Shielding structure of PCB

Abstract

The utility model provides a shielding structure of a printed circuit board (PCB), which comprises a heat dissipation panel and a plurality of supporting columns arranged on the upper side and the lower side of the heat dissipation panel, one side, opposite to the heat dissipation panel, of each supporting column is connected with an external PCB, and a space for heat generated by the PCB to circulate is arranged between the PCB and the heat dissipation panel. A first shielding frame and a second shielding frame are arranged at the upper end and the lower end of the heat dissipation panel respectively, shielding channels are communicated between the first shielding frame and the second shielding frame, and the shielding structure can overcome the defect that in the prior art, a heat dissipation cover body cannot guarantee heat dissipation of the whole PCB.

Description

Technical Field

[0001] This utility model relates to the field of shielding technology, specifically to a shielding structure for a PCB board. Background Technology

[0002] The function of a PCB board is to provide mechanical support and electrical connection for electronic components, enabling stable transmission of circuit signals and functional integration. During use, the PCB board needs to utilize heat sinks to dissipate heat generated by electronic components during operation, preventing overheating that could lead to performance degradation or damage, and ensuring stable and reliable circuit operation. In the prior art, the invention patent with patent number CN113784605A discloses a PCB board with a built-in shielding structure, which includes a PCB board body and a shielding cover. The shielding cover includes a first shielding cover and a second shielding cover, with a heat dissipation cover on top of the second shielding cover. However, although this structure can provide some shielding and heat dissipation, the heat generated by the entire PCB board during operation is dissipated through the heat dissipation cover on top of the second shielding cover. The heat dissipation cover cannot guarantee the heat dissipation of the entire PCB board, resulting in poor heat dissipation performance in actual use. Utility Model Content

[0003] Therefore, the technical problem to be solved by this utility model is to overcome the defect that the heat dissipation cover in the prior art cannot guarantee the heat dissipation of the entire PCB board, thereby providing a shielding structure for a PCB board with good heat dissipation effect.

[0004] Therefore, this utility model provides a shielding structure for a PCB board, including a heat dissipation panel and a plurality of support columns disposed on the upper and lower sides of the heat dissipation panel. The side of the support column facing away from the heat dissipation panel is connected to an external PCB board. A space for heat dissipation generated by the PCB board to circulate is provided between the PCB board and the heat dissipation panel. A first shielding frame and a second shielding frame are respectively provided at the upper and lower ends of the heat dissipation panel, and a shielding channel is interconnected between the first shielding frame and the second shielding frame.

[0005] Furthermore: the heat dissipation panel is provided with a heat sink that contacts the PCB board. The heat sink includes a contact end that contacts the PCB board and a heat dissipation end that extends away from the contact end. The heat dissipation panel is provided with a clearance hole for the heat dissipation end to pass through. Extension ends are also provided on both sides of the heat dissipation end. The lower end face of the extension end can abut against the upper end face of the heat dissipation panel.

[0006] Furthermore: a plurality of first connecting pieces are provided on the side of the first shielding frame, the first connecting pieces are arranged along the circumference of the first shielding frame, and the first connecting pieces are fixedly connected to the heat dissipation panel.

[0007] Furthermore, the second shielding frame is provided with a plurality of second connecting pieces on its side, the second connecting pieces are arranged along the circumference of the second shielding frame, and the second connecting pieces are fixedly connected to the heat dissipation panel.

[0008] Furthermore: the first connecting piece is provided with a plurality of first connecting holes, and the second connecting piece is provided with second connecting holes, wherein external rivets can pass through the first connecting holes and the second connecting holes for connection.

[0009] The technical solution of this utility model has the following advantages:

[0010] 1. This utility model provides a shielding structure for a PCB board. Several support pillars are provided on both the upper and lower sides of the heat dissipation panel, which abut against the PCB board. During use, two PCB boards can share a single heat dissipation panel for heat dissipation. A first shielding frame and a second shielding frame are provided on both sides of the heat dissipation panel. After the two PCB boards are connected to the heat dissipation panel, the radio frequency (RF) module on the PCB board radiates electromagnetic waves during operation, which may interfere with other sensitive circuits on the same PCB board. Therefore, a shielding cover needs to be installed outside the RF module so that the RF modules between the two PCB boards can only transmit signals within the shielding cover. In this way, the RF module will not affect other circuits during the operation of the PCB board, and the two PCB boards can share a single heat dissipation panel for heat dissipation, saving materials without affecting the heat dissipation effect, thereby effectively reducing production costs.

[0011] 2. This utility model provides a shielding structure for a PCB board. A groove is provided on the heat dissipation panel for contact with the chip. For some high-power components, improved heat dissipation is required in this area. Therefore, a heat sink is provided on the heat dissipation panel. The heat sink includes a heat dissipation end and an extension end. The heat dissipation end is attached to the component on the PCB board to assist in heat dissipation. An aluminum extruded heat sink is provided at the extension end to improve the heat dissipation capacity in this area. In actual manufacturing, the position of the heat sink can be adjusted according to the arrangement of the components on the PCB board. Extension ends are provided on both sides of the extension end, and the extension ends are fixed to the heat dissipation panel using fastening screws. During installation, the contact end is passed through the clearance hole, and then the extension end is fixed to the heat dissipation panel using fastening screws to complete the positioning of the heat sink. Attached Figure Description

[0012] To more clearly illustrate the specific embodiments of this utility model or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0013] Figure 1 A 3D view of the shielding structure;

[0014] Figure 2 This is a schematic diagram of the back structure of the shielding structure;

[0015] Figure 3 This is a schematic diagram of the heat sink structure;

[0016] Figure 4 This is a schematic diagram of the front structure of the shielding structure;

[0017] Figure 5 This is a schematic diagram of the shielding structure from another angle.

[0018] Explanation of reference numerals in the attached figures:

[0019] 1. Heat dissipation panel; 2. Support column; 3. First shielding frame; 31. First connecting piece; 32. First connecting hole; 4. Second shielding frame; 41. Second connecting piece; 42. Second connecting hole; 5. Shielding channel; 6. Heat sink; 61. Contact end; 62. Heat dissipation end; 63. Extension end; 7. Clearance hole. Detailed Implementation

[0020] The technical solution of this utility model will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model.

[0021] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0022] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0023] Furthermore, the technical features involved in the different embodiments of this utility model described below can be combined with each other as long as they do not conflict with each other.

[0024] Example

[0025] This embodiment provides a shielding structure for a PCB board, including a heat dissipation panel 1 and a plurality of support columns 2 disposed on the upper and lower sides of the heat dissipation panel 1. The side of the support column 2 facing away from the heat dissipation panel 1 is connected to an external PCB board. A space for heat generated by the PCB board to circulate is provided between the PCB board and the heat dissipation panel 1. A first shielding frame 3 and a second shielding frame 4 are respectively disposed at the upper and lower ends of the heat dissipation panel 1. A shielding channel 5 is interconnected between the first shielding frame 3 and the second shielding frame 4.

[0026] The specific improvements mentioned above are as follows: Figure 1 and Figure 2 As shown, compared to existing technologies, the heat dissipation panel 1 has several support pillars 2 on both the upper and lower sides. These support pillars 2 abut against the PCB board. During use, two PCB boards can share one heat dissipation panel 1 for heat dissipation. The heat dissipation panel 1 has a first shielding frame 3 and a second shielding frame 4 on both sides. After the two PCB boards are connected to the heat dissipation panel 1, the radio frequency module on the PCB board will radiate electromagnetic waves when it is working, which may interfere with other sensitive circuits on the same PCB board. Therefore, the first shielding frame 3 and the second shielding frame 4 need to be installed outside the radio frequency module so that the radio frequency module between the two PCB boards can only transmit signals within the first shielding frame 3 and the second shielding frame 4. In this way, the radio frequency module will not affect other circuits during the operation of the PCB board. Furthermore, the two PCB boards can share one heat dissipation panel 1 for heat dissipation, saving materials without affecting the heat dissipation effect, thereby effectively reducing production costs. The PCB board in this embodiment is a component sold by our company. During the production process, the positions of the first shielding frame 3 and the second shielding frame 4 can also be adjusted according to customer needs. Therefore, its specific structure will not be described here.

[0027] Based on the above embodiments: the heat dissipation panel 1 is provided with a heat sink 6 that contacts the PCB board. The heat sink 6 includes a contact end 61 that contacts the PCB board and a heat dissipation end 62 that extends away from the contact end 61. The heat dissipation panel 1 is provided with a clearance hole 7 for the heat dissipation end 62 to pass through. The heat dissipation end 62 is also provided with extension ends 63 on both sides. The lower end surface of the extension end 63 can abut against the upper end surface of the heat dissipation panel 1.

[0028] The specific improvements mentioned above are as follows: Figure 3 As shown, a groove is provided on the heat dissipation panel 1 for contact with the chip. For some high-power components, it is necessary to improve the heat dissipation function of this part. Therefore, a heat sink 6 is provided on the heat dissipation panel 1. The heat sink 6 includes a heat dissipation end 62 and an extension end 63. The heat dissipation end 62 is attached to the components on the PCB board to assist in heat dissipation. An aluminum extruded heat sink 6 is provided at the extension end 63 to improve the heat dissipation capacity of this part. In the actual manufacturing process, the position of the heat sink 6 can be adjusted according to the arrangement of the components on the PCB board. Extension ends 63 are provided on both sides of the extension end 63. The extension ends 63 are fixed to the heat dissipation panel 1 with fastening screws. During installation, the contact end 61 is passed through the clearance hole 7, and then the extension end 63 is fixed to the heat dissipation panel 1 with fastening screws to complete the positioning of the heat sink 6.

[0029] Based on the above embodiments: a plurality of first connecting pieces 31 are provided on the side of the first shielding frame 3, the first connecting pieces 31 are arranged circumferentially along the first shielding frame 3, and the first connecting pieces 31 are fixedly connected to the heat dissipation panel 1.

[0030] Based on the above embodiments: a plurality of second connecting pieces 41 are provided on the side of the second shielding frame 4, the second connecting pieces 41 are arranged circumferentially along the second shielding frame 4, and the second connecting pieces 41 are fixedly connected to the heat dissipation panel 1.

[0031] Based on the above embodiments: the first connecting piece 31 is provided with a plurality of first connecting holes 32, and the second connecting piece 41 is provided with second connecting holes 42, wherein external rivets can pass through the first connecting holes 32 and the second connecting holes 42 for connection.

[0032] The specific improvements mentioned above are as follows: Figures 3-5As shown, in order to effectively fix the positions of the first shielding frame 3 and the second shielding frame 4, a first connecting piece 31 is provided at the connection position between the first shielding frame 3 and the heat dissipation panel 1, and a first connecting hole 32 is provided on the first connecting surface. Similarly, a second connecting piece 41 is provided at the connection position between the second shielding frame 4 and the heat dissipation panel 1, and a second connecting hole 42 is provided on the second connecting piece 41. The first shielding frame 3 can be formed by processing stainless steel plate. The first connecting piece 31 and the second connecting piece 41 are respectively riveted to the heat dissipation panel 1 to effectively fix their positions.

[0033] Obviously, the above embodiments are merely illustrative examples for clear explanation and are not intended to limit the implementation. Those skilled in the art will recognize that other variations or modifications can be made based on the above description. It is neither necessary nor possible to exhaustively list all possible implementations here. However, obvious variations or modifications derived therefrom are still within the protection scope of this invention.

Claims

1. A shielding structure for a PCB board, characterized in that: It includes a heat dissipation panel (1) and several support columns (2) disposed on the upper and lower sides of the heat dissipation panel (1). The side of the support column (2) facing away from the heat dissipation panel (1) is connected to an external PCB board. A space for heat generated by the PCB board to circulate is provided between the PCB board and the heat dissipation panel (1). A first shielding frame (3) and a second shielding frame (4) are respectively provided at the upper and lower ends of the heat dissipation panel (1). A shielding channel (5) is interconnected between the first shielding frame (3) and the second shielding frame (4).

2. The shielding structure of a PCB board according to claim 1, characterized in that: The heat dissipation panel (1) is provided with a heat sink (6) that contacts the PCB board. The heat sink (6) includes a contact end (61) that contacts the PCB board and a heat dissipation end (62) that extends away from the contact end (61). The heat dissipation panel (1) is provided with a clearance hole (7) for the heat dissipation end (62) to pass through. The heat dissipation end (62) is also provided with extension ends (63) on both sides. The lower end face of the extension end (63) can abut against the upper end face of the heat dissipation panel (1).

3. The shielding structure of a PCB board according to claim 2, characterized in that: The first shielding frame (3) has a plurality of first connecting pieces (31) on its side. The first connecting pieces (31) are arranged around the first shielding frame (3) and are fixedly connected to the heat dissipation panel (1).

4. The shielding structure of a PCB board according to claim 3, characterized in that: The second shielding frame (4) has a plurality of second connecting pieces (41) on its side. The second connecting pieces (41) are arranged circumferentially along the second shielding frame (4), and the second connecting pieces (41) are fixedly connected to the heat dissipation panel (1).

5. The shielding structure of a PCB board according to claim 4, characterized in that: The first connecting piece (31) is provided with a plurality of first connecting holes (32), and the second connecting piece (41) is provided with second connecting holes (42). External rivets can pass through the first connecting holes (32) and the second connecting holes (42) for connection.

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