Silicon wafer loading device and silicon wafer feeding system

Abstract

The embodiment of the utility model provides a silicon wafer loading device and a silicon wafer feeding system, and relates to the technical field of silicon wafer processing. The silicon wafer loading device comprises a base; the placing mechanism is arranged on the base, the placing mechanism comprises a plurality of placing assemblies which are arranged at intervals in the height direction of the base, and the placing assemblies are used for placing silicon wafers; the supporting mechanism is arranged on the base; and the at least one ion blowing piece is arranged on the supporting mechanism along the height direction of the base, and the ion blowing piece is used for blowing ion wind to the silicon wafer. According to the silicon wafer loading device provided by the embodiment of the invention, the ion wind blown out by the ion blowing piece can pass through the gaps among the placing assemblies so as to remove dust on the upper surface and the lower surface of the silicon wafer at the same time, so that the dust removal effect is improved.

Description

Technical Field

[0001] This application relates to the field of silicon wafer processing technology, and in particular to a silicon wafer loading device and a silicon wafer feeding system. Background Technology

[0002] The silicon wafer loading system includes a wafer loading device, a wafer picking device, and a wafer transfer device. The wafer picking device transfers the silicon wafers from the wafer loading device to the wafer transfer device to complete the wafer loading process. Dust removal is required during the wafer loading process.

[0003] In related technologies, silicon wafer transport devices are equipped with ion air knives, which can remove dust from silicon wafers laid on the silicon wafer transport device.

[0004] However, because the silicon wafers are laid on the silicon wafer transport device, the ion air knife has difficulty removing dust from the lower surface of the silicon wafers. Utility Model Content

[0005] This application provides a silicon wafer loading device and a silicon wafer feeding system to solve the problem that the ion air knife is difficult to remove dust from the lower surface of the silicon wafer when the silicon wafer is laid on the silicon wafer transport device.

[0006] In a first aspect, embodiments of this application provide a silicon wafer loading apparatus, comprising:

[0007] Base;

[0008] A placement mechanism is mounted on a base and includes multiple placement components spaced apart along the height direction of the base. The placement components are used to place silicon wafers.

[0009] The support mechanism is mounted on the base.

[0010] At least one ion blower is provided on the support mechanism along the height direction of the base, and the ion blower is used to blow ion air toward the silicon wafer.

[0011] In one possible implementation, there is an angle between the ion blower and the support mechanism.

[0012] In one possible implementation, the ion blower is rotatably connected to the support mechanism to allow the ion blower to switch between a working position and a storage position.

[0013] In the working position, there is an angle between the ion blower and the support mechanism;

[0014] In the storage location, the ion blower is attached to the support mechanism.

[0015] In one possible implementation, the ion blowing element is an ion bar.

[0016] In one possible implementation, the placement mechanism further includes a first frame, a second frame, and a plurality of first connectors. The first frame is disposed on a base, and the first connectors connect the first frame and the second frame to form a placement space and a pick-and-place port between the first frame and the second frame. The pick-and-place port communicates with the placement space and is used to place or remove silicon wafers into or from the placement space.

[0017] The placement assembly includes multiple first placement members, multiple second placement members, and multiple third placement members. The first placement members, second placement members, and third placement members are all connected to the first connector and are all located within the placement space. The first placement members extend toward the pick-and-place port. The second placement members and third placement members are respectively disposed on both sides of the first placement members. The second placement members and third placement members extend toward the first placement members. The first placement members, second placement members, and third placement members are all used to place silicon wafers.

[0018] In one possible implementation, the silicon wafer loading device further includes a through-beam scanning assembly, which includes a signal transmitter, a signal receiver, and a signal processing unit, wherein the signal transmitter and the signal receiver are communicatively connected to the signal processing unit.

[0019] The support mechanism includes at least one support component, which includes a first support member, a second support member, and a second connecting member. The first support member and the second support member are both mounted on the base, and the second connecting member connects the first support member and the second support member. The first support member and the second support member are located on both sides of the placement mechanism.

[0020] The signal transmitter is mounted on one of the first supports, and the signal receiver is mounted on one of the second supports. The signal receiver is used to transmit a scan signal and to receive the scan signal transmitted by the signal transmitter. The signal processing unit is used to process the scan signal received by the signal receiver to identify the number, position, and abnormal status of the silicon wafers.

[0021] In one possible implementation, the silicon wafer loading device further includes:

[0022] A transmission mechanism is mounted on the base and is used to transport the placement mechanism.

[0023] The limiting mechanism is mounted on the base and located on one side of the support mechanism. The limiting mechanism is used to limit the placement mechanism when it is transported to the preset position.

[0024] In one possible implementation, the transmission mechanism includes a first conveyor belt and a second conveyor belt, both of which are mounted on a base and are used to transmit the placement mechanism.

[0025] The limiting mechanism includes two limiting components, each including a first telescopic member and a limiting member. The limiting member is connected to the telescopic end of the first telescopic member. The first telescopic member is mounted on the base and located between the first conveyor belt and the second conveyor belt. The two first telescopic members extend when the placement mechanism is transported to a preset position, and correspondingly drive the two limiting members to move in the direction toward the placement mechanism, so that the two limiting members clamp the placement mechanism.

[0026] In one possible implementation, the silicon wafer loading device further includes an abutment mechanism, which comprises:

[0027] The third support component is mounted on the base.

[0028] The second telescopic component is mounted on the third support component;

[0029] The abutting part is connected to the telescopic end of the second telescopic part;

[0030] The second telescopic member extends when the placement mechanism is transported to a preset position and drives the abutment member to move in the direction toward the placement mechanism so that the abutment member abuts against the upper part of the placement mechanism.

[0031] Secondly, embodiments of this application provide a silicon wafer loading system, comprising:

[0032] A silicon wafer loading device, wherein the silicon wafer loading device is any of the silicon wafer loading devices provided in the first aspect;

[0033] The wafer picking device and the silicon wafer transfer device are both located on the side of the silicon wafer loading device. The wafer picking device is used to transfer the silicon wafers loaded by the silicon wafer loading device to the silicon wafer transfer device.

[0034] The silicon wafer loading device and silicon wafer feeding system provided in this application embodiment have the following features: The silicon wafer loading device sets a placement mechanism and a support mechanism on a base, with the base serving as a support foundation to provide stable support for the placement mechanism and the support mechanism; By setting a placement mechanism, which includes multiple placement components spaced apart along the height direction of the base, the placement mechanism can load more silicon wafers within a limited space, thereby improving production efficiency; By setting a support mechanism and an ion blower, with the ion blower set on the support mechanism and supported by the support mechanism, the ion blower can blow ion air onto the silicon wafers, which can not only eliminate static electricity on the surface of the silicon wafers but also remove dust from the surface of the silicon wafers; By setting the ion blower along the height direction of the base, the ion air blown by the ion blower can cover silicon wafers of different heights in the placement mechanism, thereby removing dust from all silicon wafers simultaneously, thus improving dust removal efficiency; Furthermore, since the placement components are spaced apart along the height direction, the ion air blown by the ion blower can pass through the gaps between the placement components, thereby removing dust from both the upper and lower surfaces of the silicon wafers simultaneously, thus improving the dust removal effect. Attached Figure Description

[0035] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application.

[0036] Figure 1 This is a schematic diagram of the silicon wafer feeding system provided in an embodiment of this application;

[0037] Figure 2 for Figure 1 Schematic diagram of the silicon wafer loading device;

[0038] Figure 3 for Figure 2 A schematic diagram showing the angle between the central support mechanism and the ion blowing component;

[0039] Figure 4 for Figure 2 A schematic diagram of the structure of the placement mechanism;

[0040] Figure 5 for Figure 2 A schematic diagram of the structure of the silicon wafer loading device after the placement mechanism has been removed.

[0041] Explanation of reference numerals in the attached figures:

[0042] 10 - Silicon wafer loading device; 20 - Silicon wafer; 30 - Wafer picking device; 40 - Silicon wafer transfer device;

[0043] 100 - Base;

[0044] 200 - Placement mechanism; 210 - Placement component; 211 - First placement piece; 212 - Second placement piece; 213 - Third placement piece; 220 - First frame; 221 - First longitudinal beam; 222 - First crossbeam; 230 - Second frame; 231 - Second longitudinal beam; 232 - Second crossbeam; 240 - First connector; 250 - Placement space; 260 - Pick-up / drop-off port;

[0045] 300 - Support mechanism; 310 - Support assembly; 311 - First support member; 312 - Second support member; 313 - Second connector;

[0046] 400 - Ion blower component;

[0047] 500 - Through-beam scanning assembly; 510 - Signal transmitter; 520 - Signal receiver;

[0048] 600 - Transmission mechanism; 610 - First conveyor belt; 620 - Second conveyor belt;

[0049] 700 - Limiting mechanism; 710 - Limiting component; 711 - First telescopic component; 712 - Limiting component;

[0050] 800 - Abutment mechanism; 810 - Third support component; 811 - Support column; 812 - Control box; 813 - Heat dissipation hole; 820 - Second telescopic component; 830 - Abutment component;

[0051] 900-Controller.

[0052] To facilitate understanding of the embodiments of this application, the spline curves and arrows used in the reference numerals in the accompanying drawings are explained below: spline curves without arrows indicate solid components, that is, components with solid structures; spline curves with arrows indicate virtual components, that is, components without solid structures.

[0053] The accompanying drawings illustrate specific embodiments of this application, which will be described in more detail below. These drawings and descriptions are not intended to limit the scope of the embodiments of this application in any way, but rather to illustrate the concepts of this application to those skilled in the art through reference to particular embodiments. Detailed Implementation

[0054] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings.

[0055] It should be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. In the description of the embodiments of this application, it should be understood that the terms "center," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicating orientation or positional relationships (if present), are based on the orientation or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the embodiments of this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on the embodiments of this application. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Unless otherwise specified, an element defined by the phrase "comprising..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element. Where there is no conflict, embodiments of this application and the various features thereof can be combined with each other, all of which are within the scope of protection of this application.

[0056] The manufacturing process of heterojunction solar cells includes texturing and cleaning, plasma-enhanced chemical vapor deposition (PECVD), physical vapor deposition (PVD), and screen printing.

[0057] In the PVD process, the wafer loading system is used to transport the silicon wafer to the deposition system, the deposition system is used to deposit a transparent conductive film layer on the front and back of the silicon wafer, and the wafer unloading system is used to remove the deposited silicon wafer from the deposition system, ready for subsequent processes.

[0058] This application provides a silicon wafer loading system. Figure 1 This is a schematic diagram of a silicon wafer loading system.

[0059] Specifically, please see Figure 1 The silicon wafer loading system includes a silicon wafer loading device 10, a wafer picking device 30, and a silicon wafer transfer device 40. The silicon wafer loading device 10 is used to load silicon wafers 20, the wafer picking device 30 is used to transfer the silicon wafers 20 in the silicon wafer loading device 10 to the silicon wafer transfer device 40, and the silicon wafer transfer device 40 is used to transfer the silicon wafers 20 to subsequent processes to realize the loading of silicon wafers 20.

[0060] It should be noted that the silicon wafer feeding system provided in this embodiment is applicable to, but is not limited to, the photovoltaic or semiconductor fields.

[0061] Understandable Figure 1 The diagram only schematically illustrates some of the components included in the silicon wafer loading system; the actual shape, size, location, and construction of these components are not subject to change. Figure 1 Due to limitations, silicon wafer loading systems can also include, compared to... Figure 1 More or fewer parts.

[0062] It is important to note that impurities on the surface of silicon wafer 20 are deposited by the deposition system and embedded into the film layer, then transferred down to the screen, which can lead to wafer breakage and increase operating costs. Therefore, dust removal is necessary during the loading process of silicon wafer 20.

[0063] In related technologies, an ion air knife is provided on the silicon wafer transport device 40, which can remove dust from the silicon wafers 20 laid on the silicon wafer transport device 40.

[0064] However, because the silicon wafer 20 is laid on the silicon wafer transport device 40, the ion air knife has difficulty removing dust from the lower surface of the silicon wafer 20.

[0065] To address the aforementioned technical problems, embodiments of this application provide a silicon wafer loading device. Figure 2 This is a schematic diagram of the silicon wafer loading device 10.

[0066] Specifically, please see Figure 2 The silicon wafer loading device 10 includes: a base 100; a placement mechanism 200 disposed on the base 100, the placement mechanism 200 including a plurality of placement components 210 spaced apart along the height direction of the base 100, the placement components 210 being used to place silicon wafers 20; a support mechanism 300 disposed on the base 100; and at least one ion blower 400 disposed on the support mechanism 300 along the height direction of the base 100, the ion blower 400 being used to blow ion air toward the silicon wafers 20.

[0067] The silicon wafer loading device 10 provided in this application embodiment sets the placement mechanism 200 and the support mechanism 300 on the base 100, and the base 100 serves as a support base, providing stable support for the placement mechanism 200 and the support mechanism 300.

[0068] By setting up a placement mechanism 200, which includes a plurality of placement components 210 spaced apart along the height direction of the base 100, the placement mechanism 200 can load more silicon wafers 20 in a limited space, thereby improving production efficiency.

[0069] By setting up a support mechanism 300 and an ion blower 400, the ion blower 400 is mounted on the support mechanism 300 and can support the ion blower 400 so that the ion blower 400 can blow ion air onto the silicon wafer 20, which can not only eliminate static electricity on the surface of the silicon wafer 20, but also remove dust from the surface of the silicon wafer 20.

[0070] By arranging the ion blower 400 along the height direction of the base 100, the ion air blown by the ion blower 400 can cover silicon wafers 20 at different heights in the placement mechanism 200, thereby simultaneously removing dust from all silicon wafers 20 and improving dust removal efficiency. Furthermore, since the placement components 210 are spaced apart along the height direction, the ion air blown by the ion blower 400 can pass through the gaps between the placement components 210, thereby simultaneously removing dust from the upper and lower surfaces of the silicon wafers 20 and improving the dust removal effect.

[0071] The preferred technical solution of the silicon wafer loading device 10 according to the embodiments of this application is described below with reference to the accompanying drawings. Figure 3 This is a schematic diagram showing the structure with an angle between the support mechanism and the ion blower. Figure 4 This is a schematic diagram of the placement mechanism. Figure 5 This is a schematic diagram of the silicon wafer loading device after the placement mechanism has been removed.

[0072] In some embodiments, the ion blower 400 and the support mechanism 300 have an included angle.

[0073] In this embodiment, please refer to Figure 3 The support mechanism 300 is located at the edge of the placement mechanism 200. By setting the ion blower 400 to have an angle with the support mechanism 300, the ion blower 400 can gradually extend from the edge of the placement mechanism 200 to the middle of the placement mechanism 200. The ion wind blown by the ion blower 400 can spread from the middle of the placement mechanism 200 to the left and right edges of the placement mechanism 200, so that the ion wind can quickly cover the entire surface of the silicon wafer 20, thereby improving the dust removal efficiency and dust removal effect of the ion blower 400.

[0074] Furthermore, the angle between the ion blower 400 and the support mechanism 300 is 25 degrees to 35 degrees. For example, the angle between the ion blower 400 and the support mechanism 300 is 25 degrees, 30 degrees or 35 degrees.

[0075] In other embodiments, please refer to Figure 3 The ion blower 400 is rotatably connected to the support mechanism 300 so that the ion blower 400 can switch between the working position and the storage position.

[0076] In the working position, there is an angle between the ion blower 400 and the support mechanism 300.

[0077] When the ion blower 400 rotates relative to the support mechanism 300, the angle between the ion blower 400 and the support mechanism 300 also changes. During this process, the operator can test the blowing effect of the ion blower 400 to adjust it to the optimal working position. At the optimal working position, the ion air blown by the ion blower 400 can spread from the center of the placement mechanism 200 to the left and right edges of the placement mechanism 200, so that the ion air can quickly cover the entire surface of the silicon wafer 20, thereby improving the dust removal efficiency and effect of the ion blower 400.

[0078] In the storage location, the ion blower component 400 is attached to the support mechanism 300.

[0079] This attachment design not only protects the ion blower 400 from external objects, thus extending its service life, but also minimizes the space occupied by the ion blower 400 when it is not in operation.

[0080] In some specific embodiments, a drive motor (not shown) is provided on the support mechanism 300, and the output end of the drive motor is connected to the ion blower 400. The drive motor can drive the ion blower 400 to rotate relative to the support mechanism 300.

[0081] In this embodiment, by setting a drive motor, the operator can precisely control the rotation angle of the ion blower 400, making it easier to quickly find the best working position.

[0082] In some other embodiments, the ion blower 400 is an ion bar.

[0083] The ion blower bar, as a slender ion blowing component 400, is designed to maximize coverage within a limited space.

[0084] The ion bar has multiple evenly spaced air outlets (not shown), which allows the ion bar to generate a more uniform ion airflow, so that each silicon wafer 20 can be swept by the same intensity of ion airflow, thereby ensuring the consistency of dust removal effect.

[0085] It should be noted that the ion bar is an existing structural configuration in this field, and will not be described in detail here.

[0086] In some embodiments, see Figure 4The placement mechanism 200 also includes a first frame 220, a second frame 230 and a plurality of first connectors 240. The first frame 220 is disposed on the base 100. The first connectors 240 connect the first frame 220 and the second frame 230 so that a placement space 250 and a pick-and-place port 260 are formed between the first frame 220 and the second frame 230. The pick-and-place port 260 communicates with the placement space 250 and is used to put the silicon wafer 20 into or take it out of the placement space 250.

[0087] The placement assembly 210 includes a plurality of first placement members 211, a plurality of second placement members 212, and a plurality of third placement members 213. The first placement members 211, second placement members 212, and third placement members 213 are all connected to the first connector 240 and are all located within the placement space 250. The first placement members 211 extend toward the pick-and-place port 260. The second placement members 212 and third placement members 213 are respectively disposed on both sides of the first placement member 211. The second placement members 212 and third placement members 213 extend toward the first placement member 211. The first placement members 211, second placement members 212, and third placement members 213 are all used to place the silicon wafer 20.

[0088] In this embodiment, the first connector 240 connects the first frame 220 and the second frame 230. The first frame 220 and the second frame 230 respectively constitute the upper and lower surfaces of the placement mechanism 200. Multiple first connectors 240 connect the first frame 220 and the second frame 230, forming a placement space 250 and a pick-and-place port 260 between the first frame 220 and the second frame 230. The placement space 250 provides a placement environment for the silicon wafer 20, and the pick-and-place port 260 is used by the wafer pick-and-place device 30 to place or remove the silicon wafer 20 into or from the placement space 250. Furthermore, the first connector 240 connects the first frame 220 and the second frame 230, forming a lateral support. This allows the first connector 240, the first frame 220, and the second frame 230 to together form a stable frame structure that can effectively resist forces from all directions, preventing external objects from touching the silicon wafer 20 during loading and unloading, thereby better protecting the silicon wafer 20. In addition, when the silicon wafer 20 is placed into the placement space 250 from the placement port, the first connector 240 can limit the silicon wafer 20 to ensure that the silicon wafer 20 does not slide out of the placement space 250.

[0089] By setting multiple first placement components 211, the first placement components 211 are connected to the first connector 240 and located within the placement space 250. The first placement components 211 extend toward the pick-and-place port 260, so that the first placement components 211 directly face the pick-and-place port 260, which makes it convenient for operators to directly put the silicon wafer 20 into or take out the first placement component 211 from the pick-and-place port 260, thereby improving the convenience and efficiency of picking up and placing the silicon wafer 20.

[0090] By setting multiple second placement members 212 and multiple third placement members 213, both the second placement members 212 and the third placement members 213 are connected to the first connector 240 and are located within the placement space 250. The second placement members 212 and the third placement members 213 are respectively located on both sides of the first placement member 211. The first placement member 211, the second placement member 212 and the third placement member 213 together provide support for the silicon wafer 20 in three directions, providing uniform support and good support performance.

[0091] Furthermore, the first placement member 211 extends toward the pick-and-place port 260, and the first placement member 211 can provide longitudinal support for the silicon wafer 20; the second placement member 212 and the third placement member 213 both extend toward the first placement member 211, and the second placement member 212 and the third placement member 213 can both provide lateral support for the silicon wafer 20. As a result, the overall support performance of the placement assembly 210 for the silicon wafer 20 is improved.

[0092] It should be noted that the embodiments of this application do not limit the specific structure of the first placement member 211, the second placement member 212, and the third placement member 213, as long as they can achieve the supporting function. In some examples, the first placement member 211, the second placement member 212, and the third placement member 213 are all rod-shaped structures. The rod-shaped structure is easy to connect to the first connector 240, and the contact area between the rod-shaped structure and the silicon wafer 20 is small, so its impact on the silicon wafer 20 is small.

[0093] For some specific implementation methods, please refer to Figure 4 The first frame 220 includes two first longitudinal beams 221 and multiple first transverse beams 222. The multiple first transverse beams 222 are spaced apart, and each first transverse beam 222 is connected between two first longitudinal beams 221.

[0094] In this embodiment, the connection between the two first longitudinal beams 221 and the multiple first transverse beams 222 enables the first frame 220 to form a frame structure. The first frame 220 has high structural strength and can protect the silicon wafer 20 from below.

[0095] For other specific implementations, please refer to Figure 4 The second frame 230 includes two second longitudinal beams 231 and multiple second transverse beams 232. The multiple second transverse beams 232 are spaced apart, and each second transverse beam 232 is connected between two second longitudinal beams 231.

[0096] In this embodiment, the connection between the two second longitudinal beams 231 and the multiple second transverse beams 232 enables the second frame 230 to form a frame structure. The second frame 230 has high structural strength and can provide protection for the silicon wafer 20 from above.

[0097] Furthermore, the placement mechanism 200 also includes a nameplate (not shown), which is set on the first connector 240. The nameplate facilitates the operator to mark and identify the batch of silicon wafer 20.

[0098] In some embodiments, see Figure 5 The silicon wafer loading device 10 also includes a beam scanning assembly 500, which includes a signal transmitter 510, a signal receiver 520, and a signal processor (not shown). The signal transmitter 510 and the signal receiver 520 are both communicatively connected to the signal processor.

[0099] The support mechanism 300 includes at least one support component 310. The support component 310 includes a first support member 311, a second support member 312, and a second connector 313. The first support member 311 and the second support member 312 are both disposed on the base 100. The second connector 313 connects the first support member 311 and the second support member 312. The first support member 311 and the second support member 312 are respectively located on both sides of the placement mechanism 200.

[0100] The signal transmitter 510 is disposed on one of the first support members 311, and the signal receiver 520 is disposed on one of the second support members 312. The signal receiver 520 is used to transmit a scan signal and to receive the scan signal transmitted by the signal transmitter 510. The signal processing unit is used to process the scan signal received by the signal receiver 520 to identify the number, position and abnormal state of the silicon wafer 20.

[0101] In this embodiment, by providing a first support member 311 and a second support member 312, and connecting the first support member 311 and the second support member 312 with a second connector 313, the support mechanism 300 can be supported on the base 100 as a whole. By placing the signal transmitter 510 on one of the first support members 311 and the signal receiver 520 on one of the second support members 312, the through-beam scanning assembly 500 can be supported on the base 100 as a whole by the support mechanism 300. By placing the first support member 311 and the second support member 312 on both sides of the placement mechanism 200, the signal transmitter 510 and the signal receiver 520 are located on both sides of the placement mechanism 200, thereby enabling the through-beam scanning assembly 500 to perform a full scan of the entire placement space 250 of the placement mechanism 200.

[0102] The signal transmitter 510 transmits a scanning signal to scan the silicon wafers 20 in the placement mechanism 200. The signal receiver 520 receives the scanning signal transmitted by the signal transmitter 510, and the signal processing unit processes the scanning signal received by the signal receiver 520. During this process, each silicon wafer 20 causes a certain number of scanning signals to be blocked, thus forming a "signal shadow" in the signal processing unit. By calculating the number of "signal shadows," the signal receiver 520 can accurately determine the number of silicon wafers 20.

[0103] The signal processing unit can also record the location of each "signal shadow", which is the location of the silicon wafer 20 within the placement space 250.

[0104] The signal processing unit can also determine the abnormality of silicon wafer 20 by judging the shape of the "signal shadow". In some examples, signal penetration in parts of the "signal shadow" indicates that silicon wafer 20 is damaged; inconsistent heights in different parts of the "signal shadow" indicate that silicon wafer 20 is tilted; and abnormal width of the "signal shadow" indicates that different silicon wafers 20 are stuck together. When the signal processing unit determines that silicon wafer 20 is abnormal, it can issue an alarm signal to remind the operator to remove the abnormal silicon wafer 20.

[0105] It should be noted that the through-beam scanning component 500 is a structural design that already exists in the field, and will not be described in detail here.

[0106] In other embodiments, please refer to Figure 5 There are two support components 310, which are located on both sides of the placement mechanism 200. The signal transmitter 510 and the signal receiver 520 are respectively arranged on the first support member 311 and the second support member 312 of one of the support components 310. The ion blower 400 is arranged on the first support member 311 and / or the second support member 312 of the other support component 310.

[0107] In this embodiment, the ion blowing component 400 and the through-beam scanning component 500 are located on both sides of the placement mechanism 200, and the two do not interfere with each other.

[0108] In some embodiments, see Figure 2 and Figure 5 The silicon wafer loading device 10 further includes: a transmission mechanism 600, which is disposed on the base 100 and is used to transmit the placement mechanism 200; and a limiting mechanism 700, which is disposed on the base 100 and is located on one side of the support mechanism 300 and is used to limit the placement mechanism 200 when it is transmitted to a preset position.

[0109] In this embodiment, both the transmission mechanism 600 and the limiting mechanism 700 are mounted on the base 100, which provides stable support for the transmission mechanism 600 and the limiting mechanism 700 by utilizing the stability of the base 100.

[0110] By setting up a transmission mechanism 600 to move the placement mechanism 200, no manual operation is required. This not only improves the transmission efficiency of the placement mechanism 200, but also avoids personal injury to the operator.

[0111] By setting a limiting mechanism 700, which is located on one side of the support mechanism 300, when the placement mechanism 200 is transported to the preset position, the limiting mechanism 700 can block and limit the placement mechanism 200 so that the placement mechanism 200 can be kept in the preset position, making it easy for the film picking device 30 to pick up the film smoothly.

[0112] For some specific implementation methods, please refer to Figure 5 The transmission mechanism 600 includes a first conveyor belt 610 and a second conveyor belt 620. Both the first conveyor belt 610 and the second conveyor belt 620 are mounted on the base 100. Both the first conveyor belt 610 and the second conveyor belt 620 are used to transmit the placement mechanism 200.

[0113] The limiting mechanism 700 includes two limiting components 710. Each limiting component 710 includes a first telescopic member 711 and a limiting member 712. The limiting member 712 is connected to the telescopic end of the first telescopic member 711. The first telescopic member 711 is disposed on the base 100 and is located between the first conveyor belt 610 and the second conveyor belt 620. The two first telescopic members 711 are used to extend when the placement mechanism 200 is transported to a preset position, and correspondingly drive the two limiting members 712 to move in the direction toward the placement mechanism 200, so that the two limiting members 712 clamp the placement mechanism 200.

[0114] By setting up a first conveyor belt 610 and a second conveyor belt 620, the first conveyor belt 610 and the second conveyor belt 620 work together to better support the placement mechanism 200 and balance the weight of the placement mechanism 200, reducing shaking and tilting during the transmission process.

[0115] By setting two limiting components 710, the two limiting components 710 clamp and limit the placement mechanism 200 on both sides of the placement mechanism 200, which can not only prevent the placement mechanism 200 from continuing to move in the transmission direction of the transmission mechanism 600, but also effectively prevent the placement mechanism 200 from shaking, so that the placement mechanism 200 is firmly fixed in the preset position, which makes it easy for the film picking device 30 to pick up the film smoothly.

[0116] Along the transmission direction of the transmission mechanism 600, the more distal first telescopic member 711 can always remain extended. When the placement mechanism 200 encounters the more distal limiting member 712, the placement mechanism 200 cannot continue to move. At this time, the position of the placement mechanism 200 is the preset position. Along the transmission direction of the transmission mechanism 600, when the placement mechanism 200 has not moved to the preset position, the more proximal first telescopic member 711 controls the more proximal limiting member 712 to remain in a retracted state. The more proximal limiting member 712 will not interfere with the movement of the placement mechanism 200 on the transmission mechanism 600.

[0117] By placing the first telescopic member 711 between the first conveyor belt 610 and the second conveyor belt 620, the limiting component 710 is integrated into the basket conveying component, achieving structural compactness and improving the space utilization of the silicon wafer loading device 10.

[0118] It should be noted that this embodiment does not limit the specific type of the first telescopic member 711, and can be adjusted according to specific needs. For example, the first telescopic member 711 is an electric telescopic cylinder or an electric hydraulic cylinder.

[0119] Furthermore, the width of the limiting member 712 is equal to the width between the first transmission belt and the second transmission belt 620. This makes the limiting member 712 wider, thereby increasing the contact area between the limiting member 712 and the placement mechanism 200, and thus improving the limiting effect of the limiting member 712.

[0120] Furthermore, the limiting component 710 also includes a first flexible member (not shown), which is connected to the limiting member 712. The limiting member 712 contacts the placement mechanism 200 through the first flexible member. By providing the first flexible member, the rigid structure between the limiting member 712 and the placement mechanism 200 can be avoided, thereby reducing the damage caused by the limiting member 712 to the placement mechanism 200.

[0121] It should be noted that this embodiment does not limit the specific type of the first flexible member, as long as it can achieve flexible contact between the limiting member 712 and the placement mechanism 200. For example, the first flexible member is canvas, sponge, or foam.

[0122] In some other specific embodiments (not illustrated in this embodiment), the transmission mechanism 600 includes a chain drive, a chain transmission component, and a snap-fit ​​component. The chain drive is connected to the chain transmission component, and the snap-fit ​​component is disposed on the chain transmission component. The placement mechanism 200 can be snapped onto the chain transmission component through the snap-fit ​​component, so that the chain transmission component supports and fixes the placement mechanism 200. The chain drive can drive the chain transmission component to move and drive the placement mechanism 200 to move. When the placement mechanism 200 reaches a preset position, the chain drive stops driving the chain transmission component to move. At this time, the wafer removal device 30 can remove the silicon wafer 20 from the placement mechanism 200.

[0123] In other embodiments, please refer to Figure 5 The silicon wafer loading device 10 also includes an abutment mechanism 800, which abuts against the upper part of the placement mechanism 200 when the placement mechanism 200 is transported to a preset position.

[0124] By setting an abutting mechanism 800, the abutting mechanism 800 abuts against the upper part of the placement mechanism 200 when the placement mechanism 200 is transported to the preset position. Together with the side limiting mechanism 700, it forms a fixed method that cooperates with the upper and lower parts, which can prevent the placement mechanism 200 from shaking or shifting. The overall stability of the placement mechanism 200 is improved, ensuring the stability of the film picking.

[0125] In some specific embodiments, the abutment mechanism 800 includes: a third support member 810 disposed on the base 100; a second telescopic member 820 disposed on the third support member 810; and an abutment member 830 connected to the telescopic end of the second telescopic member 820. The second telescopic member 820 is used to extend when the placement mechanism 200 is transferred to a preset position and drive the abutment member 830 to move in the direction toward the placement mechanism 200 so that the abutment member 830 abuts against the upper part of the placement mechanism 200.

[0126] In this embodiment, by setting a third support member 810, which is mounted on the base 100, and a second telescopic member 820 mounted on the third support member 810, the third support member 810 provides a stable support point for the second telescopic member 820, which can ensure the smooth operation of the second telescopic member 820.

[0127] By providing a second telescopic member 820, when the placement mechanism 200 needs to be transferred, the second telescopic member 820 can retract, allowing the abutment member 830 to return to a position that does not affect the movement of the placement mechanism 200; when the placement mechanism 200 reaches a preset position and needs to be fixed, the second telescopic member 820 can extend, allowing the abutment member 830 to contact the upper part of the placement mechanism 200. By controlling the degree of extension and retraction of the second telescopic member 820, the abutting force of the abutment member 830 can be precisely controlled, avoiding pressure damage to the placement mechanism 200.

[0128] It should be noted that this embodiment does not limit the specific type of the second telescopic member 820, and can be adjusted according to specific needs. For example, the second telescopic member 820 is an electric telescopic cylinder or an electric hydraulic cylinder.

[0129] Furthermore, the third support member 810 includes multiple support columns 811 and a control box 812. The multiple support columns 811 are all mounted on the base 100, and the control box 812 is connected to the multiple support columns 811. There are multiple second telescopic members 820 and multiple abutment members 830. Multiple abutment members 830 are correspondingly connected to multiple second telescopic members 820, and each second telescopic member 820 is connected to the control box 812. In this example, the abutment member 830 is an abutment plate. The connection between the multiple second telescopic members 820 and the abutment plate has high stability, and the contact area between the abutment plate and the placement mechanism 200 is large, allowing the abutment plate to firmly abut against the upper part of the placement mechanism 200.

[0130] It should be noted that the silicon wafer loading device 10 may also include a controller 900, which is mounted on the control box 812. The controller 900 can control the operation of various electrical components of the silicon wafer loading device 10 (such as the ion blowing component 400, the through-beam scanning component 500, etc.). In addition, the control box 812 may also be provided with heat dissipation holes 813, which can be used for heat dissipation of the controller 900.

[0131] In some other specific embodiments, the abutment mechanism 800 further includes a second flexible member (not shown), which is connected to the abutment member 830, and the abutment member 830 contacts the placement mechanism 200 through the second flexible member. By providing the second flexible member, the rigid structure between the abutment member 830 and the placement mechanism 200 can be avoided, thereby reducing the damage caused by the abutment member 830 to the placement mechanism 200.

[0132] It should be noted that this embodiment does not limit the specific type of the second flexible member, as long as it can achieve flexible contact between the abutment member 830 and the placement mechanism 200. For example, the second flexible member is canvas, sponge, or foam.

[0133] It should be understood that the embodiments of this application are not limited to the precise structures described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of this application is limited only by the appended claims.

Claims

1. A silicon wafer loading device, characterized in that, include: Base (100); Placement mechanism (200) is disposed on the base (100). The placement mechanism (200) includes a plurality of placement components (210) spaced apart along the height direction of the base (100). The placement components (210) are used to place silicon wafers (20). A support mechanism (300) is disposed on the base (100); At least one ion blower (400) is disposed on the support mechanism (300) along the height direction of the base (100), and the ion blower (400) is used to blow ion air toward the silicon wafer (20).

2. The silicon wafer loading device according to claim 1, characterized in that, The ion blowing component (400) and the support mechanism (300) have an angle between them.

3. The silicon wafer loading device according to claim 1, characterized in that, The ion blower (400) is rotatably connected to the support mechanism (300) so that the ion blower (400) can switch between a working position and a storage position; In the working position, there is an angle between the ion blowing component (400) and the support mechanism (300); In the storage position, the ion blower (400) is attached to the support mechanism (300).

4. The silicon wafer loading device according to claim 1, characterized in that, The ion blowing component (400) is an ion blowing bar.

5. The silicon wafer loading apparatus according to any one of claims 1-4, characterized in that, The placement mechanism (200) further includes a first frame (220), a second frame (230), and a plurality of first connectors (240). The first frame (220) is disposed on the base (100). The first connectors (240) connect the first frame (220) and the second frame (230) to form a placement space (250) and a pick-and-place port (260) between the first frame (220) and the second frame (230). The pick-and-place port (260) communicates with the placement space (250) and is used to place or remove the silicon wafer (20) into or from the placement space (250). The placement assembly (210) includes a plurality of first placement members (211), a plurality of second placement members (212), and a plurality of third placement members (213). The first placement members (211), the second placement members (212), and the third placement members (213) are all connected to the first connector (240) and are all located within the placement space (250). The first placement member (211) extends toward the pick-and-place port (260). The second placement members (212) and the third placement members (213) are respectively disposed on both sides of the first placement member (211). The second placement members (212) and the third placement members (213) both extend toward the first placement member (211). The first placement member (211), the second placement member (212), and the third placement member (213) are all used to place the silicon wafer (20).

6. The silicon wafer loading apparatus according to any one of claims 1-4, characterized in that, It also includes a beam scanning assembly (500), which includes a signal transmitter (510), a signal receiver (520), and a signal processing unit. The signal transmitter (510) and the signal receiver (520) are both communicatively connected to the signal processing unit. The support mechanism (300) includes at least one support component (310), the support component (310) includes a first support member (311), a second support member (312) and a second connector (313), the first support member (311) and the second support member (312) are both disposed on the base (100), and the second connector (313) connects the first support member (311) and the second support member (312), the first support member (311) and the second support member (312) are respectively located on both sides of the placement mechanism (200); The signal transmitter (510) is disposed on one of the first support members (311), and the signal receiver (520) is disposed on one of the second support members (312). The signal receiver (520) is used to transmit a scan signal and to receive the scan signal transmitted by the signal transmitter (510). The signal processing unit is used to process the scan signal received by the signal receiver (520) to identify the number, position and abnormal state of the silicon wafer (20).

7. The silicon wafer loading apparatus according to any one of claims 1-4, characterized in that, Also includes: A transmission mechanism (600) is disposed on the base (100) and is used to transmit the placement mechanism (200). A limiting mechanism (700) is disposed on the base (100) and located on one side of the support mechanism (300). The limiting mechanism (700) is used to limit the placement mechanism (200) when the placement mechanism (200) is transferred to a preset position.

8. The silicon wafer loading device according to claim 7, characterized in that, The transmission mechanism (600) includes a first conveyor belt (610) and a second conveyor belt (620), both of which are disposed on the base (100). Both the first conveyor belt (610) and the second conveyor belt (620) are used to transmit the placement mechanism (200). The limiting mechanism (700) includes two limiting components (710), each limiting component (710) including a first telescopic member (711) and a limiting member (712). The limiting member (712) is connected to the telescopic end of the first telescopic member (711). The first telescopic member (711) is disposed on the base (100) and is located between the first conveyor belt (610) and the second conveyor belt (620). The two first telescopic members (711) are used to extend when the placement mechanism (200) is transported to a preset position, and correspondingly drive the two limiting members (712) to move in the direction toward the placement mechanism (200) so that the two limiting members (712) clamp the placement mechanism (200).

9. The silicon wafer loading device according to claim 7, characterized in that, It also includes an abutment mechanism (800), said abutment mechanism (800) comprising: A third support member (810) is disposed on the base (100); The second telescopic member (820) is disposed on the third support member (810); An abutment (830) is connected to the telescopic end of the second telescopic member (820); The second telescopic member (820) is used to extend when the placement mechanism (200) is transmitted to a preset position, and to drive the abutment member (830) to move in the direction toward the placement mechanism (200) so that the abutment member (830) abuts against the upper part of the placement mechanism (200).

10. A silicon wafer feeding system, characterized in that, include: A silicon wafer loading device (10), wherein the silicon wafer loading device (10) is the silicon wafer loading device (10) according to any one of claims 1-9. A wafer picking device (30) and a silicon wafer transfer device (40) are provided on the side of the silicon wafer loading device (10). The wafer picking device (30) is used to transfer the silicon wafer loaded by the silicon wafer loading device (10) to the silicon wafer transfer device (40).

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