Heat dissipation device, capacitor assembly, controller and vehicle

Abstract

The utility model discloses a heat dissipation device, a capacitor assembly, a controller and a vehicle, and relates to the technical field of capacitors. The heat dissipation device comprises a heat dissipation shell, a fan and a first windshield, the heat dissipation shell is provided with an encapsulation cavity, and at least one outer side wall of the heat dissipation shell is provided with heat dissipation fins extending from the bottom of the heat dissipation shell to the top of the heat dissipation shell; the fan is arranged at the bottom of the heat dissipation shell; the first wind shields are arranged outside at least one outer side wall of the heat dissipation shell, and first air channels are formed between the first wind shields and the heat dissipation fins. The heat dissipation device provided by the utility model is beneficial to improving the heat dissipation effect of the capacitor assembly.

Description

Technical Field

[0001] This disclosure relates to the field of capacitor technology, and more specifically, to a heat dissipation device, capacitor assembly, controller, and vehicle. Background Technology

[0002] Existing capacitor components have low long-term temperature resistance, which often requires strict temperature control of the components during operation to avoid transferring too much heat to the capacitor. This results in an increase in the size of the connecting copper busbar and stricter temperature control of the components, which severely limits the structural size, weight and current output capacity of the assembly product. Utility Model Content

[0003] This disclosure provides a heat dissipation device, a capacitor assembly, a controller, and a vehicle, which helps to improve the heat dissipation effect of the capacitor assembly.

[0004] According to one aspect of this disclosure, a heat dissipation device is provided, comprising:

[0005] A heat dissipation housing having a potting chamber, and at least one outer side wall of the heat dissipation housing having heat dissipation fins extending from the bottom to the top of the heat dissipation housing;

[0006] The fan is located at the bottom of the heat sink housing;

[0007] A first windshield is disposed on at least one outer wall of the heat dissipation housing, and a first air duct is formed between the first windshield and the heat dissipation fins.

[0008] In one exemplary embodiment of this disclosure, the first air duct extends from the bottom of the heat dissipation housing to the top of the heat dissipation housing.

[0009] In one exemplary embodiment of this disclosure, the outer sidewall of the heat dissipation housing includes a first sidewall, a second sidewall, a third sidewall, and a fourth sidewall connected end to end; at least one of the first sidewall and the third sidewall is provided with heat dissipation fins, and at least one of the second sidewall and the fourth sidewall is provided with heat dissipation fins.

[0010] In one exemplary embodiment of this disclosure, the potting chamber is used to accommodate a capacitor core package, the capacitor core package is provided with a conductive bar, the conductive bar is exposed on the top of the heat dissipation device; the conductive bar is disposed adjacent to a first sidewall, the first sidewall is provided with heat dissipation fins.

[0011] In one exemplary embodiment of this disclosure, the heat dissipation device further includes a heat dissipation fin plate disposed on the top of the potting chamber; the top of the heat dissipation fin plate is provided with heat dissipation fins; the heat dissipation fins form a plurality of second air ducts that conduct from the second sidewall to the third sidewall; and / or, the heat dissipation fins form a plurality of second air ducts that conduct from the fourth sidewall to the third sidewall.

[0012] In one exemplary embodiment of this disclosure, the heat dissipation fin includes a plurality of fins, each fin including a first guide portion along a first direction and a second guide portion along a second direction; the plurality of fins are arranged in an array to form a plurality of second air ducts on the top of the heat dissipation fin plate; wherein, the first direction is the direction in which the first sidewall extends, and the second direction is the direction in which the second sidewall extends.

[0013] In one exemplary embodiment of this disclosure, a second windshield is provided on the top of the heat dissipation fin, and the second windshield partially blocks the top of the second air duct; the second windshield is at least insulated between the heat dissipation fin and the conductive bar.

[0014] In one exemplary embodiment of this disclosure, both the second sidewall and the fourth sidewall are provided with first heat dissipation fins extending from the bottom of the heat dissipation housing to the top of the heat dissipation housing, and the first wind deflectors are arranged in pairs, adjacent to the first heat dissipation fins of the second sidewall and the fourth sidewall respectively.

[0015] The first windshield includes a third guide portion parallel to the second sidewall and a fourth guide portion located at the top of the heat dissipation housing. The third guide portion is attached to the outer side of the first heat dissipation fin and covers the first heat dissipation fin. The fourth guide portion has a first gap with the top of the first heat dissipation fin.

[0016] In one exemplary embodiment of this disclosure, the fourth guide portion is provided with a flange on the side adjacent to the first sidewall and the side adjacent to the third sidewall, and the flange is bent toward the heat dissipation housing to at least partially cover the first gap.

[0017] In one exemplary embodiment of this disclosure, a third air duct is provided within the first gap, and the third air duct passes through the flanges on opposite sides of the fourth guide portion.

[0018] In one exemplary embodiment of this disclosure, a second heat dissipation fin is provided on the first sidewall, extending from the bottom to the top of the heat dissipation housing, and a third wind deflector is provided outside the first sidewall, forming a fourth air duct between the third wind deflector and the second heat dissipation fin; the depth of the fourth air duct gradually decreases from the bottom to the top of the heat dissipation housing.

[0019] In one exemplary embodiment of this disclosure, the third windshield blocks the bottom of the fourth air duct and leaves the top of the fourth air duct open.

[0020] In one exemplary embodiment of this disclosure, the ratio of the height D1 of the third windshield to the height D2 of the fourth air duct satisfies 0.5≤D1 / D2≤0.8.

[0021] In one exemplary embodiment of this disclosure, the heat dissipation device further includes an adapter plate, which has at least one through-hole. The heat dissipation housing and the fan are respectively installed on the upper and lower sides of the adapter plate, and the airflow direction of the fan corresponds to the air outlet.

[0022] In one exemplary embodiment of this disclosure, the heat dissipation housing has a cooling chamber opposite to the potting chamber, and at least two cooling chambers are provided at the bottom of the heat dissipation housing; the cooling chambers correspond one-to-one with the air outlets of the adapter plate, and the fans are provided one-to-one with the air outlets at the bottom of the adapter plate.

[0023] In one exemplary embodiment of this disclosure, a support foot is provided at the bottom of the fan, and an adjustment device is provided on the support foot for adjusting the height of the support surface of the support foot supporting the fan.

[0024] In one exemplary embodiment of this disclosure, a protective net is provided between the support base and the fan.

[0025] According to another aspect of this disclosure, a capacitor assembly is provided, including a heat dissipation device as described above and a capacitor core package, wherein the capacitor core package is disposed in the potting chamber of the heat dissipation device.

[0026] In one exemplary embodiment of this disclosure, the capacitor core is fixed in the potting chamber by potting adhesive.

[0027] According to another aspect of this disclosure, a controller is provided, comprising: a controller housing, a power device, and a capacitor assembly of any of the foregoing; the capacitor assembly and the power device are electrically connected.

[0028] In one exemplary embodiment of this disclosure, the power device is disposed on top of the heat sink housing of the capacitor assembly, and / or the heat sink housing is integrated with the controller housing, and the fan is disposed outside the controller housing.

[0029] According to another aspect of this disclosure, a vehicle is provided, including the controller of any of the foregoing.

[0030] The heat dissipation device disclosed herein can dissipate heat from the heat dissipation shell and the capacitor core in the potting chamber. The heat dissipation fins of the heat dissipation shell and the first wind deflector constitute the first air duct. In use, the airflow blown out by the fan at the bottom of the heat dissipation shell can flow in the first air duct to dissipate the heat generated by the capacitor core and the capacitor core on the components, so as to ensure that the temperature of the capacitor core can be stabilized within the operating temperature range.

[0031] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and are not intended to limit this disclosure. Attached Figure Description

[0032] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this disclosure and, together with the description, serve to explain the principles of this disclosure. It is obvious that the drawings described below are merely some embodiments of this disclosure, and those skilled in the art can obtain other drawings based on these drawings without any inventive effort.

[0033] Figure 1 This is a schematic diagram of an exemplary embodiment of the heat dissipation device disclosed herein.

[0034] Figure 2 This is a schematic diagram of the heat dissipation housing in an exemplary embodiment of the heat dissipation device disclosed herein.

[0035] Figure 3 This is a longitudinal cross-sectional view of the fan axis in an exemplary embodiment of the heat dissipation device disclosed herein.

[0036] Figure 4 This is a schematic diagram of a heat dissipation fin plate in an exemplary embodiment of the heat dissipation device disclosed herein.

[0037] Figure 5 This is a schematic diagram of an adapter plate in one exemplary embodiment of the heat dissipation device disclosed herein.

[0038] Figure 6 This is a schematic diagram of a heat dissipation fin plate in an exemplary embodiment of the heat dissipation device disclosed herein.

[0039] Figure 7 This is a schematic diagram of the first windshield in an exemplary embodiment of the heat dissipation device disclosed herein.

[0040] Explanation of reference numerals in the attached figures:

[0041] 1. Heat dissipation housing; 101. First sidewall; 102. Second sidewall; 103. Third sidewall; 104. Fourth sidewall; 11. Encapsulation chamber; 12. First heat dissipation fin; 13. Second heat dissipation fin; 14. Cooling chamber;

[0042] 2. Fan; 21. Protective net; 3. First windshield; 31. Third guide section; 32. Fourth guide section; 33. Flanged edge; 4. Conductive busbar;

[0043] 5. Heat dissipation fins; 51. Heat dissipation fins; 511. First guide section; 512. Second guide section; 52. Second windshield; 6. Third windshield; 7. Adapter plate; 71. Air outlet; 8. Support feet; 81. Leveling screw. Detailed Implementation

[0044] Exemplary embodiments will now be described more fully with reference to the accompanying drawings. However, these exemplary embodiments can be implemented in many forms and should not be construed as limited to the embodiments set forth herein; rather, they are provided so that this disclosure will be thorough and complete, and will fully convey the concept of the exemplary embodiments to those skilled in the art. The same reference numerals in the drawings denote the same or similar structures, and therefore detailed descriptions of them will be omitted. Furthermore, the drawings are merely illustrative of this disclosure and are not necessarily drawn to scale.

[0045] Unless otherwise specified or stated, the technical or scientific terms used in this disclosure shall have the ordinary meaning understood by one of ordinary skill in the art to which this disclosure pertains. The terms “a,” “an,” “the,” “the,” and “at least one” are used to indicate the presence of one or more elements / components / etc.; the terms “comprising” and “having” are used to indicate an open-ended inclusion and to mean that there may be other elements / components / etc. in addition to those listed; the terms “first” and “second” are used only as illustrative marks and are not intended to limit the number, importance, or order of the objects.

[0046] In the following description, suffixes such as "module," "unit," and "device" used to denote elements are used only for the purposes of this application and have no specific meaning in themselves. Therefore, "module" or "device," etc., can be used interchangeably.

[0047] The phrase "part A is located on part B" as described in this disclosure can mean that part A is directly connected to part B, or that part A is located on part C, and part C is located on part B.

[0048] In the description of this disclosure, it should be understood that the terms "inner / outer," "upper / lower," "top / bottom," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are only for the convenience of describing this disclosure and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this disclosure. It should be understood that these directional terms are relative concepts, and they can change accordingly depending on the orientation of the components in the accompanying drawings. For example, after rotating the structure in the exemplary embodiments of this disclosure or changing the direction and angle of observation, "upper" may also become "lower," "left," or "right," and such changes will not hinder the understanding of those skilled in the art.

[0049] This disclosure provides a heat dissipation device, with reference to... Figure 1As shown, it includes a heat dissipation housing 1, a fan 2, and a first wind deflector 3. The heat dissipation housing 1 has a potting chamber 11, and at least one outer side wall of the heat dissipation housing 1 is provided with heat dissipation fins extending from the bottom to the top of the heat dissipation housing 1. The fan 2 is located at the bottom of the heat dissipation housing 1. The first wind deflector 3 is located outside at least one outer side wall of the heat dissipation housing 1, and a first air duct is formed between the first wind deflector 3 and the heat dissipation fins.

[0050] The heat dissipation device disclosed herein can dissipate heat from the heat dissipation housing 1 and the capacitor core package in the potting chamber 11. The heat dissipation fins of the heat dissipation housing 1 and the first wind deflector 3 constitute the first air duct. In use, the airflow blown out by the fan 2 at the bottom of the heat dissipation housing 1 can flow in the first air duct to dissipate the heat generated by the capacitor core package and the capacitor core package on the hands, so as to ensure that the temperature of the capacitor core package can be stabilized within the operating temperature range.

[0051] For example, the heat dissipation device provided in this disclosure can be used for high-temperature testing of power modules. By connecting the power module under test to the capacitor core in the potting chamber 11 via the conductive busbar 4, the conductive busbar 4 can be cooled to prevent excessive heat transfer to the capacitor core, ensuring that the capacitor temperature remains within the normal operating temperature during the test. Furthermore, integrating the heat dissipation device provided in this disclosure with the controller housing assembly, such as the controller housing assembly of a battery management system and a motor drive system, can reduce the limitations on capacitor temperature resistance, lower the heat dissipation requirements for components with high heat generation, effectively improve the outflow capacity of the electronic control assembly, and enhance the safety of the controller.

[0052] refer to Figure 1 The schematic diagram of the heat dissipation device shown and Figure 2 The diagram shows a heat dissipation housing 1. For example, the outer side wall of the heat dissipation housing 1 includes a first side wall 101, a second side wall 102, a third side wall 103, and a fourth side wall 104 connected end to end; heat dissipation fins and a first wind deflector 3 may be provided in one or more of the first side wall 101, the second side wall 102, the third side wall 103, and the fourth side wall 104.

[0053] The potting chamber 11 can be used to house the capacitor core package. Specifically, the capacitor core package can be potted and fixed within the potting chamber 11 using a potting compound such as epoxy resin to improve its shock resistance. The capacitor core package is provided with a conductive busbar 4, which protrudes from the top of the heat dissipation device. The conductive busbar 4 can be used for electrical connection with power devices. For example, the conductive busbar 4 can be a copper busbar, enabling high current transmission and also serving as a structural component to provide support and fixation for power devices such as IGBT modules. (Reference) Figure 1 As shown, the conductive busbar 4 can be arranged adjacent to the first sidewall 101.

[0054] In related technologies, electric drive systems are developing towards higher power and smaller size, leading to further increases in current and voltage, and also increasing the heat generated by the system. However, the long-term temperature resistance of existing potted capacitors is not high. To avoid the operating temperature exceeding the capacitor's temperature limit, causing the entire system to fail or even explode, the size of the busbar 4 is often large, severely limiting the structural size, weight, and current output capacity of the assembly. The heat dissipation device provided in this disclosure can improve the heat dissipation performance of the potted capacitor, and therefore can also reduce the size of the busbar 4, which is beneficial to the lightweighting of the assembly.

[0055] In one exemplary embodiment of this disclosure, a first air duct extends from the bottom of the heat dissipation housing 1 to the top of the heat dissipation housing 1. For example, at least one of the second sidewall 102 and the fourth sidewall 104 is provided with heat dissipation fins, as shown in the reference. Figure 2 As shown, both the second sidewall 102 and the fourth sidewall 104 are provided with first heat dissipation fins 12 extending from the bottom to the top of the heat dissipation housing 1. First air deflectors 3 are arranged in pairs, adjacent to the first heat dissipation fins 12 of the second sidewall 102 and the fourth sidewall 104 respectively, thus forming vertically penetrating first air ducts on both the left and right sides of the heat dissipation housing 1. In use, the airflow from the fan 2 at the bottom of the heat dissipation housing 1 passes through the first air ducts from bottom to top, dissipating heat from both sides of the heat dissipation housing 1.

[0056] In some embodiments, the fan 2 may create a negative pressure at the bottom of the heat sink 1, thereby generating a downward airflow to dissipate heat from both sides of the heat sink 1. Similarly, it is understood that since the airflow direction can vary depending on the installation direction of the fan 2, in the following description of this disclosure, unless otherwise specified, upward airflow can also be understood as downward airflow; airflow from the left and right sides to the middle can also be understood as airflow from the middle to the left and right sides.

[0057] In some embodiments of this disclosure, at least one of the first sidewall 101 and the third sidewall 103 is provided with heat dissipation fins. For example, the first sidewall 101 may also be provided with heat dissipation fins extending from the bottom of the heat dissipation housing 1 to the top of the heat dissipation housing 1, and the third sidewall 103 may also be provided with heat dissipation fins extending from the bottom of the heat dissipation housing 1 to the top of the heat dissipation housing 1.

[0058] For example, the conductive bus 4 is disposed adjacent to the first sidewall 101. During operation, the capacitor core is electrically connected to the power device through the conductive bus 4. The conductive bus 4 generates heat when the current flows through it. The first sidewall 101 may be provided with heat dissipation fins and form a first air duct. When the airflow passes through the first air duct in the first sidewall 101, it can dissipate heat from the conductive bus 4.

[0059] For example, a first air duct is formed between the first windshield 3 and the heat dissipation fins. The first windshield 3 can be detachably connected to the heat dissipation housing 1, or the first windshield 3 and the heat dissipation housing 1 can be designed as an integral part, as long as the first air duct can be realized.

[0060] In another exemplary embodiment of this disclosure, the first sidewall 101 is provided with a second heat dissipation fin 13 extending from the bottom to the top of the heat dissipation housing 1, and a third wind deflector 6 is provided outside the first sidewall 101. A fourth air duct is formed between the third wind deflector 6 and the second heat dissipation fin 13. The depth of the fourth air duct gradually decreases from the bottom to the top of the heat dissipation housing 1.

[0061] refer to Figure 1 , Figure 2 as well as Figure 4 As shown, the second heat dissipation fin 13 may not extend to the top of the heat dissipation housing 1. For example, each second heat dissipation fin 13 is formed by slotting in the first sidewall 101, with the slot depth gradually decreasing from the bottom to the top of the heat dissipation housing 1, forming a fourth air duct with gradually decreasing depth. This facilitates the connection of capacitor cores to components such as power devices at the top of the first sidewall 101, and avoids the second heat dissipation fin 13 and the fourth air duct from affecting the busbar 4. For example, the top depth of the fourth air duct gradually decreases to 0.

[0062] For example, the depth of the fourth air duct gradually decreases from the bottom to the top of the heat dissipation housing 1. The third wind deflector 6 blocks the bottom of the fourth air duct while leaving the top open. By blocking the bottom of the fourth air duct, the third wind deflector 6 can make the bottom of the fourth air duct relatively closed, making the air duct more complete. The airflow velocity is faster at the bottom of the fourth air duct, forming between each of the second heat dissipation fins 13. The third wind deflector 6 leaves the top of the fourth air duct open, so that the wind resistance at the top of the shallower fourth air duct is not too large, and at the same time, it avoids blocking the propagation of airflow in the fourth air duct.

[0063] Specifically, the third windshield 6 can be made of insulating paper, such as natural fibers, synthetic fibers, or composite materials. The third windshield 6 can be heat-pressed or bonded to the heat sink housing 1. Alternatively, the third windshield 6 can be a thin sheet material, such as non-metallic or metallic materials, and connected to the heat sink housing 1 by bolting, bonding, welding, or other methods. In some exemplary embodiments, the third windshield 6 and the heat sink housing 1 can be designed as an integral part, as long as a fourth air duct can be achieved.

[0064] refer to Figure 1 , Figure 4As shown, if the height of the third windshield 6 is too low, the airflow velocity in the fourth air duct may be too low, resulting in poor heat dissipation for the conductive busbar 4; if the height of the third windshield 6 is too high, the wind resistance will be large, and it may block the propagation of airflow in the fourth air duct, which is also detrimental to heat dissipation. In an exemplary embodiment of this disclosure, the ratio of the height D1 of the third windshield 6 to the height D2 of the fourth air duct satisfies 0.5≤D1 / D2≤0.8, which can improve the heat dissipation effect of the conductive busbar 4.

[0065] In one exemplary embodiment of this disclosure, the heat dissipation device further includes a heat dissipation fin plate 5, which is disposed at the top of the potting chamber 11. (See reference...) Figure 1 The schematic diagram of the heat dissipation device is shown. Figure 4 The diagram shows the heat sink fin 5. This is to clearly illustrate the heat sink fin 5 and facilitate its explanation. Figure 4 The structure of the heat dissipation fin plate 5, including but not limited to the second windshield 52, is partially hidden.

[0066] refer to Figure 1 , Figure 4 As shown, the top of the heat dissipation fin plate 5 is provided with heat dissipation fins 51. The heat dissipation fins 51 form a plurality of second air ducts that conduct from the second side wall 102 to the third side wall 103; and / or, the heat dissipation fins 51 form a plurality of second air ducts that conduct from the fourth side wall 104 to the third side wall 103.

[0067] For example, the second sidewall 102 is provided with a first heat dissipation fin 12 that extends from the bottom to the top of the heat dissipation housing 1. The first wind deflector 3 is arranged adjacent to the second sidewall 102 to form a vertically penetrating first air duct. The heat dissipation fins 51 form multiple second air ducts that guide from the second sidewall 102 to the third sidewall 103. The airflow blown out by the fan 2 at the bottom of the heat dissipation housing 1 passes through the first air duct from bottom to top, dissipating heat from the second sidewall 102. Then, guided by the heat dissipation fins 51, the airflow passes through the second air duct at the top of the heat dissipation housing 1 to dissipate heat from the top of the capacitor core package in the potting chamber 11. The airflow can then be blown out from the third sidewall 103.

[0068] For example, the fourth sidewall 104 is provided with a first heat dissipation fin 12 that extends from the bottom to the top of the heat dissipation housing 1. The first wind deflector 3 is arranged adjacent to the fourth sidewall 104 to form a vertically penetrating first air duct. The heat dissipation fins 51 form multiple second air ducts that guide from the fourth sidewall 104 to the third sidewall 103. The airflow blown out by the fan 2 at the bottom of the heat dissipation housing 1 passes through the first air duct from bottom to top, dissipates heat from the fourth sidewall 104, and then passes through the second air duct at the top of the heat dissipation housing 1 guided by the heat dissipation fins 51 to dissipate heat from the top of the capacitor core package in the potting chamber 11. The airflow can be blown out from the third sidewall 103.

[0069] For example, refer to Figure 1 , Figure 4 As shown, both the second sidewall 102 and the fourth sidewall 104 are provided with first heat dissipation fins 12 extending from the bottom to the top of the heat dissipation housing 1. First air deflectors 3 are arranged in pairs, adjacent to the first heat dissipation fins 12 of the second sidewall 102 and the fourth sidewall 104 respectively, thus forming vertically penetrating first air ducts on both the left and right sides of the heat dissipation housing 1. The heat dissipation fins 51 form multiple second air ducts leading from the second sidewall 102 to the third sidewall 103 and multiple second air ducts leading from the fourth sidewall 104 to the third sidewall 103. The airflow from the fan 2 at the bottom of the heat dissipation housing 1 passes through the first air ducts from bottom to top. After heat dissipation on both sides of the heat dissipation housing 1, the airflow at the top of the heat dissipation housing 1 is guided by the heat dissipation fins 51 through the second air ducts to dissipate heat from the top of the capacitor core package in the potting chamber 11. The airflow can then be blown out from the third sidewall 103.

[0070] Specifically, the heat dissipation fin 51 may include multiple fins, as shown in the reference. Figure 6 The schematic diagram shown illustrates a heat dissipation fin plate 5. The fins include a first guide portion 511 along a first direction and a second guide portion 512 along a second direction. Multiple fins are arranged in an array to form multiple second air ducts on the top of the heat dissipation fin plate 5. The first direction is the direction in which the first sidewall 101 extends, and the second direction is the direction in which the second sidewall 102 extends. The first guide portion 511 guides the airflow flowing into the top of the heat dissipation housing 1 from the second sidewall 102 and / or the fourth sidewall 104, causing the airflow to flow from both sides towards the center. The second guide portion 512 guides the airflow to be blown out from the third sidewall 103. The heat dissipation fin 51 of this exemplary embodiment allows the airflow to flow orderly within the second air ducts on the top of the heat dissipation housing 1, improving the heat dissipation effect on the top of the encapsulated capacitor core.

[0071] For example, refer to Figure 6 As shown, at least a portion of the first guide portion 511 and the second guide portion 512 can be connected to form an "L"-shaped fin, which is beneficial to improving the guiding effect on airflow. The number of first guide portions 511 and second guide portions 512 can be different. For example, in addition to all second guide portions 512 being connected to a first guide portion 511 to form an "L"-shaped fin, multiple first guide portions 511 are provided separately. The airflow flowing in from the second sidewall 102 and / or the fourth sidewall 104 guided by the multiple first guide portions 511 can be guided to the third sidewall 103 through a second guide portion 512.

[0072] In some other exemplary embodiments of this disclosure, the heat dissipation fins 5 can also form a second airflow channel through heat dissipation fins 51 of other shapes or structures. For example, the heat dissipation fins 51 may include a plurality of arrayed heat dissipation columns, and airflow is guided through the gaps between the arrayed columns to form a second airflow channel. The cross-section of the heat dissipation columns can be circular, rhomboid, rectangular, etc., and this disclosure does not specify any particular shape or shape.

[0073] In one exemplary embodiment of this disclosure, reference is made to Figure 1 As shown, a second air deflector 52 is provided on the top of the heat dissipation fin 51. The second air deflector 52 partially blocks the top of the second air duct to ensure that the airflow is guided by the second air duct to blow out towards the third side wall 103, thereby improving heat dissipation efficiency and avoiding the problem of low heat dissipation efficiency at the third side wall 103. The second air deflector 52 is at least insulated between the heat dissipation fin 51 and the conductive busbar 4, which can isolate the heat dissipation fin 51 and the conductive busbar 4.

[0074] Specifically, the second air baffle 52 can be made of insulating paper, such as natural fibers, synthetic fibers, or composite materials. The second air baffle 52 can be heat-pressed or bonded to the heat dissipation fins 5 to form a second air duct. Simultaneously, the thinness and low thermal resistance of the insulating paper help improve the heat conduction efficiency of the conductive busbar 4, thereby enhancing the capacitor's heat dissipation efficiency. The second air baffle 52 can be made of a high thermal conductivity material that meets insulation performance requirements, such as a thermal pad or a high thermal conductivity insulating film, to reduce the system's thermal resistance.

[0075] Figure 3 A longitudinal sectional view of the heat dissipation device along the axis of fan 2 is shown to clearly illustrate the structure intended for explanation. Figure 3 Some structures have been omitted, including but not limited to heat sink 5, conductive busbar 4, and capacitor core. Figure 7 A schematic diagram of a first windshield 3 is shown.

[0076] refer to Figure 1 , Figure 3 , Figure 7 As shown, the first air deflector 3 includes a third guide portion 31 parallel to the second sidewall 102 and a fourth guide portion 32 located at the top of the heat dissipation housing 1. The third guide portion 31 is attached to and covers the outer side of the first heat dissipation fin 12, forming a first air duct that extends from the bottom to the top of the heat dissipation housing 1. In use, the airflow blown by the fan 2 at the bottom of the heat dissipation housing 1 passes through the first air duct from bottom to top. There is a first gap between the fourth guide portion 32 and the top of the first heat dissipation fin 12 so that the airflow is guided into the second air duct by the heat dissipation fin 51.

[0077] refer to Figure 1 , Figure 3 , Figure 7 As shown, the fourth guide portion 32 has flanged portions 33 on the side adjacent to the first sidewall 101 and the side adjacent to the third sidewall 103. The flanged portions 33 are bent toward the heat dissipation housing 1 to at least partially block the first gap. The flanged portions 33 can increase the wind resistance at the top of the heat dissipation housing 1, so that the airflow entering the second airflow through the first airflow channel has a higher flow velocity, thereby improving the heat dissipation efficiency.

[0078] For example, refer to Figure 1 , Figure 3 , Figure 7 As shown, a third air duct is provided within the first gap, and the third air duct passes through the flanged portions 33 on both sides of the fourth guide portion 32. The airflow entering the top of the heat sink housing 1 through the first air duct can be partially depressurized through the third air duct, so as to appropriately reduce the air resistance of the airflow passage inside the heat sink housing 1, thereby reducing the air pressure requirement for the fan 2 and facilitating the selection of the fan 2.

[0079] refer to Figure 1 As shown, the first windshield 3 can be installed on the side of the heat sink housing 1 by means of fixing screws, bolts and other connecting parts, or the first windshield 3 can also be fixed to the heat sink housing 1 by means of bonding, welding and other processes.

[0080] In one exemplary embodiment of this disclosure, the heat dissipation device further includes an adapter plate 7. Figure 5 A schematic diagram of an adapter plate 7 is shown. The adapter plate 7 has at least one through-hole air outlet 71. A heat sink 1 and a fan 2 are respectively mounted on the upper and lower sides of the adapter plate 7, and the airflow direction of the fan 2 corresponds to the air outlet 71. (Reference) Figure 1 , Figure 3 As shown, the cross-sectional area of ​​the adapter plate 7 is larger than the bottom cross-sectional area of ​​the heat sink 1. Compared with the fan 2 being directly installed at the bottom of the heat sink 1, the heat sink 1 and the fan 2 are respectively installed on the upper and lower sides of the adapter plate 7, which is conducive to increasing the air cavity space, reducing the air pressure requirements of the fan 2, or achieving a better heat dissipation effect under the same specifications of the fan 2.

[0081] In one exemplary embodiment of this disclosure, reference is made to Figure 3 As shown, the heat sink 1 has cooling chambers 14 opposite to the potting chamber 11, and at least two cooling chambers 14 are provided at the bottom of the heat sink 1. Each cooling chamber 14 corresponds to an air outlet 71 of the adapter plate 7, and each fan 2 is located at the bottom of the adapter plate 7 corresponding to an air outlet 71. The sidewalls of the cooling chambers 14 can guide the airflow from the fan 2 through the air outlet 71. The adapter plate 7 can be connected to both the fan 2 and the heat sink 1, reducing assembly difficulty.

[0082] For example, the adapter plate 7 can also be integrated with the heat sink housing 1. For instance, the bottom of the cooling chamber 14 forms an air outlet 71, and the fan 2 is installed at the bottom of the heat sink housing 1 in a one-to-one correspondence with the air outlet 71.

[0083] In one exemplary embodiment of this disclosure, reference is made to Figure 1 , Figure 3 , Figure 4As shown, the fan 2 has a support foot 8 at its bottom, and the support foot 8 has an adjustment device for adjusting the height of the support surface of the support foot 8 supporting the fan 2. For example, the support feet 8 are arranged in pairs at the bottom of the heat dissipation device. The adjustment device can change the height and angle of the support surface of the support foot 8 supporting the fan 2 to adapt to different usage requirements. For example, the support feet 8 extend in a direction parallel to the first sidewall 101, and the support feet 8 can be arranged in pairs at the bottom of the first sidewall 101 and the third sidewall 103. Each end of the support foot 8 has a leveling screw 81, and the overall height and angle of the heat dissipation device can be changed by using the four leveling screws 81.

[0084] In one exemplary embodiment of this disclosure, a protective net 21 is provided between the support base 8 and the fan 2. The protective net 21 can prevent foreign objects from entering the fan blade rotation area of ​​the fan 2, ensuring the stable operation of the fan 2 and the safety of the user.

[0085] According to another aspect of this disclosure, a capacitor assembly is provided, including the heat dissipation device of any of the foregoing and a capacitor core, the capacitor core being disposed in the potting chamber 11 of the heat dissipation device. For example, the capacitor core is potted and fixed in the potting chamber 11 by potting adhesive to improve the shock resistance of the capacitor core. The capacitor assembly of this disclosure can dissipate heat through the heat dissipation device and has good high-temperature resistance. The capacitor assembly of this disclosure can be used for high-temperature testing in an open environment in a laboratory, such as the switching test of power modules in new energy vehicles. When the temperature is not high, the heat from the power module being heated can be conducted to the heat sink 1 through the conductive busbar 4 for natural convection cooling. When the temperature is high, the fan 2 can be turned on, and the airflow through the heat sink 1 carries away the heat through forced convection, thereby achieving the effect of cooling the power module and the conductive busbar 4, ensuring that the capacitor temperature is stable within the operating range.

[0086] According to another aspect of this disclosure, a controller is provided, comprising: a controller housing, a power device, and a capacitor assembly as described above; the capacitor assembly and the power device are electrically connected and both are installed within the controller housing. For example, the capacitor assembly and the power device are electrically connected via a busbar 4. The power device can be disposed on top of the heat dissipation housing 1 of the capacitor assembly, which facilitates the cooling of the power device and the busbar 4 by a heat dissipation device. The controller of this disclosure can be applied in fields such as new energy vehicles, generators, and communications. For example, the controller of this disclosure can be a controller in the battery management system and / or motor drive system of a new energy vehicle.

[0087] In one exemplary embodiment of this disclosure, the heat sink 1 can be integrally integrated with the controller housing, and the fan 2 can be located inside or outside the controller housing. For example, the controller is a motor controller in a motor drive system, the fan 2 is located outside the controller housing, and draws power from the PCB of the motor controller via a low-voltage wiring harness. Exemplarily, the heat sink 5 can be integrally integrated with the cover plate of the motor controller. The fan 2 can blow airflow into the motor controller housing and cover plate according to the internal temperature of the motor controller monitored by the temperature sensor, ensuring the airtightness of the electrical control cavity while achieving a good cooling effect.

[0088] According to another aspect of this disclosure, a vehicle is provided, including the controller of any of the foregoing embodiments. Exemplarily, the vehicle of this disclosure may be a pure electric vehicle, or a hybrid vehicle, etc.

[0089] Other embodiments of this disclosure will readily occur to those skilled in the art upon consideration of the specification and practice of the utility models disclosed herein. This application is intended to cover any variations, uses, or adaptations of this disclosure that follow the general principles of this disclosure and include common knowledge or customary techniques in the art not disclosed herein. The specification and examples are to be considered exemplary only, and the true scope and spirit of this disclosure are indicated by the appended claims.

Claims

1. A heat dissipation device, characterized in that, include: A heat dissipation housing (1) has a potting chamber (11), and at least one outer side wall of the heat dissipation housing (1) is provided with heat dissipation fins extending from the bottom to the top of the heat dissipation housing (1); A fan (2) is located at the bottom of the heat dissipation housing (1); A first windshield (3) is disposed on at least one outer wall of the heat dissipation housing (1), and a first air duct is formed between the first windshield (3) and the heat dissipation fins.

2. The heat dissipation device according to claim 1, characterized in that, The first air duct extends from the bottom of the heat dissipation housing (1) to the top of the heat dissipation housing (1).

3. The heat dissipation device according to claim 1, characterized in that, The outer sidewall of the heat dissipation housing (1) includes a first sidewall (101), a second sidewall (102), a third sidewall (103), and a fourth sidewall (104) connected end to end; at least one of the first sidewall (101) and the third sidewall (103) is provided with the heat dissipation fins, and at least one of the second sidewall (102) and the fourth sidewall (104) is provided with the heat dissipation fins.

4. The heat dissipation device according to claim 3, characterized in that, The potting chamber (11) is used to accommodate the capacitor core package, and the capacitor core package is provided with a conductive bar (4), which is exposed at the top of the heat dissipation device; the conductive bar (4) is arranged adjacent to the first side wall (101), and the first side wall (101) is provided with the heat dissipation fins.

5. The heat dissipation device according to claim 4, characterized in that, The heat dissipation device further includes a heat dissipation fin plate (5), which is disposed on the top of the potting chamber (11); the top of the heat dissipation fin plate (5) is provided with heat dissipation fins (51); the heat dissipation fins (51) form a plurality of second air ducts that are directed from the second side wall (102) to the third side wall (103); and / or, the heat dissipation fins (51) form a plurality of second air ducts that are directed from the fourth side wall (104) to the third side wall (103).

6. The heat dissipation device according to claim 5, characterized in that, The heat dissipation fin (51) includes a plurality of fins, the fins including a first guide portion (511) along a first direction and a second guide portion (512) along a second direction; the plurality of fins are arranged in an array to form a plurality of second air ducts on the top of the heat dissipation fin plate (5); wherein, the first direction is the direction in which the first sidewall (101) extends, and the second direction is the direction in which the second sidewall (102) extends.

7. The heat dissipation device according to claim 5, characterized in that, The top of the heat dissipation fin (51) is provided with a second wind deflector (52), which partially blocks the top of the second air duct; the second wind deflector (52) is at least insulated between the heat dissipation fin (51) and the conductive bar (4).

8. The heat dissipation device according to claim 3, characterized in that, The second sidewall (102) and the fourth sidewall (104) are each provided with a first heat dissipation fin (12) extending from the bottom of the heat dissipation housing (1) to the top of the heat dissipation housing (1). The first wind deflector (3) is arranged in pairs and is adjacent to the first heat dissipation fin (12) of the second sidewall (102) and the fourth sidewall (104) respectively. The first windshield (3) includes a third guide portion (31) parallel to the second sidewall (102) and a fourth guide portion (32) located on the top of the heat dissipation housing (1). The third guide portion (31) is attached to the outer side of the first heat dissipation fin (12) and covers the first heat dissipation fin (12). The fourth guide portion (32) has a first gap with the top of the first heat dissipation fin (12).

9. The heat dissipation device according to claim 8, characterized in that, The fourth guide portion (32) is provided with a flange portion (33) on the side adjacent to the first sidewall (101) and the side adjacent to the third sidewall (103), respectively. The flange portion (33) is bent toward the heat dissipation housing (1) to at least partially cover the first gap.

10. The heat dissipation device according to claim 9, characterized in that, The first gap has a third air duct that passes through the flanges (33) on both sides of the fourth guide (32).

11. The heat dissipation device according to claim 3, characterized in that, The first sidewall (101) is provided with a second heat dissipation fin (13) extending from the bottom to the top of the heat dissipation housing (1), and a third wind deflector (6) is provided outside the first sidewall (101). A fourth air duct is formed between the third wind deflector (6) and the second heat dissipation fin (13). The depth of the fourth air duct gradually decreases from the bottom to the top of the heat dissipation housing (1).

12. The heat dissipation device according to claim 11, characterized in that, The third windshield (6) covers the bottom of the fourth air duct and opens the top of the fourth air duct.

13. The heat dissipation device according to claim 12, characterized in that, The ratio of the height D1 of the third windshield (6) to the height D2 of the fourth air duct satisfies 0.5≤D1 / D2≤0.

8.

14. The heat dissipation device according to claim 1, characterized in that, The heat dissipation device also includes an adapter plate (7), which has at least one through air outlet (71). The heat dissipation housing (1) and the fan (2) are respectively installed on the upper and lower sides of the adapter plate (7), and the airflow direction of the fan (2) corresponds to the air outlet (71).

15. The heat dissipation device according to claim 14, characterized in that, The heat dissipation housing (1) has a cooling chamber (14) opposite to the potting chamber (11), and there are at least two cooling chambers (14) at the bottom of the heat dissipation housing (1); the cooling chambers (14) correspond one-to-one with the air outlets (71) of the adapter plate (7), and the fan (2) is located at the bottom of the adapter plate (7) in a corresponding manner to the air outlets (71).

16. The heat dissipation device according to claim 1, characterized in that, The fan (2) is provided with a support foot (8) at the bottom, and the support foot (8) is provided with an adjustment device for adjusting the height of the support surface of the support foot (8) supporting the fan (2).

17. The heat dissipation device according to claim 16, characterized in that, A protective net (21) is provided between the support foot (8) and the fan (2).

18. A capacitor assembly, characterized in that, The device includes a heat dissipation device as described in any one of claims 1 to 17 and a capacitor core package, wherein the capacitor core package is disposed in the potting chamber (11) of the heat dissipation device.

19. The capacitor assembly according to claim 18, characterized in that, The capacitor core is fixed in the potting chamber (11) by potting glue.

20. A controller, characterized in that, include: The controller housing, the power device, and the capacitor assembly as described in claim 18 or 19; the capacitor assembly and the power device are electrically connected.

21. The controller according to claim 20, characterized in that, The power device is located on top of the heat sink housing (1) of the capacitor assembly, and / or the heat sink housing (1) is integrated with the controller housing, and the fan (2) is located outside the controller housing.

22. A vehicle, characterized in that, Includes the controller as described in claim 20 or 21.

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