Power amplifier

Abstract

The utility model discloses a power amplifier, which is characterized in that a first-stage amplification circuit is arranged in a first sunken groove, an input external matching circuit of a second-stage amplification circuit is arranged on an input cover plate, and an input internal matching circuit of the second-stage amplification circuit and the second-stage amplification circuit are arranged on an embedded heat sink; an output matching circuit of the secondary amplification circuit is arranged in a second sunken groove, and an embedded heat sink is arranged between the first sunken groove and the second sunken groove, so that circuits in the first sunken groove and the second sunken groove are far away from each other, the degree of mutual interference is small, an additional isolation circuit does not need to be arranged, and in addition, the embedded heat sink is arranged between the first sunken groove and the second sunken groove. According to the power amplifier, a part of the circuit is arranged on the input cover plate, the input cover plate is arranged on the first sunken groove, and the output cover plate is arranged on the second sunken groove, so that the circuits are not completely laid on the same horizontal plane but are also distributed in the vertical direction, the horizontal area of the whole power amplifier is saved, and the power amplifier is convenient to install and use.

Description

Technical Field

[0001] This utility model relates to the field of signal isolation, and in particular to a power amplifier. Background Technology

[0002] In the present technology, power amplifiers are usually integrated on a single PCB (Printed Circuit Board). That is, all the components in the power amplifier are laid flat on a PCB, and additional isolation circuits are required between different components. Therefore, the PCB where the power amplifier is located has a large area. When the power amplifier is put into use, a large amount of horizontal or vertical space needs to be provided for it. This also means that if the space in which the power amplifier is used is small, it cannot be installed and used, thus limiting the application scenarios of the power amplifier. Utility Model Content

[0003] The purpose of this invention is to provide a power amplifier in which the first-stage amplifier circuit is placed in a first recessed groove, the input external matching circuit of the second-stage amplifier circuit is placed on the input cover plate, the input internal matching circuit of the second-stage amplifier circuit and the second-stage amplifier circuit are placed on an embedded heat sink, and the output matching circuit of the second-stage amplifier circuit is placed in a second recessed groove. The embedded heat sink is located between the first and second recessed grooves. Based on this, the circuits in the first and second recessed grooves are far apart, and the degree of mutual interference is small, eliminating the need for additional isolation circuits. In addition, some circuits are placed on the input cover plate, which is placed on the first recessed groove, and the output cover plate is placed on the second recessed groove. Therefore, the circuits are not all laid flat on the same horizontal plane, but are also distributed in the vertical direction, thereby saving the horizontal area of ​​the entire power amplifier and facilitating its installation and use.

[0004] To solve the above-mentioned technical problems, this utility model provides a power amplifier, including a first-stage amplifier circuit, a second-stage amplifier circuit, an input internal matching circuit of the second-stage amplifier circuit, an input external matching circuit of the second-stage amplifier circuit, an output matching circuit of the second-stage amplifier circuit, a cavity substrate, an input cover plate, and an output cover plate;

[0005] The cavity substrate includes a first recessed groove and a second recessed groove, which are separated by an embedded heat sink.

[0006] The first-stage amplifier circuit is placed in the first recessed groove; the external matching circuit of the second-stage amplifier circuit is placed on the input cover plate; the internal matching circuit of the second-stage amplifier circuit and the second-stage amplifier circuit are placed on the embedded heat sink; the output matching circuit of the second-stage amplifier circuit is placed in the second recessed groove; the input cover plate is placed on the first recessed groove; and the output cover plate is placed on the second recessed groove.

[0007] The first-stage amplifier circuit, the external input matching circuit of the second-stage amplifier circuit, the internal input matching circuit of the second-stage amplifier circuit, the second-stage amplifier circuit, and the output matching circuit of the second-stage amplifier circuit are connected in sequence.

[0008] Preferably, it further includes an input bias circuit for the second-stage amplifier circuit and an output bias circuit for the second-stage amplifier circuit;

[0009] The input bias circuit of the second-stage amplifier circuit is disposed on the input cover plate and is connected to the second-stage amplifier circuit to provide a first bias voltage to the second-stage amplifier circuit.

[0010] The output bias circuit of the secondary amplifier circuit is disposed on the output cover plate and is connected to the secondary amplifier circuit to provide a second bias voltage for the secondary amplifier circuit.

[0011] Preferably, it also includes an output detection circuit;

[0012] The output detection circuit is placed on the output cover plate and connected to the output matching circuit of the secondary amplifier circuit.

[0013] Preferably, it also includes a coupler;

[0014] The coupler is placed on the output cover plate and connected between the output matching circuit of the secondary amplifier circuit and the output detection circuit.

[0015] Preferably, the cavity substrate is an organic encapsulation substrate.

[0016] Preferably, it also includes a sealing cover;

[0017] The edges of the encapsulation cover and the cavity substrate form a detachable or sealed connection, and the encapsulation cover and the cavity substrate constitute the outer shell of the power amplifier.

[0018] Preferably, the encapsulation cover is made of plastic.

[0019] Preferably, the bottom layer material of both the input cover and the output cover is copper plating.

[0020] Preferably, the edge of the input cover plate is welded to the opening edge of the first recessed groove; the edge of the output cover plate is welded to the opening edge of the second recessed groove.

[0021] Preferably, the surface material of the second recessed groove is a ceramic medium.

[0022] This application provides a power amplifier in which the first-stage amplifier circuit is placed in a first recessed groove, the input external matching circuit of the second-stage amplifier circuit is placed on the input cover plate, the input internal matching circuit of the second-stage amplifier circuit and the second-stage amplifier circuit are placed on an embedded heat sink, and the output matching circuit of the second-stage amplifier circuit is placed in a second recessed groove. The embedded heat sink is separated by the first and second recessed grooves. Based on this, the circuits in the first and second recessed grooves are far apart, and the degree of mutual interference is small, so there is no need to set up an additional isolation circuit. In addition, some circuits are placed on the input cover plate, which is placed on the first recessed groove and the output cover plate is placed on the second recessed groove. Therefore, the circuits are not all laid flat on the same horizontal plane, but are also distributed in the vertical direction, thereby saving the horizontal area of ​​the entire power amplifier and facilitating the installation and use of the power amplifier. Attached Figure Description

[0023] To more clearly illustrate the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0024] Figure 1 A schematic diagram of the structure of a power amplifier provided by this utility model;

[0025] Figure 2 A cross-sectional view of the power amplifier provided in this application;

[0026] Figure 3 A schematic diagram of a power amplifier including a package cover provided in this application;

[0027] Figure 4 This is a schematic diagram showing the connection between the encapsulation cover and the cavity substrate provided in this application. Detailed Implementation

[0028] The core of this invention is to provide a power amplifier. The first-stage amplifier circuit is placed in a first recessed groove. The input external matching circuit of the second-stage amplifier circuit is placed on the input cover plate. The input internal matching circuit and the second-stage amplifier circuit are placed on an embedded heat sink. The output matching circuit of the second-stage amplifier circuit is located in a second recessed groove. The embedded heat sink is positioned between the first and second recessed grooves. Based on this, the circuits in the first and second recessed grooves are far apart, resulting in less mutual interference and eliminating the need for additional isolation circuits. Furthermore, some circuits are located on the input cover plate, which is placed on the first recessed groove, and the output cover plate is placed on the second recessed groove. Therefore, the circuits are not all laid flat on the same horizontal plane but are also distributed vertically, thus saving the horizontal area of ​​the entire power amplifier and facilitating its installation and use.

[0029] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0030] Please refer to Figure 1 , Figure 1 The present invention provides a schematic diagram of the structure of a power amplifier, including a first-stage amplifier circuit 11, a second-stage amplifier circuit 12, an input internal matching circuit 14 of the second-stage amplifier circuit 12, an input external matching circuit 13 of the second-stage amplifier circuit 12, an output matching circuit 15 of the second-stage amplifier circuit 12, a cavity substrate 21, an input cover plate 22, and an output cover plate 23.

[0031] The cavity substrate 21 includes a first recessed groove 24 and a second recessed groove 25, which are separated by an embedded heat sink 26.

[0032] The first-stage amplifier circuit 11 is placed in the first recessed groove 24, the input external matching circuit 13 of the second-stage amplifier circuit 12 is placed on the input cover plate 22, the input internal matching circuit 14 of the second-stage amplifier circuit 12 and the second-stage amplifier circuit 12 are placed on the embedded heat sink 26, and the output matching circuit 15 of the second-stage amplifier circuit 12 is placed in the second recessed groove 25; the input cover plate 22 is placed on the first recessed groove 24, and the output cover plate 23 is placed on the second recessed groove 25.

[0033] The input external matching circuit 13 of the first-stage amplifier circuit 11, the input internal matching circuit 14 of the second-stage amplifier circuit 12, the second-stage amplifier circuit 12, and the output matching circuit 15 of the second-stage amplifier circuit 12 are connected in sequence.

[0034] In existing power amplifiers, all circuits are laid flat on a single PCB board, meaning they are all on the same horizontal plane. Since some circuits in the power amplifier may interfere with each other, isolation circuits are required between them. This results in a larger power amplifier size, necessitating a larger PCB board to support it. The overall horizontal area of ​​the power amplifier is large, while the vertical height is small. In practical applications, a large horizontal or vertical space is required to install or house the power amplifier, which undoubtedly limits its application scenarios.

[0035] In this application, the circuits in the power amplifier are not laid flat on a single PCB board. Instead, two recessed grooves are provided in the cavity substrate 21, which are separated by an embedded heat sink 26. Circuits that may interfere with each other can be placed in different recessed grooves, or separately in the recessed grooves or on the embedded heat sink 26. Since the input cover 22 and the output cover 23 are respectively placed on the two recessed grooves, that is, covering the two recessed grooves, the circuits in the two recessed grooves are not only relatively far apart, but also separated by the input cover 22 and the output cover 23, thereby reducing interference between circuits. There is no need to set up isolation circuits. While achieving isolation between different circuits, the size of the power amplifier is reduced.

[0036] Furthermore, since some circuitry is located on the input cover plate 22, the various circuits in the power amplifier are not arranged on the same plane but are also distributed vertically. This reduces the horizontal area of ​​the power amplifier and increases its vertical height, making it more suitable for different application environments. Please refer to... Figure 2 , Figure 2 The cross-sectional view of the power amplifier provided in this application shows that the internal circuitry of the power amplifier in this application is distributed in both the horizontal and vertical directions.

[0037] The first-stage amplifier circuit 11 is located at the front end of the signal receiving link to amplify the weak input radio frequency (RF) signal, thereby amplifying the RF signal voltage, increasing the RF signal amplitude, and optimizing the RF signal linearity and signal-to-noise ratio. The second-stage amplifier circuit 12 is mainly located at the end of the transmitting link to amplify the power of the RF signal after the first-stage amplification and transmit it to the load or drive an antenna for long-distance transmission or coverage. The first-stage amplifier circuit 11 can be a gallium arsenide low-noise amplifier, and the second-stage amplifier circuit 12 can be a gallium nitride power amplifier; this application does not limit the specific type of amplifier.

[0038] If the traces between the first-stage amplifier circuit 11 and the second-stage amplifier circuit 12 are too close, electromagnetic coupling may occur between them, leading to signal distortion or other problems, or even burning out the first-stage amplifier circuit 11 and the second-stage amplifier circuit 12. In this application, by placing the first-stage amplifier circuit 11 in the first recessed groove 24 and the second-stage amplifier circuit 12 on the embedded heat sink 26, the distance between the second-stage amplifier circuit 12 and the first-stage amplifier circuit 11 is greater, and they are also isolated by the input cover plate 22. Without the need for additional isolation circuits, the interference between them can be reduced, saving costs.

[0039] Since the input impedance of the secondary amplifier circuit 12 is not 50Ω, the external input matching circuit can be directly integrated into the input terminal of the secondary amplifier circuit 12 to match the standard impedance (e.g., 50Ω) of the preceding circuit to the intermediate impedance, thereby maximizing the power transfer between stages. The internal input matching circuit mainly matches the input impedance of the amplifying transistor in the secondary amplifier circuit 12, compensating for its parasitic parameters and matching the high impedance or complex impedance characteristics of the transistor to the intermediate impedance (e.g., 10-20Ω). Therefore, the external input matching circuit can be located outside the package of the amplifying transistor in the secondary amplifier circuit 12. In this application, the external input matching circuit is located on the input cover plate 22 and connected to the primary amplifier circuit 11. The internal input matching circuit needs to be integrated inside the amplifying transistor package or in a position close to the chip in the secondary amplifier circuit 12. Therefore, both the internal input matching circuit and the secondary amplifier circuit 12 are located on the embedded heat sink 26. The output matching circuit matches the output impedance of the secondary amplifier circuit 12 to the load impedance (e.g., 50Ω) to maximize output power and efficiency.

[0040] It should be noted that if the physical distance between the input matching circuit and the output matching circuit is too close, high-frequency signals may couple between them through radiation or crosstalk. For example, the external input matching circuit is susceptible to interference from the high-power signal output by the output matching circuit, and the high-order harmonics output by the output matching circuit may couple back to the input matching circuit, causing oscillation or noise. Therefore, the external input matching circuit is mounted on the input cover plate 22, the internal input matching circuit is mounted on the embedded heat sink 26, and the output matching circuit is separately mounted in the second recessed groove 25 and covered by the output cover plate 23. This isolates the internal and external input matching circuits from the output matching circuit, preventing interference and ensuring the transmitted signal remains stable.

[0041] It should also be noted that the bottom of the first recessed groove 24 can be, but is not limited to, a PCB board, to solder the first-stage amplifier circuit 11 onto the PCB board at the bottom of the first recessed groove 24. The first-stage amplifier circuit 11 is connected to the input external matching circuit 13 of the second-stage amplifier circuit 12 on the input cover plate 22 via connecting wires on the side wall of the first recessed groove 24. The input cover plate 22 and the embedded heat sink 26 are on the same horizontal plane. The input external matching circuit 13 and the input internal matching circuit 14 of the second-stage amplifier circuit 12 are connected via the input cover plate 22 and... The traces on the embedded heat sink 26 are interconnected. A PCB board can also be set on the input cover plate 22 so that the input external matching circuit 13 of the secondary amplifier circuit 12 can be soldered onto the PCB board on the input cover plate 22. A PCB board can also be set on the embedded heat sink 26 so that the input internal matching circuit 14 of the secondary amplifier circuit 12 and the secondary amplifier circuit 12 can be soldered onto the embedded heat sink 26. The bottom of the second recessed groove 25 can be set as a PCB board so that the output matching circuit 15 of the secondary amplifier circuit 12 can be soldered onto the bottom of the second recessed groove 25.

[0042] After the input cover plate 22 is placed above the first recessed groove 24, the input cover plate 22 and the interior of the first recessed groove 24 form a cavity. The lower surface of the input cover plate 22 is inside the cavity where the first recessed groove 24 is located, while the input external matching circuit 13 of the secondary amplifier circuit 12 is disposed on the upper surface of the input cover plate 22.

[0043] Furthermore, when the first-stage amplifier circuit 11 is a gallium arsenide low-noise amplifier, a gallium arsenide bias circuit, a gallium arsenide input matching circuit, and a gallium arsenide output matching circuit can be set for the gallium arsenide low-noise amplifier. The gallium arsenide bias circuit provides bias voltage for the gallium arsenide low-noise amplifier, the gallium arsenide input matching circuit performs input impedance matching for the gallium arsenide low-noise amplifier, and the gallium arsenide output matching circuit performs output impedance matching for the gallium arsenide low-noise amplifier. Since the first-stage amplifier circuit 11 mainly amplifies the voltage of the signal, the interference between its input matching circuit and output matching circuit is small. Therefore, the gallium arsenide bias circuit, the gallium arsenide input matching circuit, and the gallium arsenide output matching circuit can all be placed in the first recessed groove 24.

[0044] In addition, the embedded heat sink 26 is also part of the cavity substrate and is disposed between the first recessed groove 24 and the second recessed groove 25.

[0045] In summary, the first-stage amplifier circuit 11 is placed in the first recessed groove 24, the input external matching circuit 13 of the second-stage amplifier circuit 12 is placed on the input cover plate 22, the input internal matching circuit 14 of the second-stage amplifier circuit 12 and the second-stage amplifier circuit 12 are placed on the embedded heat sink 26, and the output matching circuit 15 of the second-stage amplifier circuit 12 is placed in the second recessed groove 25. The embedded heat sink 26 is separated between the first recessed groove 24 and the second recessed groove 25. Based on this, the circuits in the first recessed groove 24 and the second recessed groove 25 are far apart, and the degree of mutual interference is small, so there is no need to set up an additional isolation circuit. In addition, some circuits are placed on the input cover plate 22, the input cover plate 22 is placed on the first recessed groove 24, and the output cover plate 23 is placed on the second recessed groove 25. Therefore, the circuits are not all laid flat on the same horizontal plane, but are also distributed in the vertical direction, thereby saving the horizontal area of ​​the entire power amplifier and facilitating the installation and use of the power amplifier.

[0046] Based on the above embodiments:

[0047] As a preferred embodiment, it also includes an input bias circuit and an output bias circuit for the second-stage amplifier circuit 12;

[0048] The input bias circuit of the second-stage amplifier circuit 12 is disposed on the input cover plate 22. The input bias circuit of the second-stage amplifier circuit 12 is connected to the second-stage amplifier circuit 12 and is used to provide the first bias voltage for the second-stage amplifier circuit 12.

[0049] The output bias circuit of the secondary amplifier circuit 12 is disposed on the output cover plate 23. The output bias circuit of the secondary amplifier circuit 12 is connected to the secondary amplifier circuit 12 and is used to provide a second bias voltage for the secondary amplifier circuit 12.

[0050] In this embodiment, the input bias circuit and output bias circuit of the secondary amplifier circuit 12 are less affected by interference, so they can be respectively disposed on the input cover plate 22 and the output cover plate 23. The output bias circuit of the secondary amplifier circuit 12 is used to provide a precise first bias voltage to the gate of the transistor of the secondary amplifier circuit 12. This suppresses gate oscillations in the transistors. Specifically, when the secondary amplifier circuit 12 is a gallium nitride power amplifier, the input bias circuit is used to provide a precise first bias voltage to the gate of the GaN transistor. The output bias circuit is used to provide a precise second bias voltage to the drain of the transistors in the secondary amplifier circuit 12, such as GaN transistors. To monitor drain current The changes.

[0051] As a preferred embodiment, it also includes an output detection circuit;

[0052] The output detection circuit is placed on the output cover plate 23 and connected to the output matching circuit 15 of the secondary amplifier circuit 12.

[0053] The output detection circuit is mainly used for real-time monitoring and control of the output signal characteristics of the secondary amplifier circuit 12, ensuring efficient, stable, and safe system operation. This includes extracting and quantifying physical parameters of the output signal, such as power, voltage standing wave ratio (VSWR), and temperature, and feeding this information back to the control system for dynamic adjustment of the secondary amplifier's operating state or triggering protection mechanisms. Therefore, the detection circuit is less susceptible to interference and can be mounted on the output cover plate 23.

[0054] It should be noted that since the output matching circuit 15 of the secondary amplifier circuit 12 performs output matching on the secondary amplifier circuit 12 before outputting the output signal of the secondary amplifier circuit 12, the output detection circuit needs to be connected to the output matching circuit 15 of the secondary amplifier circuit 12.

[0055] As a preferred embodiment, a coupler is also included;

[0056] The coupler is placed on the output cover plate 23 and connected between the output matching circuit 15 and the output detection circuit of the secondary amplifier circuit 12.

[0057] The coupler uses the principle of directional coupling to perform non-intrusive sampling of the output signal of the secondary amplifier circuit 12, extracts the power in the output signal and sends it to the output detection circuit so that the output detection circuit can monitor or provide feedback on the secondary amplifier circuit 12.

[0058] Therefore, the coupler is disposed on the output cover plate 23 and on the lower surface of the output cover plate 23 to connect with the output matching circuit 15 of the secondary amplifier circuit 12. After the output cover plate 23 is placed on the second recessed groove 25, it forms a cavity with the second recessed groove 25. The lower surface of the output cover plate 23 is an inner surface of the cavity formed with the second recessed groove 25.

[0059] It should be noted that since the output matching circuit 15 of the secondary amplifier circuit 12 performs output matching on the secondary amplifier circuit 12 before outputting the output signal of the secondary amplifier circuit 12, the coupler needs to be connected to the output matching circuit 15 of the secondary amplifier circuit 12.

[0060] In a preferred embodiment, the cavity substrate 21 is an organic encapsulation substrate.

[0061] In this embodiment, the cavity substrate 21 is an organic encapsulation substrate, so as to spatially isolate the circuit inside the power amplifier from the circuit outside the cavity substrate 21.

[0062] As a preferred embodiment, it also includes a sealing cover plate 3;

[0063] The edges of the encapsulation cover plate 3 and the cavity substrate 21 form a detachable or sealed connection, and the encapsulation cover plate 3 and the cavity substrate 21 are the outer shell of the power amplifier.

[0064] In the prior art, injection molding is usually performed on the power amplifier, that is, casting a layer of plastic sealant to isolate the internal circuit of the power amplifier. However, the molding material will cause insertion loss between the internal circuits of the power amplifier, resulting in loss during the signal transmission process inside the power amplifier. Therefore, this embodiment also includes a packaging cover plate 3. The packaging cover plate 3 and the cavity substrate 21 form a detachable connection at their edges, that is, the packaging cover plate 3 and the cavity substrate 21 can be detached and separated to maintain the circuit of the power amplifier inside the cavity substrate 21. The edges of the packaging cover plate 3 and the cavity substrate 21 can also form a sealed connection. The packaging cover plate 3 and the cavity substrate 21 cannot be separated to ensure that the power amplifier is isolated from the external circuit.

[0065] Based on this, the connection between the package cover 3 and the cavity substrate 21 provides a cavity for the internal circuit of the power amplifier, avoiding the introduction of additional insertion loss. That is, there is no need to injection mold the circuit in the power amplifier, which can achieve isolation between the internal circuit and the external circuit of the power amplifier, avoiding impedance shift of the power amplifier caused by injection molding and reducing device performance.

[0066] Please refer to Figure 3 and Figure 4 , Figure 3 A schematic diagram of a power amplifier including a package cover provided in this application. Figure 4 This is a schematic diagram showing the connection between the encapsulation cover and the cavity substrate provided in this application.

[0067] In a preferred embodiment, the encapsulation cover 3 is made of plastic.

[0068] In this embodiment, the encapsulation cover 3 is made of non-conductive plastic to achieve isolation.

[0069] In a preferred embodiment, the bottom layer material of both the input cover plate 22 and the output cover plate 23 is copper plating.

[0070] In this embodiment, the bottom layer material of the input cover plate 22 and the bottom layer material of the output cover plate 23 are both copper-plated, so that electromagnetic shielding is formed in the cavity formed by the input cover plate 22 and the first recessed groove 24, and electromagnetic shielding is formed in the cavity formed by the output cover plate 23 and the second recessed groove 25.

[0071] In a preferred embodiment, the edge of the input cover plate 22 is welded to the opening edge of the first recessed groove 24; the edge of the output cover plate 23 is welded to the opening edge of the second recessed groove 25.

[0072] In this embodiment, the edge of the input cover plate 22 and the opening edge of the first recessed groove 24 are welded together to make the cavity formed by the input cover plate 22 and the first recessed groove 24 a closed cavity, further avoiding interference with external circuits; the edge of the output cover plate 23 and the opening edge of the second recessed groove 25 are welded together to make the cavity formed by the output cover plate 23 and the second recessed groove 25 a closed cavity, further avoiding interference with external circuits.

[0073] In a preferred embodiment, the surface material of the second recessed groove 25 is a ceramic medium.

[0074] The surface material of the second recessed groove 25 where the output matching circuit 15 of the secondary amplifier circuit 12 is located can be a ceramic dielectric. Specifically, a low-loss ceramic dielectric with a dielectric constant of 19.8 can be used to control the circuit size on the basis of precise tuning, so as to achieve the dual benefits of high performance and miniaturization.

[0075] It should also be noted that, in this specification, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0076] The above description of the disclosed embodiments enables those skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A power amplifier, characterized in that, It includes a first-stage amplifier circuit, a second-stage amplifier circuit, an internal input matching circuit for the second-stage amplifier circuit, an external input matching circuit for the second-stage amplifier circuit, an output matching circuit for the second-stage amplifier circuit, a cavity substrate, an input cover plate, and an output cover plate; The cavity substrate includes a first recessed groove and a second recessed groove, which are separated by an embedded heat sink. The first-stage amplifier circuit is placed in the first recessed groove; the external matching circuit of the second-stage amplifier circuit is placed on the input cover plate; the internal matching circuit of the second-stage amplifier circuit and the second-stage amplifier circuit are placed on the embedded heat sink; the output matching circuit of the second-stage amplifier circuit is placed in the second recessed groove; the input cover plate is placed on the first recessed groove; and the output cover plate is placed on the second recessed groove. The first-stage amplifier circuit, the external input matching circuit of the second-stage amplifier circuit, the internal input matching circuit of the second-stage amplifier circuit, the second-stage amplifier circuit, and the output matching circuit of the second-stage amplifier circuit are connected in sequence.

2. The power amplifier as described in claim 1, characterized in that, It also includes the input bias circuit of the second-stage amplifier circuit and the output bias circuit of the second-stage amplifier circuit; The input bias circuit of the second-stage amplifier circuit is disposed on the input cover plate and is connected to the second-stage amplifier circuit to provide a first bias voltage to the second-stage amplifier circuit. The output bias circuit of the secondary amplifier circuit is disposed on the output cover plate and is connected to the secondary amplifier circuit to provide a second bias voltage for the secondary amplifier circuit.

3. The power amplifier as described in claim 1, characterized in that, It also includes an output detection circuit; The output detection circuit is placed on the output cover plate and connected to the output matching circuit of the secondary amplifier circuit.

4. The power amplifier as described in claim 3, characterized in that, It also includes couplers; The coupler is placed on the output cover plate and connected between the output matching circuit of the secondary amplifier circuit and the output detection circuit.

5. The power amplifier as described in claim 1, characterized in that, The cavity substrate is an organic encapsulation substrate.

6. The power amplifier as described in claim 1, characterized in that, It also includes the encapsulation cover; The edges of the encapsulation cover and the cavity substrate form a detachable or sealed connection, and the encapsulation cover and the cavity substrate constitute the outer shell of the power amplifier.

7. The power amplifier as described in claim 6, characterized in that, The packaging cover is made of plastic.

8. The power amplifier as claimed in claim 1, characterized in that, The bottom layer material of both the input cover and the output cover is copper plating.

9. The power amplifier as described in claim 8, characterized in that, The edge of the input cover plate is welded to the opening edge of the first recessed groove; the edge of the output cover plate is welded to the opening edge of the second recessed groove.

10. The power amplifier according to any one of claims 1-9, characterized in that, The surface material of the second recessed groove is a ceramic medium.

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