Auxiliary device

Abstract

The utility model provides an auxiliary device which is used for assisting a chip in testing. The chip is provided with at least one pin, and the auxiliary device comprises a guide pin mechanism and a fixing mechanism which is used for detachably fixing the guide pin mechanism on the chip. The guide pin mechanism comprises at least one guide pin assembly, the guide pin assembly comprises a guide pin with a first end and a second end which are opposite, the first end of the guide pin is used for being connected with test equipment, and the second end of the guide pin is used for abutting against a target pin. Wherein the target pins are pins, corresponding to a to-be-tested function, of the chip, and the target pins are in one-to-one correspondence with the guide pin assemblies; the test device is used for providing a test signal, and the test signal is transmitted to the target pin through the guide pin abutting against the target pin, so as to achieve the function test of the chip. When the auxiliary device is used for assisting the chip in testing, the installation operation is convenient and fast, the consumed time is short, and the chip pins cannot be damaged.

Description

Technical Field

[0001] This utility model relates to the field of auxiliary device technology, and in particular to an auxiliary device for assisting in the testing of chips. Background Technology

[0002] One common method for functional testing of chips in the existing technology is to first solder out the pins on the chip used to control the function under test, and then continuously pull the pin level low or high to achieve the functional test of the chip. However, the pins need to be soldered every time the chip is tested, which is not only time-consuming, but also prone to damaging the chip pins with repeated soldering. Utility Model Content

[0003] This invention aims to address at least one of the problems existing in the prior art. To this end, this invention provides an auxiliary device that facilitates convenient and time-saving installation and operation during chip testing, without damaging the chip pins.

[0004] To achieve the above objectives, this utility model provides an auxiliary device for assisting chip testing. The chip has at least one pin, and the auxiliary device includes a guide pin mechanism and a fixing mechanism for detachably fixing the guide pin mechanism to the chip.

[0005] The guide pin mechanism includes at least one guide pin assembly, each of the guide pin assemblies including a guide pin having a first end and a second end opposite to each other, the first end of the guide pin being used to connect to a test device, and the second end of the guide pin being used to abut against a target pin;

[0006] The target pin is a pin of the chip corresponding to the function to be tested, and the target pin corresponds one-to-one with the guide pin assembly; the test equipment is used to provide a test signal, which is transmitted to the target pin through the guide pin that abuts against the target pin, so as to realize the functional test of the chip.

[0007] Compared with the prior art, the present invention has the following advantages: the auxiliary device includes a guide pin mechanism and a fixing mechanism for detachably fixing the guide pin mechanism to the chip. The overall structure is simple, and the installation operation is convenient and time-saving when assisting the chip in testing. Furthermore, after the fixing mechanism detachably fixes the guide pin mechanism to the chip, one end of the guide pin in the guide pin mechanism is connected to the test equipment, and the other end abuts against the target pin of the chip, so as to realize the transmission of test signals to complete the functional test of the chip. The guide pin and the target pin are in a mutual abutting manner, which will not damage the pin of the chip compared with the welding method used in the prior art.

[0008] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0009] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0010] Figure 1 This is an application scenario diagram of the auxiliary device provided in one embodiment of the present invention for chip testing.

[0011] Figure 2 yes Figure 1 The diagram shows the three-dimensional structure of the chip.

[0012] Figure 3 yes Figure 1 A three-dimensional structural schematic diagram of the auxiliary device shown.

[0013] Figure 4 yes Figure 1 The auxiliary device and chip shown are cross-sectional views along direction II.

[0014] Figure 5 yes Figure 4 An enlarged schematic diagram of part A shown.

[0015] Figure 6 yes Figure 1 The diagram shows a three-dimensional structure of the guide pin assembly and the locking assembly in the locking state.

[0016] Figure 7 yes Figure 6 The diagram shows a three-dimensional structure of the guide needle.

[0017] Figure 8 yes Figure 3 A schematic diagram of the three-dimensional structure of the transition block shown.

[0018] Figure 9 yes Figure 6 The guide pin assembly and the latch assembly in their initial state are shown in a side view.

[0019] Figure 10 yes Figure 9 The guide pin assembly and the locking assembly in the locking state are shown in a side view.

[0020] Figure 11 yes Figure 6 A three-dimensional structural diagram of the mounting block shown.

[0021] Figure 12 yes Figure 6 The diagram shows the structure of the lever component.

[0022] Figure 13 This is a side view of the guide pin assembly and the locking assembly in the locking state provided in another embodiment of the present invention.

[0023] Explanation of key figure labels:

[0024] 1000 - Auxiliary device; 1100 - Guide pin mechanism; 1200 - Fixing mechanism; 2000 - Chip; 2100 - Chip motherboard; 2110 - Pin; 2120 - Pin slot; 2200 - Package cover plate;

[0025] 1-Guide pin assembly; 11-Guide pin; 11a-First end of guide pin; 11b-Second end of guide pin; 111-First pin segment; 112-Second pin segment; 113-Third pin segment; 12-Mounting block; 120-Mounting block body; 121-First mounting plate; 1211-Avoidance notch; 122-Second mounting plate; 1221-Guide groove; 13-Transition block; 131-Transition block body; 132-Accommodation groove;

[0026] 2-Locking assembly; 21-First pivot; 22-Second pivot; 23-Lever component; 23a-First end of lever component; 23b-Second end of lever component; 23c-Connecting part; 231-First lever segment; 232-Second lever segment; 233-Third lever segment; 234-Fourth lever segment; 24-Stop component; 25-Elastic component.

[0027] The following detailed description, in conjunction with the accompanying drawings, further illustrates the embodiments of this utility model. Detailed Implementation

[0028] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model.

[0029] It should be noted that in the description of this utility model, the terms "first," "second," and "third," etc., are used to distinguish different objects, not to describe a specific order, and the term "multiple" refers to at least two, and therefore should not be construed as a limitation on this application. Furthermore, unless otherwise explicitly specified and limited, the term "connection" should be interpreted broadly. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a direct connection, an indirect connection through other elements, or a connection within two elements; it can be a communication connection or an electrical connection, where both communication and electrical connections include direct connections or indirect connections through other elements. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0030] Please see Figure 1 This utility model provides an auxiliary device 1000 for assisting a chip 2000 in performing functional tests. The functional tests that the chip 2000 can perform include, but are not limited to, sleep function tests, wake-up function tests, and power-on / off function tests, which will not be elaborated further.

[0031] For specific details, please refer to... Figures 1 to 5 In an embodiment of this utility model, the chip 2000 is provided with at least one pin 2110, and the auxiliary device 1000 includes a guide pin mechanism 1100 and a fixing mechanism 1200 for detachably fixing the guide pin mechanism 1100 to the chip 2000. The guide pin mechanism 1100 includes at least one guide pin assembly 1, and each guide pin assembly 1 includes a guide pin 11 having a first end 11a and a second end 11b opposite to each other. The first end 11a of the guide pin 11 is used to connect to a test device (not shown in the figure), and the second end 11b of the guide pin 11 is used to abut against the target pin 2110.

[0032] As will be understood by those skilled in the art, the target pin 2110 is a pin 2110 of the chip 2000 corresponding to the function to be tested, and the chip 2000 needs to receive test signals through one or more of the pins 2110 when performing functional tests. That is, the target pin 2110 will be different when the chip 2000 performs different functional tests.

[0033] In this embodiment of the invention, the target pin 2110 corresponds one-to-one with the guide pin assembly 1. That is, the number of guide pin assemblies 1 included in the guide pin mechanism 1100 can be set according to the number of target pins 2110 corresponding to the functional test of the chip 2000, so that each target pin 2110 corresponds to one guide pin assembly 1 and abuts against the second end 11b of the guide pin 11 in the corresponding guide pin assembly 1. Thus, when the test device provides a test signal, the test signal can be transmitted to the target pin 2110 through the guide pin 11 abutting against the target pin 2110 to realize the functional test of the chip 2000. The test signal is not limited to a level signal, and the guide pin 11 is not limited to being made of materials capable of transmitting level signals such as copper or iron; there are no limitations on this.

[0034] In this embodiment of the present invention, the auxiliary device 1000 is composed of the guide pin mechanism 1100 and the fixing mechanism 1200. The overall structure is simple, and the installation operation is convenient and time-saving when assisting the chip 2000 in testing. Furthermore, after the fixing mechanism 1200 detachably fixes the guide pin mechanism 1100 to the chip 2000, one end of the guide pin 11 is connected to the test equipment, and the other end abuts against the target pin 2110 of the chip 2000. The test signal provided by the test equipment can be transmitted to the target pin 2110 to complete the functional test of the chip 2000. The guide pin 11 and the target pin 2110 are in a mutual abutting manner, which will not damage the pin 2110 of the chip 2000 compared with the soldering method.

[0035] The following will combine Figures 1 to 13 The auxiliary device 1000 used to assist the chip 2000 in performing functional tests is described in detail.

[0036] Please see Figure 2 In one embodiment, the chip 2000 includes a chip motherboard 2100 and a package cover 2200 encapsulated on one side of the chip motherboard 2100 in the thickness direction. The edge of the chip motherboard 2100 extends beyond the edge of the package cover 2200, and the pins 2110 are disposed on the edge of the chip motherboard 2100 and exposed outside the package cover 2200. Specifically, in Figure 2 In the example, the chip motherboard 2100 has a plurality of pins 2110 arranged circumferentially around its four edges, and at least one of the pins 2110 is used as a target pin 2110 when the chip 2000 is subjected to functional testing, thereby passing through the corresponding contact pin 11 (see Figure 1It receives test signals provided by the test equipment. It is easy to understand that the structure of the chip motherboard 2100 is basically the same as that of existing chip motherboards, and will not be described in detail here. The packaging cover 2200 may, but is not limited to, be made of aluminum. The packaging cover 2200 can protect the surface of the chip motherboard 2100 and the information used to identify the chip motherboard 2100, and will not be described in detail here either.

[0037] For the best option, please refer to the following: Figures 1 to 3 In one embodiment, the chip 2000 has at least one pin slot 2120 on its sidewall. Specifically, the pin slot 2120 is located on the edge of the chip motherboard 2100 and exposed outside the package cover 2200. Each pin 2110 corresponds to one pin slot 2120; that is, the edge of the chip motherboard 2100 has a pin slot 2120 at the position corresponding to each pin 2110, and at least a portion of each pin 2110 is located within its corresponding pin slot 2120. The second end 11b of the guide pin 11 is configured to be inserted into the pin slot 2120 corresponding to the target pin 2110 and abut against the target pin 2110. In this embodiment, the second end 11b of the guide pin 11 is configured to be inserted into the pin slot 2120 corresponding to the target pin 2110. Thus, the pin slot 2120 not only serves as a guide and positioning function to facilitate the quick insertion of the second end 11b of the guide pin 11 into the pin slot 2120 corresponding to the target pin 2110 and abut against the target pin 2110, but also the slot arm of the pin slot 2120 can limit the second end 11b of the guide pin 11 during the functional testing of the chip 2000, preventing the second end 11b of the guide pin 11 from moving too much along the circumference of the chip 2000 and losing contact, so that the guide pin 11 and the target pin 2110 remain in contact, thereby ensuring that the test signal can be stably transmitted to the target pin 2110.

[0038] Optionally, such as Figure 1 and Figure 3 As shown, in one embodiment, the first end 11a and the second end 11b of the guide pin 11 both extend along a first direction. When the fixing mechanism 1200 detachably fixes the guide pin mechanism 1100 to the chip 2000, the first direction is parallel to the thickness direction of the chip 2000. It should be noted that the first direction being parallel to the thickness direction of the chip 2000 can be completely parallel to the thickness direction of the chip 2000, or it can be approximately parallel to the thickness direction of the chip 2000, as long as the second end 11b of the guide pin 11 can abut against the target pin 2110 of the chip 2000. For example... Figure 1As shown, when the guide needle mechanism 1100 includes multiple guide needle components 1, the first ends 11a of the multiple guide needles 11 corresponding to the multiple guide needle components 1 all extend toward the same side of the chip 2000 in the thickness direction.

[0039] Since the chip 2000 is typically laid flat on the test platform during testing, in this embodiment, the extension direction of both ends of the guide pin 11 is set to be parallel or approximately parallel to the thickness direction of the chip 2000, that is, the guide pin 11 extends vertically. This provides a larger operating space for the first end 11a of the guide pin 11, facilitating quick connection of the first end 11a of the guide pin 11 to the test equipment. Especially when the chip 2000 has been stacked and soldered onto other circuit boards to form a module chip, compared to the horizontal extension of the guide pin 11, the guide pin 11 will not occupy a large space in the thickness direction of the other circuit boards, thus not hindering the testing or other operations of the other circuit boards.

[0040] In other embodiments, the guide pin 11 can extend horizontally. For example, when the chip 2000 is soldered to the other circuit board and the solder fills the entire or at least part of the pin slot 2120, the second end 11b of the guide pin 11 is not convenient to insert into the pin slot 2120 to abut against the portion of the target pin 2110 located within the pin slot 2120. Extending the guide pin 11 horizontally allows the second end 11b of the guide pin 11 to abut against the portion of the target pin 2110 located on the outer surface of the chip motherboard 2100 in the thickness direction with a larger area. Of course, when the solder fills the entire or at least part of the pin slot 2120, the guide pin 11 can also extend vertically. The second end 11b of the guide pin 11 abuts against the portion of the target pin 2110 located on the outer surface of the chip motherboard 2100 in the thickness direction through its end face. Although the contact area with the target pin 2110 is reduced, the test signal can still be transmitted to the target pin 2110 through the guide pin 11.

[0041] Furthermore, please combine Figures 3 to 5 In one embodiment, each of the guide pin assemblies 1 further includes a mounting block 12, the guide pin 11 is inserted into the mounting block 12, and the first end 11a and the second end 11b of the guide pin 11 are respectively located outside the opposite sides of the mounting block 12. Wherein, as Figure 5As shown, when the fixing mechanism 1200 detachably fixes the guide pin mechanism 1100 to the chip 2000, the side of the mounting block 12 near the second end 11b of the guide pin 11 is configured to abut against one side of the chip 2000 in the thickness direction. Optionally, the side of the mounting block 12 near the second end 11b of the guide pin 11 can abut against the portion of the chip motherboard 2100 exposed above the package cover 2200, or it can abut against the package cover 2200.

[0042] In this embodiment, when the fixing mechanism 1200 fixes the guide pin mechanism 1100 onto the chip 2000, the second end 11b of the guide pin 11 abuts against the target pin 2110 on the side wall of the chip 2000, while the mounting block 12 through which the guide pin 11 is mounted abuts against one side of the chip 2000 in the thickness direction. This allows the guide pin assembly 1 to contact the chip 2000 from different directions, increasing the contact area between the two and improving the relative stability between the guide pin assembly 1 and the chip 2000, thereby improving the contact reliability between the guide pin 11 and the target pin 2110.

[0043] For specific details, please refer to... Figure 1 , Figures 5 to 7 In one embodiment, the guide needle 11 includes a first needle segment 111, a second needle segment 112, and a third needle segment 113 connected between the first needle segment 111 and the second needle segment 112. The first needle segment 111 and the second needle segment 112 are spaced apart along the first direction and both extend along the first direction. The extension direction of the third needle segment 113 has an angle with the first direction, that is, the first needle segment 111 and the second needle segment 112 extend in the same direction, while the third needle segment 113 extends obliquely relative to the first needle segment 111 and the second needle segment 112. Wherein, the end of the first needle segment 111 away from the second needle segment 112 constitutes the first end 11a of the guide needle 11, and the end of the second needle segment 112 away from the first needle segment 111 constitutes the second end 11b of the guide needle 11. The mounting block 12 is fitted onto the first needle segment 111 and / or the third needle segment 113. When the fixing mechanism 1200 detachably fixes the guide needle mechanism 1100 to the chip 2000, the first needle segment 111 is located on the side of the second needle segment 112 closer to the chip 2000.

[0044] In this embodiment, the guide pin 11 is a bent guide pin. When the guide pin mechanism 1100 is fixed on the chip 2000, the first pin segment 111 is recessed towards the center of the chip 2000 relative to the second pin segment 112. The mounting block 12 is fitted onto the first pin segment 111 and / or the third pin segment 113, but not onto the second pin segment 112 which is farther away from the center of the chip 2000 relative to the first pin segment 111. This reduces the size of the mounting block 12, thereby reducing the positive projection area of ​​the guide pin assembly 1 on the chip 2000. As a result, when the chip 2000 is stacked on other circuit boards, the space occupied in the thickness direction of the other circuit boards can be reduced, which is beneficial for the other circuit boards to perform testing or other operations.

[0045] Preferred, in Figure 1 , Figures 5 to 7 In the example, the mounting block 12 is fitted onto the first pin segment 111. When the fixing mechanism 1200 detachably fixes the guide pin mechanism 1100 to the chip 2000, the orthogonal projection of the first pin segment 111 on the chip motherboard 2100 is located on the portion of the chip motherboard 2100 exposed above the packaging cover plate 2200. The side of the mounting block 12 near the second end 11b of the guide pin 11 abuts against the side of the packaging cover plate 2200 facing away from the chip motherboard 2100. In this embodiment, the mounting block 12 is only fitted onto the first pin segment 111, which can further reduce the size of the mounting block 12. Optionally, as shown... Figure 5 As shown, the extension length of the second pin segment 112 is greater than the thickness of the chip motherboard 2100, and the extension length of the second pin segment 112 is less than the extension length of the first pin segment 111. This design ensures that the first pin segment 111 has a longer connection length to facilitate connection to the test equipment, while the second pin segment 112 makes the overall length of the guide pin 11 smaller, reducing manufacturing costs, and at the same time ensuring that more of it can be inserted into the pin slot 2120 corresponding to the target pin 2110, thereby increasing the contact area between the second end 11b of the guide pin 11 and the target pin 2110, and improving the connection reliability between the guide pin 11 and the target pin 2110.

[0046] Preferred, in Figure 1 , Figures 5 to 7In the example, the guide pin mechanism 1100 includes a plurality of detachably combinable guide pin assemblies 1, with each guide pin 11 of the guide pin assembly 1 passing through the mounting block 12. In every two adjacent guide pin assemblies 1, one guide pin assembly 1 has a first connecting portion (not shown) on its mounting block 12, and the other guide pin assembly 1 has a second connecting portion (not shown). The first connecting portion and the second connecting portion are detachably coupled to allow the two adjacent guide pin assemblies 1 to be detachably connected. This design allows the guide pin mechanism 1100 to provide a plurality of detachably combinable guide pin assemblies 1 on each side of the chip 2000, depending on the specific model and size of the chip 2000, thus adapting to the testing needs of chips 2000 of different models and sizes and expanding the applicability of the auxiliary device 1000.

[0047] The engagement method between the first connecting part and the second connecting part is not limited to one of the following: magnetic attraction structure, tenon and mortise structure, and snap-fit ​​structure. For example, each pair of adjacent guide pin assemblies 1 can be detachably connected by a magnetic attraction structure. Specifically, each mounting block 12 of each pair of adjacent guide pin assemblies 1 is provided with a magnet, and the magnets on the mounting blocks 12 of the adjacent two guide pin assemblies 1 have opposite magnetic properties, so that the adjacent two guide pin assemblies 1 can be detachably connected together by magnetic attraction.

[0048] Further preferred, such as Figure 1 and Figure 3 As shown, in one embodiment, the guide pin mechanism 1100 further includes at least one transition block 13, each of the transition blocks 13 being disposed between two guide pin assemblies 1. The transition block 13 has a third connecting portion (not shown), and each mounting block 12 of each guide pin assembly 1 adjacent to the transition block 13 has a fourth connecting portion (not shown). The third connecting portion and the fourth connecting portion are detachably coupled to allow the transition block 13 to be detachably connected between the mounting blocks 12 of the two guide pin assemblies 1. It is understood that during functional testing of the chip 2000, at least some of the target pins 2110 included in the chip 2000 may be spaced apart. In this embodiment, by providing one or more transition blocks 13 between the mounting blocks 12 of two adjacent guide pin assemblies 1, the multiple guide pin assemblies 1 can be arranged and combined as needed via at least one transition block 13 to correspond to at least some of the spaced target pins 2110, which helps to further expand the applicability of the auxiliary device 1000.

[0049] Similar to the cooperation between the first and second connecting parts, the cooperation between the third and fourth connecting parts is not limited to adopting one of the following: magnetic structure, mortise and tenon structure, and snap-fit ​​structure. This will not be elaborated further.

[0050] Optionally, in Figure 1 and Figure 3 In one example, the transition block 13 can be positioned at a corner of the pin mechanism 1100 corresponding to the chip 2000, thereby connecting two sets of pin assemblies 1 on different sides of the pin mechanism 1100 corresponding to the chip 2000, so that the pin mechanism 1100 can be assembled along the entire outer periphery of the chip 2000. Of course, in other embodiments, the transition block 13 can also be positioned between two adjacent pin assemblies 1 on the same side of the pin mechanism 1100 corresponding to the chip 2000; this is not limited.

[0051] For preferred options, please refer to [link / reference]. Figure 3 and Figure 8 The transition block 13 includes a generally rectangular block body 131. The transition block body 131 has a receiving groove 132, which can be used to accommodate at least a portion of the mounting block 12 of the guide pin assembly 1 adjacent to the transition block 13. By accommodating at least a portion of the mounting block 12 in the receiving groove 132 of the adjacent transition block 13, the contact area between the two is increased, which is beneficial to improving the connection stability after the two are detachably connected.

[0052] In embodiments of this utility model, the fixing mechanism 1200 can adopt different structural designs, as long as it can detachably fix the guide pin mechanism 1100 to the chip 2000.

[0053] For specific details, please refer to... Figure 1 , Figures 3 to 6In one embodiment, a plurality of the guide pin assemblies 1 and at least one transition block 13 are arranged and combined according to a preset rule so that when the fixing mechanism 1200 detachably fixes the guide pin mechanism 1100 to the chip 2000, the guide pin mechanism 1100 extends circumferentially along the chip 2000, and at least one guide pin assembly 1 is distributed on each of the opposite sides of the chip 2000 in a preset dimension direction. The fixing mechanism 1200 includes at least two locking assemblies 2. At least one locking assembly 2 is disposed on at least one guide pin assembly 1 on one side of the chip 2000 in the preset dimension direction, and at least one locking assembly 2 is disposed on at least one guide pin assembly 1 on the other side of the chip 2000 in the preset dimension direction. Each locking assembly 2 is configured to clamp the side wall of the chip 2000 when the fixing mechanism 1200 detachably fixes the guide pin mechanism 1100 to the chip 2000. Thus, by providing at least one locking component 2 on each of the opposite sides of the chip 2000 in the preset size direction, the guide pin mechanism 1100 can be clamped and fixed to the chip 2000 by means of clamping.

[0054] Preferred, in Figure 1 , Figures 3 to 6 In the example, the locking components 2 located on opposite sides of the chip 2000 in the preset size direction are symmetrically distributed or approximately symmetrically distributed. This allows the fixing mechanism 1200 to apply a relatively balanced clamping force to the chip 2000, thereby improving the stability of the guide pin mechanism 1100 fixed to the chip 2000.

[0055] Wherein, the preset dimension direction is perpendicular to the thickness direction of the chip 2000, and the preset dimension direction can be the length direction and / or the width direction of the chip 2000. Figure 1 , Figures 3 to 6 In the example, the chip 2000 has at least one guide pin assembly 1 and at least one locking assembly 2 disposed on the guide pin assembly 1 on both opposite sides in the length direction and on both opposite sides in the width direction. In this way, the fixing mechanism 1200 can clamp the chip 2000 from different directions, which helps to improve the reliability of the guide pin mechanism 1100 fixing to the chip 2000.

[0056] Optionally, the locking assembly 2 can be disposed on the mounting block 12 of the corresponding guide pin assembly 1, or it can be disposed on the guide pin 11 of the guide pin assembly 1. It is preferred to be disposed on the mounting block 12. Compared with the part of the first pin segment 111 of the guide pin 11 that is exposed on the mounting block 12, the distance between the locking assembly 2 and the side peripheral wall of the chip 2000 is smaller, which is beneficial to reducing the size of the locking assembly 2. Moreover, the size of the mounting block 12 is larger than the size of the guide pin 11, which also facilitates the placement of the locking assembly 2.

[0057] For specific details, please refer to... Figures 4 to 6 In one embodiment, the locking assembly 2 is disposed on one side of the mounting block 12 in a second direction. The locking assembly 2 includes a first rotating shaft 21, a second rotating shaft 22, a lever 23, a stop member 24, and an elastic member 25. The first rotating shaft 21 is fixedly connected to the mounting block 12. The lever 23 has a first end 23a, a second end 23b, and a connecting portion 23c located between the two ends. The connecting portion 23c is rotatably connected to the first rotating shaft 21, and both ends of the lever 23 are located near the first rotating shaft 21. On one side of the second end 11b of the guide pin 11, the two ends of the lever 23 are spaced apart along a third direction and are respectively located on opposite sides of the first rotating shaft 21 in the third direction. The first end 23a of the lever 23 is farther away from the second end 11b of the guide pin 11 than the second end 23b of the lever 23. The first end 23a of the lever 23 and the first end of the stop member 24 are both rotatably connected to the second rotating shaft 22. The second end of the stop member 24 is a free end. The elastic member 25 is connected to the lever 23. It should be noted that the second direction, the third direction, and the aforementioned first direction are perpendicular to each other. When the fixing mechanism 1200 detachably fixes the guide pin mechanism 1100 to the chip 2000, the first direction is parallel to the thickness direction of the chip 2000, the second direction is parallel to the extension direction of a portion of the side peripheral wall of the chip 2000 adjacent to the mounting block 12, and the third direction is perpendicular to a portion of the side peripheral wall of the chip 2000 adjacent to the mounting block 12.

[0058] Please combine Figure 9 and Figure 10In the above embodiment, when the locking assembly 2 is in its initial state, the second end of the stop member 24 extends beyond the side of the mounting block 12 near the second end 11b of the guide pin 11. The second end of the stop member 24 is configured to move along the first direction and toward the side away from the second end 11b of the guide pin 11 under the action of an external force, so as to drive the lever member 23 to rotate clockwise around the first rotating shaft 21 until the second end 23b of the lever member 23 clamps the side peripheral wall of the chip 2000, so that the locking assembly 2 is in a locked state. It is easy to understand that when the locking assemblies 2 located on both sides of the chip 2000 in the preset size direction are in the locked state, the guide pin mechanism 1100 can be detachably fixed to the chip 2000.

[0059] It should be noted that the external force acting on the second end of the stop member 24 refers to the reaction force exerted by the chip 2000 on the second end of the stop member 24 during the process of the tester pressing and fastening the auxiliary device 1000 onto the chip 2000. Specifically, please refer to... Figure 1 , Figure 5 , Figure 9 and Figure 10 When the tester uses the auxiliary device 1000 to assist the chip 2000 in performing functional tests, firstly, according to the distribution positions of the multiple target pins 2110 of the chip 2000, the multiple guide pin assemblies 1 and at least one transition block 13 are arranged and combined so that each target pin 2110 corresponds to one guide pin assembly 1. Then, the auxiliary device 1000 is placed above the chip 2000, and the guide pins 11 of each guide pin assembly 1 are aligned with the pin slots 2120 of the corresponding target pin 2110. Finally, the auxiliary device 1000 is pressed toward the chip 2000, so that it extends beyond the mounting block 12. The second end of the stop member 24 abuts against the side of the package cover plate 2200 of the chip 2000 facing away from the chip motherboard 2100. The second end of the stop member 24 drives the lever member 23 to rotate clockwise around the first rotating shaft 21 until the side of the mounting block 12 near the second end 11b of the guide pin 11 abuts against the package cover plate 2200. The second end of the stop member 24 no longer drives the lever member 23 to rotate. At this time, the second end 23b of the lever member 23 is clamped in the side peripheral wall of the package cover plate 2200. At the same time, the second end 11b of the guide pin 11 is inserted into the pin slot 2120 of the target pin 2110 and abuts against the target pin.

[0060] It should also be noted that when the lever 23 rotates clockwise around the first pivot 21 until the second end 23b of the lever 23 clamps the side wall of the chip 2000, the elastic member 25 is driven by the lever 23 to undergo elastic deformation to generate elastic force. The elastic force is configured to drive the lever 23 to rotate counterclockwise around the first pivot 21 until it returns to its initial position when the external force is removed, thereby restoring the locking assembly 2 from the locking state to the initial state.

[0061] The elastic element 25 may be, but is not limited to, a spring, a torsion spring, or other elastic element. For details, please refer to... Figure 5 , Figure 6 and Figure 11 In one embodiment, the mounting block 12 includes a mounting block body 120 and a first mounting plate 121. The first rotating shaft 21 is fixedly connected to one side of the mounting block body 120 in the aforementioned second direction. The first mounting plate 121 is disposed on one side of the mounting block body 120 in the second direction and located on the side of the first rotating shaft 21 away from the stop member 24. The first mounting plate 121 extends beyond the side of the mounting block body 120 where the first rotating shaft 21 is disposed. The elastic member 25 is a spring with one end connected to the first mounting plate 121 and the other end connected to the lever member 23. Thus, when the lever member 23 rotates clockwise around the first rotating shaft 21, the spring is stretched to generate an elastic force. When the external force acting on the second end of the stop member 24 disappears, the elastic force can pull the lever member 23 to rotate counterclockwise around the first rotating shaft 21 until it returns to its initial position.

[0062] In the above embodiment, the elastic tension generated by the stretching of the elastic member 25 will cause the lever member 23 to have a tendency to reverse. In order to ensure that the second end 23b of the lever member 23 can clamp the side wall of the chip 2000 and ensure that the guide needle mechanism 1100 is fixed to the chip 2000, the tester can continuously apply a pressing force toward the chip 2000 to the auxiliary device 1000 to counteract the tendency of the lever member 23 to reverse. Alternatively, the tester may also provide a locking structure in the locking assembly 2 to ensure that the locking assembly 2 remains in the locked state. For example, the locking structure may be an elastic hook provided on the mounting block body 120. When the tester presses the auxiliary device 1000 to make the lever 23 rotate clockwise around the first pivot 21 until the second end 23b of the lever 23 clamps the side wall of the chip 2000, the elastic hook may elastically deform and stop against the side of the first end 23a of the lever 23 facing the second end 11b of the guide pin 11, thereby preventing the elastic tension generated by the elastic member 25 from driving the lever 23 to reverse. Furthermore, the elastic hook may deform under the action of the external force applied by the tester and contact the stopping action on the first end 23a of the lever 23, thereby allowing the locking assembly 2 to return to its initial state under the action of the elastic tension.

[0063] Preferred, such as Figure 9 and Figure 11 As shown, in one embodiment, the first mounting plate 121 has an clearance notch 1211 on one side near the second end 11b of the guide pin 11, and the lever member 23 is located at the connecting portion 23c (see...). Figure 5 At least a portion of the space between the first end 23b of the lever 23 and the second end 23b of the lever 23 is accommodated in the clearance notch 1211, which helps to reduce the size of the mounting block body 120 in the aforementioned third direction, thereby further reducing the size of the mounting block 12.

[0064] Please combine Figure 5 and Figure 12In one embodiment, the stop member 24 is a straight rod, while the lever member 23 is a hook-shaped rod. The lever component 23 specifically includes a first lever segment 231, a second lever segment 232, a third lever segment 233, and a fourth lever segment 234 connected in sequence. The first lever segment 231 and the second lever segment 232 are arranged in a V-shape. The connection between the first lever segment 231 and the second lever segment 232 constitutes the connection portion 23c of the lever component 23. The end of the first lever segment 231 away from the second lever segment 232 constitutes the first end 23a of the lever component 23. The third lever segment 233 is connected to the end of the second lever segment 232 away from the first lever segment 231 and extends approximately along the extension direction of the central symmetry line between the first lever segment 231 and the second lever segment 232. The fourth lever segment 234 is connected to the end of the third lever segment 233 away from the second lever segment 232 and extends obliquely toward the direction close to the central symmetry line between the first lever segment 231 and the second lever segment 232. The end of the fourth lever segment 234 away from the third lever segment 233 constitutes the second end 23b of the lever component 23. In this embodiment, the first end 23a of the lever 23 has a through hole for the second rotating shaft 22 to be inserted, and the connecting part 23c has a through hole for the first rotating shaft 21 to be inserted. When the locking assembly 2 is in the initial state, the third lever segment 233 of the lever 23 is at least partially received in the clearance notch 1211 of the first mounting plate 121, and one end of the elastic member 25 is connected to the side of the second lever segment 232 facing away from the first lever segment 231.

[0065] In other embodiments, the lever 23 may also employ other structures. For example, in one possible implementation, the lever 23 omits the third lever segment 233, and the fourth lever segment 234 is directly connected to the end of the second lever segment 232 furthest from the first lever segment 231. In another possible implementation, the first lever segment 231 and the second lever segment 232 of the lever 23 may also be designed as a single arc-shaped rod, with the middle portion of the arc-shaped rod forming the connecting portion 23c, and the center of the arc-shaped rod facing the second end 11b of the guide pin 11.

[0066] For the best option, please refer to the following: Figure 5 , Figure 6 and Figure 11In one embodiment, to improve the stability of the stop member 24 moving along the first direction, the mounting block 12 further includes a second mounting plate 122. The second mounting plate 122 and the first mounting plate 121 are spaced apart along the third direction and are located on opposite sides of the first rotating shaft 21. The second mounting plate 122 extends beyond the side of the mounting block body 120 where the first rotating shaft 21 is located. The end of the second rotating shaft 22 near the mounting block body 120 is configured to slide in contact with the side of the second mounting plate 122 facing away from the mounting block body 120. Thus, when the second rotating shaft 22 moves along the first direction, the second mounting plate 122 can support the end of the second rotating shaft 22, limiting the second rotating shaft 22 from swaying in the direction closer to the mounting block body 120, thereby improving the stability of the movement of the stop member 24 sleeved on the second rotating shaft 22.

[0067] For further optimization, please refer to... Figure 13 In one embodiment, the second mounting plate 122 has a guide groove 1221 on the side facing away from the mounting block body 120. At least a portion of the end of the second rotating shaft 22 near the mounting block body 120 is received within the guide groove 1221. The guide groove 1221 is configured to guide the second rotating shaft 22 to move along the first direction. It is easy to understand that guiding the second rotating shaft 22 to move along the first direction through the guide groove 1221 can further improve the smoothness of movement of the second rotating shaft 22 and the stop member 24.

[0068] Specifically, in Figure 13 In the example, the guide groove 1221 is an arc-shaped groove. The radius of the arc-shaped groove is equal to the distance between the center line of the first rotating shaft 21 and the center line of the second rotating shaft 22. The center of the arc-shaped groove coincides with the center line of the first rotating shaft 21. The end of the second rotating shaft 22 is slidably disposed in the arc-shaped groove and can slide along the arc-shaped groove.

[0069] Of course, in other embodiments, the guide groove 1221 may also be a strip groove extending along the first direction. The width of the strip groove along the third direction is greater than the diameter of the second rotating shaft 22. The distance between the side of the strip groove away from the first rotating shaft 21 and the axis of the first rotating shaft 21 is defined as a first dimension. The sum of the distance between the axis of the first rotating shaft 21 and the axis of the second rotating shaft 22 and the radius of the second rotating shaft 22 is defined as a second dimension. The first dimension is greater than or equal to the second dimension. In this way, the end of the second rotating shaft 22 may also move in the strip groove.

[0070] It is understood that in the above embodiments, the fixing mechanism 1200 consists of at least two locking components 2, and the guide needle mechanism 1100 is detachably fixed to the chip 2000 by means of locking. In other embodiments, the fixing mechanism 1200 may also use other methods to detachably fix the guide needle mechanism 1100 to the chip 2000, which may be, but is not limited to, an adsorption method. For example, in one possible implementation, the fixing mechanism 1200 may employ one or more suction cups, with each suction cup correspondingly disposed on the side of a mounting block 12 facing the center of the chip 2000. The tester controls the suction cups to adhere to the surface of the encapsulation cover 2200 of the chip 2000, thereby fixing the guide pin mechanism 1100 to the chip 2000. In another possible implementation, when the encapsulation cover 2200 of the chip 2000 is at least partially made of a metal capable of attracting magnets, the fixing mechanism 1200 may employ at least one magnet disposed on at least one mounting block 12. The magnet adheres to the encapsulation cover 2200, which in turn can fix the guide pin mechanism 1100 to the chip 2000.

[0071] It is also understood that in other embodiments, the guide needle mechanism 1100 of the auxiliary device 1000 may also adopt other structural designs. For example, the mounting block 12 and the guide needle 11 may be an integral structure, or the mounting blocks 12 of a plurality of adjacent guide needle assemblies 1 may be an integral structure. There is no limitation on this.

[0072] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium, or a connection within two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0073] In the description of this specification, the references to terms such as "embodiment," "specific embodiment," and "example" indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0074] Although embodiments of the present invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the claims and their equivalents.

Claims

1. An auxiliary device for assisting a chip in testing, the chip having at least one pin, characterized in that, The auxiliary device includes a guide pin mechanism and a fixing mechanism for detachably fixing the guide pin mechanism to the chip; The guide pin mechanism includes at least one guide pin assembly, each of the guide pin assemblies including a guide pin having a first end and a second end opposite to each other, the first end of the guide pin being used to connect to a test device, and the second end of the guide pin being used to abut against a target pin; The target pin is a pin of the chip corresponding to the function to be tested, and the target pin corresponds one-to-one with the guide pin assembly; the test equipment is used to provide a test signal, which is transmitted to the target pin through the guide pin that abuts against the target pin, so as to realize the functional test of the chip.

2. The auxiliary device as described in claim 1, characterized in that, The chip has at least one pin slot on its sidewall, and the pins correspond one-to-one with the pin slots. At least a portion of each pin is located in the corresponding pin slot. The second end of the guide pin is configured to be inserted into the pin slot corresponding to the target pin and abut against the target pin. The first end and the second end of the guide pin both extend along a first direction. When the fixing mechanism detachably fixes the guide pin mechanism to the chip, the first direction is parallel to the thickness direction of the chip. When the guide needle mechanism includes multiple guide needle components, the first ends of the multiple guide needles corresponding to the multiple guide needle components all extend toward the same side of the chip in the thickness direction.

3. The auxiliary device as described in claim 2, characterized in that, Each of the guide pin assemblies further includes a mounting block, the guide pin being inserted into the mounting block, and the first end and the second end of the guide pin being located outside the opposite sides of the mounting block; When the fixing mechanism detachably fixes the guide pin mechanism to the chip, the side of the mounting block near the second end of the guide pin abuts against the side of the chip in the thickness direction.

4. The auxiliary device as described in claim 3, characterized in that, The guide needle includes a first needle segment, a second needle segment, and a third needle segment connected between the first needle segment and the second needle segment. The first needle segment and the second needle segment are spaced apart along the first direction and both extend along the first direction. The extension direction of the third needle segment has an angle with the first direction. Wherein, the end of the first needle segment away from the second needle segment constitutes the first end of the guide needle, and the end of the second needle segment away from the first needle segment constitutes the second end of the guide needle. The mounting block is fitted onto the first needle segment and / or the third needle segment. When the fixing mechanism detachably fixes the guide needle mechanism to the chip, the first needle segment is located on the side of the second needle segment closer to the chip.

5. The auxiliary device as described in any one of claims 1 to 4, characterized in that, The needle guide mechanism includes a plurality of detachable and combinable needle guide assemblies, each needle guide assembly further includes a mounting block, and the needle of the needle guide assembly is mounted on the mounting block; In each pair of adjacent guide needle assemblies, the mounting block of one guide needle assembly is provided with a first connecting portion, and the mounting block of the other guide needle assembly is provided with a second connecting portion. The first connecting portion and the second connecting portion are detachably engaged to allow the two adjacent guide needle assemblies to be detachably connected.

6. The auxiliary device as described in claim 5, characterized in that, The guide needle mechanism includes at least one transition block, and each transition block is disposed between two guide needle assemblies; The transition block is provided with a third connecting part, and each of the guide needle assemblies adjacent to the transition block is provided with a fourth connecting part. The third connecting part and the fourth connecting part are detachably coupled so that the transition block is detachably connected between the two guide needle assemblies.

7. The auxiliary device as described in claim 6, characterized in that, Multiple guide pin assemblies and at least one transition block are arranged and combined according to a preset rule so that when the fixing mechanism detachably fixes the guide pin mechanism to the chip, the guide pin mechanism extends along the circumference of the chip, and at least one guide pin assembly is distributed on each of the opposite sides of the chip in a preset dimension direction, the preset dimension direction being perpendicular to the thickness direction of the chip. The fixing mechanism includes at least two locking components. At least one of the locking components is disposed on at least one of the guide pin components on one side of the chip in the preset size direction, and at least one of the locking components is disposed on at least one of the guide pin components on the other side of the chip in the preset size direction. Each locking component is configured to clamp the side wall of the chip when the fixing mechanism detachably fixes the guide pin mechanism to the chip.

8. The auxiliary device as described in claim 7, characterized in that, The first and second ends of the guide pin both extend along the first direction, and the locking assembly is disposed on one side of the mounting block in the second direction. The first direction, the second direction, and the third direction are perpendicular to each other. The locking assembly includes a first rotating shaft, a second rotating shaft, a lever, a stop member, and an elastic member. The first rotating shaft is fixedly connected to the mounting block. The lever has a first end, a second end, and a connecting portion located between the two ends. The connecting portion is rotatably connected to the first rotating shaft, and both ends of the lever are located on the side of the first rotating shaft closer to the second end of the guide pin. The two ends of the lever are spaced apart along the third direction and are respectively located on opposite sides of the first rotating shaft in the third direction. The first end of the lever is farther away from the second end of the guide pin than the second end of the lever. The first end of the lever and the first end of the stop member are both rotatably connected to the second rotating shaft. The second end of the stop member is a free end. The elastic member is connected to the lever. Wherein, when the fixing mechanism detachably fixes the guide pin mechanism to the chip, the first direction is parallel to the thickness direction of the chip, and the second direction is parallel to the extension direction of a portion of the chip's sidewall adjacent to the mounting block; the second end of the stop member is configured to move along the first direction and toward the side away from the second end of the guide pin under the action of an external force, so as to drive the lever member to rotate clockwise around the first axis until the second end of the lever member clamps the sidewall of the chip, the elastic member is driven by the lever member to undergo elastic deformation to generate an elastic force, and the elastic force is configured to drive the lever member to rotate counterclockwise around the first axis until it returns to the initial position when the external force is removed.

9. The auxiliary device as described in claim 8, characterized in that, The mounting block includes a mounting block body and a first mounting plate. The first rotating shaft is fixedly connected to the mounting block body. The first mounting plate is located on one side of the mounting block body in the second direction and on the side of the first rotating shaft away from the stop member. The elastic member is a spring with one end connected to the first mounting plate and the other end connected to the lever member.

10. The auxiliary device as described in claim 9, characterized in that, The mounting block includes a second mounting plate, which is spaced apart from the first mounting plate along the third direction and located on opposite sides of the first rotating shaft. A guide groove is provided on the side of the second mounting plate facing away from the mounting block body. At least a portion of the end of the second rotating shaft near the mounting block body is received in the guide groove. The guide groove is configured to guide the second rotating shaft to move along the first direction.

Images