Circuit board chemical copper plating equipment with ultrasonic oscillation

Abstract

Circuit board chemical copper plating equipment with ultrasonic oscillation comprises an electroplating bath, an ultrasonic oscillation device and a processing device, the ultrasonic oscillation device and the processing device are arranged in the electroplating bath, mounting seats are arranged on two opposite side surfaces of the electroplating bath, a connecting rod is arranged between the two mounting seats, and the ultrasonic oscillation device is arranged on the connecting rod and moves along the connecting rod; the ultrasonic vibration device comprises an ultrasonic vibration rod, and the outer surface of the ultrasonic vibration rod is provided with a convex ring and a groove; an ultrasonic transducer is arranged on the bottom surface of the external treatment device, a flow guide part is arranged at the top of the external treatment device, the flow guide part is gradually reduced from bottom to top, an exhaust port is formed in the top of the flow guide part, a vacuum pump is arranged on the outer side of the exhaust port, an air outlet hole is formed in the upper portion of the outer side of the vacuum pump, and a backflow pipe is arranged on the side face of the vacuum pump; and the bottom end of the return pipe is connected to the treatment tank. Through the arrangement of the movable ultrasonic vibration device and the processing device, the electroplating quality is improved, the practicability is high, and the electroplating device has high popularization significance.

Description

Technical Field

[0001] This utility model relates to the field of electroplating technology; in particular, it relates to a circuit board chemical copper plating device with ultrasonic oscillation. Background Technology

[0002] In PCB electroplating, chemical copper plating is typically performed first to form a conductive layer on the PCB surface, followed by electroplating. However, various process defects frequently occur during electroplating, such as poor flow of the plating solution within the holes, and air bubbles that cannot be expelled during the plating process, leading to problems like voids, irregular plating layers, and copper-free holes. To address these issues, various stirring devices are used to accelerate the flow of the plating solution within the holes, and ultrasonic waves are used to break up air bubbles. However, over long-term use, metal ions, undecomposed additives, oil, and residual organic matter from the pretreatment process gradually accumulate in the plating solution. These impurities degrade the stability of the plating solution, increasing hydrogen evolution and thus exacerbating bubble formation. At this point, conventional stirring and ultrasonic methods are no longer effective. Utility Model Content

[0003] Therefore, it is necessary to provide a circuit board chemical copper plating device with ultrasonic oscillation to address the shortcomings of existing technologies.

[0004] An ultrasonic electroless copper plating apparatus for circuit boards includes an electroplating tank, an ultrasonic oscillating device disposed within the electroplating tank, and a processing device. Mounting seats are provided on two opposite sides of the electroplating tank, and a connecting rod is provided between the two mounting seats. The ultrasonic oscillating device is mounted on the connecting rod and moves along the connecting rod. The ultrasonic oscillating device includes an ultrasonic vibrating rod, the outer surface of which is provided with a raised ring and a groove. An ultrasonic transducer is provided on the bottom surface of the processing device, and a guide section is provided on the top. The guide section gradually decreases in size from bottom to top, and an exhaust port is provided on the top of the guide section. A vacuum pump is provided outside the exhaust port, and an air outlet is provided above the outer side of the vacuum pump. A return pipe is provided on the side, and the bottom end of the return pipe is connected to the processing tank. A connecting pipe is provided at the bottom side of the processing tank, and the other end of the connecting pipe extends into the electroplating tank.

[0005] Furthermore, the ultrasonic oscillation device includes two ultrasonic vibrating rods, which are arranged side by side on the connecting rod.

[0006] Furthermore, a filter tank is provided on the outside of the electroplating tank, and the electroplating tank, the filter tank, and the treatment tank are connected in sequence.

[0007] Furthermore, a filter screen separating the upper and lower layers is provided in the middle of the filter tank, an inlet pipe is provided at the top of the filter tank and an outlet pipe is provided at the bottom, the inlet pipe is connected to the electroplating tank and the filter tank, and the outlet pipe is connected to the filter tank and the treatment tank.

[0008] Furthermore, an anode plate is provided on the inner side of the electroplating tank, and an electroplating area is provided in the middle. An electroplating fixture is provided above the electroplating area, and a cathode is provided on the electroplating fixture. The ultrasonic vibration device is provided between the electroplating fixture and the anode plate.

[0009] Furthermore, the electroplating fixture is also equipped with a driving device, which can drive the electroplating fixture to move in a direction perpendicular to the anode plate.

[0010] In summary, this invention utilizes a movable ultrasonic vibration device to provide more comprehensive and uniform vibration to the circuit board, accelerating the flow of the electroplating solution within the holes, making the flow smoother, and breaking up air bubbles, thus reducing problems such as voids and copper-free holes. The design of the raised ring and groove structure on the outer surface of the ultrasonic vibrator increases the effective area and improves efficiency. The filter tank filters impurities in the electroplating solution. When more and more air bubbles are generated during electroplating, making it difficult for the ultrasonic device to effectively handle them and affecting the electroplating effect, the electroplating solution is introduced into a treatment tank through the filter tank. The treatment device promotes the diffusion and precipitation of gas generated by the hydrogen evolution reaction into the air bubbles, which is then extracted by a vacuum pump. The electroplating solution treated by the treatment device is then returned to the electroplating tank, allowing for normal use. This invention is highly practical and has significant potential for widespread application. Attached Figure Description

[0011] Figure 1 This is a schematic diagram of the structure of the circuit board chemical copper plating equipment with ultrasonic oscillation according to this utility model;

[0012] Figure 2 for Figure 1 Internal structure diagram of the equipment;

[0013] Figure 3 for Figure 2 A schematic diagram of the structure of a medium-intensity ultrasonic rod. Detailed Implementation

[0014] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain this utility model and are not intended to limit this utility model.

[0015] like Figures 1 to 3 As shown, this utility model provides a circuit board chemical copper plating equipment with ultrasonic oscillation. The equipment includes an electroplating tank 10, an ultrasonic oscillation device 200, a processing device 30, and connecting pipes. The ultrasonic oscillation device 20 is disposed in the electroplating tank 10. The processing device 30 includes a processing tank 31, and the connecting pipes connect the electroplating tank 10 and the processing tank 31.

[0016] An anode plate 11 is disposed inside the electroplating tank 10, and an electroplating area is disposed in the middle. An electroplating fixture 12 is disposed above the electroplating area, and a cathode is disposed on the electroplating fixture 12. The circuit board is clamped on the electroplating fixture 12. The electroplating fixture 12 has a conventional structure, therefore, its structure will not be described in detail here. The ultrasonic vibration device 20 is disposed between the electroplating fixture 12 and the anode plate 11. In addition, a driving device (not shown in the figure) is disposed on the electroplating fixture 12, which can drive the electroplating fixture 12 to move in a direction perpendicular to the anode plate 11 to further accelerate the flow of the electroplating solution in the plate. The driving device is a conventional motor, cylinder, etc.

[0017] Mounting seats 13 are provided on two opposite sides of the electroplating tank 10, and a connecting rod 14 is provided between the two mounting seats 13. The ultrasonic oscillation device 20 is mounted on the connecting rod 14 and can move along the connecting rod 14. The ultrasonic oscillation device 20 includes an ultrasonic vibrating rod 21. The outer surface of the ultrasonic vibrating rod 21 is provided with a convex ring 211 and a groove 212. The design of the convex ring 211 and the groove 212 can increase the contact area between the ultrasonic vibrating rod 21 and the liquid. In this embodiment, the ultrasonic oscillation device 20 includes two ultrasonic vibrating rods 21, which are arranged side by side on the connecting rod 14. During operation, the two connecting rods 14 can move away from or towards each other to ensure that all areas of the circuit board can be uniformly affected. In addition, in this embodiment, the movement of the vibrating rod 21 can be driven by conventional structures such as motors or cylinders. For example, a cylinder has a rod extending from it, the vibrating rod 21 is mounted on the rod, and the rod drives the vibrating rod 21 to move.

[0018] A filter tank 40 is provided on the outer side of the electroplating tank 10. A filter screen 41 separating the upper and lower layers is provided in the middle of the filter tank 40. The filter screen 41 is used to filter impurities in the etching solution. A water inlet pipe 42 is provided at the top of the filter tank 40 and a water outlet pipe 43 is provided at the bottom. The water inlet pipe 42 is connected to the electroplating tank 10 and the filter tank 40, and a water pump is connected to the water inlet pipe 42. The water outlet pipe 43 is connected to the filter tank 40 and the treatment tank 31.

[0019] An ultrasonic transducer 32 is provided on the bottom surface of the processing tank 31, and a flow guide 33 is provided on the top of the processing tank 31. The flow guide 33 includes four inclined surfaces and gradually decreases in size from bottom to top. An exhaust port is provided on the top of the flow guide 33, and a vacuum pump 34 is provided outside the exhaust port. An air outlet is provided above the outer side of the vacuum pump 34, and a return pipe 35 is provided on the side. The bottom end of the return pipe 35 is connected to the lower middle part of the processing tank 31. A connecting pipe 36 is provided at the bottom side of the processing tank 31, and the connecting pipe 36 extends into the electroplating tank 10.

[0020] During operation, the ultrasonic transducer 32 generates cavitation bubbles in the liquid, causing the gas generated in the initial hydrogen evolution reaction to diffuse into the bubbles and precipitate. Due to the density difference, the precipitated bubbles naturally rise; the inclined baffle on the guide section 33 guides the bubbles to gather at the exhaust port. The vacuum pump 34 applies a slight negative pressure at the exhaust port, drawing in the gas and preventing it from redissolving. After the bubbles drawn by the vacuum pump 34 break, the gas is discharged through the vent, and the liquid flows back to the processing tank 31 through the return pipe 35.

[0021] In summary, this utility model utilizes a movable ultrasonic vibration device to provide more comprehensive and uniform vibration to the circuit board, accelerating the flow rate of the electroplating solution within the holes, making the flow smoother, and breaking up air bubbles, thus reducing problems such as voids and copper-free holes. The design of the convex ring 211 and groove 212 on the outer surface of the ultrasonic vibrator 21 increases the effective area and improves efficiency. The filter tank 40 filters impurities in the electroplating solution. When more and more bubbles are generated during electroplating, making it difficult for the ultrasonic device to effectively handle them and affecting the electroplating effect, the electroplating solution is introduced into the treatment tank 31 through the filter tank 40. The treatment device 30 promotes the diffusion and precipitation of the gas generated by the hydrogen evolution reaction into the bubbles, which is then extracted by the vacuum pump 34. The electroplating solution treated by the treatment device 30 is then returned to the electroplating tank 10, allowing for normal use. This utility model is highly practical and has significant potential for widespread application.

[0022] The above-described embodiments are merely one implementation of this utility model, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of this utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these all fall within the protection scope of this utility model. Therefore, the protection scope of this utility model patent should be determined by the appended claims.

Claims

1. A circuit board chemical copper plating device with ultrasonic oscillation, characterized in that: The device includes an electroplating tank, an ultrasonic oscillation device disposed within the electroplating tank, and a processing device. Mounting seats are provided on two opposite sides of the electroplating tank, and a connecting rod is provided between the two mounting seats. The ultrasonic oscillation device is mounted on the connecting rod and moves along the connecting rod. The ultrasonic oscillation device includes an ultrasonic vibrating rod, the outer surface of which is provided with a raised ring and a groove. The processing device has an ultrasonic transducer on its bottom surface and a flow guide on its top surface. The flow guide gradually decreases in size from bottom to top, and an exhaust port is provided on the top of the flow guide. A vacuum pump is located outside the exhaust port, with an air outlet above its outer side and a return pipe on its side. The bottom end of the return pipe is connected to the processing tank, and a connecting pipe is provided at the bottom side of the processing tank, with the other end of the connecting pipe extending into the electroplating tank.

2. The circuit board chemical copper plating equipment with ultrasonic oscillation as described in claim 1, characterized in that: The ultrasonic oscillation device includes two ultrasonic vibrating rods, which are arranged side by side on a connecting rod.

3. The circuit board chemical copper plating equipment with ultrasonic oscillation as described in claim 1, characterized in that: A filter tank is provided on the outside of the electroplating tank, and the electroplating tank, filter tank and treatment tank are connected in sequence.

4. The circuit board chemical copper plating equipment with ultrasonic oscillation as described in claim 3, characterized in that: The filter tank is provided with a filter screen that separates the upper and lower layers in the middle. The filter tank is provided with an inlet pipe at the top and an outlet pipe at the bottom. The inlet pipe is connected to the electroplating tank and the filter tank, and the outlet pipe is connected to the filter tank and the treatment tank.

5. The circuit board chemical copper plating equipment with ultrasonic oscillation as described in claim 1, characterized in that: An anode plate is provided on the inner side of the electroplating tank, and an electroplating area is provided in the middle. An electroplating fixture is provided above the electroplating area, and a cathode is provided on the electroplating fixture. The ultrasonic vibration device is provided between the electroplating fixture and the anode plate.

6. The circuit board chemical copper plating equipment with ultrasonic oscillation as described in claim 5, characterized in that: The electroplating fixture is also equipped with a driving device, which can drive the electroplating fixture to move in a direction perpendicular to the anode plate.

Images