Chopping board laser marking device

Abstract

The utility model relates to the technical field of chopping board processing, in particular to a chopping board laser marking device which comprises a first supporting plate and a second supporting plate, an L-shaped limiting plate used for limiting a rectangular chopping board is arranged on the first supporting plate, and a semi-arc-shaped limiting plate used for limiting a round chopping block is arranged on the second supporting plate. The first supporting plate and the second supporting plate are moved to the position under the laser marking device, and therefore the device can be suitable for limiting a round chopping board and a rectangular chopping board.

Description

Technical Field

[0001] This utility model relates to the field of cutting board processing technology, and in particular to a cutting board laser marking device. Background Technology

[0002] In existing technology, cutting boards are marked with product information and patterns using laser marking after production. Cutting boards are divided into round cutting boards and rectangular cutting boards. When existing equipment uses laser devices to limit the cutting board, it can only limit one type of cutting board, either round or rectangular. Therefore, there is an urgent need for a cutting board laser marking device that can limit the cutting board for both round and rectangular cutting boards. Utility Model Content

[0003] The technical problem to be solved by this utility model is to provide a cutting board laser marking device that can be used for limiting the position of round cutting boards and rectangular cutting boards.

[0004] To solve the above-mentioned technical problems, the technical solution adopted by this utility model is: a laser marking device for cutting boards, comprising:

[0005] Workbench;

[0006] A first support plate is movably connected to the worktable along the X direction or in the opposite direction of the X direction, and the first support plate is provided with a number of first through holes.

[0007] The first driving component is used to drive the first support plate to move.

[0008] The L-shaped limiting plate is locked to the first through hole by bolts and is used to limit the two adjacent sides of the rectangular cutting board.

[0009] The second support plate is located opposite the first support plate in the X direction. The second support plate is provided with three second through holes, which are arranged in a semi-circular shape.

[0010] A semi-circular limiting plate is bolted to the second through hole to limit the outer circumference of the circular chopping block.

[0011] The second driving component is used to drive the second support plate to move.

[0012] A laser marking device is located above the worktable;

[0013] The first driving component and the second driving component are used to drive the first support plate and the second support plate to switch between the first state and the second state.

[0014] In the first state, the first support plate is located directly below the laser marking device, and the second support plate is located on the opposite side of the first support plate in the X direction.

[0015] In the second state, the second support plate is located directly below the laser marking device, and the first support plate is located on the X-direction side of the second support plate.

[0016] Furthermore, several first through holes are arranged in a rectangular array on the first support plate.

[0017] Furthermore, three second through holes are arranged in an array along the Y direction.

[0018] Furthermore, a limiting groove is provided on the worktable. The first driving component is a first cylinder, and the second driving component is a second cylinder. A guide rail along the X-direction is provided in the limiting groove. The cylinder body of the first cylinder is connected to one side of the worktable in the X-direction. A first slider is provided on the first support plate. The first slider is connected to the cylinder body of the first cylinder and is slidably connected to the guide rail. The cylinder body of the second cylinder is connected to the opposite side of the worktable in the X-direction. A second slider is provided on the second support plate. The second slider is connected to the cylinder body of the second cylinder. The cylinder bodies of the first cylinder and the second cylinder are axially aligned in the X-direction.

[0019] Furthermore, a third cylinder is provided in the limiting groove. The cylinder body of the third cylinder is vertical, and a third support plate is provided on the piston rod of the third cylinder. The third support plate is located directly below the laser marking device.

[0020] Furthermore, a dust extraction pipe is also installed on the workbench.

[0021] The beneficial effects of this utility model are as follows: When it is necessary to laser mark a rectangular cutting board, the first driving component drives the first support plate to move, so that the first support plate is located directly below the laser marking device. Then, the rectangular cutting board is manually placed on the first support plate, and the L-shaped limiting plate limits the rectangular cutting board. When it is necessary to laser mark a round chopping block, the second driving component drives the second support plate to move, so that the second support plate is located directly below the laser marking device. Then, the round chopping block is manually placed on the second support plate, so that the semi-circular limiting plate fits and limits the outer circumference of the round chopping block. Compared with the prior art, one device can be used to limit the chopping blocks and rectangular cutting boards. Attached Figure Description

[0022] Figure 1 This is a schematic diagram of the structure of a cutting board laser marking device according to a specific embodiment of the present invention;

[0023] Figure 2 This is a front view of a cutting board laser marking device according to a specific embodiment of the present invention;

[0024] Figure 3 This is a schematic diagram of the structure of L-shaped limiting plates and semi-circular limiting plates of different specifications in a laser marking device for cutting boards according to a specific embodiment of this utility model.

[0025] Label Explanation

[0026] 1. Workbench; 11. Limiting groove; 111. Guide rail; 112. Third cylinder; 1121. Third support plate; 12. Dust suction pipe;

[0027] 2. First support plate; 21. First through hole; 22. First slider;

[0028] 3. First driving component;

[0029] 4. L-shaped limiting plate;

[0030] 5. Second support plate; 51. Second through hole; 52. Second slider;

[0031] 6. Semi-circular limiting plate;

[0032] 7. Second driving component;

[0033] 8. Laser marking device. Detailed Implementation

[0034] To explain in detail the technical content, objectives, and effects of this utility model, the following description is provided in conjunction with the embodiments and accompanying drawings.

[0035] Please refer to Figures 1 to 3 A laser marking device for cutting boards, comprising:

[0036] Workbench 1;

[0037] The first support plate 2 is movably connected to the workbench 1 along the X direction or in the opposite direction of the X direction, and the first support plate 2 is provided with a plurality of first through holes 21.

[0038] The first driving component 3 is used to drive the first support plate 2 to move.

[0039] L-shaped limiting plate 4, L-shaped limiting plate 4 is locked to the first through hole 21 by bolts, used to limit the two adjacent sides of the rectangular cutting board;

[0040] The second support plate 5 is located opposite to the first support plate 2 in the X direction. The second support plate 5 is provided with three second through holes 51, which are arranged in a semi-arc shape.

[0041] The semi-circular limiting plate 6 is locked to the second through hole 51 by bolts and is used to limit the outer circumference of the circular chopping block.

[0042] The second driving component 7 is used to drive the second support plate 5 to move.

[0043] Laser marking device 8 is located above worktable 1;

[0044] The first driving component 3 and the second driving component 7 are used to drive the first support plate 2 and the second support plate 5 to switch between the first state and the second state.

[0045] In the first state, the first support plate 2 is located directly below the laser marking device 8, and the second support plate 5 is located on the opposite side of the first support plate 2 in the X direction.

[0046] In the second state, the second support plate 5 is located directly below the laser marking device 8, and the first support plate 2 is located on the X-direction side of the second support plate 5.

[0047] In the above embodiments, when it is necessary to laser mark a rectangular cutting board, the first driving component 3 drives the first support plate 2 to move, so that the first support plate 2 is located directly below the laser marking device 8. Then, the rectangular cutting board is manually placed on the first support plate 2, and the L-shaped limiting plate 4 limits the rectangular cutting board. When it is necessary to laser mark a round chopping block, the second driving component 7 drives the second support plate 5 to move, so that the second support plate 5 is located directly below the laser marking device 8. Then, the round chopping block is manually placed on the second support plate 5, so that the semi-circular limiting plate 6 fits and limits the outer circumference of the round chopping block. Compared with the prior art, the limiting of round chopping blocks and rectangular cutting boards can be applied by one device.

[0048] As an optional implementation, a plurality of first through holes 21 are arranged in a rectangular array on the first support plate 2.

[0049] In the above embodiments, by selecting an L-shaped limiting plate 4 of appropriate length, it can be applied to rectangular cutting boards of different sizes.

[0050] As an alternative implementation, the three second through holes 51 are arranged in an array along the Y direction.

[0051] In the above embodiments, by arranging the three second through holes 51 in an array along the Y direction, it is possible to adapt to circular chopping blocks of different radii.

[0052] As an optional implementation, the workbench 1 is provided with a limiting groove 11, the first driving member 3 is a first cylinder, the second driving member 7 is a second cylinder, the limiting groove 11 is provided with a guide rail 111 along the X direction, the cylinder body of the first cylinder is connected to one side of the workbench 1 in the X direction, the first support plate 2 is provided with a first slider 22, the first slider 22 is connected to the cylinder body of the first cylinder, the first slider 22 is slidably connected to the guide rail 111, the cylinder body of the second cylinder is connected to the opposite side of the workbench 1 in the X direction, the second support plate 5 is provided with a second slider 52, the second slider 52 is connected to the cylinder body of the second cylinder, and the cylinder bodies of the first cylinder and the second cylinder are axially uniformly in the X direction.

[0053] In the above embodiments, by setting the guide rail 111, the first cylinder, the second cylinder, the first slider 22 and the second slider 52, the stability of the movement of the first support plate 2 and the second support plate 5 can be further increased.

[0054] As an optional implementation, a third cylinder 112 is provided in the limiting groove 11. The cylinder body axis of the third cylinder 112 is vertical. A third support plate 1121 is provided on the piston rod of the third cylinder 112. The third support plate 1121 is located directly below the laser marking device 8.

[0055] In the above embodiments, the third support plate 1121 can provide support for the first support plate 2 in the first state and the second support plate 5 in the second state, thereby ensuring the stability of the laser marking.

[0056] As an optional implementation, the workbench 1 is also equipped with a dust extraction pipe 12.

[0057] In the above embodiments, by connecting the exhaust device to the dust extraction pipe 12, the wood chips and white smoke generated by the laser marking device 8 when laser marking on the cutting board can be sucked away.

[0058] The above description is merely an embodiment of this utility model and does not limit the patent scope of this utility model. Any equivalent modifications made based on the content of this utility model specification and drawings, or direct or indirect applications in related technical fields, are similarly included within the patent protection scope of this utility model.

Claims

1. A laser marking device for a cutting board, characterized in that, include: Workbench; A first support plate is movably connected to the worktable along the X direction or in the opposite direction of the X direction, and the first support plate is provided with a number of first through holes. The first driving component is used to drive the first support plate to move. The L-shaped limiting plate is locked to the first through hole by bolts and is used to limit the two adjacent sides of the rectangular cutting board. The second support plate is located opposite the first support plate in the X direction. The second support plate is provided with three second through holes, which are arranged in a semi-circular shape. A semi-circular limiting plate is bolted to the second through hole to limit the outer circumference of the circular chopping block. The second driving component is used to drive the second support plate to move. A laser marking device is located above the worktable; The first driving component and the second driving component are used to drive the first support plate and the second support plate to switch between the first state and the second state. In the first state, the first support plate is located directly below the laser marking device, and the second support plate is located on the opposite side of the first support plate in the X direction. In the second state, the second support plate is located directly below the laser marking device, and the first support plate is located on the X-direction side of the second support plate.

2. The cutting board laser marking device according to claim 1, characterized in that, Several first through holes are arranged in a rectangular array on the first support plate.

3. The cutting board laser marking device according to claim 1, characterized in that, Three second through holes are arranged in an array along the Y direction.

4. The cutting board laser marking device according to claim 1, characterized in that, The worktable is provided with a limiting groove. The first driving component is a first cylinder, and the second driving component is a second cylinder. A guide rail along the X direction is provided in the limiting groove. The cylinder body of the first cylinder is connected to one side of the worktable in the X direction. A first slider is provided on the first support plate. The first slider is connected to the cylinder body of the first cylinder and is slidably connected to the guide rail. The cylinder body of the second cylinder is connected to the opposite side of the worktable in the X direction. A second slider is provided on the second support plate. The second slider is connected to the cylinder body of the second cylinder. The cylinder bodies of the first cylinder and the second cylinder are axially aligned in the X direction.

5. The cutting board laser marking device according to claim 4, characterized in that, A third cylinder is installed in the limiting groove. The cylinder body of the third cylinder is vertical. A third support plate is installed on the piston rod of the third cylinder. The third support plate is located directly below the laser marking device.

6. The cutting board laser marking device according to claim 1, characterized in that, The workbench is also equipped with a dust extraction pipe.

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