Dispensing and hot-pressing equipment for processing metal shell of notebook computer

Abstract

The utility model discloses dispensing and hot-pressing equipment for processing a metal shell of a notebook computer, and relates to the technical field of notebook computer processing. The metal shell glue dispensing device comprises a metal shell glue dispensing device body, a metal shell transferring mechanical arm, a conveying belt structure and a machining table top, a connecting cover is fixedly connected to the top face of the machining table top, a ventilation assembly is arranged on the surface of the connecting cover, an air outlet is formed in the surface of the connecting cover, and a first fixing rod is fixedly connected to the inner wall of the connecting cover; a semiconductor refrigerator is fixedly connected to the surface of the first fixing rod, a second fixing rod is fixedly connected to the inner wall of the connecting cover, and a second miniature fan structure is fixedly connected to the surface of the second fixing rod. By arranging the connecting cover, the ventilation assembly, the air outlet, the semiconductor cooler and the second micro fan structure, a cold air blowing structure is formed, the temperature of the heat-sealed metal shell can be rapidly and effectively reduced, and the subsequent machining precision and quality are prevented from being affected by high temperature.

Description

Technical Field

[0001] This utility model relates to the field of laptop computer processing technology, specifically to a dispensing and hot pressing device for processing laptop computer metal casings. Background Technology

[0002] In the manufacturing process of laptop metal casings, dispensing and hot pressing are common steps. Currently, existing equipment typically uses a conveyor belt to transport the laptop metal casing, a robotic arm picks up the metal casing, first feeds it into a dispensing device for dispensing, and then feeds it into a heat sealing device for heat sealing.

[0003] However, the metal casing after heat sealing is at a high temperature. If it is not cooled in time, it will affect the accuracy and quality of subsequent processing steps, potentially causing deformation or damage to other components in contact with the high-temperature metal casing. Furthermore, the high temperature of the metal casing also poses a safety hazard to operators. Existing equipment often lacks effective cooling measures and cannot meet actual production needs.

[0004] Therefore, a dispensing and hot pressing device for processing metal casings of laptops is proposed. Utility Model Content

[0005] The purpose of this utility model is to provide a dispensing and hot pressing device for processing metal casings of laptops, in order to solve the problems mentioned in the background art.

[0006] To achieve the above objectives, this utility model specifically adopts the following technical solution:

[0007] A dispensing and hot-pressing device for processing metal casings of laptops includes a metal casing dispensing device, a metal casing transfer robotic arm, a conveyor belt structure, and a processing table. The top surface of the processing table is provided with a heat-sealing component for heat sealing after dispensing the metal casing. A connecting cover is fixedly connected to the top surface of the processing table. A ventilation component is provided on the surface of the connecting cover, and an air outlet is opened on the surface of the connecting cover. A fixing rod is fixedly connected to the inner wall of the connecting cover. A semiconductor cooler is fixedly connected to the surface of the fixing rod. A heat dissipation component for heat dissipation of the semiconductor cooler is provided on the heat dissipation surface of the semiconductor cooler and the surface of the fixing rod. A second fixing rod is fixedly connected to the inner wall of the connecting cover, and a second micro-fan structure is fixedly connected to the surface of the second fixing rod.

[0008] Furthermore, the heat sealing assembly includes a guide rod, the top surface of the processing table is fixedly connected to the guide rod, the top surface of the guide rod is fixedly connected to a top plate, a cylinder is provided on the top plate, the telescopic rod of the cylinder is fixedly connected to an upper heat sealing module, and the upper heat sealing module is slidably connected to the guide rod, and the top surface of the processing table is fixedly connected to a lower placement platform.

[0009] Furthermore, the ventilation assembly includes ventilation holes, the side of the connecting cover has ventilation holes, and the top surface of the connecting cover has an air inlet.

[0010] Furthermore, the heat dissipation component includes heat dissipation fins, the heat dissipation surface of the semiconductor cooler is provided with heat dissipation fins, a fixing block is fixedly connected to the surface of the fixing rod, and a micro fan structure is fixedly connected to the surface of the fixing block.

[0011] Furthermore, there are multiple miniature fan structures II, and these multiple miniature fan structures II are distributed in a linear array on the surface of the fixed rod II.

[0012] Furthermore, the connecting cover is a detachable structure, connected to the processing table by bolts, which facilitates cleaning and maintenance of the inside of the connecting cover.

[0013] The beneficial effects of this utility model are as follows:

[0014] 1. This utility model forms a cold air blowing structure by setting up a connecting cover, a ventilation component, an air outlet, a semiconductor cooler, and a micro fan structure II. The ventilation component introduces air, the semiconductor cooler cools it, and the micro fan structure II accelerates the flow of cold air, which can quickly and effectively reduce the temperature of the metal shell after heat sealing, avoiding the impact of high temperature on the accuracy and quality of subsequent processing.

[0015] 2. The heat dissipation fins in the heat dissipation assembly increase the heat dissipation area, and the micro-fan structure accelerates airflow, effectively dissipating the heat generated by the thermoelectric cooler, ensuring stable operation and extending its service life. Multiple micro-fans arranged in a linear array (structure two) allow for more even distribution of cool air within the connecting cover, providing comprehensive cooling of the heat-sealed metal casing and further improving cooling efficiency and effectiveness. The connecting cover features a detachable structure, connected to the processing table with bolts, facilitating disassembly during equipment maintenance. This allows for cleaning, inspection, and replacement of components inside the connecting cover, such as the thermoelectric cooler and micro-fans, reducing maintenance difficulty and costs. Attached Figure Description

[0016] Figure 1 This is a three-dimensional structural diagram of the present invention;

[0017] Figure 2 This is a schematic diagram of the structure of the metal shell heat sealing device of this utility model;

[0018] Figure 3 This is a partial structural schematic diagram of the present invention;

[0019] Figure 4 This is a partial structural cross-sectional view of the present invention.

[0020] Reference numerals: 1. Metal casing dispensing equipment; 2. Metal casing transfer robotic arm; 3. Conveyor belt structure; 4. Processing table; 5. Heat sealing assembly; 501. Guide rod; 502. Top plate; 503. Cylinder; 504. Upper heat sealing module; 505. Lower placement platform; 6. Connecting cover; 7. Ventilation assembly; 701. Ventilation hole; 702. Air inlet; 8. Air outlet; 9. Fixing rod one; 10. Semiconductor cooler; 11. Heat dissipation assembly; 1101. Heat dissipation fins; 1102. Fixing block; 1103. Miniature fan structure one; 12. Fixing rod two; 13. Miniature fan structure two. Detailed Implementation

[0021] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. The components of the embodiments of this utility model described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0022] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.

[0023] It should be noted that similar reference numerals and letters in the following figures indicate similar items; therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures. Furthermore, the terms "first," "second," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0024] In the description of the embodiments of this utility model, it should be noted that the terms "inner", "outer", "upper", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship in which the utility model product is usually placed when in use. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0025] like Figure 1 , Figure 2 , Figure 3 , Figure 4As shown, a dispensing and hot-pressing device for processing metal casings of laptops includes a metal casing dispensing device 1, a metal casing transfer robotic arm 2, a conveyor belt structure 3, and a processing table 4. The top surface of the processing table 4 is provided with a heat-sealing component 5 for heat sealing after dispensing the metal casing. A connecting cover 6 is fixedly connected to the top surface of the processing table 4. A ventilation component 7 is provided on the surface of the connecting cover 6, and an air outlet 8 is opened on the surface of the connecting cover 6. A fixing rod 9 is fixedly connected to the inner wall of the connecting cover 6. A semiconductor cooler 10 is fixedly connected to the surface of the fixing rod 9. A heat dissipation component 11 for heat dissipation of the semiconductor cooler 10 is provided on the heat dissipation surface of the semiconductor cooler 10 and the surface of the fixing rod 9. A second fixing rod 12 is fixedly connected to the inner wall of the connecting cover 6, and a second micro-fan structure 13 is fixedly connected to the surface of the second fixing rod 12. Specifically, this device mainly includes a metal casing dispensing device 1, a metal casing transfer robotic arm 2, a conveyor belt structure 3, a processing table 4, and a heat-sealing component 5. The conveyor belt structure 3 is used to transport the laptop's metal casing. The metal casing transfer robotic arm 2 is responsible for gripping the metal casing and feeding it into the metal casing dispensing equipment 1 for dispensing, and then into the heat sealing assembly 5 for heat sealing. The metal casing dispensing equipment 1 adopts a high-precision dispensing system equipped with an adjustable dispensing head, which can precisely control the glue dispensing volume and dispensing position according to the dispensing requirements of different models of laptop metal casings. The dispensing equipment is equipped with a glue storage tank and a delivery pipeline, and the glue is delivered to the dispensing head by a pressure pump. In this dispensing and heat sealing equipment, during the dispensing stage: the laptop metal casing is transported to the designated position by the conveyor belt structure 3, the metal casing transfer robotic arm 2 grips the metal casing and places it on the worktable of the metal casing dispensing equipment 1, and the dispensing equipment performs the dispensing operation on the metal casing according to preset parameters. During the heat sealing stage: after the dispensing is completed, the metal casing transfer robotic arm 2 grips the metal casing and places it on the heat sealing assembly 5, and the heat sealing assembly 5 performs heat sealing processing on the metal casing. Cooling Stage: After heat sealing, the thermoelectric cooler 10 starts working, generating cold air. The micro-fan structure 13 blows the cold air onto the heat-sealed metal casing. The heat dissipation assembly 11 dissipates heat from the heat dissipation surface of the thermoelectric cooler 10, ensuring its stable operation. Unloading Stage: After cooling, the metal casing transfer robot arm 2 picks up the metal casing from the heat sealing assembly 5 and places it back onto the conveyor belt structure 3. The conveyor belt structure 3 then transports the processed metal casing to the next process.

[0026] like Figure 1 , Figure 2As shown, the heat-sealing assembly 5 includes a guide rod 501. The guide rod 501 is fixedly connected to the top surface of the processing table 4, and a top plate 502 is fixedly connected to the top surface of the guide rod 501. A cylinder 503 is installed on the top plate 502, and the telescopic rod of the cylinder 503 is fixedly connected to an upper heat-sealing module 504. The upper heat-sealing module 504 is slidably connected to the guide rod 501. A lower placement platform 505 is fixedly connected to the top surface of the processing table 4. Specifically, the heat-sealing assembly 5 is configured to perform heat-sealing processing on the metal casing of a laptop computer that has been glued. The telescopic rod of the cylinder 503 extends, pushing the upper heat-sealing module 504 downward along the guide rod 501 until it is tightly bonded to the metal casing on the lower placement platform 505. At the same time, the heating tube inside the upper heat-sealing module 504 starts heating, rapidly raising the temperature of the upper heat-sealing module 504 to the preset heat-sealing temperature and maintaining it for a period of time, allowing the glue on the metal casing to fully melt and achieve heat sealing. After the heat sealing is completed, the control system issues a command, the telescopic rod of cylinder 503 retracts, and drives the upper heat sealing module 504 to move upward along the guide rod 501 and return to the initial position.

[0027] like Figure 3 , Figure 4 As shown, the ventilation component 7 includes a ventilation hole 701. The ventilation hole 701 is provided on the side of the connecting cover 6, and the air inlet 702 is provided on the top surface of the connecting cover 6. Specifically, the ventilation component 7 is provided for ventilation inside the connecting cover 6. The ventilation hole 701 works with the heat dissipation component 11 to dissipate heat from the semiconductor cooler 10. The air inlet 702 allows external air to be introduced into the connecting cover 6 when the micro fan structure 13 is running, so that cold air can be continuously and effectively blown onto the surface of the heat-sealed metal shell through the air outlet 8, accelerating the cooling speed of the metal shell.

[0028] like Figure 4 As shown, the heat dissipation assembly 11 includes heat dissipation fins 1101. The heat dissipation surface of the thermoelectric cooler 10 is provided with heat dissipation fins 1101. A fixing block 1102 is fixedly connected to the surface of the fixing rod 9, and a micro fan structure 1103 is fixedly connected to the surface of the fixing block 1102. Specifically, the heat dissipation assembly 11 enables the thermoelectric cooler 10 to operate stably. When the thermoelectric cooler 10 is working, the heat generated on the heat dissipation surface is quickly conducted to the heat dissipation fins 1101 through thermally conductive silicone. Due to the large surface area of ​​the heat dissipation fins 1101, the heat is quickly dispersed to the fin surface. The micro fan structure 1103 is activated, and the blown air is directed vertically towards the heat dissipation fins 1101, accelerating the airflow between the fins. The flowing air continuously carries away the heat from the fin surface, allowing the heat to be discharged from the connecting cover 6 with the air, achieving convection cooling.

[0029] like Figure 4As shown, there are multiple micro fan structures 2 13, and the multiple micro fan structures 2 13 are distributed in a linear array on the surface of the fixed rod 2 12; specifically, multiple micro fans work together, which can provide a larger ventilation volume compared to a single fan. At this time, the cold air can be blown more effectively onto the surface of the metal shell, and the cooling process can be carried out more quickly.

[0030] like Figure 2 As shown, the connecting cover 6 is a detachable structure, connected to the processing table 4 by bolts, which facilitates cleaning and maintenance of the inside of the connecting cover 6. Specifically, when components such as the semiconductor cooler 10 inside the connecting cover 6 malfunction, the connecting cover 6 can be quickly disassembled, allowing maintenance personnel to directly access the internal equipment, facilitating the inspection and replacement of faulty components, effectively shortening maintenance time and improving equipment availability. At the same time, when there is a lot of dust inside the connecting cover 6, it can be easily disassembled for cleaning.

[0031] In summary: Equipment operation process: The laptop's metal casing is transported to the designated position via conveyor belt structure 3. The metal casing transfer robotic arm 2 picks up the metal casing and sends it into the metal casing dispensing device 1 for dispensing. After dispensing, the metal casing transfer robotic arm 2 picks up the metal casing again and places it on the lower placement platform 505 of the heat sealing assembly 5. Cylinder 503 drives the upper heat sealing module 504 to move downwards, contacting the metal casing on the lower placement platform 505 and performing a heat sealing operation. After heat sealing is completed, cylinder 503 drives the upper heat sealing module 504 to rise and reset. Cooling process: Cold air enters the connecting cover 6 through ventilation holes 701. The semiconductor cooler 10 is powered on and cools the air in the connecting cover 6. The heat dissipation fins 1101 and the micro fan structure 1103 dissipate the heat generated by the semiconductor cooler 10, ensuring its stable operation. The micro fan structure 2 13 blows the cold air generated by the semiconductor cooler 10 out through the air outlet 8 and onto the heat-sealed metal shell to achieve rapid cooling of the metal shell.

[0032] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claimed utility model. The scope of protection of this utility model is defined by the appended claims and their equivalents.

Claims

1. A dispensing and hot pressing device for processing metal casings of laptops, characterized in that, The device includes a metal shell dispensing device (1), a metal shell transfer robotic arm (2), a conveyor belt structure (3), and a processing table (4). The top surface of the processing table (4) is provided with a heat sealing component (5) for heat sealing after dispensing the metal shell. A connecting cover (6) is fixedly connected to the top surface of the processing table (4). A ventilation component (7) is provided on the surface of the connecting cover (6). An air outlet (8) is opened on the surface of the connecting cover (6). A fixing rod (9) is fixedly connected to the inner wall of the connecting cover (6). A semiconductor cooler (10) is fixedly connected to the surface of the fixing rod (9). A heat dissipation component (11) for heat dissipation of the semiconductor cooler (10) is provided on the heat dissipation surface of the semiconductor cooler (10) and the surface of the fixing rod (9). A fixing rod (12) is fixedly connected to the inner wall of the connecting cover (6). A micro fan structure (13) is fixedly connected to the surface of the fixing rod (12).

2. The dispensing and hot pressing equipment for processing metal casings of laptops according to claim 1, characterized in that, The heat sealing assembly (5) includes a guide rod (501). The top surface of the processing table (4) is fixedly connected to the guide rod (501). The top surface of the guide rod (501) is fixedly connected to a top plate (502). A cylinder (503) is provided on the top plate (502). The telescopic rod of the cylinder (503) is fixedly connected to an upper heat sealing module (504), and the upper heat sealing module (504) is slidably connected to the guide rod (501). The top surface of the processing table (4) is fixedly connected to a lower placement platform (505).

3. The dispensing and hot pressing equipment for processing metal casings of laptops according to claim 1, characterized in that, The ventilation assembly (7) includes a ventilation hole (701), the side of the connecting cover (6) is provided with a ventilation hole (701), and the top surface of the connecting cover (6) is provided with an air inlet (702).

4. The dispensing and hot pressing equipment for processing metal casings of laptops according to claim 1, characterized in that, The heat dissipation assembly (11) includes heat dissipation fins (1101), the heat dissipation surface of the semiconductor cooler (10) is provided with heat dissipation fins (1101), the surface of the fixing rod (9) is fixedly connected with a fixing block (1102), and the surface of the fixing block (1102) is fixedly connected with a micro fan structure (1103).

5. The dispensing and hot pressing equipment for processing metal casings of laptops according to claim 1, characterized in that, There are multiple miniature fan structures (13), and the multiple miniature fan structures (13) are distributed in a linear array on the surface of the fixing rod (12).

6. The dispensing and hot pressing equipment for processing metal casings of laptops according to claim 1, characterized in that, The connecting cover (6) is a detachable structure and is connected to the processing table (4) by bolts, which facilitates cleaning and maintenance of the inside of the connecting cover (6).

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