Coupling structure of silicon optical chip and FAU

Abstract

The utility model discloses a coupling structure of a silicon optical chip and an FAU, comprising a silicon optical chip and an FAU, the silicon optical chip and the FAU are provided with a plug-in assembly, the plug-in assembly comprises a support sleeve and an interface, the support sleeve is provided with a sealing assembly, the sealing assembly comprises a slot and a sealing ring, the support sleeve is provided with a locking assembly, and the locking assembly is connected with the interface. The locking assembly comprises a clamping pin and a clamping groove, the interface is provided with a limiting assembly, the limiting assembly comprises a clamping opening and a second spring, the interface is provided with a protection assembly, and the coupling structure of the silicon optical chip and the FAU can enable the bottom end of the clamping pin to only move rightwards in one direction at the top of a stop block under the cooperation of a wedge pattern and the second spring; therefore, it is guaranteed that the interface can be inserted into the inner side of the slot more and more tightly under the action of vibration, infirm connection or untight coupling of the silicon optical chip and the FAU is avoided, safe work of the silicon optical chip is effectively guaranteed, and the connector is suitable for rapid installation and coupling of the silicon optical chip and the FAU.

Description

Technical Field

[0001] This utility model relates to the field of silicon photonic chip coupling structure technology, specifically a coupling structure between a silicon photonic chip and a FAU. Background Technology

[0002] When using silicon photonics chips, a silicon photonics chip coupling structure is often required for installation and coupling. Utility model patent application number CN202020701519.3 discloses a coupling structure between a silicon photonics chip and an active chip, including a silicon photonics chip, a ceramic substrate, a ceramic ferrule, a capillary tube, an active chip assembly, metal pins, and a single-mode optical fiber. The silicon photonics chip is disposed on one side of the ceramic substrate. The ceramic ferrule, opposite and on the same side as the silicon photonics chip, is disposed on one side of the ceramic substrate and has a base plate inside. The active chip assembly is disposed on the base plate of the ceramic ferrule. The single-mode optical fiber connects the active chip assembly and the silicon photonics chip respectively to transmit light. The capillary tube is used to hermetically seal the active chip assembly. The metal pins are electrically connected to the active chip within the active chip assembly to provide driving energy. This coupling structure can reduce the size and cost of the coupling package. At the same time, it solves the reliability problem of active chip hermetically sealed packaging. According to its publicly available technical solution, the existing silicon photonics chip coupling structure has two problems when in use. On the one hand, it cannot quickly perform the fixed coupling work, which reduces the efficiency of the installation coupling work. On the other hand, after installation and fixing, it is easy to loosen due to vibration, which is not conducive to ensuring the installation firmness of the silicon photonics chip and the normal operation of data transmission.

[0003] Therefore, how to design the coupling structure between the silicon photonics chip and the FAU has become the problem we need to solve. Utility Model Content

[0004] In view of the shortcomings of the existing technology, the purpose of this utility model is to provide a coupling structure between a silicon photonic chip and a FAU to solve the problems mentioned in the background. This utility model is reasonably designed, convenient to use, and suitable for rapid installation and coupling of silicon photonic chips and FAU.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a coupling structure between a silicon photonic chip and a fairing active unit (FAU), comprising a silicon photonic chip and a fairing active unit (FAU), wherein a plug-in assembly is mounted on the silicon photonic chip and the FAU, the plug-in assembly comprising a support and an interface, a sealing assembly comprising a slot and a sealing ring, a locking assembly comprising a locking pin and a locking groove, a limiting assembly comprising a locking slot and a spring, a blocking assembly comprising a blocking block and a wedge pattern, and a pressing assembly comprising a sliding groove and a pushing block.

[0006] Furthermore, the sleeve is fitted onto the outer side of the FAU, the interface is soldered to one side of the silicon photonic chip, and the slot is opened on the inner side of the sleeve.

[0007] Furthermore, one end of the FAU is inserted into the inside of the interface, the interface is secured to the inside of the slot, the sealing ring is adhered to the inner wall of the slot, and the outer side of the interface is secured to the sealing ring.

[0008] Furthermore, the slot is formed on the inner side of the support sleeve, one end of the locking pin is connected to the inner wall of the slot through a spring, one end of the locking pin is welded with a pull rod, and one end of the pull rod passes through the slot and extends to the outer side of the support sleeve.

[0009] Furthermore, the bayonet is located on the inside of the interface, and the other end of the pin passes through the slot and extends to the inside of the bayonet.

[0010] Furthermore, both sides of the stop block are engaged with the inner wall of the bayonet, one end of the stop block is connected to the inner wall of the bayonet via a spring, the wedge pattern is formed at the other end of the stop block, the wedge pattern is evenly distributed on the stop block, and the other end of the locking pin is engaged with the wedge pattern.

[0011] Furthermore, the slide groove is formed on the inner side of the interface, the slide groove is located on one side of the bayonet, and the outer side of the push block is engaged with the inner wall of the slide groove.

[0012] Furthermore, one end of the push block is connected to the inner wall of the slide groove via a spring, and the other end of the push block is engaged with the outer side of the locking pin or the stop block.

[0013] Beneficial effects: 1. When using this coupling structure between the silicon photonic chip and the FAU, the interface on the silicon photonic chip is pressed and inserted into the inner side of the slot in the support until the bayonet on the interface moves to align with the locking pin. A spring pushes the locking pin into the inner side of the bayonet, locking the interface inside the slot. At the same time, the interface presses against the sealing ring, and the sealing ring seals the interface inside the slot. The FAU is then inserted into the inner side of the interface, which can quickly realize the fixing and coupling of the FAU and the silicon photonic chip, improving work efficiency.

[0014] 2. In use, when the coupling structure between the silicon photonics chip and the FAU is inserted into the inner side of the slot, the spring force of spring one is greater than that of spring two, causing the pin to press against the stop block inside the slot. This causes the stop block to move outside the push block until it separates from the push block. Then, under the spring force of spring three, the push block moves to the right from the inside of the groove. The pin is fixed to the inside of the support sleeve by the limiting position of the slot. This allows the push block to continue pressing and pushing the interface to the left under the spring force of spring three. The bottom end of the pin, through the wedge pattern and the cooperation of spring two, can only move to the right in one direction from the top of the stop block. This effectively ensures that the interface is inserted into the slot more and more tightly under the action of vibration, thus effectively preventing the silicon photonics chip and the FAU from having a loose connection or poor coupling, and thus effectively ensuring the safe operation of the silicon photonics chip.

[0015] 3. The coupling structure between the silicon photonics chip and the FAU is reasonably designed, making it highly efficient and convenient to use. It is suitable for the rapid installation and coupling of the silicon photonics chip and the FAU. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the coupling structure between a silicon photonics chip and a FAU according to the present invention.

[0017] Figure 2 This is a cross-sectional view of the coupling structure between a silicon photonics chip and a FAU according to this utility model;

[0018] Figure 3 This is a schematic diagram of the FAU structure of the coupling structure between a silicon photonics chip and a FAU according to this utility model;

[0019] Figure 4 This is a schematic diagram of the silicon photonics chip with a coupling structure between the silicon photonics chip and the FAU according to this utility model.

[0020] Figure 5 This is a schematic diagram of the bayonet structure for the coupling structure between a silicon photonics chip and a FAU according to this utility model;

[0021] In the diagram: 1. Silicon photonics chip; 2. FAU; 3. Support sleeve; 4. Slot; 5. Interface; 6. Sealing ring; 7. Bayonet; 8. Slot; 9. Pin; 10. Pull rod; 11. Spring 1; 12. Stop block; 13. Spring 2; 14. Wedge pattern; 15. Slide groove; 16. Push block; 17. Spring 3. Detailed Implementation

[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0023] Please see Figures 1 to 5 This utility model provides a technical solution: a coupling structure between a silicon photonic chip and a fairing active unit (FAU), comprising a silicon photonic chip 1 and a fairing active unit (FAU2). A connector assembly is mounted on the silicon photonic chip 1 and the FAU2. The connector assembly includes a sleeve 3 and an interface 5. A sealing assembly is mounted on the sleeve 3, comprising a slot 4 and a sealing ring 6. A locking assembly is mounted on the sleeve 3, comprising a locking pin 9 and a locking groove 8. A limiting assembly is mounted on the interface 5, comprising a locking slot 7 and a spring 13. A blocking assembly is mounted on the locking slot 7, comprising a blocking block 12 and a wedge pattern 14. A pressing assembly is mounted on the interface 5, comprising a sliding groove 15 and a pushing block 16. The sleeve 3 is fitted onto the outer side of the FAU2. The interface 5 is welded to one side of the silicon photonic chip 1. The slot 4 is located inside the sleeve 3. One end of the FAU2 is inserted into the connector assembly. Inside the port 5, the interface 5 is snapped into the inside of the slot 4. The sealing ring 6 is adhered to the inner wall of the slot 4. The outer side of the interface 5 is snapped into the sealing ring 6. The slot 8 is opened inside the support 3. One end of the locking pin 9 is connected to the inner wall of the slot 8 through a spring 11. A pull rod 10 is welded to one end of the locking pin 9. One end of the pull rod 10 passes through the slot 8 and extends to the outside of the support 3. In use, the interface 5 on the silicon photonic chip 1 is squeezed and inserted into the inside of the slot 4 in the support 3 until the locking opening 7 on the interface 5 moves to align with the locking pin 9. The spring 11 pushes the locking pin 9 into the inside of the locking opening 7, locking the interface 5 inside the slot 4. At the same time, the interface 5 squeezes the sealing ring 6 and seals the interface 5 inside the slot 4 through the sealing ring 6. The FAU2 is inserted into the inside of the interface 5, which can quickly realize the fixing and coupling of the FAU2 and the silicon photonic chip 1, improving work efficiency.

[0024] In this embodiment, the bayonet 7 is located inside the interface 5. The other end of the locking pin 9 passes through the slot 8 and extends to the inside of the bayonet 7. Both sides of the stop block 12 are engaged with the inner wall of the bayonet 7. One end of the stop block 12 is connected to the inner wall of the bayonet 7 via a spring 13. The wedge pattern 14 is located at the other end of the stop block 12 and is evenly distributed on the stop block 12. The other end of the locking pin 9 is engaged with the wedge pattern 14. The sliding groove 15 is located inside the interface 5 and is situated on one side of the bayonet 7. The outer side of the push block 16 is engaged with the inner wall of the sliding groove 15. One end of the push block 16 is connected to the inner wall of the sliding groove 15 via a spring 17. The other end of the push block 16 is engaged with the outer side of the locking pin 9 or the stop block 12. In use, when the locking pin 9 is inserted into the inside of the bayonet 7, under the elastic force of the spring 11, the spring... The elastic force of spring 11 is greater than that of spring 213, causing the locking pin 9 to press against the stop block 12 inside the slot 7, which in turn causes the stop block 12 to move outside the push block 16 until the stop block 12 moves to separate from the push block 16. Then, under the elastic force of spring 317, the push block 16 moves to the right from the inside of the slide groove 15. The locking pin 9 is fixed inside the support sleeve 3 under the limit of the slot 8, which in turn causes the push block 16 to continue to press and push the interface 5 to the left under the elastic force of spring 317. The bottom end of the locking pin 9 can only move to the right in one direction from the top of the stop block 12 through the cooperation of the wedge pattern 14 and spring 213. This effectively ensures that the interface 5 will only be inserted into the inner side of the slot 4 more and more tightly under the action of vibration, thus effectively avoiding the silicon photonic chip 1 and FAU2 from being loosely connected or loosely coupled, and thus effectively ensuring the safe operation of the silicon photonic chip 1.

[0025] In use, the coupling structure between the silicon photonic chip and the FAU involves pressing the interface 5 on the silicon photonic chip 1 into the slot 4 inside the support 3 until the latch 7 on the interface 5 aligns with the locking pin 9. Spring 11 then pushes the locking pin 9 into the latch 7, locking the interface 5 inside the slot 4. Simultaneously, the interface 5 presses against the sealing ring 6, sealing the interface 5 inside the slot 4. The FAU2 is then inserted into the interface 5. This allows for rapid fixing and coupling of the FAU2 and the silicon photonic chip 1, improving work efficiency. During use, when the locking pin 9 is inserted into the latch 7, the spring force of spring 11, greater than that of spring 2 13, causes the locking pin 9 to press against the latch 7. Block 12, which in turn causes the stop block 12 to move outside the push block 16 until the stop block 12 moves to separate from the push block 16. Then, the push block 16 moves to the right from the inside of the slide groove 15 under the elastic force of the spring 3 17. The locking pin 9 is fixed to the inside of the support sleeve 3 under the limit of the locking groove 8. Then, the push block 16 continues to push the interface 5 to the left under the elastic force of the spring 3 17. The bottom end of the locking pin 9 can only move to the right in one direction at the top of the stop block 12 through the cooperation of the wedge 14 and the spring 2 13. This effectively ensures that the interface 5 will only be inserted into the inside of the slot 4 more and more tightly under the action of vibration. This effectively avoids the silicon photonic chip 1 and the FAU2 from being loosely connected or loosely coupled. This effectively ensures the safe operation of the silicon photonic chip 1.

[0026] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A coupling structure between a silicon photonic chip and a fairing active unit (FAU), comprising a silicon photonic chip (1) and a fairing active unit (FAU) (2), wherein a connector assembly is mounted on the silicon photonic chip (1) and the fairing active unit (FAU) (2), the connector assembly comprising a sleeve (3) and an interface (5), characterized in that: A sealing assembly is installed on the support sleeve (3), the sealing assembly includes a slot (4) and a sealing ring (6). A locking assembly is installed on the support sleeve (3), the locking assembly includes a locking pin (9) and a locking groove (8). A limiting assembly is installed on the interface (5), the limiting assembly includes a locking slot (7) and a spring (13). A blocking assembly is installed on the locking slot (7), the blocking assembly includes a stop block (12) and a wedge pattern (14). A pressing assembly is installed on the interface (5), the pressing assembly includes a sliding groove (15) and a push block (16).

2. The coupling structure between a silicon photonic chip and a FAU according to claim 1, characterized in that: The sleeve (3) is fitted on the outer side of the FAU (2), the interface (5) is welded to one side of the silicon photonic chip (1), and the slot (4) is opened on the inner side of the sleeve (3).

3. The coupling structure between a silicon photonic chip and a FAU according to claim 2, characterized in that: One end of the FAU (2) is inserted into the inside of the interface (5), the interface (5) is locked inside the slot (4), the sealing ring (6) is bonded to the inner wall of the slot (4), and the outer side of the interface (5) is locked onto the sealing ring (6).

4. The coupling structure between a silicon photonic chip and a FAU according to claim 1, characterized in that: The slot (8) is opened on the inner side of the sleeve (3). One end of the pin (9) is connected to the inner wall of the slot (8) through a spring (11). A pull rod (10) is welded to one end of the pin (9). One end of the pull rod (10) passes through the slot (8) and extends to the outer side of the sleeve (3).

5. The coupling structure between a silicon photonic chip and a FAU according to claim 4, characterized in that: The bayonet (7) is located inside the interface (5), and the other end of the pin (9) passes through the slot (8) and extends to the inside of the bayonet (7).

6. The coupling structure between a silicon photonic chip and a FAU according to claim 5, characterized in that: Both sides of the stop block (12) are locked on the inner wall of the bayonet (7). One end of the stop block (12) is connected to the inner wall of the bayonet (7) through the second spring (13). The wedge pattern (14) is opened on the other end of the stop block (12). The wedge pattern (14) is evenly distributed on the stop block (12). The other end of the locking pin (9) is locked on the wedge pattern (14).

7. The coupling structure between a silicon photonic chip and a FAU according to claim 6, characterized in that: The groove (15) is opened on the inner side of the interface (5), the groove (15) is located on one side of the bayonet (7), and the outer side of the push block (16) is stuck on the inner wall of the groove (15).

8. The coupling structure between a silicon photonic chip and a FAU according to claim 7, characterized in that: One end of the push block (16) is connected to the inner wall of the slide groove (15) via spring three (17), and the other end of the push block (16) is locked on the outer side of the locking pin (9) or the stop block (12).

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