Magnetically-positioned crystal carrying plate

Abstract

The utility model relates to the technical field of wafer production equipment, and specifically relates to a magnetic attraction positioning wafer carrying plate. According to the utility model, the permanent magnets are arranged in the mounting holes in the circumferential direction of the crystal carrying plate, and the side surfaces of the permanent magnets are lower than the plate surface of the crystal carrying plate, so that the magnet alignment adsorption principle is effectively utilized. In the transportation process, the crystal carrying plates stacked in sequence can be firmly fixed through mutual adsorption of the permanent magnets. Compared with a traditional crystal carrying plate which is prone to dislocation during transportation, dislocation friction between the crystal carrying plates is greatly avoided, the stability in the transportation process is remarkably improved, the risk that the crystal carrying plates and the wafers are damaged due to dislocation friction is effectively reduced, and the product quality and the transportation efficiency are guaranteed.

Description

Technical Field

[0001] This utility model relates to the field of wafer manufacturing equipment technology, specifically a magnetically positioned wafer carrier. Background Technology

[0002] In the resonator manufacturing process, multiple wafers are usually installed in each space of the wafer carrier at one time. This allows multiple wafers to be processed simultaneously in one operation, such as coating, photolithography, and etching. This reduces the auxiliary time such as clamping and positioning when processing a single wafer, thereby greatly improving production efficiency and reducing production costs.

[0003] Currently, the die carriers used in resonator manufacturing processes are all designed as rectangular thin-film structures. This design perfectly suits transportation needs, enabling efficient and convenient transfer during stacking, handling, and storage in various transportation environments. During die carrier transportation, to prevent misalignment and friction between the carriers, they are individually placed in slots within the transport box. However, once the carriers arrive at their respective workstations, they need to be removed one by one for subsequent processing, which is cumbersome and reduces processing efficiency. To address this issue, technicians have created mounting holes and corresponding positioning protrusions on the die carrier surface. Through the interlocking of these protrusions, the stacked die carriers are positioned relative to each other.

[0004] After using mounting holes and positioning protrusions, the wafer carriers can be removed from the transport box in stacks. However, sometimes unexpected situations may occur, such as bumps during transportation, which may cause some mounting holes and positioning protrusions to detach from each other, resulting in misalignment or even the collapse of the stacked wafer carriers.

[0005] Therefore, the current positioning structure between carrier plates needs further improvement to reduce the occurrence of unexpected situations. Utility Model Content

[0006] To avoid and overcome the technical problems existing in the prior art, this utility model provides a magnetically positioned crystal carrier plate. This utility model uses magnets to attract and fix sequentially stacked crystal carrier plates together, effectively avoiding misalignment and friction, and improving transportation stability.

[0007] To achieve the above objectives, this utility model provides the following technical solution:

[0008] A magnetically positioned crystal carrier plate has multiple mounting holes sequentially opened along its circumference. A permanent magnet is installed in each mounting hole, and the two sides of each permanent magnet are lower than the surface of the crystal carrier plate on the side where the two sides are located.

[0009] As a further embodiment of this utility model: the mounting holes arranged circumferentially are located at the edge of the crystal carrier plate, and two rings of mounting holes are arranged at the edge of the crystal carrier plate.

[0010] As a further improvement of this utility model, each mounting hole is a rectangular hole, and each mounting hole is parallel to the edge of the substrate on which it is located.

[0011] As a further improvement of this utility model, the wafer carrier is provided with multiple rows and columns of mounting holes, and the rows and columns of mounting holes are arranged to divide the wafer carrier into multiple wafer mounting areas.

[0012] As a further improvement of this utility model, the mounting holes in each row are arranged at equal intervals.

[0013] As a further improvement of this invention, the permanent magnet is fixedly installed in the mounting hole by adhesive.

[0014] As a further improvement of this utility model, abrasive holes are recessed on the surfaces where the permanent magnet and the mounting hole fit together.

[0015] As a further improvement of this utility model, the edges of the carrier plate are all rounded.

[0016] As a further improvement of this utility model, the wafer carrier is provided with an information code that records the wafer processing information on the wafer carrier.

[0017] As a further improvement of this utility model, the information code is set on the upper surface of the substrate by spraying or printing.

[0018] Compared with the prior art, the beneficial effects of this utility model are:

[0019] 1. By placing permanent magnets within the mounting holes along the circumference of the die carrier substrate, with the sides of the permanent magnets lower than the substrate surface, the principle of magnetic alignment and adsorption is effectively utilized. During transportation, the stacked die carrier substrates can be firmly fixed together by mutual attraction through the permanent magnets. Compared to the misalignment problems that easily occur during the transportation of traditional die carrier substrates, this method greatly avoids misalignment friction between the substrates, significantly improves stability during transportation, effectively reduces the risk of damage to the die carrier substrates and wafers caused by misalignment friction, and ensures product quality and transportation efficiency.

[0020] 2. The mounting holes are arranged circumferentially at the edge of the substrate, with two rings of holes. Firstly, the edge-mounted hole layout ensures precise alignment and tight adhesion of the substrates during stacking and adsorption, laying a solid foundation for overall fixation and further enhancing stability during stacking. Secondly, the two rings of holes provide double the adsorption points, significantly improving the adsorption strength between substrates. Even in bumpy or complex transportation environments, this effectively prevents loosening and displacement of the substrates, ensuring safe and reliable transportation.

[0021] 3. Compared to other shapes, the rectangular holes better fit the shape of the permanent magnets, making the installation more stable and reducing displacement caused by shaking during transportation. At the same time, the design of the mounting holes being parallel to the edge of the crystal carrier plate allows for more intuitive and convenient alignment when stacking and adsorbing the crystal carrier plates, improving operational efficiency, further optimizing the adsorption effect, and ensuring stability and accuracy during transportation.

[0022] 4. By arranging multiple rows and columns of mounting holes on the die carrier, and dividing the space into multiple wafer mounting areas through row and column arrangement, the functionality of the die carrier is greatly enhanced. This not only allows for the rational planning of the die carrier space, making wafer mounting more orderly and facilitating the classification, management, and processing of wafers in different locations, but also effectively increases the wafer load capacity of the die carrier, meeting the needs of large-scale production. Simultaneously, the row and column layout of the mounting holes enhances the adsorption stability between the die carriers from multiple directions during magnetic positioning, ensuring comprehensive transportation safety.

[0023] The equidistant design ensures more uniform force distribution on the substrate during adsorption and fixation, preventing excessively strong or weak local adsorption forces caused by uneven spacing of mounting holes. This effectively prevents deformation or misalignment of the substrate during transportation due to uneven force distribution. Furthermore, this regular, equidistant layout facilitates automated installation and positioning during production, improving efficiency and reducing costs.

[0024] 5. The adhesive bonding method enables a quick and tight connection between the permanent magnet and the mounting hole. The operation is relatively simple and does not require complex installation tools or processes. Simultaneously, the adhesive fills the tiny gaps between the permanent magnet and the mounting hole, further enhancing the fixing effect and preventing the permanent magnet from falling off due to vibration during transportation, ensuring the continuous and stable operation of the magnetic positioning function.

[0025] 6. Recessed frosted holes are provided on the surfaces where the permanent magnet and mounting hole meet, significantly improving the fixing effect. The frosted holes increase the roughness and contact area of ​​the mating surfaces, allowing the adhesive to form a stronger anchoring effect after filling the holes, significantly enhancing the bonding force between the permanent magnet and the mounting hole. Even under long-term transportation vibration and complex environments, it effectively prevents the permanent magnet from loosening or falling off, providing reliable protection for the magnetic positioning of the carrier board.

[0026] 7. The rounded corner design avoids the risk of scratches to operators caused by sharp right angles on the substrate edges during transportation and operation, improving safety. At the same time, the rounded corners reduce collision damage to other substrates or equipment during substrate stacking and handling, protecting the integrity of the substrate itself and surrounding equipment, extending equipment lifespan, and reducing maintenance costs.

[0027] 8. The information code enables quick and accurate acquisition of detailed information such as the processing progress, process parameters, and quality inspection results of the wafers on the wafer carrier, facilitating tracking and quality traceability for production personnel. During transportation, the information code also allows for precise classification and scheduling of the wafer carriers, improving logistics efficiency and ensuring the efficient and smooth operation of the production process.

[0028] Information codes are applied to the surface of the die carrier board via spraying or printing, offering advantages such as intuitive readability and durability. Spraying or printing ensures the information codes are clearly displayed on the board, facilitating easy viewing and reading by operators. Furthermore, these methods guarantee that the information codes remain clear and intact even after long-term transportation, use, and environmental changes, resisting fading or damage, thus ensuring information accuracy and traceability, and providing stable and reliable information support for production management. Attached Figure Description

[0029] Fig. 1 This is a schematic diagram of the assembly structure of this utility model.

[0030] Fig. 2 This is a schematic diagram of the disassembled structure of the permanent magnet and the crystal carrier plate in this utility model.

[0031] Fig. 3 This is a schematic diagram of the permanent magnet structure in this utility model.

[0032] In the diagram: 10, carrier plate; 11, mounting hole; 20, permanent magnet; 21, frosted hole; 30, information code. Detailed Implementation

[0033] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0034] Please see Figs. 1-3 The specific details of this utility model are as follows:

[0035] I. Magnetic Positioning Structure

[0036] Permanent magnet mounting design: Multiple mounting holes 11 are sequentially formed along the circumference of the wafer carrier 10, and a permanent magnet 20 is installed in each mounting hole 11. The two sides of these permanent magnets 20 are lower than the surface of the wafer carrier 10 on those sides. Utilizing the principle of opposite poles attracting, when multiple wafer carriers 10 are stacked sequentially, they are attracted to each other by the permanent magnets 20, thus firmly fixing the wafer carriers 10 together. This design effectively avoids misalignment and friction between the wafer carriers 10 during transportation, significantly improving transportation stability and reducing the risk of damage to the wafer carriers 10 and the wafers.

[0037] Optimized mounting hole layout: The mounting holes 11 arranged circumferentially are located at the edge of the wafer carrier 10, with two rings of mounting holes 11 along the edge of the wafer carrier 10. This edge-mounted hole layout ensures precise alignment and tight adhesion of the wafer carrier 10 during stacking and adsorption, laying a solid foundation for overall fixation. The two rings of mounting holes 11 provide double the adsorption points, significantly enhancing the adsorption strength between wafer carriers 10, effectively preventing loosening and displacement even under bumpy or complex transportation conditions.

[0038] Mounting hole shape and orientation: Each mounting hole 11 is rectangular and parallel to the edge of the substrate 10 it is on. The rectangular holes better fit the shape of the permanent magnet 20, making the permanent magnet 20 more stable and reducing displacement caused by transportation shaking. The parallel design of the mounting holes 11 to the edge of the substrate 10 makes alignment more intuitive and convenient when stacking and adsorbing the substrates 10, improving operational efficiency, optimizing adsorption effect, and ensuring transportation stability and accuracy.

[0039] II. Wafer Mounting Area Design

[0040] The wafer carrier 10 has multiple rows and columns of mounting holes 11, which, when arranged in rows and columns, divide the wafer carrier 10 into multiple wafer mounting areas. This design rationally plans the space of the wafer carrier 10, making wafer mounting more orderly and facilitating the classification, management, and processing of wafers in different locations. It also effectively increases the wafer load capacity of the wafer carrier 10, meeting the needs of large-scale production. During magnetic positioning, the row and column layout of the mounting holes 11 enhances the adsorption stability between wafer carriers 10 from multiple directions, ensuring comprehensive transportation safety. The evenly spaced rows of mounting holes 11 ensure more uniform force distribution on the wafer carrier 10 during adsorption and fixation, preventing abnormal local adsorption forces caused by uneven spacing of the mounting holes 11 and effectively preventing deformation or misalignment of the wafer carrier 10 during transportation due to uneven force distribution. This regular layout also facilitates automated installation and positioning operations during production, improving production efficiency and reducing production costs.

[0041] III. Permanent Magnet Fixing Method

[0042] Adhesive fixing process: The permanent magnet 20 is fixed in the mounting hole 11 by adhesive. This method is simple to operate and can quickly achieve a tight connection between the permanent magnet 20 and the mounting hole 11 without complicated installation tools and processes. The adhesive can fill the tiny gaps between the permanent magnet 20 and the mounting hole 11, further enhancing the fixing effect, preventing the permanent magnet 20 from falling off during transportation vibration, and ensuring the continuous and stable operation of the magnetic positioning function.

[0043] Frosted holes enhance adhesion: Frosted holes 21 are recessed on the surfaces where the permanent magnet 20 and the mounting hole 11 meet. The frosted holes 21 increase the roughness and contact area of ​​the mating surfaces, allowing for a stronger anchoring effect after adhesive filling, significantly enhancing the adhesion between the permanent magnet 20 and the mounting hole 11. Even under long-term transportation vibrations and complex environments, this effectively prevents the permanent magnet 20 from loosening or falling off, providing reliable assurance for the magnetic positioning of the crystal carrier plate 10.

[0044] IV. Safety Protection Design

[0045] The edges of the substrate 10 are all designed with rounded corners. This design avoids scratches to operators caused by sharp right angles of the substrate 10 edges during transportation and operation, improving safety. At the same time, when stacking and handling the substrate 10, the rounded corners reduce collision damage to other substrates 10 or equipment, protecting the integrity of the substrate 10 itself and surrounding equipment, extending equipment lifespan, and reducing maintenance costs.

[0046] V. Information Code Design

[0047] Information code setting: The wafer carrier 10 is equipped with an information code 30 that records the wafer processing information on the wafer carrier 10. Through the information code 30, production personnel can quickly and accurately obtain detailed information such as wafer processing progress, process parameters, and quality inspection results, facilitating tracking management and quality traceability. During transportation, the wafer carrier 10 can be accurately classified and scheduled based on the information code 30, improving logistics efficiency and ensuring efficient and smooth operation of the production process.

[0048] Information code presentation method: The information code 30 is applied to the upper surface of the substrate 10 by spraying or printing. Both methods ensure that the information code 30 is clearly displayed on the upper surface of the substrate 10, facilitating easy viewing and reading by operators. Furthermore, the information code 30 remains clear and intact even under long-term transportation, use, and environmental changes, and is not easily faded or damaged, ensuring the accuracy and traceability of the information and providing stable and reliable information support for production management.

[0049] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.

Claims

1. A magnetically positioned crystal carrier plate, characterized in that, Multiple mounting holes (11) are sequentially opened along the circumference of the crystal carrier plate (10). A permanent magnet (20) is installed in each mounting hole (11), and the two sides of each permanent magnet (20) are lower than the surface of the crystal carrier plate (10) on the side where the two sides are located.

2. The magnetically positioned crystal carrier plate according to claim 1, characterized in that, Each mounting hole (11) arranged circumferentially is located at the edge of the substrate (10), and two rings of mounting holes (11) are arranged at the edge of the substrate (10).

3. The magnetically positioned crystal carrier plate according to claim 2, characterized in that, Each mounting hole (11) is a rectangular hole, and each mounting hole (11) is parallel to the edge of the substrate (10) on which it is located.

4. A magnetically positioned crystal carrier plate according to any one of claims 1-3, characterized in that, The substrate (10) has multiple rows and columns of mounting holes (11), and the rows and columns of the mounting holes (11) are arranged to divide the substrate (10) into multiple wafer mounting areas.

5. A magnetically positioned crystal carrier plate according to claim 4, characterized in that, The mounting holes (11) in each row are arranged at equal intervals.

6. A magnetically positioned crystal carrier plate according to claim 5, characterized in that, The permanent magnet (20) is fixedly installed in the mounting hole (11) by adhesive.

7. A magnetically positioned crystal carrier plate according to claim 6, characterized in that, The permanent magnet (20) and the mounting hole (11) are both recessed with frosted holes (21).

8. A magnetically positioned crystal carrier plate according to claim 7, characterized in that, The edges of the carrier plate (10) are all rounded.

9. A magnetically positioned crystal carrier plate according to claim 8, characterized in that, The wafer carrier (10) is provided with an information code (30) that records the wafer processing information on the wafer carrier (10).

10. A magnetically positioned crystal carrier plate according to claim 9, characterized in that, The information code (30) is applied to the upper surface of the substrate (10) by spraying or printing.

Images