Quartz ring special for semiconductor etching process
By incorporating connecting components and a detachable protective top ring on the quartz ring, the problem of limited protection at the top of the quartz ring is solved, achieving greater stability and adaptability, and improving the reliability and consistency of the etching process.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SUZHOU XWC ELECTRONIC TECH CO LTD
- Filing Date
- 2025-04-07
- Publication Date
- 2026-05-05
AI Technical Summary
The fixed size of existing quartz rings used in semiconductor etching processes results in limited top protection, making it difficult to meet diverse etching needs.
A connecting assembly, including first and second connecting rings, is provided on the ring base of the quartz ring. The connection is made by threaded connection and bolt fixation to enhance the stability of the ring base and the top protection. A detachable protective top ring is used to adapt to different etching requirements.
This improves the stability and protective properties of the quartz ring, enhances its stability and protective effect, achieves protection and adaptability to the ring substrate, and improves the reliability and consistency of the etching process.
Smart Images

Figure CN224205569U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of quartz rings, specifically a quartz ring for semiconductor etching processes. Background Technology
[0002] Semiconductor etching is a technique used to fabricate semiconductor devices. Its purpose is to cut semiconductor materials into specific shapes and sizes to create various complex integrated circuit components, such as transistors, memory, and transistor stages. Semiconductor etching quartz rings play a crucial role in semiconductor manufacturing. They are primarily used in the etching process as spacers between the wafer and electrodes, ensuring the accuracy and consistency of the etching process. Quartz rings are typically made of high-purity quartz, a material known for its high purity, chemical resistance, and thermal stability, enabling it to withstand the chemical reagents and high-temperature environments encountered during etching. However, the dimensions of quartz rings specifically designed for semiconductor etching are fixed, and the protective effect of the quartz ring's top is limited.
[0003] Therefore, it is necessary to propose a quartz ring specifically for semiconductor etching processes. Utility Model Content
[0004] The purpose of this invention is to provide a quartz ring specifically for semiconductor etching processes to solve the problems mentioned in the background art.
[0005] To achieve the above objectives, this utility model provides the following technical solution:
[0006] A quartz ring for semiconductor etching process includes a ring base, a protective protrusion fixedly installed on the side wall of the ring base, and a connecting component connected to the upper and lower ends of the ring base. The connecting component can improve the protection of the quartz ring for semiconductor etching process.
[0007] Preferably, the connecting assembly includes a first connecting ring and a second connecting ring, wherein the first connecting ring is threadedly connected to the top of the ring base and the second connecting ring is threadedly connected to the bottom of the ring base.
[0008] Preferably, the top of the ring base is provided with a first threaded groove, the bottom of the first connecting ring is fixedly installed with a threaded ring, the threaded ring is threaded into the first threaded groove, and the edge of the first connecting ring covers the side wall of the protective convex edge.
[0009] Preferably, a convex ring is fixedly installed on the top of the first connecting ring, a protective top ring is snapped onto the convex ring, and the protective top ring and the first connecting ring are connected by bolts.
[0010] Preferably, bolt grooves for installing bolts are provided on the top of the first connecting ring and the protective top ring.
[0011] Preferably, a sealing ring is provided on the side wall of the ring base, and a second threaded groove is provided at the bottom of the ring base, through which a second connecting ring is threadedly connected.
[0012] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention.
[0013] Beneficial effects:
[0014] By setting connecting components at the upper and lower ends of the quartz ring specifically for semiconductor etching processes, and extending the quartz ring downwards via a second connecting ring, the stability of the ring body is increased. The top of the quartz ring is covered by the detachable installation of the first connecting ring and the protective top ring, thereby improving the top protection of the quartz ring specifically for semiconductor etching processes. Attached Figure Description
[0015] Figure 1 This is a structural diagram of a quartz ring used in semiconductor etching processes;
[0016] Figure 2 A schematic diagram of a quartz ring connection for a semiconductor etching process. Figure 1 ;
[0017] Figure 3 A schematic diagram of a quartz ring connection for a semiconductor etching process. Figure 2 ;
[0018] Figure 4 A schematic diagram of a quartz ring substrate for a semiconductor etching process. Figure 1 ;
[0019] Figure 5 A schematic diagram of a quartz ring substrate for a semiconductor etching process. Figure 2 ;
[0020] Figure 6 A schematic diagram of the first connecting ring in a quartz ring specifically designed for semiconductor etching processes. Figure 1 ;
[0021] Figure 7 A schematic diagram of the first connecting ring in a quartz ring specifically designed for semiconductor etching processes. Figure 2 .
[0022] In the figure: 1. Ring base; 11. Protective protrusion; 2. Connecting assembly; 21. First connecting ring; 22. Protective top ring; 23. Second connecting ring; 24. First threaded groove; 25. Sealing ring; 26. Second threaded groove; 27. Protruding ring; 28. Bolt groove; 29. Threaded ring. Detailed Implementation
[0023] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model.
[0024] like Figures 1-7 ;
[0025] A quartz ring for semiconductor etching process includes a ring base 1, which is a quartz ring. A protective protrusion 11 is fixedly installed on the side wall of the ring base 1. The protective protrusion 11 is used to increase the protective effect of the top of the ring base 1 extending outward. A connecting component 2 is connected to the upper and lower ends of the ring base 1. The connecting component 2 can improve the protection of the quartz ring for semiconductor etching process.
[0026] The connecting assembly 2 includes a first connecting ring 21 and a second connecting ring 23. The first connecting ring 21 is threaded to the top of the ring base 1, supporting the protective top ring 22 and protecting the top of the ring base 1. The second connecting ring 23 is threaded to the bottom of the ring base 1, extending downwards to increase the installation stability of the ring base 1 and also providing protection. A first threaded groove 24 is provided on the top of the ring base 1, which is used to connect to a threaded ring 29, thereby quickly connecting the first connecting ring 21 to the ring base 1. The threaded ring 29 is fixedly installed at the bottom of the first connecting ring 21, and the threaded ring 29 is threaded into the first threaded groove 24. When the threaded ring 29 is rotated and tightened, the edge of the first connecting ring 21 covers the side wall of the protective protrusion 11, protecting the top of the ring base 1. A protruding ring 27 is fixedly installed on the top of the first connecting ring 21. The protruding ring 27 is used to snap and position the protective top ring 22. The protective top ring 22 is snapped onto the protruding ring 27. The protective top ring 22 can be replaced. The appropriate width of the protective top ring 22 can be selected according to the actual use requirements. The protective top ring 22 should cover the first connecting ring 21, the protective protruding edge 11 and the ring base 1 to improve the top protection of the quartz ring for semiconductor etching process. The protective top ring 22 and the first connecting ring 21 are connected by bolts. The top of the first connecting ring 21 and the protective top ring 22 are provided with bolt grooves 28 for installing bolts. The side wall of the ring base 1 is provided with a sealing ring 25. By providing the sealing ring 25, the sealing and tightness of the ring base 1 after installation are increased. The bottom of the ring base 1 is provided with a second threaded groove 26. The second threaded groove 26 is used to support and connect the second connecting ring 23.
[0027] The working principle of this utility model is as follows: A first threaded groove 24 is provided on the top of the ring base 1; a threaded ring 29 is fixedly installed on the bottom of the first connecting ring 21; the threaded ring 29 is threaded into the first threaded groove 24; the edge of the first connecting ring 21 covers the side wall of the protective convex edge 11; a convex ring 27 is fixedly installed on the top of the first connecting ring 21; a protective top ring 22 is snapped onto the convex ring 27; the protective top ring 22 and the first connecting ring 21 are connected by bolts; bolt grooves 28 for installing bolts are provided on the top of the first connecting ring 21 and the protective top ring 22; a sealing ring 25 is provided on the side wall of the ring base 1; and a second threaded groove 24 is provided on the bottom of the ring base 1. 6. The second connecting ring 23 is connected to the inner thread of the second threaded groove 26. The threaded ring 29 at the bottom of the first connecting ring 21 is threaded to the first threaded groove 24 at the top of the ring base 1. When the threaded ring 29 is rotated and tightened, the edge of the first connecting ring 21 covers the side wall of the protective convex edge 11, protecting the top of the ring base 1. The convex ring 27 is first snapped onto the top of the first connecting ring 21 and then fixed by bolts. The protective top ring 22 can be replaced. Select a protective top ring 22 of appropriate width according to actual use requirements. The protective top ring 22 should cover the first connecting ring 21, the protective convex edge 11 and the ring base 1 to improve the top protection of the quartz ring for semiconductor etching process.
[0028] Although the present invention has been described above with reference to embodiments, various modifications can be made and components can be replaced with equivalents without departing from the scope of the present invention. In particular, as long as there is no structural conflict, the features in the embodiments disclosed in this invention can be combined with each other in any way. The lack of an exhaustive description of these combinations in this specification is merely for the sake of brevity and resource conservation. Therefore, the present invention is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.
Claims
1. A quartz ring for semiconductor etching processes, comprising a ring substrate (1), wherein a protective protrusion (11) is fixedly mounted on the sidewall of the ring substrate (1), characterized in that: The upper and lower ends of the ring substrate (1) are connected to the connecting components (2), which can improve the protection of the quartz ring for semiconductor etching process. The connecting assembly (2) includes a first connecting ring (21) and a second connecting ring (23), wherein the first connecting ring (21) is threaded to the top of the ring base (1) and the second connecting ring (23) is threaded to the bottom of the ring base (1); The top of the ring base (1) is provided with a first threaded groove (24), and the bottom of the first connecting ring (21) is fixedly installed with a threaded ring (29). The threaded ring (29) is threadedly connected to the first threaded groove (24), and the edge of the first connecting ring (21) covers the side wall of the protective protrusion (11). A protruding ring (27) is fixedly installed on the top of the first connecting ring (21), and a protective top ring (22) is snapped onto the protruding ring (27). The protective top ring (22) and the first connecting ring (21) are connected by bolts. The top of the first connecting ring (21) and the protective top ring (22) are both provided with bolt grooves (28) for installing bolts. The side wall of the ring base (1) is provided with a sealing ring (25), and the bottom of the ring base (1) is provided with a second threaded groove (26), and the second threaded groove (26) is internally threaded to a second connecting ring (23).