Polishing device for wafer processing

Abstract

The utility model provides a polishing device for wafer processing, which comprises a wafer rotating disc and a driving mechanism, the wafer rotating disc is used for placing a wafer, the driving mechanism comprises a swing motor unit and a fixed frame connected with the swing motor unit, and the fixed frame is used for equipping a polishing clamp in contact connection with the wafer; a rocker arm is arranged on the swing motor unit, a limiting rod and a guide rod are arranged on the rocker arm, a locking hole and a guide hole of the limiting rod and the guide rod are formed in the side, away from the grinding clamp, of the fixing frame, and the fixing frame is embedded in the limiting rod and the guide rod through the locking hole and the guide hole; a locking piece is further arranged in the fixing frame and abuts against the portion, penetrating through the locking hole, of the side wall of the limiting rod. The fixing frame is movably connected with the rocker arm, and the height of the fixing frame can be conveniently adjusted with the help of the supporting nut and the locking piece.

Description

Technical Field

[0001] This utility model belongs to the field of grinding and processing technology, and in particular relates to a grinding device for wafer processing. Background Technology

[0002] The wafer processing often requires grinding the wafer surface. In existing technology, grinding and polishing equipment is used to grind the wafer. This grinding and polishing equipment mainly consists of grinding fixtures, a carrier turntable, and a fixed support for assembling the grinding fixtures. In order to improve the processing effect, a rotary swinging device is also used to swing the fixed support.

[0003] In the existing technology, the fixed support and the rotating swinging device are connected by a fixed structure. When the height of the fixed support needs to be adjusted during the processing, the entire rotating swinging device usually needs to be adjusted, which is inconvenient to operate and makes it difficult to adjust the height of the fixed support. Utility Model Content

[0004] This utility model provides a grinding device for wafer processing, which aims to solve the problem that when the height of the fixed support needs to be adjusted during the current processing, it is usually necessary to adjust the entire rotating and swinging device, which is inconvenient to operate and the height of the fixed support is not easy to adjust.

[0005] This invention is implemented as follows: a grinding device for wafer processing, comprising:

[0006] A wafer turntable and a drive mechanism for placing wafers, the drive mechanism including a swing motor unit and a fixed frame, the fixed frame being used to equip a grinding fixture that contacts and connects with the wafer;

[0007] The rocking motor unit is provided with a rocker arm, the rocker arm is provided with a limiting rod and a guide rod, and the fixing frame is provided with a locking hole and a guide hole on the side away from the grinding fixture, and the fixing frame is nested in the limiting rod and the guide rod through the locking hole and the guide hole;

[0008] The mounting bracket is also equipped with a locking element, which abuts against the side wall of the limiting rod that passes through the locking hole. When it is necessary to change the distance between the mounting bracket and the wafer rotating disk, the locking element and the limiting rod are locked in position by raising or lowering them.

[0009] Preferably, the outer wall of the limiting rod is threaded, and the limiting rod is also provided with a support nut. When the height of the fixing frame is adjusted, the support nut is rotated to support the end face of the fixing frame near the wafer rotating disk.

[0010] Preferably, the number of limiting rods is two sets, and the limiting rods and guide rods form a triangular structure.

[0011] Preferably, the locking component includes a locking bolt and a U-shaped rod. The fixing frame has a sliding cavity, the U-shaped rod is disposed in the sliding cavity, and a sliding guide groove is provided between the sliding cavity and the locking hole. The two ends of the U-shaped rod extend from the sliding guide groove to different locking holes.

[0012] Preferably, the sliding cavity is further provided with a threaded hole that communicates with the outside. The locking bolt extends from the outside of the fixing frame to the inside of the sliding cavity through the threaded hole and abuts against the end of the U-shaped rod away from the locking hole.

[0013] Preferably, the front end of the U-shaped rod is provided with a rubber pad, and the U-shaped rod is connected to the limiting rod through the rubber pad.

[0014] Preferably, the cross-section of the limiting rod is an arc-shaped structure, and the cross-section of the locking hole is adapted to the cross-section of the limiting rod.

[0015] Compared with the prior art, the embodiments of this application have the following main advantages:

[0016] The wafer processing grinding device provided by this utility model uses a movable connection between the fixed frame and the rocker arm, and is locked with the help of the support nut and locking component. When it is necessary to adjust the height of the fixed frame, no complicated adjustment is required. The fixed position of the fixed frame, the limiting rod and the guide rod can be directly changed, thereby realizing convenient adjustment of the height of the fixed frame. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the structure of a grinding device for wafer processing provided by this utility model.

[0018] Figure 2 This is a schematic diagram of the fixing frame and rocker arm structure of a grinding device for wafer processing provided by this utility model.

[0019] Figure 3 This is a schematic diagram of the sliding cavity structure of a grinding device for wafer processing provided by this utility model.

[0020] Figure 4 This is a schematic diagram of the locking component and the limiting rod in a wafer processing grinding device provided by this utility model.

[0021] Figure 5 This is a schematic diagram of the locking component structure of a grinding device for wafer processing provided by this utility model.

[0022] Explanation of reference numerals in the attached figures:

[0023] 101. Wafer rotating disk; 102. Grinding fixture; 103. Rocking motor unit; 200. Fixture; 201. Locking hole; 202. Guide hole; 203. Sliding cavity; 210. Transmission guide wheel; 220. Locking element; 221. Locking bolt; 222. U-shaped rod; 223. Rubber pad; 230. Support nut; 300. Rocker arm; 310. Limiting rod; 320. Guide rod. Detailed Implementation

[0024] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs; the terminology used herein in the specification of the application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application; the terms "comprising" and "having," and any variations thereof, in the specification, claims, and foregoing drawings of this application are intended to cover non-exclusive inclusion. The terms "first," "second," etc., in the specification, claims, or foregoing drawings of this application are used to distinguish different objects, not to describe a particular order.

[0025] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0026] This utility model provides a grinding device for wafer processing, such as... Figures 1-5 As shown, the wafer processing grinding apparatus includes:

[0027] A wafer turntable 101 for placing wafers and a drive mechanism are provided. The drive mechanism includes a rocking motor unit 103 and a fixed frame 200. The fixed frame 200 is used to equip a grinding fixture 102 that contacts and connects to the wafer. The wafer turntable 101 supports the wafer to be processed. The wafer turntable 101 is usually driven by a rotating device to rotate. The grinding fixture 102 is driven by a drive device on the fixed frame 200. The transmission is mainly achieved by the friction between the transmission guide wheel 210 on the fixed frame 200 and the grinding fixture 102. The grinding disc on the grinding fixture 102 rotates under the transmission action to complete the processing of the wafer surface. The rocking motor unit 103 is equipped with a rocker arm 300 connected to the fixed frame 200. The rocking motor unit 103 is powered by a rocking motor, and the rocker arm 300 pulls the fixed frame 200 to rock, thereby changing the position of the grinding area of ​​the grinding fixture 102.

[0028] The working principle of the wafer turntable 101, the grinding fixture 102, and the rocking motor unit 103 is the same as that of the prior art. The assembly and transmission principle of the grinding fixture 102 and the fixed frame 200 are described in detail here. Those skilled in the art can refer to the structure of existing grinding equipment. The rocker arm 300 in this application is provided with a limiting rod 310 and a guide rod 320. The fixed frame 200 is provided with a locking hole 201 and a guide hole 202 on the side away from the grinding fixture 102. The fixed frame 200 is nested in the limiting rod 310 and the guide rod 320 through the locking hole 201 and the guide hole 202. The fixed frame 200 is also provided with a locking member 220. The locking member 220 abuts against the side wall of the limiting rod 310 that passes through the locking hole 201. When it is necessary to change the distance between the fixed frame 200 and the wafer turntable 101, the locking member 220 is raised or lowered to lock the position with the limiting rod 310.

[0029] In this application, the outer wall of the limiting rod 310 is threaded, and the limiting rod 310 is also provided with a support nut 230. When the height of the fixing frame 200 is adjusted, the support nut 230 is rotated to support the end face of the fixing frame 200 near the wafer rotating disk 101. There are two sets of limiting rods 310. The limiting rods 310 and the guide rod 320 form a triangular structure. The movable connection between the fixing frame 200 and the rocker arm 300 is locked with the help of the support nut 230 and the locking member 220. In actual application, when the height of the fixing frame 200 needs to be adjusted, there is no need to make complicated adjustments. The fixed position of the fixing frame 200, the limiting rod 310 and the guide rod 320 can be changed directly to realize the height adjustment of the fixing frame 200. Here, double fixing is adopted to ensure sufficient connection strength while realizing convenient adjustment.

[0030] In a preferred embodiment of this invention, the limiting rods 310 are in two sets. The locking element 220 includes a locking bolt 221 and a U-shaped rod 222. The fixing frame 200 has a sliding cavity 203. The U-shaped rod 222 is disposed in the sliding cavity 203. A sliding guide groove is provided between the sliding cavity 203 and the locking hole 201. The two ends of the U-shaped rod 222 extend from the sliding guide groove to different locking holes 201. The sliding cavity 203 also has a threaded hole communicating with the outside. The locking bolt 221 extends from the outside of the fixing frame 200 to the inside of the sliding cavity 203 through the threaded hole and abuts against the end of the U-shaped rod 222 away from the locking hole 201.

[0031] In this embodiment, the front end of the U-shaped rod 222 is provided with a rubber pad 223, and the U-shaped rod 222 is in contact with the limiting rod 310 through the rubber pad 223; the limiting rod 310 is laterally locked by a locking member 220.

[0032] In a preferred embodiment of this invention, the limiting rod 310 has an arc-shaped cross-section, and the locking hole 201 has a cross-section that matches the limiting rod 310. The arc-shaped structure of the limiting rod 310 enhances the resistance of the fixing frame 200 to the torque of the swaying motion. The support nut 230 provides overall support for the fixing frame 200, reducing the torque required for the lateral fixing of the locking member 220. In actual adjustment, after position adjustment, the locking member 220 is locked, and then the support nut 230 is rotated to adjust the height, so that the support nut 230 supports the end face of the fixing frame 200 near the wafer rotating disk 101. In the initial state, the support nut 230 is as far away from the fixing frame 200 as possible, and the locking member 220 is far away from the limiting rod 310, to avoid interference between the support nut 230 and the locking member 220 on the height adjustment.

[0033] The rubber pad 223 is made of wear-resistant silicone or rubber material to increase the fixing effect of the U-shaped rod 222 on the limiting rod 310. The guide rod 320 mainly distributes the torque of the swinging motion to prevent the limiting rod 310 from bearing excessive pressure.

[0034] It should be noted that, for the sake of simplicity, the foregoing embodiments are all described as a series of actions. However, those skilled in the art should understand that the present invention is not limited to the described order of actions, as some steps may be performed in other orders or simultaneously according to the present invention. Furthermore, those skilled in the art should also understand that the embodiments described in the specification are preferred embodiments, and the actions and modules involved are not necessarily essential to the present invention.

[0035] The above embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit the scope of protection of this utility model. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on these embodiments, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model. Although this utility model has been described in detail with reference to the above embodiments, those skilled in the art can still combine, add, delete, or otherwise adjust the features of the various embodiments of this utility model according to the circumstances without conflict or creative effort, thereby obtaining different technical solutions that do not fundamentally depart from the concept of this utility model. These technical solutions are also within the scope of protection of this utility model.

Claims

1. A grinding apparatus for wafer processing, characterized in that, include: A wafer turntable (101) for placing wafers and a drive mechanism, the drive mechanism including a rocking motor unit (103) and a fixed frame (200) for equipping a grinding fixture (102) that contacts and connects to the wafer; The rocking motor unit (103) is provided with a rocker arm (300), the rocker arm (300) is provided with a limiting rod (310) and a guide rod (320), the fixing frame (200) is provided with a locking hole (201) and a guide hole (202) for the limiting rod (310) and the guide rod (320) on the side away from the grinding fixture (102), and the fixing frame (200) is nested in the limiting rod (310) and the guide rod (320) through the locking hole (201) and the guide hole (202); The fixing frame (200) is also provided with a locking member (220), which abuts against the side wall of the limiting rod (310) inside the through locking hole (201). When it is necessary to change the distance between the fixing frame (200) and the wafer rotating disk (101), the locking member (220) and the limiting rod (310) are locked in position by raising or lowering.

2. The wafer grinding apparatus as described in claim 1, characterized in that, The outer wall of the limiting rod (310) is threaded, and the limiting rod (310) is also provided with a support nut (230). When the height of the fixing frame (200) is adjusted, the support nut (230) is rotated to support the end face of the fixing frame (200) close to the wafer rotating disk (101).

3. The wafer grinding apparatus as described in claim 2, characterized in that, The number of limiting rods (310) is two sets, and the limiting rods (310) and guide rods (320) form a triangular structure.

4. The wafer grinding apparatus as described in claim 3, characterized in that, The locking component (220) includes a locking bolt (221) and a U-shaped rod (222). The fixing frame (200) has a sliding cavity (203). The U-shaped rod (222) is disposed in the sliding cavity (203). A sliding guide groove is provided between the sliding cavity (203) and the locking hole (201). The two ends of the U-shaped rod (222) extend from the sliding guide groove to different locking holes (201).

5. The wafer grinding apparatus as described in claim 4, characterized in that, The sliding cavity (203) is also provided with a threaded hole that communicates with the outside. The locking bolt (221) extends from the outside of the fixing frame (200) to the inside of the sliding cavity (203) through the threaded hole and abuts against the end of the U-shaped rod (222) away from the locking hole (201).

6. The wafer grinding apparatus as described in claim 5, characterized in that, The front end of the U-shaped rod (222) is provided with a rubber pad (223), and the U-shaped rod (222) is connected to the limiting rod (310) through the rubber pad (223).

7. The wafer grinding apparatus as described in claim 6, characterized in that, The cross-section of the limiting rod (310) is an arc-shaped structure, and the cross-section of the locking hole (201) is adapted to the cross-section of the limiting rod (310).

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