.5 mm. This design prevents the solder joints from contacting the bottom wall of the inner cavity 11. Simultaneously, the aforementioned dimensional design ensures that the electronic device 1 is installed at a suitable height within the housing body 10, providing sufficient support without affecting the flow and filling of the adhesive.
[0042] Specifically, in this embodiment, the height of the annular support rib 31 is 1.2mm. Of course, the above-mentioned dimensions can also be 1.1mm, 1.3mm, 1.4mm or other dimensions.
[0043] like Figure 1 and Figure 2 As shown, in this embodiment, the electronic device packaging structure further includes a guide structure 50, which is disposed on the inner sidewall of the housing body 10. The guide structure 50 makes the installation of the electronic device 1 easier.
[0044] like Figure 1 and Figure 2 As shown, in this embodiment, the guide structure 50 includes multiple guide ribs 51, which are spaced apart circumferentially along the shell body 10. Each guide rib 51 is provided with a guide slope 511. From the glue injection port 20 to the bottom wall of the shell body 10, the distance between the guide slope 511 and the side wall of the shell body 10 gradually increases. The guide ribs 51 have a simple structure and are easy to install. Furthermore, the guide slope 511 can effectively guide the electronic device 1, thereby ensuring that the electronic device 1 is installed in an accurate position and that there is a gap between the electronic device 1 and the side wall of the inner cavity 11.
[0045] Meanwhile, due to the setting of the guide rib 51, the contact area of the colloid is larger. That is, the colloid can not only contact the side wall of the inner cavity 11, but also contact the surface of the guide rib 51. This makes the sealing effect of the colloid better and less prone to gaps.
[0046] like Figure 1 and Figure 2 As shown, in this embodiment, the electronic device packaging structure further includes multiple connectors, which are arranged one-to-one with multiple guide ribs 51. Each connector is connected between the corresponding guide rib 51 and the annular support rib 31. The connectors improve the structural strength of the guide rib 51 and the annular support rib 31.
[0047] like Figures 1 to 3 As shown, in this embodiment, the electronic device packaging structure further includes a wire fixing part 60, which is disposed on the upper part of the housing body 10 and is higher than the housing body 10. The wire fixing part 60 can effectively fix the wires of the electronic device 1 and can prevent the wires from interfering with the glue injection port 20 and affecting the glue injection.
[0048] like Figures 1 to 3 As shown, in this embodiment, the wire fixing part 60 includes a first connecting segment, a second connecting segment, and a third connecting segment. The first end of the first connecting segment is connected to the side wall of the shell body 10, the second end of the first connecting segment is connected to the first end of the second connecting segment, the second end of the second connecting segment is connected to the first end of the third connecting segment, and the third connecting segment extends towards the shell body 10. A gap exists between the second end of the third connecting segment and the top wall of the shell body 10. The wire can enter the wire fixing part 60 through the gap between the second end of the third connecting segment and the top wall of the shell body 10, thereby making the position of the wire more stable.
[0049] It should also be noted that the wire fixing part 60 is located on a different surface from the glue injection port 20 on the shell body 10, so as to avoid the wire affecting the glue injection process.
[0050] like Figures 1 to 3 As shown, in this embodiment, the electronic device packaging structure further includes a limiting member 70, which is disposed on the side wall of the housing body 10 and located inside the inner cavity 11. The limiting member 70 can limit the electronic device 1, thereby making the position of the electronic device 1 more stable.
[0051] like Figures 1 to 3 As shown, in this embodiment, the electronic device packaging structure further includes an abutment portion 80, which is disposed on the bottom wall of the housing body 10 and correspondingly disposed with respect to the limiting member 70. The electronic device 1 can be inserted between the abutment portion 80 and the limiting member 70. The abutment portion 80 provides a stable contact surface for the electronic device 1, thereby making the position of the electronic device 1 more stable and better securing the electronic device 1 in cooperation with the limiting member 70.
[0052] The advantages of this embodiment are that, by improving the shell body 10, stable support and precise positioning of the electronic device 1 are achieved, the glue injection process is optimized, the problem of low efficiency in traditional glue injection methods is solved, it adapts to the needs of automated production lines, significantly improves production efficiency, and reduces production costs. By reducing the size of the shell body 10 and the electronic device 1, not only are material costs saved, but the curing time of the glue is also shortened, further improving production line efficiency. The overall solution improves product performance while greatly optimizing the production process.
[0053] According to a second aspect of this application, an electronic device assembly is provided, such as... Figures 4 to 6As shown, the electronic device assembly of this embodiment includes an electronic device packaging structure and an electronic device 1 installed within the electronic device packaging structure. The electronic device packaging structure is the one described above. The electronic device packaging structure described above can improve the waterproof performance of the electronic device 1, therefore, the electronic device assembly having the above-described electronic device packaging structure also has the aforementioned advantages.
[0054] like Figures 4 to 6 As shown, in this embodiment, the electronic device 1 protrudes from the supporting protrusion 30 toward the side wall of the housing body 10. This arrangement allows the colloid to wrap around the edge of the lower surface of the electronic device 1, thereby improving the waterproof performance of the electronic device 1.
[0055] According to a third aspect of this application, a cooking appliance is provided. The cooking appliance of this embodiment includes an electronic component, which is the electronic component described above. The electronic component described above has good waterproof performance; therefore, the cooking appliance having the electronic component described above also has the aforementioned advantages.
[0056] The cooking appliances mentioned above include rice cookers, electric pressure cookers, soy milk makers, food processors, etc.
[0057] In the description of this utility model, it should be understood that "multiple" means two or more. Directional terms such as "front, back, up, down, left, right," "horizontal, vertical, perpendicular, horizontal," and "top, bottom" indicate directions or positional relationships based on the directions or positional relationships shown in the accompanying drawings. These terms are used solely for the convenience of describing this utility model and simplifying the description. Unless otherwise stated, these directional terms do not indicate or imply that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation, and therefore should not be construed as limiting the scope of protection of this utility model. The directional terms "inner" and "outer" refer to the inner or outer contours relative to the outline of each component itself.
[0058] For ease of description, spatial relative terms such as "above," "on top of," "on the upper surface of," "above," etc., are used herein to describe the spatial positional relationship of a device or feature as shown in the figures to other devices or features. It should be understood that spatial relative terms are intended to encompass different orientations in use or operation beyond the orientation of the device as described in the figures. For example, if the device in the figures were inverted, a device described as "above" or "on top of" other devices or structures would subsequently be positioned as "below" or "under" other devices or structures. Thus, the exemplary term "above" can include both "above" and "below." The device may also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatial relative descriptions used herein will be interpreted accordingly.
[0059] Furthermore, it should be noted that the use of terms such as "first" and "second" to define components is merely for the purpose of distinguishing the corresponding components. Unless otherwise stated, the above terms have no special meaning and therefore cannot be construed as limiting the scope of protection of this utility model.
[0060] The above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model. Various modifications and variations can be made to this utility model by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.
Claims
1. An electronic device packaging structure, characterized in that, include: The shell body (10) has an inner cavity (11); A glue injection port (20) is provided on the top surface of the shell body (10) and communicates with the inner cavity (11). The glue injection port (20) allows the electronic device (1) to pass through so as to install the electronic device (1) into the inner cavity (11). There is a gap between the electronic device (1) and the side wall of the shell body (10). A support protrusion (30) is provided on the bottom wall of the shell body (10) and is used to support the electronic device (1). A glue flow groove (40) is formed between the support protrusion (30) and the side wall of the inner cavity (11).
2. The electronic device packaging structure according to claim 1, characterized in that, The glue flow channel (40) is arranged circumferentially along the shell body (10).
3. The electronic device packaging structure according to claim 1, characterized in that, The depth of the glue flow channel (40) is between 0.8 mm and 1.5 mm, and / or the width of the glue flow channel (40) is between 0.8 mm and 1.5 mm.
4. The electronic device packaging structure according to claim 1, characterized in that, The supporting protrusion (30) is an annular supporting rib (31), which is disposed on the bottom wall of the shell body (10). The annular supporting rib (31) is located below the electronic device (1) and abuts against the electronic device (1). The adhesive flow groove (40) is formed between the side wall of the shell body (10), the annular supporting rib (31), and the bottom wall of the shell body (10).
5. The electronic device packaging structure according to claim 4, characterized in that, The height of the annular support rib (31) is between 1 mm and 1.5 mm.
6. The electronic device packaging structure according to claim 1, characterized in that, The electronic device packaging structure also includes a guide structure (50), which is disposed on the inner sidewall of the shell body (10).
7. The electronic device packaging structure according to claim 6, characterized in that, The guide structure (50) includes a plurality of guide ribs (51), which are spaced apart circumferentially along the shell body (10). Each guide rib (51) is provided with a guide slope (511). The distance between the guide slope (511) and the side wall of the shell body (10) gradually increases in the direction from the glue injection port (20) to the bottom wall of the shell body (10).
8. The electronic device packaging structure according to any one of claims 1 to 7, characterized in that, The electronic device packaging structure also includes a wire fixing part (60), which is disposed on the upper part of the shell body (10) and is higher than the shell body (10).
9. The electronic device packaging structure according to any one of claims 1 to 7, characterized in that, The electronic device packaging structure also includes a limiting member (70), which is disposed on the side wall of the shell body (10) and located inside the inner cavity (11).
10. The electronic device packaging structure according to claim 9, characterized in that, The electronic device packaging structure further includes an abutment portion (80), which is disposed on the bottom wall of the shell body (10) and corresponding to the limiting member (70). The electronic device (1) can be inserted between the abutment portion (80) and the limiting member (70).
11. An electronic device assembly, characterized in that, The electronic device assembly includes an electronic device packaging structure and an electronic device (1) installed within the electronic device packaging structure, wherein the electronic device packaging structure is the electronic device packaging structure according to any one of claims 1 to 10.
12. The electronic device assembly according to claim 11, characterized in that, The electronic device (1) protrudes from the supporting protrusion (30) toward the side wall of the shell body (10).
13. A cooking utensil, characterized in that, The cooking appliance includes an electronic device assembly, which is the electronic device assembly as described in claim 11 or 12.