Notebook computer heat dissipation module and notebook computer

Abstract

The utility model discloses a notebook computer heat dissipation module and a notebook computer, and relates to the technical field of electronic products, and the notebook computer heat dissipation module comprises a fan shell, heat dissipation fins and a heat dissipation plate; the fan shell comprises a first shell body and a second shell body, and a containing cavity is defined by the first shell body and the second shell body. The heat dissipation fins are arranged on one side of the fan shell, and part of the heat dissipation fins are arranged in the containing cavity and connected with the first shell; partial structure of the heat dissipation pipe is arranged in the containing cavity and is attached to the heat dissipation fins and the second shell; according to the technical scheme provided by the utility model, the occupied space of the heat dissipation module of the notebook computer can be reduced.

Description

Technical Field

[0001] This utility model relates to the field of electronic product technology, and in particular to a laptop heat dissipation module and a laptop. Background Technology

[0002] With the trend towards thinner, lighter, and higher-performance laptops, processor heat generation is constantly increasing, placing higher demands on the design of laptop cooling modules. Traditional laptop cooling modules typically employ a combination of fans, heat sinks, and heat pipes. Their working principle involves the fan providing airflow to dissipate heat from the surfaces of the heat sinks and heat pipes, thereby reducing the temperature of the processor and surrounding components. However, existing laptop cooling modules usually have independently designed fans, heat sinks, and heat pipes, resulting in complex connections between components and occupying a significant amount of space, making it difficult to meet the space constraints of thin and light laptops. Utility Model Content

[0003] The main purpose of this invention is to provide a laptop cooling module and a laptop, which aims to reduce the space occupied by the laptop cooling module.

[0004] To achieve the above objectives, the present invention provides a notebook heat dissipation module comprising:

[0005] A fan housing, the fan housing comprising a first housing and a second housing, the first housing and the second housing enclosing a receiving cavity;

[0006] Heat dissipation fins, wherein the heat dissipation fins are disposed on one side of the fan housing, and a portion of the structure of the heat dissipation fins is disposed within the receiving cavity and connected to the first housing; and

[0007] A heat dissipation pipe, part of which is located within the receiving cavity and is attached to the heat dissipation fins and the second housing.

[0008] In one embodiment, the laptop cooling module includes two fan housings, two cooling fins, and a plurality of heat pipes. Each cooling fin is disposed on one side of a fan housing, and each cooling fin is connected to at least one heat pipe.

[0009] The laptop cooling module also includes a heat sink, which is located between the two fan housings, and the end of each heat pipe away from the heat sink fins is connected to the heat sink.

[0010] In one embodiment, the heat sink is formed with a receiving groove, and each of the heat sink pipes is disposed in the receiving groove.

[0011] In one embodiment, thermal grease is provided on the side of the heat sink facing away from the heat pipe.

[0012] In one embodiment, the heat sink is provided with a plurality of first mounting blocks on its periphery, and each first mounting block is provided with a first mounting hole.

[0013] In one embodiment, the heat dissipation fins include a first heat-conducting part and a second heat-conducting part connected to each other, the first heat-conducting part being inserted into the receiving cavity and connected to the first housing;

[0014] The second heat-conducting part protrudes from the fan housing along the thickness direction of the fan housing.

[0015] In one embodiment, the heat dissipation fins are welded to the first housing; and / or

[0016] Both the heat dissipation fins and the second housing are welded to the heat dissipation pipe.

[0017] In one embodiment, the first housing and the second housing are made of copper; and / or

[0018] The heat pipe is made of copper.

[0019] In one embodiment, the fan housing has a plurality of second mounting blocks on its periphery, and the first mounting block has a second mounting hole.

[0020] This utility model also proposes a notebook computer, including the notebook computer heat dissipation module as described above.

[0021] In this invention, the fan housing, heat dissipation fins, and heat pipes are designed as a single integrated structure. The fan housing not only provides airflow but also acts as a medium for heat conduction, transferring heat from the heat dissipation fins and heat pipes to the entire housing, thereby improving heat conduction efficiency and preventing heat accumulation. Partial structures of the heat dissipation fins and heat pipes are housed within the receiving cavity of the fan housing and are fitted to the first and second shells of the fan housing. This increases the contact area between the heat dissipation fins and heat pipes, shortens the heat conduction path, and thus improves heat exchange efficiency. This allows for rapid heat transfer from the processor to the outside, while also making the entire laptop cooling module more compact and space-saving, meeting the strict space requirements of thin and light laptops. Attached Figure Description

[0022] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0023] Figure 1 A schematic diagram of a structural embodiment of the notebook heat dissipation module provided by this utility model;

[0024] Figure 2 A schematic diagram of another embodiment of the notebook heat dissipation module provided by this utility model;

[0025] Figure 3 A schematic diagram of another embodiment of the notebook heat dissipation module provided by this utility model;

[0026] Figure 4 This is a schematic diagram of the structure of a laptop heat dissipation module according to an embodiment of the present invention, applied to a laptop.

[0027] Explanation of icon numbers:

[0028] 100. Notebook cooling module; 1. Fan housing; 11. First housing; 12. Second housing; 13. Second mounting block; 2. Heat dissipation fins; 21. First heat conduction part; 22. Second heat conduction part; 3. Heat pipe; 4. Heat dissipation plate; 41. First mounting block; 5. Thermal grease.

[0029] The realization of the purpose, functional features and advantages of this utility model will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0030] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present utility model.

[0031] It should be noted that if the embodiments of this utility model involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a specific posture. If the specific posture changes, the directional indicators will also change accordingly.

[0032] Furthermore, if the embodiments of this utility model involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the use of "and / or" or "and / or" throughout the text includes three parallel solutions. For example, "A and / or B" includes solution A, solution B, or a solution where both A and B are satisfied simultaneously. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this utility model.

[0033] This utility model proposes a notebook heat dissipation module 100.

[0034] Please see Figures 1 to 4 In one embodiment of the present invention, the notebook heat dissipation module 100 includes a fan housing 1, heat dissipation fins 2, and a heat dissipation plate 4; the fan housing 1 includes a first housing 11 and a second housing 12, which together form a receiving cavity; the heat dissipation fins 2 are disposed on one side of the fan housing 1, and a portion of the structure of the heat dissipation fins 2 is disposed within the receiving cavity and connected to the first housing 11; a portion of the structure of the heat dissipation pipe 3 is disposed within the receiving cavity and is attached to the heat dissipation fins 2 and the second housing 12.

[0035] In this invention, the fan housing 1, heat dissipation fins 2, and heat pipes 3 are designed as a single integrated structure. The fan housing 1 not only provides airflow but also acts as a medium for heat conduction, transferring heat from the heat dissipation fins 2 and heat pipes 3 to the entire housing, thereby improving heat conduction efficiency and preventing heat accumulation. Partial structures of the heat dissipation fins 2 and heat pipes 3 are housed within the receiving cavity of the fan housing 1 and are in close contact with the first housing 11 and the second housing 12 of the fan housing 1. This increases the contact area between the heat dissipation fins 2 and heat pipes 3, shortens the heat conduction path, and thus improves heat exchange efficiency. This allows for rapid heat transfer from the processor to the outside, while also making the entire laptop cooling module 100 more compact and space-saving, meeting the strict space requirements of thin and light laptops. Furthermore, due to the improved heat conduction and heat exchange efficiency of the laptop cooling module 100, the fan can achieve effective heat dissipation at lower speeds, thereby reducing fan noise and improving the user experience.

[0036] To improve heat dissipation efficiency, please refer to one embodiment of this utility model. Figure 1 and Figure 2The laptop cooling module 100 includes two fan housings 1, two heat dissipation fins 2 and multiple heat pipes 3. Each heat dissipation fin 2 is located on one side of a fan housing 1 and each heat dissipation fin 2 is connected to at least one heat pipe 3. The laptop cooling module 100 also includes a heat dissipation plate 4, which is located between the two fan housings 1. The end of each heat pipe 3 away from the heat dissipation fin 2 is connected to the heat dissipation plate 4.

[0037] The design of two fan housings 1 and two heat sinks 2 allows the laptop cooling module 100 to dissipate heat in multiple areas simultaneously, increasing the heat dissipation area and improving overall cooling efficiency. Simultaneously, the heat sink 4 ensures heat is evenly distributed between the two fan housings 1, preventing localized overheating and improving heat dissipation uniformity. Furthermore, connecting the heat pipes 3 to the heat sink 4 enhances the structural stability of the entire laptop cooling module 100, making it more stable during operation and reducing component loosening due to vibration or impact. In addition, the connection between the heat pipes 3, the heat sinks 2, and the heat sink 4 optimizes the heat conduction path, allowing heat to be transferred more quickly from the processor to the heat sinks 2 and fan housings 1, further improving cooling efficiency. In this embodiment, depending on actual usage requirements, one fan housing 1 has one heat pipe 3, and the other fan housing 1 has two heat pipes 3; in other embodiments, the number of heat pipes 3 can also be different.

[0038] Furthermore, in one embodiment of this utility model, the heat sink 4 has a receiving groove, and each heat sink 3 is disposed within the receiving groove. Placing the heat sink 3 within the receiving groove ensures the stability and fixation of the heat sink 3, preventing it from shifting or being damaged due to vibration or collision during operation, thereby improving the reliability of the laptop cooling module 100. The increased contact area between the heat sink 3 and the heat sink 4, along with the design of the receiving groove, allows the heat sink 3 to fit more tightly against the heat sink 4, thus more effectively transferring heat from the processor to the heat sink 4, and then dissipating it through the fan housing 1 and the heat dissipation fins 2. The receiving groove design allows the heat sink 3 to be neatly arranged on the heat sink 4, reducing mutual interference between the heat sink 3 and making the entire laptop cooling module 100 more compact and tidy. The receiving groove of the heat sink 4 provides additional support for the heat sink 3, enhancing the structural strength of the entire laptop cooling module 100 and making the laptop cooling module 100 more stable during operation.

[0039] Furthermore, in one embodiment of this utility model, please refer to... Figure 2Thermal grease 5 is applied to the side of the heat sink 4 facing away from the heat pipe 3. The thermal grease 5 is used to adhere to heat-generating components such as the laptop's processor or circuit board. It fills the tiny gaps between the heat sink 4 and the heat-generating components, reducing thermal resistance and allowing heat to be transferred more efficiently from the heat-generating components to the heat sink 4, and then dissipated through the heat pipe 3 and fan housing 1. The thermal grease 5 ensures a tight fit between the heat sink 4 and the heat-generating components, preventing uneven heat transfer due to surface roughness, thereby improving heat dissipation efficiency. Furthermore, the thermal grease 5 is easy to apply and replace, simplifying the maintenance of the laptop cooling module 100. Users can easily maintain it as needed without requiring specialized tools or skills. The location and amount of thermal grease 5 can be set according to actual usage requirements.

[0040] For ease of installation, please refer to one embodiment of this utility model. Figure 1 The heat sink 4 has multiple first mounting blocks 41 around its periphery, and each first mounting block 41 has a first mounting hole. The design of the first mounting blocks 41 and the first mounting holes allows the laptop cooling module 100 to be easily installed onto the laptop chassis. Screws or other fasteners are passed through the mounting holes to securely fix the laptop cooling module 100 in the designated position. The multiple first mounting blocks 41 distributed around the periphery of the heat sink 4 ensure that the laptop cooling module 100 receives good support and fixation in all directions, avoiding instability caused by single-point fixation. Furthermore, the multiple first mounting blocks 41 allow the laptop cooling module 100 to adapt to different installation positions and orientations, providing greater installation flexibility and meeting the cooling needs of different laptop models. The first mounting holes allow for easy disassembly and reinstallation of the laptop cooling module 100, facilitating maintenance, cleaning, or component replacement when needed.

[0041] Specifically, in one embodiment of this utility model, please refer to... Figure 3The heat dissipation fins 2 include a first heat-conducting part 21 and a second heat-conducting part 22 connected to each other. The first heat-conducting part 21 is inserted into the receiving cavity and connected to the first housing 11; the second heat-conducting part 22 protrudes from the fan housing 1 along its thickness direction. The first heat-conducting part 21 is directly inserted into the receiving cavity of the fan housing 1 and connected to the first housing 11. This design allows heat to be quickly transferred from the heat dissipation fins 2 to the fan housing 1 and then dissipated through the airflow of the fan, improving heat conduction efficiency. The second heat-conducting part 22 protrudes from the fan housing 1, increasing the contact area between the heat dissipation fins 2 and the external air, thereby improving heat dissipation efficiency and allowing heat to be dissipated to the surrounding environment more quickly. The first heat-conducting part 21 is inserted into the receiving cavity, saving space and making the entire laptop cooling module 100 more compact, suitable for the limited space of thin and light laptops. The protruding second heat-conducting part 22 can be designed with different shapes and sizes as needed to adapt to the heat dissipation needs of different heat-generating areas inside the laptop, providing more precise heat dissipation.

[0042] To ensure structural stability, in one embodiment of this invention, the heat dissipation fins 2 are welded to the first housing 11; simultaneously, both the heat dissipation fins 2 and the second housing 12 are welded to the heat pipes 3. Welding is a very robust connection method, ensuring a tight connection between the heat dissipation fins 2, the first housing 11, and the heat pipes 3, thereby improving the structural stability of the entire laptop cooling module 100. Furthermore, welding ensures good heat conduction between the heat dissipation fins 2, the first housing 11, the second housing 12, and the heat pipes 3, reducing thermal resistance and allowing for more efficient heat transfer and dissipation. In addition, welding reduces reliance on other fixing components (such as screws, clips, etc.), simplifying the structure of the laptop cooling module 100 and reducing production costs and assembly complexity.

[0043] Specifically, in one embodiment of this utility model, the first housing 11 and the second housing 12 are made of copper; and the heat pipe 3 is also made of copper. Copper has very high thermal conductivity, enabling it to quickly transfer heat from the heat source to the heat dissipation fins 2 and the fan housing 1, thereby improving the overall heat transfer efficiency of the laptop cooling module 100. Copper also possesses good mechanical strength and corrosion resistance, ensuring the stability of the first housing 11, the second housing 12, and the heat pipe 3 during prolonged use and reducing the decline in heat dissipation performance due to material aging or damage. Furthermore, copper has good weldability, ensuring a strong and reliable welded connection between the heat dissipation fins 2, the housing, and the heat pipe 3, further improving the structural stability and heat transfer efficiency of the laptop cooling module 100.

[0044] Furthermore, in one embodiment of this utility model, please refer to... Figure 1The fan housing 1 has multiple second mounting blocks 13 around its periphery, and the first mounting block 41 has second mounting holes. The design of the second mounting blocks 13 and second mounting holes allows the fan housing 1 to be easily installed onto the laptop chassis, providing more installation position and orientation options and enhancing installation flexibility. The multiple second mounting blocks 13 distributed around the periphery of the fan housing 1 ensure that the fan housing 1 is well supported and fixed in all directions, avoiding instability caused by single-point fixing. The second mounting holes allow for easy disassembly and reinstallation of the fan housing 1, facilitating maintenance, cleaning, or component replacement when needed.

[0045] This utility model also proposes a notebook computer, which includes the notebook computer heat dissipation module 100 described above. The specific structure of the notebook computer heat dissipation module 100 is as described in the above embodiments. Since this notebook computer adopts all the technical solutions of all the above embodiments, it has at least all the beneficial effects brought about by the technical solutions of the above embodiments, which will not be described in detail here.

[0046] The above description is merely an exemplary embodiment of the present utility model and does not limit the patent scope of the present utility model. Any equivalent structural transformations made based on the technical concept of the present utility model and the contents of the present utility model specification and drawings, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present utility model.

Claims

1. A laptop cooling module, characterized in that, include: A fan housing, the fan housing comprising a first housing and a second housing, the first housing and the second housing enclosing a receiving cavity; The heat dissipation fins are disposed on one side of the fan housing, and a portion of the structure of the heat dissipation fins is disposed within the receiving cavity and connected to the first housing. as well as A heat dissipation pipe, part of which is located within the receiving cavity and is attached to the heat dissipation fins and the second housing.

2. The laptop cooling module as described in claim 1, characterized in that, The laptop cooling module includes two fan housings, two cooling fins, and multiple heat pipes. Each cooling fin is located on one side of a fan housing, and each cooling fin is connected to at least one heat pipe. The laptop cooling module also includes a heat sink, which is located between the two fan housings, and the end of each heat pipe away from the heat sink fins is connected to the heat sink.

3. The laptop cooling module as described in claim 2, characterized in that, The heat sink has a receiving groove, and each of the heat sink pipes is disposed in the receiving groove.

4. The laptop cooling module as described in claim 3, characterized in that, Thermal grease is applied to the side of the heat sink facing away from the heat pipe.

5. The laptop cooling module as described in claim 2, characterized in that, The heat sink is provided with a plurality of first mounting blocks on its periphery, and each first mounting block is provided with a first mounting hole.

6. The laptop cooling module as described in claim 1, characterized in that, The heat dissipation fins include a first heat-conducting part and a second heat-conducting part connected to each other. The first heat-conducting part is inserted into the receiving cavity and connected to the first housing. The second heat-conducting part protrudes from the fan housing along the thickness direction of the fan housing.

7. The laptop cooling module as described in claim 1, characterized in that, The heat dissipation fins are welded to the first housing; and / or Both the heat dissipation fins and the second housing are welded to the heat dissipation pipe.

8. The laptop cooling module as described in claim 1, characterized in that, The first housing and the second housing are made of copper; and / or The heat pipe is made of copper.

9. The laptop cooling module as described in claim 1, characterized in that, The fan housing has a plurality of second mounting blocks on its periphery, and the second mounting blocks have second mounting holes.

10. A notebook computer, characterized in that, Includes the notebook heat dissipation module as described in any one of claims 1 to 9.

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