Common-mode and differential-mode interference processing integrated capacitor bank

Abstract

The utility model discloses a common-mode and differential-mode interference processing integrated capacitor bank, which is characterized in that a first conducting strip extends downwards out of an integrated box and is horizontally bent outwards to form a first welding piece, and a first front welding disc and a first rear welding disc are formed on the inner side wall of the integrated box; a second front conducting strip and a second rear conducting strip are embedded in the front portion and the rear portion of the other side wall of the integrated box respectively, a second front welding disc and a second rear welding disc are formed on the inner side wall of the integrated box, the second front conducting strip extends downwards to form a second front welding piece, and the second rear conducting strip extends downwards to form a second rear welding piece. The other ends of the first electrode plate and the second electrode plate are respectively bent to form a first welding end plate and a second welding end plate, the other end of the third electrode plate is bent to form a third welding end plate, and the other end of the fourth electrode plate is bent to form a fourth welding end plate which is pressed and welded with the second rear welding disc. According to the utility model, the ceramic capacitor and the thin-film capacitor are integrated and installed in the integration box, and are welded on the circuit board through the solder paste, thereby realizing integration and flattening of capacitor installation.

Description

Technical Field

[0001] This utility model relates to the field of electronic components, and in particular to an integrated capacitor bank for common and differential mode interference processing. Background Technology

[0002] Capacitors are common electronic components on circuit boards. Ceramic capacitors are connected to the neutral and ground lines, or the live and ground lines, respectively, to handle common-mode interference. Film capacitors are connected to the neutral and live lines, respectively, to handle differential-mode interference. Currently, ceramic and film capacitors on circuit boards are generally soldered in different locations on the circuit board as through-hole components, which takes up a lot of space, has low integration, and is not conducive to the miniaturization of circuit boards. Utility Model Content

[0003] The purpose of this invention is to provide an integrated capacitor bank for common and differential mode interference processing in order to solve the above-mentioned problems.

[0004] This utility model achieves the above objectives through the following technical solutions:

[0005] A common- and differential-mode interference processing integrated capacitor bank includes an insulated integrated box, a ceramic capacitor, and a film capacitor. The integrated box has a removable sealed top cover. A first conductive sheet with a front-to-back orientation is embedded in one side wall of the integrated box. The first conductive sheet extends downwards and outwards from the bottom of the integrated box, then bends horizontally to form a first welding sheet. The inner side wall of the integrated box is hollowed out at the front and rear ends corresponding to the first conductive sheet, thus forming a first front welding pad and a first rear welding pad at the front and rear ends of the first conductive sheet, respectively. A second front conductive sheet and a second rear conductive sheet are embedded in the front and rear portions of the other side wall of the integrated box opposite to the first conductive sheet. The inner side wall of the integrated box is hollowed out at the locations corresponding to the second front and second rear conductive sheets, thus forming a second front welding pad and a second rear welding pad at the second front and second rear conductive sheets, respectively. The second front conductive sheet extends downwards and outwards from the bottom of the integrated box, then bends horizontally to form a second welding pad. The second rear conductive sheet extends downwards... The ceramic capacitor extends beyond the bottom of the integrated box and bends outward to form a second post-welding piece. The two electrode output terminals of the ceramic capacitor are a first electrode piece and a second electrode piece in the shape of long strips. One end of the first electrode piece is electrically fixed to one electrode of the ceramic capacitor, and the other end of the first electrode piece is bent to form a first welding end piece that is pressed and welded to the first front welding pad. One end of the second electrode piece is electrically fixed to the other electrode of the ceramic capacitor, and the other end of the second electrode piece is bent to form a second welding end piece that is pressed and welded to the second front welding pad. The two electrode output terminals of the thin film capacitor are a third electrode piece and a fourth electrode piece in the shape of long strips. One end of the third electrode piece is electrically fixed to one electrode of the thin film capacitor, and the other end of the third electrode piece is bent to form a third welding end piece that is pressed and welded to the first post-welding pad. One end of the fourth electrode piece is electrically fixed to the other electrode of the thin film capacitor, and the other end of the fourth electrode piece is bent to form a fourth welding end piece that is pressed and welded to the second post-welding pad.

[0006] Preferably, the integrated box has a partition between the ceramic capacitor and the film capacitor.

[0007] Preferably, one end of the first electrode sheet is horizontally attached to one pole of the ceramic capacitor, and the other end of the first electrode sheet extends horizontally outward and then bends vertically backward to form the first welding end piece. One end of the second electrode sheet is horizontally attached to the other pole of the ceramic capacitor, and the other end of the second electrode sheet extends horizontally outward and then bends vertically forward to form the second welding end piece.

[0008] Preferably, the other end of the third electrode extends horizontally outward and then bends vertically forward to form the third welding end piece, and the other end of the fourth electrode extends horizontally outward and then bends vertically backward to form the fourth welding end piece.

[0009] Preferably, the integrated box has a sealed bottom cover below the ceramic capacitor and the film capacitor.

[0010] Compared with the prior art, this utility model integrates ceramic capacitors and film capacitors into an integrated box, and the first welding piece, the second front welding piece, and the second rear welding piece are soldered to the circuit board with solder paste, realizing the integration and flattening of capacitor installation, which is more conducive to the miniaturization of the circuit board. Attached Figure Description

[0011] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0012] Figure 1 This is a cross-sectional view of the present invention;

[0013] Figure 2 This is a structural diagram of the present invention from the first angle;

[0014] Figure 3 This is a structural diagram of the present invention from a second angle;

[0015] Figure 4 This is a structural diagram of the present invention from the third angle. Detailed Implementation

[0016] In the description of this utility model, it should be understood that the terms "center," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, features defined with "first," "second," etc., may explicitly or implicitly include one or more of that feature. In the description of this utility model, unless otherwise stated, "a plurality of" means two or more.

[0017] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0018] The present invention will be further described below with reference to the accompanying drawings:

[0019] refer to Figures 1 to 4 The present invention provides an integrated capacitor bank for common and differential mode interference processing, comprising an insulated integrated box 10, a ceramic capacitor 20, and a thin film capacitor 30.

[0020] The integrated box 10 has a removable sealed top cover (not shown). A first conductive sheet 11 with a front-to-back orientation is embedded in one side wall of the integrated box 10. The first conductive sheet 11 extends downwards and protrudes from the bottom of the integrated box 10, then bends horizontally outwards to form a first welding sheet 111. The inner side wall of the integrated box 10 is hollowed out at the front and rear ends corresponding to the first conductive sheet 11, thereby forming a first front welding pad 112 and a first rear welding pad 113 at the front and rear ends of the first conductive sheet 11, respectively. A second front conductive sheet 1 with a front-to-back orientation is embedded in the front and rear portions of the other side wall of the integrated box 10 opposite to the first conductive sheet 11. 2. The second front conductive sheet 12 and the second rear conductive sheet 13 are respectively hollowed out on the inner sidewall of the integrated box 10 at the locations corresponding to the second front conductive sheet 12 and the second rear conductive sheet 13, thereby forming the second front welding pad 121 and the second rear welding pad 131 at the locations of the second front conductive sheet 12 and the second rear conductive sheet 13, respectively. The second front conductive sheet 12 extends downward and out of the bottom of the integrated box 10 and bends horizontally outward to form the second front welding sheet 122. The second rear conductive sheet 13 extends downward and out of the bottom of the integrated box 10 and bends horizontally outward to form the second rear welding sheet 132. The bottom surfaces of the first welding sheet 111, the second front welding sheet 122, and the rear welding sheet 132 are located on the same horizontal plane. The two output terminals of the ceramic capacitor 20 are a first electrode plate 21 and a second electrode plate 22 in the shape of a strip. One end of the first electrode plate 21 is electrically fixed to one pole of the ceramic capacitor 20, and the other end of the first electrode plate 21 is bent to form a first welding end plate 211 that is pressed and welded to the first front welding pad 112. One end of the second electrode plate 22 is electrically fixed to the other pole of the ceramic capacitor 20, and the other end of the second electrode plate 22 is bent to form a second welding end plate 221 that is pressed and welded to the second front welding pad 121. The two electrode output terminals of the thin-film capacitor 30 are a strip-shaped third electrode 31 and a fourth electrode 32, respectively. One end of the third electrode 31 is electrically fixed to one electrode of the thin-film capacitor 30, and the other end of the third electrode 31 is bent to form a third welding end piece 311 that is pressed and welded to the first rear welding pad 113. One end of the fourth electrode 32 is electrically fixed to the other electrode of the thin-film capacitor 30, and the other end of the fourth electrode 32 is bent to form a fourth welding end piece 321 that is pressed and welded to the second rear welding pad 131.

[0021] Preferably, the integrated box 10 has a partition 14 between the ceramic capacitor 20 and the film capacitor 30.

[0022] Specifically, one end of the first electrode 21 is horizontally attached to one pole of the ceramic capacitor 20, and the other end of the first electrode 21 extends horizontally outward and then bends vertically backward to form the first welding end piece 211. One end of the second electrode 22 is horizontally attached to the other pole of the ceramic capacitor 20, and the other end of the second electrode 22 extends horizontally outward and then bends vertically forward to form the second welding end piece 221. The other end of the third electrode 31 extends horizontally outward and then bends vertically forward to form the third welding end piece 311, and the other end of the fourth electrode 32 extends horizontally outward and then bends vertically backward to form the fourth welding end piece 321.

[0023] The integrated box 10 has a sealed bottom cover 15 below the ceramic capacitor 20 and the film capacitor 30.

[0024] In use, the first soldering piece 111 is soldered to the neutral pad of the circuit board using solder paste, the second front soldering piece 122 is soldered to the live pad of the circuit board, and the second rear soldering piece 132 is soldered to the ground pad of the circuit board; or the first soldering piece 111 is soldered to the live pad of the circuit board using solder paste, the second front soldering piece 122 is soldered to the neutral pad of the circuit board, and the second rear soldering piece 132 is soldered to the ground pad of the circuit board, thereby integrating the common-mode interference processing capacitor and the differential-mode interference processing capacitor into one unit.

[0025] This invention integrates a ceramic capacitor for common-mode interference treatment and a thin-film capacitor for differential-mode interference treatment into an integrated box. At the same time, the first solder pad, the second front solder pad, and the second rear solder pad are soldered to the circuit board with solder paste, realizing the integration and flattening of capacitor installation, which is more conducive to the miniaturization of the circuit board.

[0026] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claimed utility model.

Claims

1. An integrated capacitor bank for common-mode and differential-mode interference processing, characterized in that: The system includes an insulated integrated box, ceramic capacitors, and film capacitors. The integrated box has a removable sealed top cover. A first conductive sheet with a front-to-back orientation is embedded in one side wall of the integrated box. The first conductive sheet extends downwards and beyond the bottom of the integrated box, then bends horizontally outwards to form a first welding sheet. The inner side wall of the integrated box is hollowed out at the front and rear ends corresponding to the first conductive sheet, thus forming a first front welding pad and a first rear welding pad at the front and rear ends of the first conductive sheet, respectively. A second front conductive sheet and a second rear conductive sheet are embedded in the front and rear portions of the other side wall of the integrated box opposite to the first conductive sheet. The inner side wall of the integrated box is hollowed out at the locations corresponding to the second front and second rear conductive sheets, thus forming a second front welding pad and a second rear welding pad at the second front and second rear conductive sheets, respectively. The second front conductive sheet extends downwards and beyond the bottom of the integrated box, then bends outwards to form a second front welding pad. The second rear conductive sheet extends downwards and beyond the bottom of the integrated box... The bottom of the box is bent outward to form a second post-welding piece. The two electrode output terminals of the ceramic capacitor are a first electrode piece and a second electrode piece in the shape of long strips. One end of the first electrode piece is electrically fixed to one electrode of the ceramic capacitor. The other end of the first electrode piece is bent to form a first welding end piece that is pressed and welded to the first front welding pad. One end of the second electrode piece is electrically fixed to the other electrode of the ceramic capacitor. The other end of the second electrode piece is bent to form a second welding end piece that is pressed and welded to the second front welding pad. The two electrode output terminals of the film capacitor are a third electrode piece and a fourth electrode piece in the shape of long strips. One end of the third electrode piece is electrically fixed to one electrode of the film capacitor. The other end of the third electrode piece is bent to form a third welding end piece that is pressed and welded to the first post-welding pad. One end of the fourth electrode piece is electrically fixed to the other electrode of the film capacitor. The other end of the fourth electrode piece is bent to form a fourth welding end piece that is pressed and welded to the second post-welding pad.

2. The integrated capacitor bank for common-mode and differential-mode interference processing according to claim 1, characterized in that: The integrated box has a partition between the ceramic capacitor and the film capacitor.

3. The integrated capacitor bank for common-mode and differential-mode interference processing according to claim 1, characterized in that: One end of the first electrode is horizontally attached to one pole of the ceramic capacitor, and the other end of the first electrode extends horizontally outward and then bends vertically backward to form the first welding end piece. One end of the second electrode is horizontally attached to the other pole of the ceramic capacitor, and the other end of the second electrode extends horizontally outward and then bends vertically forward to form the second welding end piece.

4. The integrated capacitor bank for common-mode and differential-mode interference processing according to claim 1, characterized in that: The other end of the third electrode extends horizontally outward and then bends vertically forward to form the third welding end piece, and the other end of the fourth electrode extends horizontally outward and then bends vertically backward to form the fourth welding end piece.

5. The integrated capacitor bank for common-mode and differential-mode interference processing according to claim 1, characterized in that: The integrated box has a sealed bottom cover below the ceramic capacitor and the film capacitor.

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