Structure for preventing resonance of loudspeaker and microphone and intelligent equipment

Abstract

The utility model relates to a horn and microphone resonance prevention structure and intelligent equipment, and belongs to the field of intelligent equipment. A structure for preventing resonance of a loudspeaker and a microphone comprises a shell assembly provided with an accommodating cavity; the first shockproof assembly is arranged on the shell assembly; the second shockproof assembly is arranged on the shell assembly; the loudspeaker assembly is arranged on the first shockproof assembly and located in the containing cavity; the circuit board microphone assembly is arranged on the second shockproof assembly and located in the accommodating cavity; and the fixing assembly passes through the circuit board, the microphone assembly and the second shockproof assembly and is arranged on the shell assembly. According to the structure, by arranging the first shockproof assembly and the second shockproof assembly which are independent, vibration conducted to the microphone by the loudspeaker assembly is greatly reduced, and the accuracy and stability of voice recognition are improved.

Description

Technical Field

[0001] This utility model relates to the field of smart devices, and in particular to a structure for preventing resonance between a speaker and a microphone, and a smart device. Background Technology

[0002] In existing technologies, speakers in smart devices vibrate when broadcasting sound. Since smart terminals are mostly enclosed or semi-enclosed structures, the mechanical waves generated by the speaker vibrations are conducted through the terminal casing and internal components. This vibration, when transmitted to the microphone, interferes with its performance, causing background noise to enter the microphone during sound acquisition, severely affecting the accuracy and reliability of the device's voice recognition. Utility Model Content

[0003] Therefore, it is necessary to provide a structure and smart device that prevents resonance between the speaker and microphone when the speaker of a smart device vibrates, so as to address the problem that the vibration sound waves are transmitted to the microphone.

[0004] A structure for preventing speaker and microphone resonance includes: a housing assembly having a receiving cavity; a first shock-absorbing assembly disposed on the housing assembly; a second shock-absorbing assembly disposed on the housing assembly; a speaker assembly disposed on the first shock-absorbing assembly and located within the receiving cavity; a circuit board microphone assembly disposed on the second shock-absorbing assembly and located within the receiving cavity; and a fixing assembly passing through the circuit board microphone assembly and the second shock-absorbing assembly and disposed on the housing assembly.

[0005] The above-disclosed structure provides an anti-speaker and microphone resonance structure for use in smart devices. This structure elastically isolates the speaker assembly and the circuit board microphone assembly by setting independent first and second anti-vibration components. The first anti-vibration component effectively absorbs vibrations generated during speaker operation, preventing direct transmission of vibrations to the housing assembly; the second anti-vibration component provides cushioning for the circuit board microphone assembly. This dual protection significantly reduces the possibility of vibrations affecting the microphone through mechanical transmission. A fixing component passes through the circuit board microphone assembly and the second anti-vibration component, securing them to the housing assembly. This ensures stable installation of each component while avoiding vibration transmission caused by rigid connections, further optimizing the anti-vibration effect. Thanks to this structural design, the device can significantly reduce noise generated by speaker vibration during voice interaction, greatly improving the accuracy and stability of voice recognition. Whether in noisy environments or everyday use scenarios, it ensures clear voice input and smooth output, effectively improving the user's voice interaction experience. Simultaneously, reducing vibration interference extends the lifespan of the microphone and speaker, reduces the probability of device failure due to vibration, improves the overall reliability and stability of the device, and provides strong support for the high-performance operation of smart terminal devices.

[0006] In one embodiment, there are multiple second shock-absorbing components sandwiched between the housing assembly and the circuit board microphone assembly. There are also multiple fixing components, each passing through the circuit board microphone assembly and one of the second shock-absorbing components. By providing multiple second shock-absorbing components, when the speaker vibrates during operation, the vibration is transmitted to the housing assembly. These multiple second shock-absorbing components absorb and buffer the vibration from different points and directions, dispersing the vibration energy. Compared to a single shock-absorbing component, this multi-point vibration damping layout more comprehensively and effectively suppresses vibration transmission to the circuit board microphone assembly. The multiple fixing components, passing through the circuit board microphone assembly and the second shock-absorbing components and fixed to the housing assembly, form a stable multi-point fixing connection. This design avoids the stress concentration problem that may occur with single-point fixing, making the installation of the circuit board microphone assembly inside the device more stable. Even if the device is subjected to external impact or used in a complex environment, the multiple fixing components and the second shockproof component work together to ensure that the circuit board microphone assembly will not be easily displaced by external force, and the elastic deformation of the second shockproof component can buffer the vibration caused by external force, further ensuring the normal working environment of the microphone.

[0007] In one embodiment, there are multiple first shock-absorbing components and multiple horn components, with each of the first shock-absorbing components sandwiched between the horn components and the housing component in a one-to-one correspondence. By using multiple horn components corresponding to multiple first shock-absorbing components, since each horn component generates vibration during operation, the multiple first shock-absorbing components can precisely correspond to each horn component, buffering and absorbing vibration from multiple points. Simultaneously, this one-to-one correspondence arrangement ensures that each horn component receives independent and stable support and shockproof protection. The even distribution of the multiple first shock-absorbing components can evenly disperse the reaction force generated by the horn components during operation, preventing structural damage or deformation caused by excessive local stress.

[0008] In one embodiment, the fixing component includes a locking head and a fixing part. The fixing part is disposed on the locking head, passes through the circuit board microphone assembly and the second shock-absorbing component, and is mounted on the housing assembly. By placing the fixing part on the locking head, the circuit board microphone assembly, the second shock-absorbing component, and the housing assembly are tightly connected. Appropriate tightening ensures that each component will not shift due to vibration, external forces, or other factors during device operation, thus guaranteeing the integrity and stability of the device from a structural perspective. The fixing part passes through the circuit board microphone assembly and the second shock-absorbing component and connects to the housing assembly. This through-type design cleverly utilizes the elastic characteristics of the second shock-absorbing component. When the device is running, vibrations generated by the speaker assembly or externally transmitted vibrations may attempt to cause the components to shake. At this time, the second shock-absorbing component can absorb vibration energy through deformation, while the fixing part acts as a supporting frame, limiting excessive component displacement while avoiding direct vibration transmission caused by rigid connections. Compared to ordinary rigid fixing methods, this design effectively buffers vibrations in the transmission path, reducing the interference of vibrations on microphone performance, thereby improving the accuracy of device voice recognition and providing users with a clearer and more stable voice interaction experience.

[0009] In one embodiment, the fixing part includes a limiting part and a threaded part. The limiting part is disposed on the locking head, and the threaded part is disposed on the limiting part. The limiting part passes through the circuit board microphone assembly and the second shock-absorbing assembly, and the threaded part is disposed on the housing assembly. By passing the limiting part through the circuit board microphone assembly and the second shock-absorbing assembly, and adapting its size and shape to the perforations on the assemblies, the horizontal displacement of the assemblies can be precisely limited, ensuring that the circuit board microphone assembly and the second shock-absorbing assembly maintain a relatively stable positional relationship. When the device is subjected to external impact or speaker vibration, the limiting part prevents the assemblies from shifting or misaligning due to vibration, ensuring the regularity of the internal structure of the device and providing a stable environment for the normal operation of the microphone. At the same time, since the limiting part has no threads, it avoids the entire fixing assembly being locked downwards, ensuring that the second shock-absorbing assembly is not compressed and deformed, reducing the rigid connection strength between the circuit board microphone assembly and the housing assembly. During device operation, the threaded part provides a continuous and stable fastening force, preventing the components from loosening and achieving a firm fixation of the circuit board microphone assembly and the second shock-absorbing assembly.

[0010] In one embodiment, the housing assembly includes a top cover and a lower housing. The top cover is disposed on the lower housing and forms the receiving cavity. The first and second shock-absorbing components are disposed on the lower housing. By placing the first and second shock-absorbing components on the lower housing, the characteristics of the lower housing as the main load-bearing structure are fully utilized. The lower housing provides a stable mounting base for the shock-absorbing components, ensuring that the absorption and buffering effect is not affected by the instability of the mounting surface. When the speaker assembly vibrates during operation, the first shock-absorbing component disposed on the lower housing can directly receive and dissipate the vibration energy, preventing the vibration from being transmitted to other parts through the lower housing. The second shock-absorbing component also relies on the lower housing to effectively isolate the circuit board microphone assembly from the vibration source, and the structural strength of the lower housing also helps to disperse the stress generated when the components are fixed, further optimizing the shock-absorbing effect. This layout makes the internal structure of the device compact and orderly, with each component performing its own function. While ensuring the performance of the device, it also improves the stability and reliability of the overall structure. At the same time, the enclosed receiving cavity provides physical protection for the internal components, preventing dust, water, and external impacts, protecting precision components such as the speaker assembly and circuit board microphone assembly from the influence of the external environment, and extending the service life of the device.

[0011] In one embodiment, the lower housing includes a main housing, a mounting housing, and mounting posts. Multiple mounting housings and mounting posts are disposed on the main housing. Multiple first shock-absorbing components are also disposed, one-to-one on each mounting housing, and multiple second shock-absorbing components are disposed one-to-one on each mounting post. By employing a structural design with a main housing, multiple mounting housings, and multiple mounting posts, efficient shock absorption and stable support can be achieved through functional zoning. The main housing, as the core frame, provides a stable mounting foundation for the mounting housings and mounting posts, and forms a closed cavity with the top cover, achieving dustproof, waterproof, and impact-resistant protection. Multiple mounting housings precisely fit the speaker assembly, and with corresponding first shock-absorbing components, effectively isolate vibrations generated during speaker assembly operation, preventing vibration transmission within the device and optimizing the sound wave transmission path to improve sound quality. The multiple mounting posts, in conjunction with the second shock-absorbing components, precisely limit the movement of the circuit board microphone assembly, and then buffer external impacts and internal vibrations through elastic deformation, avoiding the impact of rigid transmission on microphone performance.

[0012] In one embodiment, the mounting housing includes a mounting side shell and a mounting bottom shell. The mounting side shell is disposed on the main housing, and the mounting bottom shell is disposed on the mounting side shell. The mounting side shell and the mounting bottom shell enclose a mounting groove, in which the first shock-absorbing component and the horn assembly are located. By securely mounting the mounting side shell on the main housing, a solid vertical support is provided for the entire mounting housing, ensuring its stability during equipment operation. The mounting bottom shell and the mounting side shell enclose the mounting groove, which provides dedicated installation space for the first shock-absorbing component and the horn assembly. Through precise matching dimensions, accurate positioning of the horn assembly is achieved, preventing displacement during operation and thus avoiding increased vibration interference due to positional changes. Simultaneously, the space enclosed by the mounting side shell and the mounting bottom shell can also provide initial guidance and constraint for the sound waves emitted by the horn, optimizing the sound wave propagation path and reducing noise caused by sound wave reflection. The first shock-absorbing component located in the mounting slot can fully play a buffering role. When the speaker vibrates during operation, the first shock-absorbing component absorbs the vibration energy through elastic deformation in the mounting slot, isolating the vibration of the speaker assembly from the main housing and other components, greatly reducing the possibility of vibration being transmitted to the microphone, effectively improving the clarity and stability of the device's voice interaction, and bringing users a better user experience.

[0013] In one embodiment, the circuit board microphone assembly includes a circuit board microphone body and a protrusion. The protrusion is disposed on the circuit board microphone body, which is disposed on the second shock-absorbing assembly. The housing assembly has a groove, and the protrusion is located in the groove. By precisely fitting the protrusion onto the circuit board microphone body and the groove of the housing assembly, the circuit board microphone body can be precisely positioned, ensuring a stable installation position within the device and preventing displacement due to external impacts or speaker vibrations, thus ensuring the stability of the microphone when acquiring voice signals. Simultaneously, the cooperation between the protrusion and the groove further enhances the cushioning effect of the second shock-absorbing assembly. When the device is subjected to vibration, the second shock-absorbing assembly undergoes elastic deformation, while the protrusion remains relatively constrained within the groove, preventing excessive shaking of the circuit board microphone body. This ensures that the shock-absorbing assembly fully exerts its shock-absorbing function while preventing collisions or interference with other components due to excessive displacement. In addition, this design can help disperse the fastening force applied by the fixing components, prevent the main body of the circuit board microphone from being damaged due to excessive local stress, effectively improve the reliability of the internal structure of the device, ensure that the microphone can still accurately collect sound in complex vibration environments, reduce noise interference, and provide strong support for the efficient operation of voice interaction.

[0014] The second aspect of this application discloses a smart device, which includes: the aforementioned anti-speaker and microphone resonance structure; and a smart device body, wherein the anti-speaker and microphone resonance structure is disposed on the smart device.

[0015] The second aspect disclosed above discloses a smart device that integrates the aforementioned anti-speaker and microphone resonance structure into the smart device body. This structure effectively isolates the interference of speaker vibration on the microphone, avoids noise caused by vibration, and enables the microphone to clearly collect user voice commands, greatly improving the accuracy and response speed of voice recognition. Whether in the voice control scenario of smart home devices or in the smart vehicle voice interaction system, it can ensure that the device accurately executes user commands and achieves smooth and efficient human-computer interaction. Attached Figure Description

[0016] Figure 1 First perspective view of the structure to prevent resonance between the speaker and microphone;

[0017] Figure 2 A second perspective view of the structure to prevent resonance between the speaker and microphone;

[0018] Figure 3 Cross-sectional view of the structure to prevent resonance between the speaker and microphone;

[0019] Figure 4 for Figure 3 A magnified view of a portion of region A;

[0020] Figure 5 for Figure 3 A magnified view of a portion of region B;

[0021] Figure 6 Exploded view of the structure to prevent resonance between the speaker and microphone;

[0022] Figure 7 This is a three-dimensional view of the housing assembly;

[0023] Figure 8 A 3D view of the microphone assembly on the circuit board;

[0024] Figure 9 This is a 3D view of the fixed components.

[0025] The correspondence between the reference numerals and the component names is as follows:

[0026] 1. Housing assembly, 11. Top cover, 12. Lower housing, 121. Main housing, 122. Housing mounting, 1221. Side housing mounting, 1222. Bottom housing mounting, 123. Mounting post, 101. Receiving cavity, 102. Mounting groove, 103. Recess.

[0027] 2. First shockproof component;

[0028] 3. Second shock-absorbing component;

[0029] 4-speaker assembly;

[0030] 5. Circuit board microphone assembly; 51. Circuit board microphone body; 52. Protrusion;

[0031] 6. Fixing component, 61. Locking head, 62. Fixing part, 621. Limiting part, 622. Threaded part. Detailed Implementation

[0032] To better understand the above-mentioned objectives, features, and advantages of this utility model, the present utility model will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be noted that, unless otherwise specified, the embodiments and features described in these embodiments can be combined with each other.

[0033] Many specific details are set forth in the following description in order to provide a full understanding of the present invention. However, the present invention may also be implemented in other ways different from those described herein. Therefore, the scope of protection of the present invention is not limited to the specific embodiments disclosed below.

[0034] The following describes, with reference to the accompanying drawings, some embodiments of the anti-speaker and microphone resonance structure and intelligent device of this utility model.

[0035] Example 1

[0036] like Figures 1 to 9As shown, this embodiment discloses a structure for preventing resonance between a speaker and a microphone, comprising: a housing assembly 1, the housing assembly 1 having a receiving cavity 101; a first shock-absorbing component 2, the first shock-absorbing component 2 being disposed on the housing assembly 1; a second shock-absorbing component 3, the second shock-absorbing component 3 being disposed on the housing assembly 1; a speaker assembly 4, the speaker assembly 4 being disposed on the first shock-absorbing component 2 and located in the receiving cavity 101; a circuit board microphone assembly 5, the circuit board microphone assembly 5 being disposed on the second shock-absorbing component 3 and located in the receiving cavity 101; and a fixing component 6, the fixing component 6 passing through the circuit board microphone assembly 5 and the second shock-absorbing component 3 and being disposed on the housing assembly 1.

[0037] This application discloses a structure for preventing speaker and microphone resonance in smart devices. This structure elastically isolates the speaker assembly 4 and the circuit board microphone assembly 5 by setting independent first and second anti-vibration components 2 and 3, respectively. The first anti-vibration component 2 effectively absorbs vibrations generated during speaker operation, preventing direct transmission of vibrations to the housing assembly 1; the second anti-vibration component 3 provides cushioning for the circuit board microphone assembly 5. This dual protection significantly reduces the possibility of vibrations affecting the microphone through mechanical transmission. A fixing component 6 passes through the circuit board microphone assembly 5 and the second anti-vibration component 3 and is fixed to the housing assembly 1, ensuring stable installation of each component while avoiding vibration transmission caused by rigid connections, further optimizing the anti-vibration effect. Thanks to this structural design, the device can significantly reduce noise generated by speaker vibration during voice interaction, greatly improving the accuracy and stability of voice recognition. Whether in noisy environments or everyday use scenarios, it ensures clear voice input and smooth output, effectively improving the user's voice interaction experience. Simultaneously, reducing vibration interference extends the lifespan of the microphone and speaker, reduces the probability of device failure due to vibration, improves the overall reliability and stability of the device, and provides strong support for the high-performance operation of smart terminal devices.

[0038] like Figure 2 , Figure 3 , Figure 4 and Figure 6As shown, in addition to the features of the above embodiments, this embodiment further specifies that: there are multiple second shock-absorbing components 3, which are sandwiched between the housing assembly 1 and the circuit board microphone assembly 5; and there are multiple fixing components 6, which pass through the circuit board microphone assembly 5 and the multiple second shock-absorbing components 3 respectively. By providing multiple second shock-absorbing components 3, when the speaker vibrates during operation, the vibration is transmitted to the housing assembly 1. The multiple second shock-absorbing components 3 can absorb and buffer the vibration from different points and directions, dispersing the vibration energy. Compared to a single shock-absorbing component, this multi-point vibration damping layout can more comprehensively and effectively suppress the transmission of vibration to the circuit board microphone assembly 5. The multiple fixing components 6 pass through the circuit board microphone assembly 5 and the second shock-absorbing components 4 respectively and are fixed to the housing assembly 1, forming a stable multi-point fixed connection. This design avoids the stress concentration problem that may occur with single-point fixing, making the installation of the circuit board microphone assembly 5 inside the device more stable. Even if the device is subjected to external impact or used in a complex environment, the multiple fixing components 6 and the second shockproof component 4 work together to ensure that the circuit board microphone assembly 5 will not be easily displaced by external force, and the elastic deformation of the second shockproof component 4 can buffer the vibration caused by external force, further ensuring the normal working environment of the microphone.

[0039] like Figure 2 and Figure 6 As shown, in addition to the features of the above embodiments, this embodiment further specifies that: the number of first shock-absorbing components 2 is multiple, the number of speaker components 4 is multiple, and the multiple first shock-absorbing components 2 are sandwiched between the multiple speaker components 4 and the housing component 1 in a one-to-one correspondence. By using multiple speaker components 4 corresponding to multiple first shock-absorbing components 2, since each speaker component will generate vibration when working, the multiple first shock-absorbing components 2 can accurately correspond to each speaker component 4, buffering and absorbing vibration from multiple points. At the same time, this one-to-one correspondence setting allows each speaker component 4 to receive independent and stable support and shock-absorbing protection. The multiple first shock-absorbing components 2 are evenly distributed, which can evenly disperse the reaction force generated when the speaker components 4 are working, preventing structural damage or deformation caused by excessive local stress.

[0040] like Figure 3 , Figure 5 and Figure 9As shown, in addition to the features of the above embodiments, this embodiment further specifies that: the fixing component 6 includes a locking head 61 and a fixing part 62. The fixing part 62 is disposed on the locking head 61, and passes through the circuit board microphone assembly 5 and the second anti-vibration assembly 3 and is disposed on the housing assembly 1. By disposing of the fixing part 62 on the locking head 61, the circuit board microphone assembly 5, the second anti-vibration assembly 4 and the housing assembly 1 are tightly connected. By tightening appropriately, it is ensured that each component will not be displaced due to vibration, external force or other factors during equipment operation, thus ensuring the integrity and stability of the equipment from a structural perspective. The fixing part 62 passes through the circuit board microphone assembly 5 and the second anti-vibration assembly 4 and is connected to the housing assembly 1. This through-type design cleverly utilizes the elastic characteristics of the second anti-vibration assembly 4. When the equipment is running, the vibration generated by the speaker assembly 4 or the vibration transmitted from the outside will attempt to cause each component to shake. At this time, the second anti-vibration assembly 4 can absorb the vibration energy through deformation, while the fixing part 62 acts as a supporting frame, limiting excessive displacement of the components while avoiding direct transmission of vibration caused by rigid connection. Compared to ordinary rigid fixing methods, this design effectively buffers vibrations in the transmission path, reducing the interference of vibrations on microphone performance, thereby improving the accuracy of device voice recognition and bringing users a clearer and more stable voice interaction experience.

[0041] like Figure 3 , Figure 5 and Figure 9 As shown, in addition to the features of the above embodiments, this embodiment further defines: the fixing part 62 includes a limiting part 621 and a threaded part 622. The limiting part 621 is disposed on the locking head 61, and the threaded part 622 is disposed on the limiting part 621. The limiting part 621 passes through the circuit board microphone assembly 5 and the second shockproof assembly 3, and the threaded part 622 is disposed on the housing assembly 1. By allowing the limiting part 621 to pass through the circuit board microphone assembly 5 and the second shockproof assembly 4, and by adapting its size and shape to the perforations on the assemblies, the horizontal displacement of the assemblies can be precisely limited, ensuring that the circuit board microphone assembly 5 and the second shockproof assembly 4 maintain a relatively stable positional relationship. When the device is subjected to external impact or speaker vibration, the limiting part 621 prevents the assemblies from shifting or misaligning due to vibration, ensuring the regularity of the internal structure of the device and providing a stable environment for the normal operation of the microphone. At the same time, since the limiting part 62 has no threads, it avoids the entire fixing assembly 6 from being locked downwards, ensuring that the second shockproof assembly 4 will not be compressed and deformed, and reducing the rigid connection strength between the circuit board microphone assembly 5 and the housing assembly 1. During equipment operation, the threaded part 622 provides a continuous and stable fastening force to prevent the components from loosening and to securely fix the circuit board microphone assembly 5 and the second shockproof assembly 4.

[0042] like Figure 1 and Figure 6As shown, in addition to the features of the above embodiments, this embodiment further defines: the housing assembly 1 includes a top cover 11 and a lower housing 12. The top cover 11 is disposed on the lower housing 12 and forms a receiving cavity 101. The first shock-absorbing assembly 2 and the second shock-absorbing assembly 3 are disposed on the lower housing 12. By disposing of the first shock-absorbing assembly 2 and the second shock-absorbing assembly 3 on the lower housing 12, the characteristics of the lower housing 12 as the main load-bearing structure are fully utilized. The lower housing 12 provides a stable mounting base for the shock-absorbing assemblies, ensuring that the effect is not affected by the instability of the mounting surface when absorbing and buffering vibrations. When the speaker assembly 4 vibrates during operation, the first shock-absorbing assembly 2 disposed on the lower housing 12 can directly receive and dissipate the vibration energy, preventing the vibration from being transmitted to other parts through the lower housing 12; the second shock-absorbing assembly 3 also relies on the lower housing 12 to effectively isolate the circuit board microphone assembly 5 from the vibration source, and the structural strength of the lower housing 12 also helps to disperse the stress generated when the components are fixed, further optimizing the shock-absorbing effect. This layout makes the internal structure of the device compact and orderly, with each component performing its own function, ensuring the performance of the device while also improving the stability and reliability of the overall structure. Meanwhile, the enclosed cavity 101 provides physical protection for the internal components, preventing dust, water, and external impacts, protecting precision components such as the speaker assembly 4 and the circuit board microphone assembly 5 from external environmental influences, and extending the service life of the equipment.

[0043] like Figure 1 and Figure 7 As shown, in addition to the features of the above embodiments, this embodiment further defines: the lower housing 12 includes a main housing 121, a mounting housing 122 and a mounting post 123, the number of mounting housings 122 and mounting posts 123 is multiple, the multiple mounting housings 122 and multiple mounting posts 123 are disposed on the main housing 121, the number of first shock-absorbing components 2 is multiple, the multiple first shock-absorbing components 2 are disposed one-to-one on the mounting housing 122, and the multiple second shock-absorbing components 3 are disposed one-to-one on the multiple mounting posts 123. By adopting a structural design consisting of a main housing 121, multiple mounting housings 122, and multiple mounting posts 123, efficient shock absorption and stable support can be achieved through functional zoning. The main housing 121 serves as the core frame, providing a stable mounting foundation for the mounting housings 122 and mounting posts 123, and forming a closed receiving cavity 101 with the top cover 11, achieving dustproof, waterproof, and impact-resistant protection. The multiple mounting housings 122 are precisely adapted to the speaker assembly 4, and in conjunction with the corresponding first shock-absorbing components 3, they can effectively isolate the vibration generated by the speaker assembly 4 during operation, preventing vibration from being transmitted inside the device, while optimizing the sound wave transmission path and improving sound quality. The multiple mounting posts 123, in conjunction with the second shock-absorbing components 3, precisely limit the circuit board microphone assembly 5, and then buffer external impacts and internal vibrations through elastic deformation, avoiding the impact of rigid transmission on microphone performance.

[0044] like Figure 1 and Figure 7 As shown, in addition to the features of the above embodiments, this embodiment further defines: the mounting housing 122 includes a mounting side shell 1221 and a mounting bottom shell 1222. The mounting side shell 1221 is disposed on the main housing 121, and the mounting bottom shell 1222 is disposed on the mounting side shell 1221. The mounting side shell 1221 and the mounting bottom shell 1222 enclose and form a mounting groove 102, in which the first shock-absorbing component 2 and the horn component 4 are located. By firmly mounting the mounting side shell 1221 on the main housing 121, a solid vertical support is provided for the entire mounting housing 122, ensuring its stability during equipment operation. The mounting bottom shell 1222 and the mounting side shell 1221 enclose and form the mounting groove 102, which provides dedicated installation space for the first shock-absorbing component 2 and the horn component 4. Through precise matching dimensions, the horn component 4 is accurately positioned, preventing displacement during operation and thus avoiding increased vibration interference due to positional changes. Meanwhile, the space enclosed by the side shell 1221 and the bottom shell 1222 can also initially guide and constrain the sound waves emitted by the speaker, optimize the sound wave propagation path, and reduce noise caused by sound wave reflection. The first shock-absorbing component 2 located in the mounting groove 102 can fully play a buffering role. When the speaker vibrates during operation, the first shock-absorbing component 2 absorbs the vibration energy through elastic deformation within the mounting groove 102, isolating the vibration of the speaker assembly 4 from the main shell 121 and other components, greatly reducing the possibility of vibration being transmitted to the microphone, effectively improving the clarity and stability of the device's voice interaction, and bringing users a better user experience.

[0045] like Figure 2 and Figure 8As shown, in addition to the features of the above embodiments, this embodiment further defines: the circuit board microphone assembly 5 includes a circuit board microphone body 51 and a protrusion 52. The protrusion 52 is disposed on the circuit board microphone body 51, and the circuit board microphone body 51 is disposed on the second shockproof assembly 3. The housing assembly 1 has a groove 103, and the protrusion 52 is located in the groove 103. By disposing the protrusion 52 on the circuit board microphone body 51 and precisely fitting it with the groove 103 of the housing assembly 1, the circuit board microphone body 51 can be precisely positioned, ensuring that it maintains a stable installation position inside the device, avoiding displacement of the assembly due to external impact or speaker vibration, and ensuring the stability of the microphone when collecting voice signals. At the same time, the cooperation between the protrusion 52 and the groove 103 further enhances the buffering effect of the second shockproof assembly 3. When the device is vibrated, the second shockproof assembly 3 undergoes elastic deformation, while the protrusion 52 can still maintain relative constraint within the groove 103, preventing the circuit board microphone body 51 from shaking excessively. This ensures that the shockproof assembly fully exerts its shock absorption function and avoids collision or interference between the assembly and other components due to excessive displacement. In addition, this design can also help disperse the fastening force applied by the fixing component 6, prevent the circuit board microphone body 51 from being damaged due to excessive local stress, effectively improve the reliability of the internal structure of the device, ensure that the microphone can still accurately collect sound in complex vibration environment, reduce noise interference, and provide strong support for the efficient operation of voice interaction.

[0046] Example 2

[0047] like Figures 1 to 9 As shown, this embodiment discloses a smart device, including: the above-mentioned anti-speaker and microphone resonance structure; and a smart device body, wherein the anti-speaker and microphone resonance structure is disposed on the smart device.

[0048] The second aspect of this application discloses a smart device that integrates the aforementioned anti-speaker and microphone resonance structure into the smart device body. This structure effectively isolates the interference of speaker vibration on the microphone, avoids noise caused by vibration, and enables the microphone to clearly collect user voice commands, greatly improving the accuracy and response speed of voice recognition. Whether in the voice control scenario of smart home devices or in the smart vehicle voice interaction system, it can ensure that the device accurately executes user commands and achieves smooth and efficient human-computer interaction.

[0049] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0050] The embodiments described above are merely illustrative of several implementations of this utility model, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these all fall within the protection scope of this utility model. Therefore, the protection scope of this utility model patent should be determined by the appended claims.

Claims

1. A structure for preventing resonance between a speaker and a microphone, characterized in that, The aforementioned anti-speaker and microphone resonance structure includes: A housing assembly (1) having a receiving cavity (101); The first shock-absorbing component (2) is disposed on the housing component (1); The second shock-absorbing component (3) is disposed on the housing component (1); A horn assembly (4) is disposed on the first shock-absorbing assembly (2) and located in the receiving cavity (101); A circuit board microphone assembly (5) is disposed on the second shockproof assembly (3) and located in the receiving cavity (101); A fixing component (6) passes through the circuit board microphone assembly (5) and the second shockproof assembly (3) and is mounted on the housing assembly (1).

2. The anti-speaker and microphone resonance structure according to claim 1, characterized in that, The number of the second shock-absorbing components (3) is multiple, and the multiple second shock-absorbing components (3) are sandwiched between the housing component (1) and the circuit board microphone component (5). The number of the fixing components (6) is multiple, and the multiple fixing components (6) pass through the circuit board microphone component (5) and the multiple second shock-absorbing components (3) respectively.

3. The anti-speaker and microphone resonance structure according to claim 1, characterized in that, There are multiple first shock-absorbing components (2) and multiple horn components (4). The multiple first shock-absorbing components (2) are sandwiched between the multiple horn components (4) and the housing component (1) in a one-to-one correspondence.

4. The anti-speaker and microphone resonance structure according to claim 1, characterized in that, The fixing component (6) includes a locking head (61) and a fixing part (62). The fixing part (62) is disposed on the locking head (61). The fixing part (62) passes through the circuit board microphone assembly (5) and the second shockproof assembly (3) and is disposed on the housing assembly (1).

5. The anti-speaker and microphone resonance structure according to claim 4, characterized in that, The fixing part (62) includes a limiting part (621) and a threaded part (622). The limiting part (621) is disposed on the locking head (61), and the threaded part (622) is disposed on the limiting part (621). The limiting part (621) passes through the circuit board microphone assembly (5) and the second shockproof assembly (3). The threaded part (622) is disposed on the housing assembly (1).

6. The anti-speaker and microphone resonance structure according to claim 1, characterized in that, The housing assembly (1) includes a top cover (11) and a lower housing (12). The top cover (11) is disposed on the lower housing (12) and forms the receiving cavity (101). The first shock-absorbing component (2) and the second shock-absorbing component (3) are disposed on the lower housing (12).

7. The anti-speaker and microphone resonance structure according to claim 6, characterized in that, The lower housing (12) includes a main housing (121), a mounting housing (122), and mounting posts (123). There are multiple mounting housings (122) and mounting posts (123), which are disposed on the main housing (121). There are multiple first shock-absorbing components (2), which are disposed one-to-one on the mounting housing (122). There are multiple second shock-absorbing components (3), which are disposed one-to-one on the mounting posts (123).

8. The anti-speaker and microphone resonance structure according to claim 7, characterized in that, The mounting housing (122) includes a mounting side shell (1221) and a mounting bottom shell (1222). The mounting side shell (1221) is disposed on the main housing (121), and the mounting bottom shell (1222) is disposed on the mounting side shell (1221). The mounting side shell (1221) and the mounting bottom shell (1222) enclose to form a mounting groove (102). The first shock-absorbing component (2) and the horn component (4) are located in the mounting groove (102).

9. The anti-speaker and microphone resonance structure according to claim 1, characterized in that, The circuit board microphone assembly (5) includes a circuit board microphone body (51) and a bump (52). The bump (52) is disposed on the circuit board microphone body (51). The circuit board microphone body (51) is disposed on the second shockproof assembly (3). The housing assembly (1) has a groove (103), and the bump (52) is located in the groove (103).

10. A smart device, characterized in that, The smart devices include: The anti-speaker and microphone resonance structure according to any one of claims 1 to 9; The intelligent device body, wherein the anti-speaker and microphone resonance structure is installed on the intelligent device.

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