Power device

By setting a clamping mechanism and leaving a gap between the power module and the heat dissipation module, the buckling of the power module caused by thermal expansion and the problem of air mixing are solved, ensuring the reliability and heat dissipation performance of the product.

CN224205638UActive Publication Date: 2026-05-05UNITED AUTOMOTIVE ELECTRONICS SYST
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
UNITED AUTOMOTIVE ELECTRONICS SYST
Filing Date
2025-03-31
Publication Date
2026-05-05

AI Technical Summary

Technical Problem

The existing method of fixing the power module and the heat dissipation module causes the power module to buckle when heated, allowing air to get in and causing thermal failure of the product.

Method used

A clamping mechanism is used to fix one side of the power module to the heat dissipation module, and the other side is clamped and fixed by the clamping mechanism. A gap is left between the power module and the substrate on the side of the power module near the clamping mechanism to allow the module to expand and contract laterally when the temperature changes, thus preventing buckling and air from entering.

Benefits of technology

This effectively avoids buckling and air ingress between the power module and the heat dissipation module, ensuring product reliability and heat dissipation performance.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model provides a power device. The power device comprises a heat radiation module; the power module is arranged on the heat dissipation module; the pressing mechanism is arranged on the heat dissipation module and located on one side of the power module, the pressing mechanism partially extrudes the first face of the power module, the side, away from the pressing mechanism, of the power module is fixedly connected with the heat dissipation module, and a gap exists between the side face, close to the pressing mechanism, of the power module and the pressing mechanism. According to the utility model, the power module is pressed and fixed through the pressing mechanism, so that the power module is fixed, and a gap exists between one side, close to the pressing mechanism, of the power module and the substrate of the pressing mechanism, so that the power module is allowed to generate telescopic micro-motion in the transverse direction under the condition that the temperature of the power module is suddenly changed; the situation that the power module is bent or air enters the space between the power module and the heat dissipation module is avoided, so that thermal failure is avoided, and the reliability of a product is ensured.
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Description

Technical Field

[0001] This utility model belongs to the field of power module technology, and specifically relates to a power device. Background Technology

[0002] The ever-increasing demand for automobiles has led to a series of energy depletion and environmental problems, prompting new energy sources to fully enter the mass market. This market expansion will undoubtedly bring about demands for smaller, higher power density products from manufacturers; this industry trend is an indisputable fact and is expected to continue.

[0003] The biggest challenge brought about by high power density is undoubtedly the thermal management of the product, requiring the dissipation of more heat in a smaller volume. This poses a significant challenge to product design. Existing electronic control modules in new energy vehicles generally use liquid cooling, with components that clearly have high heat dissipation requirements including power modules and power windings. Different manufacturers use different methods for fixing, insulating, and dissipating heat from silicon transistors. The typical method for fixing power modules is as follows: the power module is placed on top of the heat sink module, with a thermally conductive medium sandwiched in between; the power module and the heat sink module are fixed in some way, such as by welding or screwing around the perimeter or sides.

[0004] The above methods offer lower manufacturing costs and higher product performance. However, the density of power devices on power modules is increasing, leading to greater temperature fluctuations and thermal diffusion ranges. The fixed-end mounting method provides ample conditions for buckling. If there is a significant difference in the coefficients of thermal expansion between the heat dissipation module and the power module, the module's stiffness may not be sufficient to prevent sudden temperature changes from causing material expansion and subsequent buckling. In this case, not only will there be a heat-conducting medium between the power module and the heat dissipation module, but air will also be introduced, potentially leading to thermal failure of the product. Utility Model Content

[0005] In view of the shortcomings of the prior art, the purpose of this utility model is to provide a power device to solve the problem that the power module buckles when heated due to the fixing method between the existing power module and the heat dissipation module, causing air to mix between the power module and the heat dissipation module, and thus leading to thermal failure of the product.

[0006] To achieve the above and other related objectives, this utility model proposes a power device, comprising:

[0007] Heat dissipation module;

[0008] A power module, wherein the power module is disposed on the heat dissipation module;

[0009] A clamping mechanism is disposed on the heat dissipation module and located on one side of the power module. The clamping mechanism partially presses against a first surface of the power module, which is the side of the power module away from the heat dissipation module. The side of the power module away from the clamping mechanism is fixedly connected to the heat dissipation module. There is a gap between the side of the power module close to the clamping mechanism and the clamping mechanism.

[0010] In a preferred embodiment of this utility model, the clamping mechanism includes:

[0011] A substrate, which is fixedly connected to the heat dissipation module;

[0012] A clamping plate is disposed on the substrate and partially covers the side of the power module away from the heat dissipation module;

[0013] An elastic element is disposed on the side of the clamping plate facing the power module.

[0014] In a preferred embodiment of this utility model, the distance between the elastic element and the heat dissipation module is less than the height of the power module.

[0015] In a preferred embodiment of this utility model, the substrate, the pressing plate, and the heat dissipation module are integrally formed.

[0016] In a preferred embodiment of this utility model, the elastic element and the pressing plate are detachably connected.

[0017] In a preferred embodiment of this utility model, the substrate and the clamping plate are configured as heat dissipation plates.

[0018] In a preferred embodiment of this utility model, the elastic element is made of a thermally conductive material.

[0019] In a preferred embodiment of this utility model, the side of the power module away from the clamping mechanism is fixedly connected to the heat dissipation module by welding or bolts.

[0020] In a preferred embodiment of this invention, the side of the power module facing the heat dissipation module is coated with a thermally conductive medium.

[0021] This invention proposes a power device that fixes one side of the power module to a heat dissipation module and the other side to a pressing mechanism on the heat dissipation module. The power module is secured by this mechanism, and a gap exists between the side of the power module near the pressing mechanism and the base plate of the pressing mechanism. This allows the power module to undergo slight lateral expansion and contraction under sudden temperature changes, eliminating the preconditions for buckling and preventing buckling or air from entering between the power module and the heat dissipation module. This avoids thermal failure and ensures product reliability. Attached Figure Description

[0022] To more clearly illustrate the technical solutions of the embodiments of this utility model, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0023] Figure 1 This is a schematic diagram of the power device in one embodiment of the present invention.

[0024] Label Explanation:

[0025] 100. Power device; 10. Heat dissipation module; 20. Power module; 30. Pressing mechanism; 31. Substrate; 32. Pressing plate; 33. Elastic component. Detailed Implementation

[0026] The following specific examples illustrate the implementation of this utility model. Those skilled in the art can easily understand other advantages and effects of this utility model from the content disclosed in this specification. This utility model can also be implemented or applied through other different specific embodiments, and various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of this utility model.

[0027] It should be noted that the illustrations provided in this embodiment are only schematic representations of the basic concept of this utility model. Therefore, the drawings only show the components related to this utility model and are not drawn according to the actual number, shape and size of the components. In actual implementation, the form, quantity and proportion of each component can be arbitrarily changed, and the layout of the components may also be more complex.

[0028] Please see Figure 1As shown, the purpose of this utility model is to provide a power device to solve the problem that, under the existing fixing method between the power module and the heat dissipation module, the power module buckles when heated, causing air to mix between the power module and the heat dissipation module, thus leading to thermal failure of the product. Specifically, the power device 100 includes a heat dissipation module 10, a power module 20, and a clamping mechanism 30. The heat dissipation module 10 is used for heat dissipation, and the power module 20 is arranged on the heat dissipation module 10. The clamping mechanism 30 is disposed on the heat dissipation module 10 and located on one side of the power module 20. The clamping mechanism 30 partially presses against a first surface of the power module 20, which is the surface of the power module 20 away from the heat dissipation module 10, to apply pressure to the power module 20. The side of the power module 20 away from the clamping mechanism 30 is fixedly connected to the heat dissipation module 10, that is, one side of the power module 20 is fixedly connected to the heat dissipation module 10, and the other side is pressed and fixed by the clamping mechanism 30, thereby fixing the power module 20 to the heat dissipation module 10.

[0029] Please see Figure 1 As shown, in this embodiment, the clamping mechanism 30 includes a base plate 31, a clamping plate 32, and an elastic element 33. The base plate 31 is fixedly connected to the heat dissipation module 10. The clamping plate 32 is disposed on the base plate 31 and protrudes towards one side of the power module 20 relative to the side of the base plate 31. The protruding area of ​​the clamping plate 32 relative to the base plate 31 partially covers the side of the power module 20 away from the heat dissipation module 10. The elastic element 33 is disposed on the side of the clamping plate 32 facing the power module 20. In this embodiment, the distance between the elastic element 33 and the heat dissipation module 10 is less than the height of the power module 20, so that when the clamping mechanism 30 fixes the power module 20, the elastic element 33 is compressed, applying pressure to the power module 20 to fix it. It can be understood that the elastic element 33 can provide sufficient pressure to fix the power module 20, while also playing a buffering role and avoiding damage to the power module 20 caused by the rigid structure in the traditional structure.

[0030] Please see Figure 1As shown, in this embodiment, there is a gap between the side of the power module 20 near the clamping mechanism 30 and the clamping mechanism 30. Specifically, there is a gap between the end of the power module 20 near the clamping mechanism 30 and the substrate 31. The other side of the power module 20 opposite to the clamping mechanism 30 is fixedly connected to the heat dissipation module 10 by welding or bolts or other means. That is, one side of the power module 20 is fixed by welding or other means, and the other side is fixed by applying pressure through the clamping mechanism 30. When the temperature of the power module 20 changes, for example, when it suddenly rises, since the lateral space of the side of the power module 20 clamped by the clamping mechanism 30 is not restricted, the gap between the side of the power module 20 near the clamping mechanism 30 and the substrate 31 can serve as the expansion space of the power module 20. The power module 20 itself is allowed to generate lateral expansion and contraction micro-movements. At this time, the preconditions for buckling will not exist, avoiding the situation of power module buckling or air entering between the power module 20 and the heat dissipation module 10, thereby avoiding thermal failure and ensuring the reliability of the product.

[0031] Please see Figure 1 As shown, in this embodiment, the substrate 31, the clamping plate 32, and the heat dissipation module 10 are integrally formed, facilitating their processing and molding. Furthermore, the substrate 31 and the clamping plate 32 can also be configured as heat dissipation plates to improve their heat dissipation effect. Even further, the elastic element 33 can be made of a thermally conductive material, such as thermally conductive silicone or a thermally conductive pad, and a thermally conductive medium can be coated on the side of the power module 20 facing the heat dissipation module 10 to further improve the heat dissipation effect.

[0032] Please see Figure 1 As shown, in this embodiment, the elastic element 33 is detachably connected to the pressure plate 32 or to the power module 20, so as to facilitate replacement of the elastic element 33 after aging and ensure the reliability of the installation of the power module 20.

[0033] Please see Figure 1 As shown, in this embodiment, the assembly process of the power device 100 is described as follows: Thermally conductive adhesive is applied to one side of the power module 20; the power module 20 is positioned on the heat dissipation module 10; one side of the power module 20 is pressed and fixed by the clamping mechanism 30; and the other side is fixed by bolts or welding. In this embodiment, the elastic element 33 can be assembled with the clamping plate 32 or the power module 20 first, then one side of the power module 20 can be assembled below the clamping plate 32 to achieve one-sided fixation; finally, the other side of the power module 20 is fixedly connected to the heat dissipation module 10 by welding or bolts.

[0034] This invention proposes a power device that fixes one side of the power module to a heat dissipation module and the other side to a pressing mechanism on the heat dissipation module. The power module is secured by this mechanism, and a gap exists between the side of the power module near the pressing mechanism and the base plate of the pressing mechanism. This allows the power module to undergo slight lateral expansion and contraction under sudden temperature changes, eliminating the preconditions for buckling and preventing buckling or air from entering between the power module and the heat dissipation module. This avoids thermal failure and ensures product reliability.

[0035] The above embodiments are merely illustrative of the principles and effects of this utility model and are not intended to limit the scope of this utility model. Any person skilled in the art can modify or alter the above embodiments without departing from the spirit and scope of this utility model. Therefore, all equivalent modifications or alterations made by those skilled in the art without departing from the spirit and technical concept disclosed in this utility model should still be covered by the claims of this utility model.

[0036] Throughout this description, numerous specific details, such as examples of components and / or methods, are provided to provide a complete understanding of embodiments of the present invention. However, those skilled in the art will recognize that embodiments of the present invention may be practiced without one or more of these specific details or by other devices, systems, components, methods, parts, materials, components, etc. In other instances, well-known structures, materials, or operations have not been specifically shown or described in detail to avoid obscuring aspects of embodiments of the present invention.

[0037] Throughout this specification, references to "an embodiment," "an embodiment," or "a specific embodiment" mean that a particular feature, structure, or characteristic described in connection with an embodiment is included in at least one embodiment of the present invention, but not necessarily in all embodiments. Therefore, the various representations of the phrases "in one embodiment," "in an embodiment," or "in a specific embodiment" in different places throughout the specification do not necessarily refer to the same embodiment. Furthermore, a particular feature, structure, or characteristic of any specific embodiment of the present invention can be combined with one or more other embodiments in any suitable manner. It should be understood that other variations and modifications of the embodiments of the present invention described and illustrated herein may be based on the teachings herein and will be considered part of the spirit and scope of the present invention.

[0038] It should also be understood that one or more of the elements shown in the figures may be implemented in a more separate or more integrated manner, or may even be removed because they are inoperable in certain circumstances or provided because they may be useful for a particular application.

[0039] Furthermore, unless otherwise expressly stated, any arrows in the accompanying drawings should be considered illustrative only and not limiting. Additionally, unless otherwise stated, the term "or" as used herein is generally intended to mean "and / or". Where a term is anticipated to provide a separation or combination capability that is unclear, a combination of components or steps will also be considered as indicated.

[0040] As used herein and throughout the claims below, unless otherwise specified, “a” and “the” include the plural references. Similarly, as used herein and throughout the claims below, unless otherwise specified, “in” means “in” and “on”.

[0041] The above description of the embodiments shown in this utility model (including the content set forth in the abstract of the specification) is not intended to be an exhaustive enumeration or to limit the utility model to the precise forms disclosed herein. Although specific embodiments and examples of the utility model have been described herein for illustrative purposes only, various equivalent modifications are possible within the spirit and scope of the utility model, as will be recognized and understood by those skilled in the art. As indicated, these modifications can be made to the utility model in accordance with the above description of the embodiments described herein, and such modifications will be within the spirit and scope of the utility model.

[0042] This document has generally described the systems and methods in detail to aid in understanding the present invention. Furthermore, various specific details have been set forth to provide a general understanding of embodiments of the present invention. However, those skilled in the art will recognize that embodiments of the present invention can be practiced without one or more specific details, or using other devices, systems, accessories, methods, components, materials, parts, etc. In other instances, well-known structures, materials, and / or operations have not been specifically shown or described in detail to avoid obscuring aspects of embodiments of the present invention.

[0043] Therefore, although the present invention has been described herein with reference to specific embodiments thereof, freedom of modification, various changes and substitutions are also within the scope of the above disclosure, and it should be understood that in some cases, certain features of the present invention may be adopted without departing from the scope and spirit of the invention and without corresponding use of other features. Thus, many modifications can be made to adapt a particular environment or material to the essential scope and spirit of the present invention. The present invention is not intended to be limited to the specific terms used in the following claims and / or the specific embodiments disclosed as the best mode of carrying out the present invention, but the present invention will include any and all embodiments and equivalents falling within the scope of the appended claims. Therefore, the scope of the present invention will be determined only by the appended claims.

Claims

1. A power device, characterized in that, include: Heat dissipation module; A power module, wherein the power module is disposed on the heat dissipation module; A clamping mechanism is disposed on the heat dissipation module and located on one side of the power module. The clamping mechanism partially presses against a first surface of the power module, which is the side of the power module away from the heat dissipation module. The side of the power module away from the clamping mechanism is fixedly connected to the heat dissipation module. There is a gap between the side of the power module close to the clamping mechanism and the clamping mechanism.

2. The power device according to claim 1, characterized in that, The clamping mechanism includes: A substrate, which is fixedly connected to the heat dissipation module; A clamping plate is disposed on the substrate and partially covers the side of the power module away from the heat dissipation module; An elastic element is disposed on the side of the clamping plate facing the power module.

3. The power device according to claim 2, characterized in that, The distance between the elastic element and the heat dissipation module is less than the height of the power module.

4. The power device according to claim 2, characterized in that, The substrate, the clamping plate, and the heat dissipation module are integrally formed.

5. The power device according to claim 2, characterized in that, The elastic element is detachably connected to the pressure plate or detachably connected to the power module.

6. The power device according to claim 2, characterized in that, The substrate and the clamping plate are configured as heat dissipation plates.

7. The power device according to claim 2, characterized in that, The elastic element is made of a thermally conductive material.

8. The power device according to claim 1, characterized in that, The power module is fixedly connected to the heat dissipation module by welding or bolts on the side away from the clamping mechanism.

9. The power device according to claim 1, characterized in that, The side of the power module facing the heat dissipation module is coated with a thermally conductive medium.