Continuous and rapid film covering equipment

Abstract

The utility model relates to the technical field of semiconductor processing, in particular to continuous rapid film laminating equipment, which comprises an equipment rack, a displacement mechanism, film laminating mechanisms and ring cutting mechanisms, a plurality of film laminating stations are arranged on the equipment rack, and each film laminating station is provided with a corresponding film laminating mechanism and a corresponding ring cutting mechanism; the displacement mechanism is provided with a displacement support, a translation part, a lifting part and a plurality of displacement suction cups, the displacement support is installed on the equipment rack, the translation part is installed on the displacement support, the lifting part is installed at the driving end of the translation part, and the displacement suction cups are evenly installed at the driving end of the lifting part at intervals; therefore, a plurality of wafers can be conveyed at equal intervals. In conclusion, assembly line work is achieved through the equidistant displacement mechanism and the multiple film laminating stations, and the film laminating efficiency is greatly improved; accurate positioning of the wafer is ensured through correction and visual inspection; the rotating station and the overturning station are matched with a multi-element process; all mechanisms are optimized in design, equipment stability and reliability are guaranteed, and the efficient production requirement is met.

Description

Technical Field

[0001] This utility model relates to the technical field of semiconductor processing, and in particular to a continuous and rapid coating equipment. Background Technology

[0002] In semiconductor manufacturing processes, wafer lamination is a preliminary step before critical processes such as photolithography and etching, requiring the application of protective films (such as blue films, UV films, etc.) to the surface or back of the wafer. In actual production, some processes require lamination not only on the front side of the wafer but also on the back side, and even require the application of two or more layers of films.

[0003] Currently, wafer lamination operations can be divided into two methods: manual lamination and automated equipment lamination. Manual lamination is inefficient, has high labor costs, and poor quality consistency. Although automated lamination equipment can solve these problems to some extent, existing automated lamination machines have significant drawbacks: their lamination speed is slow, especially when handling processes that require the application of multiple layers of film or simultaneous lamination of the front and back sides of the wafer. This significantly restricts the overall production efficiency of semiconductor manufacturing plants and makes it difficult to meet the ever-increasing capacity demands.

[0004] Chinese patent document CN222355075U discloses a wafer lamination platform, which includes a transverse frame, a transverse drive module, a height adjustment component, a lifting component, and a rotation component. The adsorption platform is used to adsorb the wafer to be laminated, and the auxiliary support platform is used to support the film material when cutting the inner ring film material. The transverse drive module is configured to drive the transverse frame to move, the height adjustment component is configured to drive the auxiliary support platform to a high or low position, the lifting component is configured to drive the adsorption platform to rise to a preset height and place the wafer on the adsorption platform, and the rotation component is configured to drive the adsorption platform to rotate by a preset angle to drive the wafer located on the adsorption platform to rotate.

[0005] Although the above method can coat two or more layers of film onto a wafer at once, it can only operate on one wafer at a time, which is not convenient for rapid coating operations on a large number of wafers, and it is necessary to improve it. Utility Model Content

[0006] To overcome the shortcomings mentioned above, this utility model aims to provide a technical solution that can solve the above problems.

[0007] This utility model provides a continuous and rapid coating equipment, including a frame, a displacement mechanism, a coating mechanism, and a ring-cutting mechanism. The frame has multiple coating stations, each with a corresponding coating mechanism and a ring-cutting mechanism, which respectively perform coating and ring-cutting operations on the wafers at the coating station. The displacement mechanism includes a displacement bracket, a translation component, a lifting component, and multiple displacement suction cups. The displacement bracket is mounted on the frame, the translation component is mounted on the displacement bracket, the lifting component is mounted on the drive end of the translation component, and the multiple displacement suction cups are evenly spaced and mounted on the drive end of the lifting component, so that multiple wafers are transported at equal intervals under the drive of the translation component.

[0008] Furthermore: the translation component is provided with a first linear module and a translation bracket, and the lifting component is provided with a first actuator and a lifting bracket. The first linear module is installed on the displacement bracket, and the translation bracket is installed on the slide section of the first linear module, so that the first linear module can rotate and drive the translation bracket to perform linear motion in the horizontal direction; the first actuator is installed on the translation bracket, and the lifting bracket is slidably connected to the translation bracket and drively connected to the output end of the first actuator, so that the first actuator can rotate and drive the lifting bracket to perform vertical lifting motion.

[0009] Furthermore, the equipment frame is also equipped with a calibration station, which is equipped with a calibration mechanism. The calibration mechanism is equipped with a calibration motor and a calibration table. The calibration table is driven by the output end of the calibration motor, so that the wafer is subjected to edge-finding calibration under the drive of the calibration motor, thereby calibrating the placement position of the wafer.

[0010] Furthermore, the equipment frame is also equipped with a rotating station, which is equipped with a rotating mechanism. The rotating mechanism is equipped with a rotating motor and a rotating table. The rotating table is connected to the output end of the rotating motor, so that the wafer is rotated under the drive of the rotating motor, thereby causing the wafer to rotate at a certain angle.

[0011] Furthermore, the equipment frame is also equipped with a flipping station, which is equipped with a flipping mechanism. The flipping mechanism includes a flipping bracket, a flipping shaft, a flipping motor, a flipping table, and a receiving table. The flipping shaft is rotatably connected to the flipping bracket, the flipping motor is fixed to the flipping bracket, and its output shaft is driven to the flipping shaft. The flipping table is fixed to the flipping shaft and is equipped with an adsorption plate for adsorbing wafers. When the flipping motor operates, it drives the flipping shaft to rotate synchronously and drives the flipping table to rotate 180 degrees. After flipping the wafers adsorbed by the adsorption plate by 180 degrees, they are placed on the receiving table.

[0012] Furthermore: The coating mechanism includes a coating support, a second linear module, a film supply component, a film attaching component, and an attaching seat. The coating support is mounted on the equipment frame, the second linear module is mounted on the coating support, and has a waiting end and an attaching end at its two ends respectively. The attaching seat is mounted on the slide of the second linear module, thereby causing the second linear module to rotate and drive the attaching seat to reciprocate between the waiting end and the attaching end. The film supply component is used to supply films to the attaching seat at the attaching end, and the film attaching component is used to perform film attaching operations on the wafers on the attaching seat.

[0013] Furthermore, the membrane supply component is equipped with a raw material shaft, an edge material shaft, a bottom material shaft, and a spreading shaft respectively installed on the coating support. The raw material shaft is used to place and supply the membrane raw material, the edge material shaft is used to collect the membrane edge material remaining after the ring cutting operation, and the bottom material shaft is used to collect the membrane bottom lining material. The two sets of spreading shafts are respectively installed on the coating supports on both sides of the bonding end, and are used to spread the membrane raw material supplied at the raw material shaft, so that the membrane raw material is held flat above the bonding end, which facilitates the bonding operation of the membrane bonding component.

[0014] Furthermore, the film attaching component is provided with a second actuator and a vacuum coating assembly. The second actuator is mounted on the coating support, and the vacuum coating assembly is mounted on the drive end of the second actuator and forms an air path communication with the external vacuum generating device, thereby performing a vacuum attaching operation on the film material above the attaching end, so that the film material is attached to the wafer.

[0015] Furthermore: The ring cutting mechanism is equipped with a longitudinal displacement module, a transverse displacement module, a third actuator, a rotating device, and a ring cutting blade. The longitudinal displacement module is mounted on the equipment frame, the transverse displacement module is mounted on the slide of the longitudinal displacement module via an extension bracket, the third actuator is mounted on the slide of the transverse displacement module, the rotating device is mounted on the drive end of the third actuator, and the ring cutting blade is mounted on the output shaft of the rotating device.

[0016] Furthermore, it also includes an automatic feeder, an automatic unloader, a feeding robotic arm, and an unloading robotic arm. The automatic feeder is used to transport the wafers to be coated into the equipment. The feeding robotic arm is used to transfer the wafers to be coated to the calibration table of the calibration station. The equipment frame is also equipped with an unloading station, which is equipped with an unloading platform. The unloading robotic arm is used to transfer the coated wafers on the unloading platform to the automatic unloader. The automatic unloader is used to transport the coated wafers out of the equipment.

[0017] Compared with the prior art, the beneficial effects of this utility model are:

[0018] 1. High-efficiency continuous operation: This invention, through the setting of an equidistant displacement mechanism and multiple coating stations, can simultaneously perform coating operations on multiple wafers, forming an assembly line operation mode. Compared with traditional coating equipment, it can significantly improve coating efficiency, realize rapid coating of a large number of wafers, and significantly improve the factory's production efficiency and capacity.

[0019] 2. Precise delivery and positioning: The displacement mechanism adopts a unique design, in which the translation component and the lifting component work together to accurately achieve equidistant delivery of wafers; the calibration mechanism set in the calibration station uses a calibration motor to drive the calibration table to perform edge-finding calibration of the wafers, combined with the vision inspection module at the front end of the displacement suction cup, to ensure that the placement angle and position of the wafers at each station are accurate, providing a guarantee for high-quality film application.

[0020] 3. Flexible Process Adaptation: The equipment is equipped with a rotary station and a flipping station to meet the needs of various film application processes. The rotary mechanism allows the wafer to rotate at a preset angle before the second film application, adapting to the angle requirements of different film application processes; the flipping mechanism, through the cooperation of the flipping motor and the flipping shaft, achieves a rapid 180-degree flipping of the wafer. Compared with the flipping mode of traditional robotic arms, it is lower in cost and more efficient, and facilitates film application operations on the back of the wafer.

[0021] 4. Automation and Intelligence: Equipped with automatic feeders, automatic unloading machines, feeding robotic arms, and unloading robotic arms, the equipment achieves fully automated operation of the wafer process from feeding, film application to unloading, reducing manual intervention and improving production stability and consistency. At the same time, the collaborative operation between various mechanisms and intelligent detection in some links (such as vision inspection modules) enhance the intelligence level of the equipment.

[0022] 5. Structural Optimization and Stable Reliability: Various mechanisms, such as the coating mechanism and the ring-cutting mechanism, adopt a modular design, resulting in a compact and rational structure. For example, the membrane supply component of the coating mechanism uses multi-axis linkages to achieve stable membrane supply and waste collection, while the membrane application component employs a vacuum coating assembly to ensure coating quality. The ring-cutting mechanism utilizes longitudinal and lateral displacement modules to precisely control the movement of the ring-cutting blade, ensuring ring-cutting accuracy. Furthermore, the equipment incorporates linear guide rail structures and multiple sets of support components in various locations, enhancing overall structural stability and ensuring long-term stable operation.

[0023] Therefore, this equipment achieves assembly line operation through equidistant displacement mechanism and multiple lamination stations, greatly improving lamination efficiency; it uses calibration and visual inspection to ensure precise wafer positioning; the rotation and flipping stations are adaptable to diverse processes; the fully automated operation reduces manual labor; and the optimized design of each mechanism ensures the stability and reliability of the equipment, meeting the needs of high-efficiency production.

[0024] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0025] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0026] Figure 1 This is a schematic diagram of the displacement mechanism, coating mechanism and ring cutting mechanism of this utility model;

[0027] Figure 2 This is a structural schematic diagram of the calibration station, film coating station, rotation station, and flipping station of this utility model;

[0028] Figure 3 This is a structural schematic diagram of the translation component and the lifting component of this utility model;

[0029] Figure 4 This is a schematic diagram of the lifting bracket and displacement suction cup of this utility model;

[0030] Figure 5 This is a schematic diagram of the correction mechanism and the rotation mechanism of this utility model;

[0031] Figure 6 This is a schematic diagram of the flipping mechanism and the discharge platform of this utility model;

[0032] Figure 7 This is a structural schematic diagram of the flipping mechanism of this utility model in its flipping state;

[0033] Figure 8 This is a schematic diagram of the structure of the film-coated support and film-attaching component of this utility model;

[0034] Figure 9 This is a schematic diagram of the structure of the diaphragm supply component and the attachment seat of this utility model;

[0035] Figure 10 This is a schematic diagram of the ring-cutting mechanism of this utility model.

[0036] The reference numerals and names in the figure are as follows:

[0037] 10 Equipment frame; 11 Coating station; 12 Alignment station; 13 Rotary station; 14 Tilting station; 15 Discharge station; 16 Automatic feeder; 17 Automatic unloader; 18 Feeding robotic arm; 19 Unloading robotic arm; 20 Displacement mechanism; 21 Displacement bracket; 22 Displacement suction cup; 23 Vision inspection module; 30 Translation component; 31 First linear module; 32 Translation bracket; 33 Lifting component; 34 First actuator; 35 Lifting bracket; 36 Suction cup mounting base; 40 Coating mechanism; 41 Attachment base; 42 Coating bracket; 43 Second linear module; 44 Waiting end; 45 Attachment end; 50 Film supply unit Components; 51 Raw material shaft; 52 Edge material shaft; 53 Bottom material shaft; 54 Spreading shaft; 55 Film attaching component; 56 Second actuator; 57 Vacuum coating assembly; 60 Ring cutting mechanism; 61 Longitudinal displacement module; 62 Extension bracket; 63 Lateral displacement module; 64 Third actuator; 65 Rotating device; 66 Ring cutting knife; 70 Correction mechanism; 71 Correction motor; 72 Correction table; 73 Clearance groove; 74 Rotation mechanism; 75 Rotation motor; 76 Rotary table; 77 Discharge table; 80 Tilting mechanism; 81 Tilting bracket; 82 Tilting shaft; 83 Tilting motor; 84 Tilting table; 85 Adsorption plate; 86 Receiving table. Detailed Implementation

[0038] The technical solutions in the embodiments of this utility model will be clearly and completely described below. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0039] Please see Figures 1 to 10 In this embodiment of the present invention, a continuous rapid coating equipment includes a frame 10, a displacement mechanism 20, a coating mechanism 40, and a ring-cutting mechanism 60. The frame 10 is provided with multiple coating stations 11, each of which is provided with a corresponding coating mechanism 40 and a ring-cutting mechanism 60, so as to perform coating and ring-cutting operations on the wafers at the coating station 11 respectively. The displacement mechanism 20 is provided with a displacement bracket 21, a translation component 30, a lifting component 33, and multiple displacement suction cups 22. The displacement bracket 21 is installed on the frame 10, the translation component 30 is installed on the displacement bracket 21, the lifting component 33 is installed on the drive end of the translation component 30, and the multiple displacement suction cups 22 are evenly spaced and installed on the drive end of the lifting component 33, so that multiple wafers are transported at equal intervals under the drive of the translation component 30.

[0040] Specifically, in the process of fabricating semiconductor circuits using wafers, a film-coating operation is required. Some processes require film coating on both the front and back sides, while others require two or more layers of film. Film coating can be done manually or automatically using automated equipment. However, existing automated film coating machines are relatively slow, especially when multiple layers of film need to be coated or when film needs to be coated on both the front and back sides. Their coating efficiency is even lower, severely impacting the overall operational efficiency of the factory.

[0041] like Figure 2 and Figure 3 As shown, this utility model, by setting up an equidistant displacement mechanism 20 and multiple coating stations 11, can simultaneously perform coating operations on multiple wafers, forming an assembly line-like operation process, which greatly improves coating efficiency and enables rapid coating operations on a large number of wafers.

[0042] Secondly, the lifting component 33 operates, driving multiple displacement suction cups 22 to pick up the wafers on multiple coating stations 11 respectively. Then, the translation component 30 operates, moving horizontally a certain distance to transport the wafers from the previous coating station 11 to the next coating station 11, completing the equidistant wafer transport operation.

[0043] like Figures 1 to 4 As shown, preferably, the translation component 30 is provided with a first linear module 31 and a translation bracket 32, and the lifting component 33 is provided with a first actuator 34 and a lifting bracket 35. The first linear module 31 is mounted on the displacement bracket 21, and the translation bracket 32 ​​is mounted on the slide section of the first linear module 31, so that the first linear module 31 can be rotated and the translation bracket 32 ​​can be driven to perform linear motion in the horizontal direction. The first actuator 34 is mounted on the translation bracket 32, and the lifting bracket 35 is slidably connected to the translation bracket 32 ​​and is transmittedly connected to the output end of the first actuator 34, so that the first actuator 34 can be rotated and the lifting bracket 35 can be driven to perform vertical lifting motion.

[0044] Specifically, in order to install multiple displacement suction cups 22, the lifting bracket 35 can be set to be relatively long, and then multiple suction cup mounting seats 36 can be evenly spaced at the lower end near the coating station 11, so that the multiple displacement suction cups 22 are respectively installed on the multiple suction cup mounting seats 36, and the displacement suction cups 22 are respectively aligned with the corresponding coating station 11, correction station 12, rotation station 13, flipping station 14 or unloading station 15, so as to perform adsorption and conveying operations on the wafers at the corresponding stations.

[0045] Secondly, a slide rail and a slider are provided between the lifting bracket 35 and the translation bracket 32 ​​to form a linear guide structure. The slide rail is fixed to the translation bracket 32, and the slider is fixed to the lifting bracket 35, thereby enabling the lifting bracket 35 to move stably in a straight line along the translation bracket 32. Since the lifting bracket 35 and the translation bracket 32 ​​are relatively long, multiple sets of linear guide structures can be set to further improve the stability of the lifting bracket 35, so that the displacement chuck 22 installed on the lifting bracket 35 can stably adsorb and place the wafer.

[0046] Furthermore, the first linear module 31 is preferably a linear module using existing technology, such as a fully enclosed embedded module, a dust-free ball screw linear slide, or a linear motor module, thereby driving the translation bracket 32 ​​to perform stable linear motion in the horizontal direction. The first actuator 34 is preferably an actuator using existing technology such as a cylinder or hydraulic cylinder, capable of realizing linear reciprocating motion.

[0047] like Figure 2 , Figure 3 and Figure 5 As shown, preferably, the equipment frame 10 is also provided with a calibration station 12, the calibration station 12 is equipped with a calibration mechanism 70, the calibration mechanism 70 is provided with a calibration motor 71 and a calibration table 72, the calibration table 72 is driven to the output end of the calibration motor 71, so that under the drive of the calibration motor 71, the wafer is subjected to edge-finding calibration operation, thereby calibrating the placement position of the wafer.

[0048] Specifically, since the wafer lamination operation needs to meet the preset angle relationship, a correction mechanism 70 is set in the correction station 12, and the correction table 72 is used to perform edge correction on the wafer, so that the wafer maintains the preset angle relationship when it enters the lamination station 11.

[0049] Secondly, the calibration station 12 is located at the very front of all the coating stations 11, so that the calibration mechanism 70 can perform calibration operations on all wafers entering the coating equipment to ensure that their angles are correct before conveying them to the rear coating station 11. The calibration table 72 is also provided with a clearance groove 73 to avoid the loading fork of the loading robot arm 18, so that the loading fork can smoothly place the wafers on the calibration table 72.

[0050] Furthermore, the front end of the displacement suction cup 22 of the displacement mechanism 20 is also equipped with a vision inspection module 23, which is used to detect the placement position of the wafer at the calibration station 12, thereby ensuring that the angular relationship of the wafer after placement is kept correct, and then the feedback is sent to the displacement mechanism 20 to perform the equidistant displacement operation of the wafer.

[0051] like Figure 2 , Figure 3 and Figure 5As shown, preferably, the equipment frame 10 is also provided with a rotating station 13, the rotating station 13 is equipped with a rotating mechanism 74, the rotating mechanism 74 is provided with a rotating motor 75 and a rotating table 76, the rotating table 76 is driven to the output end of the rotating motor 75, so that the wafer is rotated under the drive of the rotating motor 75, thereby causing the wafer to rotate at a certain angle.

[0052] Specifically, since the second film application operation on the wafer needs to be staggered by a certain angle, a rotation mechanism 74 is set in the rotation station 13, and the wafer is rotated using a rotary table 76. For example, after rotating 90 degrees, the wafer enters the next film application station 11 for the second film application operation.

[0053] Secondly, the rotary station 13 is set before the second coating mechanism 40, so that the wafer can be rotated at a preset angle at the rotary station 13 before entering the second coating station 11 to perform the second layer film application operation.

[0054] like Figure 2 , Figure 3 , Figure 6 and Figure 7 As shown, preferably, the equipment frame 10 is also provided with a flipping station 14, and the flipping station 14 is equipped with a flipping mechanism 80. The flipping mechanism 80 is provided with a flipping bracket 81, a flipping shaft 82, a flipping motor 83, a flipping table 84 and a receiving table 86. The flipping shaft 82 is rotatably connected to the flipping bracket 81, the flipping motor 83 is fixedly connected to the flipping bracket 81, and its output shaft is drivenly connected to the flipping shaft 82. The flipping table 84 is fixedly connected to the flipping shaft 82 and is provided with an adsorption plate 85 for adsorbing wafers. When the flipping motor 83 operates, it drives the flipping shaft 82 to rotate synchronously and drives the flipping table 84 to rotate 180 degrees. After the wafers adsorbed by the adsorption plate 85 are flipped 180 degrees, they are placed on the receiving table 86.

[0055] Specifically, since a film coating operation is also required on the back of the wafer, traditional film coating machines typically use a robotic arm to flip the wafer 180 degrees. However, robotic arms are expensive and have low wafer flipping efficiency, making them unsuitable for rapid operation. This invention addresses this by installing a flipping mechanism 80 before the back-side film coating station 11. Utilizing the coordinated rotation of a flipping motor 83 and a flipping shaft 82, a flipping table 84 can be rapidly flipped 180 degrees, enabling rapid wafer flipping. The flipping motor 83 starts, driving the flipping shaft 82 to rotate via a coupling, which in turn causes the flipping table 84, fixed to the flipping shaft 82, to rotate 180° around its axis. During the flipping process, the suction plate 85 maintains negative pressure through a vacuum line to ensure wafer fixation. When the flipping table 84 reaches above the receiving platform 86, the vacuum release valve opens, and the wafer falls onto the receiving platform 86.

[0056] Secondly, in order to prevent the wafer from falling off during the flipping process, an adsorption plate 85 can be set on the flipping stage 84. The vacuum adsorption effect generated by the external vacuum generating device is used to adsorb the wafer on the adsorption plate 85, so that it can be stably fixed on the adsorption plate 85 during the flipping process.

[0057] Secondly, the adsorption plate 85 is connected to an external vacuum generating device through a pipeline, thereby generating a negative pressure adsorption effect. When the previous displacement suction cup 22 places the wafer on the adsorption plate 85, the adsorption plate 85 uses negative pressure to firmly adsorb the wafer. Then, the flip motor 83 runs, driving the flip shaft 82 to drive the flip table 84 to flip. When the flip table 84 rotates 180 degrees and is exactly above the receiving platform 86, the adsorption plate 85 releases the negative pressure, causing the adsorbed wafer to be released from the adsorption plate 85 and then fall onto the receiving platform 86, completing the 180-degree flip operation, forming a wafer with the back side facing up, which is convenient for the back side to be coated.

[0058] It is important to note that during the wafer flipping process by the flipping mechanism 80, the lifting component 33 and the multiple displacement chucks 22 do not move downwards, but remain at a high position away from the flipping mechanism 80. This avoids the flipping mechanism 80 colliding with the displacement chucks 22 during the flipping process. Specifically, before the flipping motor 83 starts, the control system checks whether the displacement chucks 22 have risen to a safe height, and only executes the flipping action after confirming that everything is correct.

[0059] like Figure 3 , Figure 8 and Figure 9 As shown, preferably, the coating mechanism 40 includes a coating support 42, a second linear module 43, a film supply component 50, a film attaching component 55, and an attaching seat 41. The coating support 42 is mounted on the equipment frame 10. The second linear module 43 is mounted on the coating support 42 and has a waiting end 44 and an attaching end 45 at its two ends, respectively. The attaching seat 41 is mounted on the slide section of the second linear module 43, thereby causing the second linear module 43 to rotate and drive the attaching seat 41 to reciprocate between the waiting end 44 and the attaching end 45. The film supply component 50 is used to supply films to the attaching seat 41 at the attaching end 45, and the film attaching component 55 is used to perform film attaching operations on the wafers on the attaching seat 41.

[0060] Specifically, the waiting end 44 of the second linear module 43 corresponds to the displacement suction cup 22 of the displacement mechanism 20, so that the displacement suction cup 22 places the adsorbed wafer onto the attachment seat 41 at the waiting end 44. Then, the second linear module 43 operates, driving the attachment seat 41 to the attachment end 45, so that the film attaching component 55 attaches the film supplied by the film supply component 50 onto the wafer on the attachment seat 41, completing the coating operation. After the coating is completed, the second linear module 43 operates again, moving the attachment seat 41 back to the waiting end 44, waiting for the displacement suction cup 22 to adsorb the wafer again, and then moving to the next station.

[0061] like Figure 3 , Figure 8 and Figure 9 As shown, preferably, the film supply component 50 is provided with a raw material shaft 51, an edge material shaft 52, a bottom material shaft 53, and a spreading shaft 54 ​​respectively installed on the film covering bracket 42. The raw material shaft 51 is used to place and supply film raw materials, the edge material shaft 52 is used to collect the film edge material remaining after the ring cutting operation, and the bottom material shaft 53 is used to collect the film bottom lining material. The two sets of spreading shafts 54 are respectively installed on the film covering bracket 42 on both sides of the attachment end 45 to spread the film raw materials supplied at the raw material shaft 51, so that the film raw materials are held flat above the attachment end 45, which facilitates the film attaching component 55 to perform the attaching operation.

[0062] Specifically, the edge material shaft 52 and the bottom material shaft 53 are respectively connected to corresponding collecting motors, causing the collecting motors to operate and drive the edge material shaft 52 to collect the membrane edge material, and the bottom material shaft 53 to collect the membrane bottom liner material. To ensure the membrane is transported smoothly to the attachment end 45, two sets of spreading shafts 54 can be installed on both sides of the attachment end 45. By tightening the membrane, they keep it flat and transport it to the attachment end 45. The spreading shafts 54 control the membrane tension by adjusting the distance between themselves and the raw material shaft 51, ensuring the membrane remains flat at the attachment end 45. In addition, multiple sets of transition shafts can be installed between the spreading shafts 54 and the raw material shaft 51 to further assist in tightening the membrane.

[0063] like Figure 3 , Figure 8 and Figure 9 As shown, preferably, the film attaching component 55 is provided with a second actuator 56 and a vacuum coating assembly 57. The second actuator 56 is mounted on the coating support 42, and the vacuum coating assembly 57 is mounted on the drive end of the second actuator 56 and forms an air path communication with an external vacuum generating device, thereby performing a vacuum attaching operation on the film material above the attaching end 45, so that the film material is attached to the wafer.

[0064] Specifically, the second actuator 56 operates, driving the vacuum coating assembly 57 to move downward a certain distance, thereby pressing the film material downward a certain distance so that it adheres to the wafer. Then, the negative pressure generated by the external vacuum generating device allows the film material to adhere tightly to the wafer, completing the coating operation.

[0065] In addition, the vacuum coating assembly 57 can adopt a vacuum coating device in the prior art and work together with the film supply component 50 and the second linear module 43 of this equipment. Through the negative pressure provided by the external vacuum generating device, the film material is accurately and tightly attached to the wafer surface to ensure that the coating effect meets the process requirements, while adapting to the continuous and rapid coating working rhythm of this equipment.

[0066] like Figure 1 and Figure 10 As shown, preferably, the circumferential cutting mechanism 60 includes a longitudinal displacement module 61, a transverse displacement module 63, a third actuator 64, a rotating device 65, and a circumferential cutting blade 66. The longitudinal displacement module 61 is mounted on the equipment frame 10. The transverse displacement module 63 is mounted on the slide of the longitudinal displacement module 61 via an extension bracket 62. The third actuator 64 is mounted on the slide of the transverse displacement module 63. The rotating device 65 is mounted on the drive end of the third actuator 64. The circumferential cutting blade 66 is mounted on the output shaft of the rotating device 65.

[0067] Specifically, after the film material is attached to the wafer, it needs to be circumferentially cut along the edge of the wafer. This circumferentially cuts off the film material and collects the scrap on the scrap shaft 52. Therefore, a circumferential cutter 66 is required. The rotation output of the rotating device 65 drives the circumferential cutter 66 to rotate synchronously, thereby cutting the film. The third actuator 64 can be a cylinder, which moves the rotating device 65 and the circumferential cutter 66 downwards a certain distance, allowing the circumferential cutter 66 to contact the film for circumferential cutting. Preferably, the rotating device 65 is an electric motor, which drives the circumferential cutter 66 to rotate, thus cutting the film.

[0068] Secondly, the longitudinal displacement module 61 and the transverse displacement module 63 are preferably linear modules as used in the prior art, so as to precisely control the circumferential cutting blade 66 to perform circumferential cutting operations along the edge of the wafer. The transverse displacement module 63 is linked with the longitudinal displacement module 61 to drive the circumferential cutting blade 66 to move along a preset trajectory to adapt to the edge contours of wafers of different sizes.

[0069] like Figure 1As shown, preferably, it also includes an automatic feeder 16, an automatic unloader 17, a feeding robotic arm 18, and an unloading robotic arm 19. The automatic feeder 16 is used to transport the wafers to be coated into the equipment. The feeding robotic arm 18 is used to transfer the wafers to be coated to the calibration table 72 of the calibration station 12. The equipment frame 10 is also provided with an unloading station 15, and the unloading station 15 is equipped with an unloading table 77. The unloading robotic arm 19 is used to transfer the coated wafers on the unloading table 77 to the automatic unloader 17. The automatic unloader 17 is used to transport the coated wafers out of the equipment.

[0070] Specifically, to facilitate continuous and rapid coating operations with the coating equipment, an automatic feeder 16, an automatic unloader 17, a loading robotic arm 18, and an unloading robotic arm 19 are required. The automatic feeder 16 and automatic unloader 17 can both utilize existing AGV (Automated Guided Vehicle) systems for automatic docking with loading and unloading machines, thus automating the wafer loading and unloading operations for the coating equipment. The loading robotic arm 18 and unloading robotic arm 19 can both employ existing single-arm robotic arms, with loading and unloading forks respectively mounted on their wrists for loading and unloading wafers. Both the loading robotic arm 18 and unloading robotic arm 19 have built-in lifting and rotating functions, and the extension of the robotic arm enables the retraction of the loading or unloading forks, thereby outputting or inserting wafers from the corresponding cassettes.

[0071] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered exemplary and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention.

Claims

1. A continuous and rapid film coating device, characterized in that, The equipment includes a frame (10), a displacement mechanism (20), a coating mechanism (40), and a ring cutting mechanism (60). The frame (10) is equipped with multiple coating stations (11). Each coating station (11) is equipped with a corresponding coating mechanism (40) and a ring cutting mechanism (60), so as to perform coating and ring cutting operations on the wafers on the coating station (11) respectively. The displacement mechanism (20) is equipped with a displacement bracket (21), a translation component (30), a lifting component (33), and multiple displacement suction cups (22). The displacement bracket (21) is installed on the frame (10), the translation component (30) is installed on the displacement bracket (21), the lifting component (33) is installed on the driving end of the translation component (30), and multiple displacement suction cups (22) are evenly spaced on the driving end of the lifting component (33), so as to perform equidistant transport operations on multiple wafers under the drive of the translation component (30).

2. The continuous rapid coating equipment according to claim 1, characterized in that, The translation component (30) is provided with a first linear module (31) and a translation bracket (32), and the lifting component (33) is provided with a first actuator (34) and a lifting bracket (35). The first linear module (31) is installed on the displacement bracket (21), and the translation bracket (32) is installed on the slide of the first linear module (31), so that the first linear module (31) can operate and drive the translation bracket (32) to perform linear motion in the horizontal direction; the first actuator (34) is installed on the translation bracket (32), and the lifting bracket (35) is slidably connected to the translation bracket (32) and driven to the output end of the first actuator (34), so that the first actuator (34) can operate and drive the lifting bracket (35) to perform vertical lifting motion.

3. The continuous rapid coating equipment according to claim 1, characterized in that, The equipment frame (10) is also provided with a calibration station (12), and the calibration station (12) is equipped with a calibration mechanism (70). The calibration mechanism (70) is provided with a calibration motor (71) and a calibration table (72). The calibration table (72) is connected to the output end of the calibration motor (71), so that the wafer is calibrated under the drive of the calibration motor (71), and the wafer placement position is calibrated.

4. The continuous rapid coating equipment according to claim 1, characterized in that, The equipment frame (10) is also provided with a rotating station (13), the rotating station (13) is equipped with a rotating mechanism (74), the rotating mechanism (74) is provided with a rotating motor (75) and a rotating table (76), the rotating table (76) is connected to the output end of the rotating motor (75), so that the wafer is rotated under the drive of the rotating motor (75), thereby causing the wafer to rotate at a certain angle.

5. A continuous and rapid film coating device according to claim 1, characterized in that, The equipment frame (10) is also equipped with a flipping station (14), which is equipped with a flipping mechanism (80). The flipping mechanism (80) is equipped with a flipping bracket (81), a flipping shaft (82), a flipping motor (83), a flipping table (84), and a receiving table (86). The flipping shaft (82) is rotatably connected to the flipping bracket (81), the flipping motor (83) is fixedly connected to the flipping bracket (81), and its output shaft is connected to the flipping shaft (82). The flipping table (84) is fixedly connected to the flipping shaft (82) and is equipped with an adsorption plate (85) for adsorbing wafers. When the flipping motor (83) runs, it drives the flipping shaft (82) to rotate synchronously and drives the flipping table (84) to rotate 180 degrees. After the wafer adsorbed by the adsorption plate (85) is flipped 180 degrees, it is placed on the receiving table (86).

6. The continuous rapid coating equipment according to claim 1, characterized in that, The coating mechanism (40) is provided with a coating support (42), a second linear module (43), a film supply component (50), a film attaching component (55), and an attaching seat (41). The coating support (42) is installed on the equipment frame (10). The second linear module (43) is installed on the coating support (42) and has a waiting end (44) and an attaching end (45) at its two ends respectively. The attaching seat (41) is installed on the slide of the second linear module (43), so that the second linear module (43) operates and drives the attaching seat (41) to reciprocate between the waiting end (44) and the attaching end (45). The film supply component (50) is used to supply films to the attaching seat (41) at the attaching end (45). The film attaching component (55) is used to perform film attaching operation on the wafer on the attaching seat (41).

7. A continuous rapid coating equipment according to claim 6, characterized in that, The film supply component (50) is provided with a raw material shaft (51), an edge material shaft (52), a bottom material shaft (53), and a spreading shaft (54) respectively installed on the film covering bracket (42). The raw material shaft (51) is used to place and supply film raw materials, the edge material shaft (52) is used to collect the remaining film edge material after the ring cutting operation, and the bottom material shaft (53) is used to collect the film bottom liner material. The two sets of spreading shafts (54) are respectively installed on the film covering bracket (42) on both sides of the attachment end (45) to spread the film raw materials supplied at the raw material shaft (51) so that the film raw materials are held flat above the attachment end (45) to facilitate the film attaching component (55) to perform the attaching operation.

8. A continuous and rapid coating equipment according to claim 7, characterized in that, The film attaching component (55) is provided with a second actuator (56) and a vacuum coating assembly (57). The second actuator (56) is mounted on the coating support (42), and the vacuum coating assembly (57) is mounted on the drive end of the second actuator (56) and forms an air path connection with the external vacuum generating device, thereby performing a vacuum attaching operation on the film material above the attaching end (45) so that the film material is attached to the wafer.

9. A continuous and rapid coating equipment according to claim 1, characterized in that, The ring cutting mechanism (60) is provided with a longitudinal displacement module (61), a transverse displacement module (63), a third actuator (64), a rotating device (65), and a ring cutting blade (66). The longitudinal displacement module (61) is installed on the equipment frame (10). The transverse displacement module (63) is installed on the slide of the longitudinal displacement module (61) through an extension bracket (62). The third actuator (64) is installed on the slide of the transverse displacement module (63). The rotating device (65) is installed on the drive end of the third actuator (64). The ring cutting blade (66) is installed on the output shaft of the rotating device (65).

10. A continuous and rapid coating equipment according to claim 1, characterized in that, It also includes an automatic feeder (16), an automatic unloader (17), a feeding robot arm (18), and an unloading robot arm (19). The automatic feeder (16) is used to transport the wafers to be coated into the equipment. The feeding robot arm (18) is used to transfer the wafers to be coated to the calibration table (72) of the calibration station (12). The equipment frame (10) is also equipped with a discharge station (15). The discharge station (15) is equipped with a discharge table (77). The unloading robot arm (19) is used to transfer the coated wafers on the discharge table (77) to the automatic unloader (17). The automatic unloader (17) is used to transport the coated wafers out of the equipment.

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