Retaining ring for CMP (chemical mechanical polishing)

Abstract

The utility model relates to the technical field of CMP grinding assembly shaking research and development, and discloses a retaining ring for CMP grinding, which comprises a base, one end of the base is fixedly connected with a retainer ring, the outer side of the retainer ring is inserted with a cleaning assembly, the other end of the base is fixedly connected with an adjusting assembly, and the adjusting assembly is inserted into the retainer ring. The cleaning assembly comprises a plurality of sets of dovetail buckles inserted into the outer side of the check ring, and a cleaning ring is fixedly connected to one sides of the multiple sets of dovetail buckles. According to the retaining ring for CMP grinding, through the arrangement of the cleaning assembly, when the retaining ring is used, a cleaning ring is fixed, and rapid assembly is completed through buckle meshing, when the retaining ring rotates or moves, the cleaning ring fixed to the retaining ring rotates, a brush on the cleaning ring is driven to clean and wipe a machined wafer, and the cleaning ring is not prone to falling off. And the brush moves and rotates to clean chips on the surface of the wafer, so that the chips are prevented from being mixed into a polishing solution in the subsequent grinding process to cause scratches or other defects on the surface of the wafer, and the grinding effect of the wafer is improved.

Description

Technical Field

[0001] This utility model relates to the field of CMP grinding component shaking research and development technology, and in particular to a retaining ring for CMP grinding. Background Technology

[0002] Chemical mechanical polishing (CMP) is a key process in semiconductor manufacturing used to achieve global planarization of the wafer surface. This technology eliminates non-uniform topological structures on the wafer surface through the synergistic effect of chemical etching and mechanical grinding, thereby meeting the extremely high surface flatness requirements of processes such as multilayer interconnects and shallow trench isolation.

[0003] Existing technologies require extremely high flatness of the wafer surface during the polishing process. The debris generated during polishing is mixed into the polishing slurry during subsequent grinding, which can cause scratches or other defects on the wafer surface. It is necessary to clean the debris and water stains on the surface in a timely manner. Therefore, a retaining ring for CMP polishing is proposed. Utility Model Content

[0004] (a) Technical problems to be solved

[0005] The technical problem solved by this utility model is to provide a retaining ring for CMP polishing that is highly practical, easy to operate, and has a simple structure. This solves the problem mentioned in the background art where there are extremely high requirements for the flatness of the wafer surface. In the subsequent polishing process, the debris generated during polishing is mixed into the polishing fluid, which causes scratches or other defects on the wafer surface. It is necessary to clean the debris and water stains on the surface in a timely manner.

[0006] (II) Technical Solution

[0007] To achieve the above objectives, this utility model provides the following technical solution: a retaining ring for CMP grinding, comprising a base, a retaining ring fixedly connected to one end of the base, a cleaning component inserted into the outer side of the retaining ring, and an adjusting component fixedly connected to the other end of the base. The cleaning component includes several sets of dovetail buckles inserted into the outer side of the retaining ring, a cleaning ring fixedly connected to one side of each set of dovetail buckles, and a brush fixedly connected to the upper side of the cleaning ring. The adjusting component includes a telescopic rod fixedly connected to the other end of the base, several sets of springs nested around the telescopic rod, and an elastic washer fixedly connected to the other end of the telescopic rod.

[0008] As a further embodiment of this utility model, the upper end of the retaining ring is provided with several sets of liquid flow grooves, and one side of the retaining ring is provided with several sets of first slots. The slots enable quick replacement of the cleaning components.

[0009] As a further embodiment of this utility model, a protective cover is provided on the outer side of the base, and a rubber ring is fixedly connected to the top of the protective cover. The protective cover serves to prevent liquid from splashing.

[0010] As a further embodiment of this utility model, the outer side of the protective cover is provided with several sets of drainage holes, and the outer side of the base is provided with several sets of air holes. The air holes serve to exhaust air.

[0011] As a further embodiment of this utility model, the lower end of the elastic gasket is fixedly connected with several sets of quick-locking pins, and the other end of the several sets of quick-locking pins is inserted with a fixing ring. The quick-locking pins enable quick replacement of the base.

[0012] As a further embodiment of this utility model, a plurality of second slots are provided on the upper side of the fixing ring, and a sealing ring is fixedly connected to the upper side of the fixing ring. The sealing ring serves to block liquid.

[0013] As a further embodiment of this utility model, one end of the retaining ring is provided with an internal thread, and one end of the base is provided with an external thread. The combination of internal and external threads enables quick replacement of the retaining ring.

[0014] (III) Beneficial Effects

[0015] This invention provides a retaining ring for CMP grinding, which has the following advantages:

[0016] 1. This retaining ring for CMP grinding, through the setting of the cleaning component, fixes the cleaning ring during use and is quickly assembled by snap-fit ​​engagement. When the retaining ring rotates or moves, the cleaning ring fixed on the retaining ring rotates, driving the brush on the cleaning ring to clean and wipe the processed wafer. The brush moves and rotates to clean the debris on the surface of the wafer, preventing the debris from mixing into the polishing fluid during subsequent grinding, which would cause scratches or other defects on the wafer surface, thereby improving the grinding effect of the wafer.

[0017] 2. This retaining ring for CMP polishing, through the adjustment of the component settings, when the retaining ring presses down on the wafer, the spring will contract. The contraction length of the spring is different depending on the force. At the same time, the telescopic rod nested inside the spring is used to fix the position of the elastic pad and the base, preventing the base and elastic pad from shifting. By adjusting the spring, it can be adapted to the requirements of different polishing processes. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0019] Figure 2 This is a schematic diagram of the fixing ring structure of this utility model;

[0020] Figure 3 This is a schematic diagram of the cleaning component structure of this utility model;

[0021] Figure 4 This is a schematic diagram of the adjustment component structure of this utility model.

[0022] In the diagram: 1. Base; 2. Retaining ring; 3. Cleaning assembly; 301. Dovetail buckle; 302. Cleaning ring; 303. Brush; 4. Adjustment assembly; 401. Telescopic rod; 402. Spring; 403. Elastic washer; 5. Liquid flow channel; 6. First slot; 7. Protective cover; 8. Rubber ring; 9. Drain hole; 10. Air hole; 11. Quick locking pin; 12. Fixing ring; 13. Second slot; 14. Sealing ring. Detailed Implementation

[0023] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present utility model without creative effort are within the scope of protection of the present utility model.

[0024] Please see Figures 1 to 4 This utility model provides a technical solution: a retaining ring for CMP grinding, including a base 1, a retaining ring 2 fixedly connected to one end of the base 1, a cleaning component 3 inserted into the outside of the retaining ring 2, the cleaning component 3 enhances the cleaning effect on the wafer surface, an adjusting component 4 fixedly connected to the other end of the base 1, the adjusting component 4 facilitates the application of different polishing processes, the cleaning component 3 includes several sets of dovetail buckles 301 inserted into the outside of the retaining ring 2, a cleaning ring 302 fixedly connected to one side of the several sets of dovetail buckles 301, a brush 303 fixedly connected to the upper side of the cleaning ring 302; the adjusting component 4 includes a telescopic rod 401 fixedly connected to the other end of the base 1, several sets of springs 402 nested outside the telescopic rod 401, and an elastic pad 403 fixedly connected to the other end of the telescopic rod 401;

[0025] The upper end of the retaining ring 2 is provided with several sets of liquid flow grooves 5, and the side of the retaining ring 2 is provided with several sets of first slots 6. The first slots 6 are designed to facilitate the quick replacement of the cleaning component 3.

[0026] A protective cover 7 is provided on the outer side of the base 1, and a rubber ring 8 is fixedly connected to the top of the protective cover 7. The protective cover 7 is designed to prevent liquid from splashing.

[0027] The outer side of the protective cover 7 is provided with several sets of drainage holes 9, and the outer side of the base 1 is provided with several sets of air holes 10. The air holes 10 are provided to exhaust air.

[0028] The lower end of the elastic pad 403 is fixedly connected with several sets of quick-locking pins 11, and the other end of the several sets of quick-locking pins 11 is inserted with a fixing ring 12. The quick-locking pins 11 enable the quick replacement of the base 1.

[0029] The upper side of the fixing ring 12 is provided with several second slots 13, and a sealing ring 14 is fixedly connected to the upper side of the fixing ring 12. The sealing ring 14 plays a role in blocking liquid.

[0030] One end of the retaining ring 2 is provided with an internal thread, and one end of the base 1 is provided with an external thread. The internal and external threads enable quick replacement of the retaining ring 2.

[0031] In this invention, the working steps of the device are as follows:

[0032] First step: When in use, fix the cleaning ring 302 and quickly assemble it by snap-fit. When the retaining ring rotates or moves, the cleaning ring 302 fixed on the retaining ring rotates, which drives the brush 303 on the cleaning ring 302 to clean and wipe the processed wafer. The brush 303 cleans the debris on the wafer surface by moving and rotating, preventing the debris from being mixed into the polishing fluid in the subsequent grinding process, which would cause scratches or other defects on the wafer surface.

[0033] The second step: When the retaining ring presses down on the wafer, the spring 402 will contract. The contraction length of the spring 402 will vary depending on the force applied. At the same time, the telescopic rod 401 nested inside the spring 402 is used to fix the position of the elastic pad 403 and the base 1 to prevent the base 1 and the elastic pad 403 from shifting.

[0034] It should be noted that the device structure and accompanying drawings of this utility model mainly describe the principle of this utility model. In terms of the technical aspects of this design principle, the setting of the power mechanism, power supply system and control system of the device is not fully described. However, under the premise that those skilled in the art understand the principle of the above utility model, the specific details of its power mechanism, power supply system and control system can be clearly understood. The control method in the application document is automatic control through a controller. The control circuit of the controller can be implemented by those skilled in the art through simple programming.

[0035] All standard parts used can be purchased from the market, and can be customized according to the instructions and drawings. The specific connection methods of each part adopt conventional methods such as bolts, rivets, and welding that are mature in the existing technology. The machinery, parts and equipment adopt conventional models in the existing technology, and the structure and principle of the components known to those skilled in the art can be known by those skilled in the art through technical manuals or conventional experimental methods.

[0036] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A retaining ring for CMP grinding, comprising a base (1), characterized in that: A retaining ring (2) is fixedly connected to one end of the base (1), and a cleaning component (3) is inserted into the outer side of the retaining ring (2). An adjusting component (4) is fixedly connected to the other end of the base (1). The cleaning assembly (3) includes several sets of dovetail buckles (301) inserted into the outside of the retaining ring (2), and a cleaning ring (302) is fixedly connected to one side of each set of dovetail buckles (301). A brush (303) is fixedly connected to the upper side of the cleaning ring (302). The adjustment assembly (4) includes a telescopic rod (401) fixedly connected to the other end of the base (1). Several sets of springs (402) are nested on the outside of the telescopic rod (401), and an elastic pad (403) is fixedly connected to the other end of the telescopic rod (401).

2. A retaining ring for CMP grinding according to claim 1, characterized in that: The upper end of the retaining ring (2) is provided with several sets of liquid flow grooves (5), and the side of the retaining ring (2) is provided with several sets of first slots (6).

3. A retaining ring for CMP grinding according to claim 1, characterized in that: A protective cover (7) is provided on the outside of the base (1), and a rubber ring (8) is fixedly connected to the top of the protective cover (7).

4. A retaining ring for CMP grinding according to claim 3, characterized in that: The outer side of the protective cover (7) is provided with several sets of drainage holes (9), and the outer side of the base (1) is provided with several sets of air holes (10).

5. A retaining ring for CMP grinding according to claim 1, characterized in that: The lower end of the elastic pad (403) is fixedly connected to several sets of quick-locking pins (11), and the other end of the several sets of quick-locking pins (11) is inserted with a fixing ring (12).

6. A retaining ring for CMP grinding according to claim 5, characterized in that: The upper side of the fixing ring (12) is provided with several second slots (13), and a sealing ring (14) is fixedly connected to the upper side of the fixing ring (12).

7. A retaining ring for CMP grinding according to claim 1, characterized in that: One end of the retaining ring (2) is provided with an internal thread, and one end of the base (1) is provided with an external thread.

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