Heat exchange device assembly

Abstract

The utility model provides a heat exchange device assembly which is at least provided with a condenser structure and comprises a cover plate with a plurality of first columns and a bottom plate with a plurality of second columns. Wherein the cover plate covers and defines a sealed chamber corresponding to the bottom plate, and the end faces of the plurality of first cylinders correspond to the end faces of the plurality of second cylinders respectively. Therefore, by means of the design, the condenser can be suitable for special environments (such as extremely low temperature), and the situation that the structure of the condenser is damaged due to steam volume change expansion is avoided.

Description

Technical Field

[0001] This utility model relates to a heat exchange device, and more particularly to a heat exchange device assembly suitable for special environments. Background Technology

[0002] The miniaturization and high integration of electronic devices (such as base stations) have led to a significant increase in the heat flux density of internal chips. Therefore, heat exchange devices that utilize phase change (such as two-phase flow) are widely favored due to their rapid heat dissipation and high efficiency.

[0003] Conventional heat exchanger assemblies typically include a condenser structure 9, such as Figure 1 As shown, a sealed chamber 92 is defined by the mutual covering of a cover plate 911 and a base plate 912, in which a working fluid circulates to achieve the effect of heat exchange; for example, the cover plate 911 and the base plate 912 can be used to cover the chamber together; and a plurality of support columns 93 are provided to provide the structural strength support required for the cover plate 911 and the base plate 912.

[0004] When the condenser structure 9 is installed in the heat exchange assembly (not shown), it can be connected to an evaporator that is in contact with a heat source (e.g., an electronic device) via an inlet pipe for conducting steam and a return pipe for conducting the condensed working fluid. Thus, the inner surfaces of the cover plate 911 or the base plate 912 correspond to a return side or a condensation side of the working fluid, respectively. The plurality of support columns 93 are typically attached to the inner surface of one of the cover plate 911 or the base plate 912, with their end faces extending and engaging (contacting) the other inner surface to form a gap, and vice versa. Alternatively, the plurality of support columns 93 can be individually installed between the two sides, each forming a gap with the inner surface of the cover plate 911 or the base plate 912.

[0005] At this point, regardless of whether the aforementioned gap is formed near the return side or the condensation side, the working fluid will pass through and enter the gap between the end face and inner surface of the plurality of support columns 93 during its circulation within the sealed chamber 92. In special environments (e.g., extremely low temperatures), if solidification occurs due to the extremely low temperature (e.g., water freezing), the working fluid will accumulate in the gap and undergo volume changes. This will not only weaken the structural strength of the plurality of support columns 93 but also cause the cover plate 911 or base plate 912 to bulge, and may even lead to system failure. For example, at extremely low temperatures, the vapor of the working fluid may solidify in the gap on the condensation side due to the low temperature; or, the working fluid accumulated on the return side may also solidify in the gap on the return side due to the extremely low temperature.

[0006] Therefore, when electronic devices need to be used in special environments (such as extremely low temperatures), conventional heat exchanger assemblies, although having good thermal conductivity, are prone to icing and bulging due to the characteristics of the working fluid (such as water) and the condenser structure. Thus, how to solve the aforementioned problems and shortcomings of conventional methods is the direction that the designers of this project and related manufacturers in this industry urgently need to research and improve. Utility Model Content

[0007] Therefore, in order to effectively solve the above problems, the purpose of this utility model is to provide a heat exchange device assembly suitable for special environments.

[0008] To achieve the above objectives, this utility model provides a heat exchange device assembly having at least one condenser structure, which includes a cover plate and a base plate.

[0009] The cover plate has a plurality of first pillars disposed on the inner surface of the cover plate, and the base plate has a plurality of second pillars disposed on the inner surface of the base plate; wherein the cover plate covers and defines a sealed cavity corresponding to the base plate, and the end faces of the plurality of first pillars correspond to the end faces of the plurality of second pillars respectively.

[0010] The end faces of the complex first column and the end faces of the complex second column are respectively concave and convex.

[0011] The end faces of the complex first column and the complex second column are mutually concave and convex, with arc, rectangle or wedge shapes.

[0012] The sealed chamber has a condensation side corresponding to the inner surface of the cover plate and a reflux side corresponding to the inner surface of the base plate.

[0013] The end face of the plurality of first pillars forms a concave surface, and the end face of the plurality of second pillars forms a convex surface corresponding to the concave surface.

[0014] The end faces of the complex first column are respectively engaged with the end faces of the complex second column.

[0015] The condenser structure is connected to an evaporator via an inlet pipe and a return pipe.

[0016] Therefore, this utility model provides a condenser structure suitable for special environments (e.g., extremely low temperatures) that does not damage the condenser structure due to the expansion of steam volume changes. Attached Figure Description

[0017] Figure 1 A cross-section and a partially enlarged schematic diagram of a known condenser structure;

[0018] Figure 2This is a three-dimensional schematic diagram of the heat exchange device assembly of this utility model;

[0019] Figure 3 This is a partially exploded schematic diagram of the heat exchange device assembly of this utility model;

[0020] Figure 4 This is a partially exploded schematic diagram of the heat exchange device assembly of this utility model;

[0021] Figure 5 This is a partial cross-sectional schematic diagram of the heat exchange device assembly of this utility model;

[0022] Figure 6 This is a partial cross-sectional schematic diagram of the heat exchange device assembly of this utility model;

[0023] Figure 7 This is a partial cross-sectional schematic diagram of the heat exchange device assembly of this utility model;

[0024] Figure 8 This is a partial cross-sectional schematic diagram of the heat exchange device assembly of this utility model.

[0025] Explanation of reference numerals in the attached drawings: condenser structure 1; cover plate 11; first column 111; base plate 12; second column 121; sealed chamber 13; condensing side 131; return side 132; evaporator 2; inlet pipe 21; return pipe 22; reservoir 4; condenser structure 9; cover plate 911; base plate 912; sealed chamber 92; support column 93. Detailed Implementation

[0026] The above-mentioned objectives of this utility model and its structural and functional characteristics will now be described with reference to the preferred embodiments shown in the accompanying drawings.

[0027] Please refer to this utility model. Figure 2 This is a three-dimensional schematic diagram of the heat exchange device assembly of this utility model; Figure 3 and Figure 4 This is a partially exploded view of the heat exchange device assembly of this utility model; and, Figures 5 to 8 This is a partial cross-sectional schematic diagram of the heat exchange device assembly of this utility model.

[0028] First, as in this utility model Figures 2 to 6 As shown, this utility model provides a heat exchange device assembly, which includes at least a condenser structure 1, comprising a cover plate 11 and a base plate 12. In some embodiments, both the cover plate 11 and the base plate 12 are made of a metal with good thermal conductivity. Specifically, the cover plate 11 and the base plate 12 can be closed to define a sealed chamber 13. In use, the sealed chamber 13 is filled with a working fluid (not shown) to circulate within it, thereby achieving heat exchange.

[0029] Please refer to this again. Figure 2 As shown, in some embodiments, the heat exchange device assembly of this utility model may also be provided with an evaporator 2 corresponding to the condenser structure 1. The evaporator 2 (e.g., a water cooling head) can absorb heat energy from the electronic device and transfer the heat energy to the working fluid, causing the working fluid to undergo a phase change (i.e., evaporate into steam).

[0030] The evaporator 2 and the condenser structure 1 are connected by at least one inlet pipe 21 for conveying steam and at least one return pipe 22 for conveying the condensed working fluid (e.g., a loop thermosiphon or loop heat pipe). In this way, steam can be transported to the condenser structure 1 for condensation and then returned to the evaporator 2 via the return pipe 22 for continuous heat exchange. The sealed chamber 13, corresponding to the circulation of the working fluid, has a condensation side 131 and a return side 132. The condensation side 131 is arranged upwards to accommodate rising steam and can be configured to be adjacent to the inlet pipe 21; the return side 132 is opposite to the inlet pipe 21, allowing the condensed working fluid to flow back by gravity.

[0031] For example, please refer to [link / reference]. Figure 6 As shown, with the arrangement of the aforementioned heat exchange device assembly, the condensation side 131 of the sealed chamber 13 corresponds to the inner surface of the cover plate 11, and the return side 132 corresponds to the inner surface of the base plate 12. However, the reverse is not limited to this. In this embodiment, the outer surface of the cover plate 11 is arranged facing upwards and in contact with the low-temperature external environment to exchange heat and dissipate heat energy. Of course, other configurations in which the condensation side 131 and the return side 132 are formed corresponding to the cover plate 11 and the base plate 12 do not affect the implementation of this utility model.

[0032] Furthermore, as Figure 2 As shown, in this embodiment, the heat exchange device assembly may further include a heat dissipation fin assembly (not shown) disposed on the outer surface of the base plate 12, and may include a reservoir 4 protruding from the return side 132 corresponding to the inner surface of the base plate 12. The reservoir 4 connects the base plate 12 and the return pipe 22, allowing the working fluid that condenses and returns to the evaporator 2 to continue the heat exchange cycle. Thus, the working fluid (e.g., water) undergoes a two-phase flow heat exchange cycle; that is, after absorbing heat energy from the electronic equipment and vaporizing, it dissipates heat and condenses through the heat exchange cycle, dissipating the heat energy to the external environment.

[0033] In other embodiments, the heat exchange device assembly of this invention may also be configured to have only the condenser structure 1, allowing the working fluid to undergo a closed heat exchange cycle only within the sealed chamber 13 therein (not shown; e.g., a vapor chamber, a 3D vapor chamber, or a two-phase flow device, etc.), without the other structures described above (e.g., the evaporator 2, etc.). For example, the electronic device may be configured to directly contact the outer surface corresponding to the return side 132, allowing the working fluid to directly absorb heat on the return side 132 and undergo a phase change (i.e., evaporation).

[0034] In particular, in the heat exchange device assembly of this utility model, the condenser structure 1 has a plurality of first pillars 111 attached to the inner surface of the cover plate 11, and the base plate 12 also has a plurality of second pillars 121 attached to the inner surface of the base plate 12. The plurality of first pillars 111 and second pillars 121 can be formed by forging, casting, or welding (this utility model is not limited thereto), so that they are integrally formed with the cover plate 11 and the base plate 12. Therefore, there are no gaps between the plurality of first pillars 111 and second pillars 121 and the cover plate 11 and the base plate 12, respectively. More specifically, gaps will not form at the joints between the cover plate 11 and the base plate 12 and the plurality of first pillars 111 and second pillars 121, respectively.

[0035] Therefore, since this invention is formed by the plurality of first pillars 111 and second pillars 121 extending away from the inner surface of the cover plate 11 and the base plate 12, even in special environments (e.g., extremely low temperatures) where the working fluid solidifies on the inner surface of the cover plate 11 or the base plate 12, regardless of the correspondence between the condensation side 131 or the return side 132 and the inner surface of the cover plate 11 or the base plate 12, gaps will not form near the inner surface of the cover plate 11 or the base plate 12. Therefore, the solidified working fluid will not accumulate in the gaps, preventing problems such as weakening of the plurality of first pillars 111 and second pillars 121, or even bulging of the cover plate 11 or the base plate 12, leading to system failure.

[0036] It is worth noting that, since the cover plate 11 corresponds to the base plate 12, and the sealing chamber 13 is defined by the two covering each other, the end faces of the plurality of first pillars 111 in the sealing chamber 13 defined by the cover plate 11 and the base plate 12 respectively correspond to the end faces of the plurality of second pillars 121. For example, both end faces can be planar; furthermore, the end faces can also be mutually concave and convex or have other geometric shapes that correspond or match each other. Figure 6 and Figure 8 As shown, the concave-convex corresponding joint can be a mutual concave-convex corresponding joint in which the end faces of the plurality of first pillars 111 and the plurality of second pillars 121 are arc-shaped, rectangular or wedge-shaped.

[0037] Please refer to the following: Figures 2 to 6 As shown, in the arrangement of the heat exchange device assembly in this embodiment (due to the corresponding arrangement of the condenser structure 1 with the evaporator 2, inlet pipe 21, return pipe 22, and reservoir 4), the condensing side 131 corresponds to the inner surface of the upward-facing cover plate 11, and the return side 132 corresponds to the inner surface of the base plate 12. Therefore, a concave surface with a convex-concave fit can be formed on the end face of the plurality of first pillars 111, and the end face of the plurality of second pillars 121 forms a convex surface corresponding to the concave surface.

[0038] At this time, the working fluid condensed on the condensation side 131 will then drip downwards under gravity, or flow back to the return side 132 along the plurality of first columns 111 and second columns 121. Therefore, due to the arrangement of the plurality of first columns 111 being concave and the plurality of second columns 121 being convex, and corresponding to the arrangement of the condensation side 131 and the return side 132, the working fluid flowing back under gravity, although it will still pass through the corresponding junction of the end faces of the two, will still flow back to the return side 132 under gravity. Therefore, the heat exchange device assembly of this invention can further prevent the working fluid from accumulating and solidifying at any point during circulation due to extremely low temperatures under special environments.

[0039] In addition to the embodiments described above, in other embodiments, the end faces of the plurality of first pillars 111 and second pillars 121 can also be stably engaged (in contact) with each other in a normal state, and are not limited to the above.

[0040] The present invention has been described in detail above. However, the above description is only a preferred embodiment of the present invention and should not be construed as limiting the scope of the present invention. All equivalent changes and modifications made based on the present invention should still fall within the patent coverage of the present invention.

Claims

1. A heat exchange device assembly, comprising at least one condenser structure, characterized in that, The condenser structure includes: A cover plate having a plurality of first pillars disposed on the inner surface of the cover plate; A base plate having a plurality of second columns disposed on the inner surface of the base plate; wherein: The cover plate covers and defines a sealed chamber corresponding to the bottom plate, and the end faces of the plurality of first columns correspond to the end faces of the plurality of second columns respectively.

2. The heat exchange device assembly as described in claim 1, characterized in that: The end faces of the first complex column and the end faces of the second complex column are respectively concave and convex.

3. The heat exchange device assembly as described in claim 2, characterized in that: The end faces of the first complex column and the second complex column are mutually concave and convex, with arc, rectangle or wedge shapes.

4. The heat exchange device assembly as described in claim 2, characterized in that: The sealed chamber has a condensation side corresponding to the inner surface of the cover plate and a reflux side corresponding to the inner surface of the base plate.

5. The heat exchange device assembly as described in claim 4, characterized in that: The end face of the complex first column forms a concave surface, and the end face of the complex second column forms a convex surface corresponding to the concave surface.

6. The heat exchange device assembly as described in claim 1, characterized in that: The end faces of the first complex prism are respectively engaged with the end faces of the second complex prism.

7. The heat exchange device assembly as described in claim 1, characterized in that: The condenser structure is connected to an evaporator via an inlet pipe and a return pipe.

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