Liquid cooling phase change cold plate device

Abstract

The utility model provides a liquid cooling phase change cold plate device which comprises a heat dissipation device, the heat dissipation device is provided with a liquid inlet, and one side of the heat dissipation device far away from the liquid inlet is provided with a liquid outlet. The heat dissipation device comprises a substrate, a cover plate and a shell, a groove is formed in the top face of the substrate, and the cover plate is connected to the top face of the substrate to form a cavity. The lower end opening of the shell and the cover plate are connected to form a hollow cavity, a radiator is arranged in the hollow cavity and comprises a set of second radiating fins, flat pipes are vertically arranged between the second radiating fins, the cover plate is provided with kidney-shaped through holes, and the flat pipes are communicated with the grooves through the kidney-shaped through holes. The side wall of the substrate is provided with a liquid injection port, four corners of the substrate are connected with screw groups, and the substrate is connected to the surface of the chip through the screw groups. According to the utility model, heat generated by the chip is rapidly transferred through refrigerant phase change, the heat is taken out of the cabinet in combination with external circulation, the structure is compact, the space of the cabinet is saved, the heat dissipation efficiency and the system performance are greatly improved, and the high-power-consumption heat dissipation requirement of the chip is met.

Description

Technical Field

[0001] This utility model belongs to the technical field of heat dissipation devices, specifically relating to a liquid-cooled phase change plate device. Background Technology

[0002] With the rapid development of artificial intelligence technology, the computing power demand of AI chips is growing exponentially, but their power consumption density is also rising sharply. For example, the thermal design power (TDP) of NVIDIA's H100 GPU has reached 700W, while its next-generation B200 GPU will further exceed 1000W, and the TDP of future B300 chips may even exceed 1400W. The heat generated by these high-power chips during operation poses a challenge to the heat dissipation requirements of existing server racks. Traditional cooling technologies improve heat dissipation efficiency by increasing the heat exchange area and using forced convection, but the limited space in existing server racks restricts the size of cooling devices, easily leading to heat dissipation bottlenecks.

[0003] Therefore, the above problems urgently need to be solved. Utility Model Content

[0004] Purpose of the utility model: In order to overcome the above shortcomings, this utility model provides a liquid-cooled phase change cold plate device, which quickly transfers the heat generated by the chip through the phase change of the refrigerant, and carries the heat out of the cabinet in combination with water cooling. Its structure is compact, saves cabinet space, greatly improves heat dissipation efficiency and system performance, and meets the high power consumption heat dissipation requirements of the chip.

[0005] Technical Solution: To achieve the above objectives, this utility model provides a liquid-cooled phase change plate device, including a heat dissipation device. The heat dissipation device has a liquid inlet and a liquid outlet on the side away from the liquid inlet. The heat dissipation device includes a substrate, a cover plate, and a housing. A groove is provided on the top surface of the substrate, and the cover plate is connected to the top surface of the substrate to form a cavity. The lower end opening of the housing is connected to the cover plate to form a hollow chamber. A heat sink is provided in the hollow chamber. The heat sink includes a set of second heat dissipation fins, and a flat tube is provided between the second heat dissipation fins. The flat tube is vertically arranged, and the cover plate has an oblong through hole. The flat tube communicates with the groove through the oblong through hole. A liquid injection port is provided on the side wall of the substrate, and screw assemblies are connected to the four corners of the substrate. The substrate is connected to the chip surface by the screw assemblies. This invention is used for heat dissipation of high-power chips. During operation, refrigerant is injected into the groove through the injection port. When the chip is not in operation, the refrigerant remains in the groove in a liquid state. When the chip is in operation, the heat generated by the chip is conducted to the substrate, which acts as a heat spreader. The refrigerant absorbs the heat and vaporizes, entering a flat tube through a waist-shaped through-hole. The vaporized refrigerant condenses and transforms into a liquid state within the flat tube, flowing back into the groove. The flat tube absorbs the heat from the refrigerant and transfers it to the second heat dissipation fins. Meanwhile, coolant enters through the inlet and exits through the outlet, carrying away heat from the second heat dissipation fins. The coolant exiting the outlet enters an external cooling device for further cooling, and then re-enters the heat dissipation device through the inlet for further cooling. This invention rapidly transfers the heat generated by the chip to the second heat dissipation fins through a refrigerant phase change. The heat from the second heat dissipation fins is then carried out of the cabinet by the circulating coolant. Its compact structure saves cabinet space, significantly improves heat dissipation efficiency and system performance, and meets the high-power heat dissipation requirements of chips.

[0006] Furthermore, in the aforementioned liquid-cooled phase-change cold plate device, a first heat dissipation fin is connected within the groove. The first heat dissipation fin includes a first top plate and a first bottom plate, which are connected by first fins. The first top plate array has a first upper slot, and the first bottom plate array has a first lower slot. The first upper slot and the first lower slot are arranged parallel and spaced apart, and the first upper slot and the waist-shaped through hole are correspondingly arranged. The heat absorbed by the substrate from the chip is transferred to the first fin through the first bottom plate and then to the cover plate from the first top plate, improving heat dissipation efficiency. At the same time, the refrigerant surrounds the first fin, increasing the heat exchange area, making the refrigerant more heat-absorbing and the heat dissipation efficiency higher. When the gaseous refrigerant condenses inside the flat tube, the liquid refrigerant enters the first heat dissipation fin from the first upper slot and flows out from the first lower slot, guiding the flow path of the liquid refrigerant and forming microchannels, thereby improving the heat exchange efficiency of the refrigerant and the overall heat dissipation efficiency.

[0007] Furthermore, in the aforementioned liquid-cooled phase-change plate device, the first fin has an upper groove near the first upper slot opening, and the cross-section of the upper groove is square. The first fin has a lower groove near the first lower slot opening, and the cross-section of the lower groove is semi-circular. The upper groove guides the refrigerant flow, allowing the refrigerant to quickly flow into the gaps between the first fins, while the lower groove guides the refrigerant to flow rapidly along the lower groove, ensuring rapid refrigerant flow, increasing the heat exchange area, and improving heat dissipation efficiency.

[0008] Furthermore, in the above-mentioned liquid-cooled phase change cold plate device, the end of the second heat dissipation fin away from the cover plate is connected to the second top plate, and a set of side plates are respectively provided on both sides of the second heat dissipation fin. The lower end of the set of side plates is connected to both sides of the cover plate, and the upper end of the set of side plates is connected to both sides of the second top plate.

[0009] Furthermore, in the aforementioned liquid-cooled phase change plate device, the inner wall of the flat tube is provided with multiple stiffeners, which divide the interior of the flat tube into multiple cavities. These cavities form multiple microchannels, allowing the refrigerant to enter and increasing the heat exchange area, reducing flow resistance, and improving heat dissipation efficiency. At the same time, the stiffeners enhance the structural strength of the flat tube, preventing deformation under high temperature and pressure.

[0010] Furthermore, in the aforementioned liquid-cooled phase change plate device, the inner wall of the flat tube is provided with multiple ribs, which are arranged parallel to the rib plate. The ribs further increase the heat exchange area and guide the movement direction of the refrigerant, thereby improving the heat exchange capacity.

[0011] Furthermore, in the above-mentioned liquid-cooled phase change plate device, the liquid inlet is connected to a liquid inlet pipe, the liquid outlet is connected to a liquid outlet pipe, and the liquid inlet pipe and the liquid outlet pipe are respectively connected to quick connectors.

[0012] Furthermore, in the aforementioned liquid-cooled phase change cold plate device, the inlet pipe and outlet pipe are detachably connected with pipe clamps, and the inlet pipe and outlet pipe are fixed to the cabinet by the pipe clamps.

[0013] Furthermore, in the above-mentioned liquid-cooled phase change cold plate device, there are two or more heat dissipation devices, and the liquid outlet and liquid inlet of adjacent heat dissipation devices are connected by liquid pipes.

[0014] As can be seen from the above technical solution, this utility model has the following beneficial effects: The liquid-cooled phase change cold plate device of this utility model, with its first upper slot and first lower slot, guides the flow path of the refrigerant, forming microchannels, thereby improving the heat exchange efficiency and heat dissipation efficiency of the refrigerant. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the liquid-cooled phase change cold plate device of this utility model;

[0016] Figure 2 This is an exploded view of the liquid-cooled phase change cold plate device of this utility model;

[0017] Figure 3 This is an exploded view of the radiator;

[0018] Figure 4 This is a schematic diagram of the structure of the first heat dissipation fin;

[0019] Figure 5 This is a top view of the flat tube;

[0020] Figure 6 This is a schematic diagram of the structure of Example 2;

[0021] Figure 7 This is a schematic diagram of the structure of Example 3.

[0022] In the diagram: 1. Heat dissipation device; 11. Base plate; 111. Groove; 12. Cover plate; 121. Waist-shaped through hole; 13. Housing; 14. Screw assembly; 15. First heat dissipation fin; 151. First top plate; 1511. First upper slot; 152. First bottom plate; 1521. First lower slot; 153. First fin; 1531. Upper cut groove; 1532. Lower cut groove; 16. Top plate; 17. Side plate; 2. Radiator; 21. Second heat dissipation fin; 22. Flat tube; 221. Rib; 222. Rib; 3. Liquid inlet; 31. Liquid inlet pipe; 4. Liquid outlet; 41. Liquid outlet pipe; 5. Injection port; 6. Quick connector; 7. Pipe clamp. Detailed Implementation

[0023] Example 1

[0024] like Figure 1-3 The liquid-cooled phase-change plate device shown includes a heat dissipation device 1, which has a liquid inlet 3 and a liquid outlet 4 on the side away from the liquid inlet 3. The heat dissipation device 1 includes a substrate 11, a cover plate 12, and a housing 13. The top surface of the substrate 11 has a groove 111, and the cover plate 12 is connected to the top surface of the substrate 11 to form a cavity. The lower opening of the housing 13 is connected to the cover plate 12 to form a hollow chamber, in which a heat sink 2 is provided. The heat sink 2 includes a set of second heat dissipation fins 21, and a flat tube 22 is provided between the second heat dissipation fins 21. The flat tube 22 is vertically arranged, and the cover plate 12 has an oblong through hole 121. The flat tube 22 communicates with the groove 111 through the oblong through hole 121. The side wall of the substrate 11 has a liquid injection port 5, and screw sets 14 are connected to the four corners of the substrate 11. The substrate 11 is connected to the chip surface by the screw sets 14.

[0025] In this embodiment, the end of the second heat dissipation fin 21 away from the cover plate 12 is connected to the second top plate 16. A set of side plates 17 are provided on both sides of the second heat dissipation fin 21. The lower end of the set of side plates 17 is connected to both sides of the cover plate 12, and the upper end of the set of side plates 17 is connected to both sides of the second top plate 16.

[0026] like Figure 4The liquid-cooled phase change plate device shown has a first heat dissipation fin 15 connected within a groove 111. The first heat dissipation fin 15 includes a first top plate 151 and a first bottom plate 152, which are connected by a first fin 153. The first top plate 151 has an array of first upper slots 1511, and the first bottom plate 152 has an array of first lower slots 1521. The first upper slots 1511 and the first lower slots 1521 are arranged in parallel and spaced apart. The first upper slots 1511 and the waist-shaped through holes 121 are correspondingly arranged.

[0027] In this embodiment, the first fin 153 is provided with an upper groove 1531 near the first upper groove opening 1511, and the cross-section of the upper groove 1531 is square. The first fin 153 is provided with a lower groove 1532 near the first lower groove opening 1521, and the cross-section of the lower groove 1532 is semi-circular.

[0028] like Figure 5 The liquid-cooled phase change plate device shown has multiple stiffening plates 221 on the inner wall of the flat tube 22, which divide the interior of the flat tube 22 into multiple cavities.

[0029] In this embodiment, the inner wall of the flat tube 22 is provided with multiple ribs 222, which are arranged parallel to the rib plate 221.

[0030] In this invention, the second heat dissipation fins 21, the flat tube 22, the second top plate 16, and the side plate 17 are brazed together to form a heat sink 2. The substrate 11, the cover plate 12, the heat sink 2, and the shell 13 are brazed together to form a heat dissipation device 1. The heat dissipation device 1 is connected to the chip surface by a screw assembly 14. Refrigerant is injected into the groove 111 through the liquid injection port 5. The refrigerant remains in the groove 111 in a liquid state. The heat generated by the chip during operation is transferred to the substrate 11, which serves as a heat spreader, and then to the second heat dissipation fins 21. The refrigerant immersed in the second heat dissipation fins 21 absorbs heat and vaporizes. The vaporized refrigerant enters the flat tube 22 through the waist-shaped through hole 121. The refrigerant enters the multiple cavities provided in the flat tube 22, and the ribs 222 guide the flow of the refrigerant. The refrigerant condenses and transforms into a liquid state in the flat tube 22. The liquid refrigerant flows downward under the action of gravity and enters the first heat dissipation fins 15 through the first upper slot 1511. The liquid refrigerant flows along the upper groove 1531 and enters the space between the first heat dissipation fins 15, where it is heated and vaporized again. This process is repeated to transfer the heat generated by the chip to the flat tube 22. The flat tube 22 absorbs heat and transfers the heat to the second heat dissipation fins 21. At this time, the coolant enters the hollow cavity formed by the connection between the housing 13 and the cover plate 12 from the inlet 3 and is discharged from the outlet 4. The outlet 4 carries away the heat from the second heat dissipation fins 21. After the coolant discharged from the outlet 4 enters the external cooling device for cooling, it enters the heat dissipation device 1 again from the inlet 3 for cooling.

[0031] Example 2

[0032] The difference between this implementation and Example 1 is that, Figure 6 The liquid-cooled phase change plate device shown has an inlet 3 connected to an inlet pipe 31 and an outlet 4 connected to an outlet pipe 41. The inlet pipe 31 and the outlet pipe 41 are respectively connected to quick connectors 6.

[0033] In this embodiment, the inlet pipe 31 and the outlet pipe 41 are detachably connected to pipe clamps 7, and the inlet pipe 31 and the outlet pipe 41 are fixed to the cabinet by the pipe clamps 7. The inlet pipe 31 and the outlet pipe 41 are preferably EPDM rubber hoses.

[0034] Example 3

[0035] The difference between this implementation and Example 1 is that, Figure 6 The liquid-cooled phase change plate device shown has two or more heat dissipation devices 1, and the liquid outlet 4 and liquid inlet 3 of adjacent heat dissipation devices 1 are connected by liquid pipes. The liquid pipes are preferably EPDM rubber hoses.

[0036] The above embodiments are exemplary and are intended to illustrate the technical concept and features of this utility model, so that those skilled in the art can understand the content of this utility model and implement it accordingly. They should not be construed as limiting the scope of protection of this utility model. All equivalent changes or modifications made in accordance with the spirit and essence of this utility model should be covered within the scope of protection of this utility model.

Claims

1. A liquid-cooled phase change plate device, characterized in that: The device includes a heat dissipation device (1), which has an inlet (3) and an outlet (4) on the side away from the inlet (3). The heat dissipation device (1) includes a base plate (11), a cover plate (12), and a housing (13). The top surface of the base plate (11) has a groove (111). The cover plate (12) is connected to the top surface of the base plate (11). The lower opening of the housing (13) is connected to the cover plate (12) to form a hollow cavity. A radiator (2) is provided in the hollow cavity. The heat sink (2) includes a set of second heat dissipation fins (21), and a flat tube (22) is provided between the second heat dissipation fins (21). The flat tube (22) is vertically arranged. The cover plate (12) is provided with a waist-shaped through hole (121). The flat tube (22) is connected to the groove (111) through the waist-shaped through hole (121). The side wall of the substrate (11) is provided with a liquid injection port (5). The four corners of the substrate (11) are connected with screw groups (14). The substrate (11) is connected to the chip surface through the screw groups (14).

2. The liquid-cooled phase change plate device according to claim 1, characterized in that: The groove (111) is connected to a first heat dissipation fin (15), which includes a first top plate (151) and a first bottom plate (152). The first top plate (151) and the first bottom plate (152) are connected by a first fin (153). The first top plate (151) array is provided with a first upper slot (1511), and the first bottom plate (152) array is provided with a first lower slot (1521). The first upper slot (1511) and the first lower slot (1521) are arranged in parallel and spaced apart. The first upper slot (1511) and the waist-shaped through hole (121) are correspondingly arranged.

3. The liquid-cooled phase change plate device according to claim 2, characterized in that: The first fin (153) has an upper groove (1531) near the first upper groove (1511), and the cross-section of the upper groove (1531) is square; the first fin (153) has a lower groove (1532) near the first lower groove (1521), and the cross-section of the lower groove (1532) is semi-circular.

4. The liquid-cooled phase change plate device according to claim 1, characterized in that: The second heat dissipation fin (21) is connected to the second top plate (16) at the end away from the cover plate (12). A set of side plates (17) are provided on both sides of the second heat dissipation fin (21). The lower end of the set of side plates (17) is connected to both sides of the cover plate (12), and the upper end of the set of side plates (17) is connected to both sides of the second top plate (16).

5. The liquid-cooled phase change plate device according to claim 1, characterized in that: The inner wall of the flat tube (22) is provided with multiple stiffening plates (221), which divide the interior of the flat tube (22) into multiple cavities.

6. The liquid-cooled phase change plate device according to claim 5, characterized in that: The inner wall of the flat tube (22) is provided with a plurality of ribs (222), which are arranged parallel to the rib plate (221).

7. The liquid-cooled phase change plate device according to claim 1, characterized in that: The inlet (3) is connected to an inlet pipe (31), the outlet (4) is connected to an outlet pipe (41), and the inlet pipe (31) and the outlet pipe (41) are respectively connected to quick connectors (6).

8. The liquid-cooled phase change plate device according to claim 7, characterized in that: The inlet pipe (31) and outlet pipe (41) are detachably connected to pipe clamps (7), and the inlet pipe (31) and outlet pipe (41) are fixed to the cabinet by the pipe clamps (7).

9. The liquid-cooled phase change plate device according to claim 1, characterized in that: The heat dissipation device (1) is provided in two or more parts, and the liquid outlet (4) and liquid inlet (3) of adjacent heat dissipation devices (1) are connected by liquid pipes.

Images