Substrate heating carrier

Abstract

A substrate heating carrier comprises a rectangular plate, a plurality of rectangular holes are formed in the rectangular plate from top to bottom in a penetrating mode, the rectangular holes are evenly distributed in the rectangular plate, annular grooves are formed in the upper ends of the rectangular holes, embedded grooves are formed in the two ends of the rectangular holes in the length direction respectively, penetrating rods are arranged at the bottoms of the embedded grooves in a penetrating mode, and end caps are arranged at the lower ends of the penetrating rods. The upper end of the penetrating rod is connected with an upper top plate through threads, the upper top plate is provided with a step groove, the upper end of the penetrating rod is sleeved with a spring, the spring is located between the upper top plate and the bottom of the embedded groove, the two sides of the rectangular hole in the width direction are each provided with a pair of kidney-shaped holes, and movable screws are movably arranged in the kidney-shaped holes. The upper ends of the moving screws located on the same side are connected with upper clamping plates through threads, and the upper clamping plates are located on the upper sides of the rectangular plates. According to the utility model, the substrate is convenient to take and place, the limiting and fixing effect on the substrate is improved, the problem that the substrate moves when being transferred is avoided, and the contact effect of the lower wall of the substrate and the heating block can be ensured.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor device processing technology, and in particular to a substrate heating carrier. Background Technology

[0002] like Figure 5 As shown, this is a carrier for heating a power module. The carrier includes a plate 1 with multiple rectangular through holes 10 evenly distributed on it. An embedded annular groove 11 is formed at the upper end of each rectangular through hole 10, and R-grooves 12 are formed at each of the four corners of the embedded annular groove 11. The power module includes a substrate 2, on which multiple electronic components 20 and multiple pins 21 are soldered. The carrier is used to fix the substrate 2. When soldering the electronic components 20 to the substrate 2, the substrate 2 is first placed on the embedded annular groove 11, and then the power modules to be soldered are transferred to the carrier. The heating device has each heating block inserted through a rectangular through hole 10, with the upper end of the heating block in contact with the lower wall of the substrate 2. The solder paste is then melted by heating, and the electronic components are then soldered. This method can ensure the uniformity of heating of the substrate 2. However, in actual use, since the substrate 2 is embedded in the inner ring groove 11, it is inconvenient to place and remove the substrate 2. In addition, the substrate 2 may be tilted when placed, which may affect the contact effect between the substrate 2 and the heating block. Utility Model Content

[0003] This invention provides a substrate heating carrier to overcome the shortcomings of the prior art and solve the problem of inconvenient substrate handling, thus having strong practicality.

[0004] In order to achieve the purpose of this utility model, the following technology is proposed to be adopted:

[0005] A substrate heating carrier includes a rectangular plate with multiple rectangular holes extending from top to bottom. The rectangular holes are evenly distributed on the rectangular plate. An annular groove is formed at the upper end of each rectangular hole, and arc-shaped grooves are formed at the four corners of the annular groove. An embedded groove is formed at both ends of the rectangular hole along its length. A through rod is passed through the bottom of the embedded groove. An end cap is provided at the lower end of the through rod, which is located on the lower side of the rectangular plate. An upper top plate is threaded to the upper end of the through rod. A stepped groove is formed on the inner side of the upper top plate. A spring is sleeved on the upper end of the through rod, and the spring is located between the upper top plate and the bottom of the embedded groove.

[0006] A pair of oblong holes are provided on both sides of the width direction of the rectangular hole. A movable screw is installed in the oblong hole. The upper end of the movable screw on the same side is connected to an upper clamping plate by thread. The upper clamping plate is located on the upper side of the rectangular plate.

[0007] In application, the substrate is placed in the annular groove, and after placement, both ends of the substrate are located in the stepped groove. The vertical surface of the stepped groove can limit the substrate during placement. After the substrate is placed, the upper clamping plate is pressed down and moved inward to limit the substrate. At this time, the spring is in a compressed state, which can ensure the contact effect between the substrate and the heating block. When the upper clamping plate releases the limit on the substrate, the upper top plate can lift the substrate, which facilitates the picking and placing of the substrate.

[0008] Furthermore, the rectangular plate is made of aluminum alloy, which is convenient to process, lightweight, and not easily deformed.

[0009] Furthermore, when the upper plate is moved inward, in order to avoid the upper plate scratching the upper wall of the substrate, a moving block is connected to the lower end of the moving screw by a thread. A central rod is provided between the moving blocks on the same side. Inner grooves are opened on both sides of the lower end of the rectangular hole in the width direction. A concave seat is fixed to the upper end of the inner groove by a screw. An oblique hole is opened on both sides of the concave seat. The inner end of the oblique hole extends downward at an angle. The two ends of the oblique hole are connected to the end transverse groove. The central rod moves in the oblique hole and the end transverse groove.

[0010] Furthermore, in order to improve the limiting effect of the upper card plate on the substrate, the end slot is set horizontally.

[0011] Furthermore, in order to limit the substrate by the upper clamping plate when the middle rod moves to the upper end transverse groove, the length of the upper end transverse groove is greater than the length of the lower end transverse groove.

[0012] The advantages of the above technical solution are:

[0013] This invention facilitates the handling of substrates, improves the limiting and fixing effect of substrates to prevent movement during substrate transfer, and ensures the contact effect between the lower wall of the substrate and the heating block. Attached Figure Description

[0014] To make the objectives, technical solutions, and advantages of this utility model clearer, the following will provide a further detailed description of this utility model in conjunction with the accompanying drawings.

[0015] Figure 1 A three-dimensional structure of one embodiment is shown. Figure 1 .

[0016] Figure 2 A three-dimensional structure of one embodiment is shown. Figure 2 .

[0017] Figure 3 A magnified view of point A is shown.

[0018] Figure 4A three-dimensional structural diagram of the top plate is shown.

[0019] Figure 5 A three-dimensional structural diagram of the vehicle currently in use is shown. Detailed Implementation

[0020] like Figures 1-4 As shown, a substrate heating carrier includes a rectangular plate 3, which is made of aluminum alloy. The rectangular plate 3 has multiple rectangular holes 30 extending from top to bottom, which are evenly distributed on the rectangular plate 3. An annular groove 31 is formed at the upper end of the rectangular hole 30, and arc-shaped grooves 32 are formed at the four corners of the annular groove 31. An embedded groove 300 is formed at both ends of the rectangular hole 30 along its length. A through rod 42 is inserted through the bottom of the embedded groove 300. An end cap 43 is provided at the lower end of the through rod 42 and is located on the lower side of the rectangular plate 3. An upper top plate 44 is connected to the upper end of the through rod 42 by a thread. A stepped groove 45 is formed on the inner side of the upper top plate 44. A spring 46 is sleeved on the upper end of the through rod 42 and is located between the upper top plate 44 and the bottom of the embedded groove 300.

[0021] A pair of oblong holes 33 are formed on both sides of the rectangular hole 30 in the width direction. A movable screw 34 is movably installed in the oblong hole 33. The upper end of the movable screw 34 on the same side is connected to an upper retaining plate 35 by a thread. The upper retaining plate 35 is located on the upper side of the rectangular plate 3. The lower end of the movable screw 34 is connected to a movable block 37 by a thread. A central rod 41 is provided between the movable blocks 37 on the same side. An inner groove 36 is formed on both sides of the lower end of the rectangular hole 30 in the width direction. The upper end of the inner groove 36 is fixed to a concave seat 38 by a screw. An oblique hole 40 is formed on both sides of the concave seat 38. The inner end of the oblique hole 40 extends downward at an angle. The two ends of the oblique hole 40 are connected to an end transverse groove 39. The central rod 41 moves within the oblique hole 40 and the end transverse groove 39. The end transverse groove 39 is horizontally set. The length of the end transverse groove 39 at the upper end is greater than the length of the end transverse groove 39 at the lower end.

[0022] In this embodiment, the operator places each substrate 2 sequentially into the stepped groove 45 of each pair of upper top plates 44, and limits the vertical surfaces of the stepped groove 45 to both ends of the substrate 2. Then, the operator presses the substrate 2 downward so that the lower wall of the substrate 2 abuts against the bottom of the annular groove 31. At this time, the spring 46 is also in a compressed state. Then, the two upper clamping plates 35 move inward simultaneously. When the upper clamping plates 35 move inward, the middle rod 41 will first move inward in the end transverse groove 39 located at the upper end. In the initial stage of movement, the upper clamping plates 35 are located above the substrate 2, and when the middle rod 41 passes through the oblique hole 40 When the upper plate 35 is moved to the lower end of the transverse groove 39, it will move downward and make its lower wall fit tightly against the upper wall of the substrate 2. In this way, the upper plate 35 can lock the substrate 2 vertically. Then, the carrier is transferred to the heating device and the heating block is inserted through the rectangular hole 30, so that the upper end of the heating block contacts the lower wall of the substrate 2. Then, the heating operation is performed. After heating, the operator removes the carrier and moves the upper plate 35 outward to release the upper plate 35 from the substrate 2, so that the spring 46 lifts the substrate 2 and then the substrate 2 is taken out.

[0023] The above description is merely a preferred embodiment of this utility model and is not intended to limit the scope of this utility model. Obviously, those skilled in the art can make various modifications and variations to this utility model without departing from its spirit and scope. Therefore, if these modifications and variations of this utility model fall within the scope of the claims of this utility model and their equivalents, this utility model also intends to include these modifications and variations.

Claims

1. A substrate heating carrier, comprising a rectangular plate (3), wherein the rectangular plate (3) has a plurality of rectangular holes (30) extending from top to bottom, the rectangular holes (30) being evenly distributed on the rectangular plate (3), and an annular groove (31) being formed at the upper end of each rectangular hole (30), and arc-shaped grooves (32) being formed at the four corners of the annular groove (31), characterized in that, An inner groove (300) is provided at both ends of the rectangular hole (30) along its length. A through rod (42) is provided at the bottom of the inner groove (300). An end cap (43) is provided at the lower end of the through rod (42). The end cap (43) is located on the lower side of the rectangular plate (3). An upper plate (44) is connected to the upper end of the through rod (42) by a thread. A stepped groove (45) is provided at the inner end of the upper plate (44). A spring (46) is sleeved on the upper end of the through rod (42). The spring (46) is located between the upper plate (44) and the bottom of the inner groove (300). A pair of waist-shaped holes (33) are provided on both sides of the width direction of the rectangular hole (30). A movable screw (34) is provided in the waist-shaped hole (33). The upper end of the movable screw (34) on the same side is connected to an upper clamping plate (35) by thread. The upper clamping plate (35) is located on the upper side of the rectangular plate (3).

2. The substrate heating carrier according to claim 1, characterized in that, The rectangular plate (3) is made of aluminum alloy.

3. The substrate heating carrier according to claim 1, characterized in that, The lower end of the movable screw (34) is connected to a movable block (37) by a thread. A middle rod (41) is provided between the movable blocks (37) on the same side. An inner groove (36) is provided on both sides of the lower end of the rectangular hole (30) in the width direction. A concave seat (38) is fixed to the upper end of the inner groove (36) by a screw. An oblique hole (40) is provided on both sides of the concave seat (38). The inner end of the oblique hole (40) extends downward at an angle. The two ends of the oblique hole (40) are connected to the end transverse groove (39). The middle rod (41) moves in the oblique hole (40) and the end transverse groove (39).

4. The substrate heating carrier according to claim 3, characterized in that, The end transverse groove (39) is set horizontally.

5. The substrate heating carrier according to claim 3, characterized in that, The length of the upper end transverse groove (39) is greater than the length of the lower end transverse groove (39).

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