Ball mounting device

Abstract

The utility model provides a ball mounting device. The ball mounting device comprises a vacuum platform, an independent moving module and a first control unit, a chip is fixed on the vacuum platform, the independent moving module is provided with a ball groove, a nozzle and a moving mechanism, the nozzle is fixed on the moving mechanism through the ball groove, the moving mechanism is composed of an X-axis driving device, a Y-axis driving device and a Z-axis driving device, multi-axis linkage control is supported, solder balls with different ball diameters and materials can be loaded, and the balls are accurately sprayed through gas pressure. The second control unit cooperatively adjusts the air pressure of the nozzles, and various solder ball mounting operations are completed through one-time backflow. The device is integrated with a safety distance calculation module, so that the modules are ensured not to interfere with each other, and the stability and safety are improved. The working areas of the plurality of independent mobile modules are distributed in various forms and cover the whole chip together. The device is compatible with large-size, high-warpage, small-ball and small-spacing packaged products, the influence of multiple times of backflow on the performance and structure of the products is effectively avoided, and the packaging efficiency and quality are improved.

Description

Technical Field

[0001] This utility model belongs to the field of wafer processing equipment and relates to a ball planting device. Background Technology

[0002] With the rapid development of electronic technology, the demand for higher density, smaller size, higher integration, and higher performance packaging has presented new challenges to the semiconductor manufacturing industry, prompting continuous breakthroughs in advanced packaging technologies. Simultaneously, the support of emerging industries such as artificial intelligence, autonomous driving, 5G networks, and the Internet of Things has led to an increasingly strong demand for 2.5D / 3D packages. However, with the diversification and complexity of packaging requirements, it is becoming increasingly common to solder balls of different diameters and materials onto the same substrate. Traditional ball-mounting methods have significant limitations in addressing this demand: because solder balls of different diameters and materials need to be reflow soldered separately, the same substrate needs to undergo multiple reflow processes. Multiple reflows not only cause further changes in product stress, increasing the risk of ring failure, but may also cause unpredictable thermal damage to critical components such as high-bandwidth memory (HBM). Therefore, packaging processes typically limit the number of reflows, resulting in many products with defective solder balls having to be scrapped. This not only increases the difficulty of packaging operations but also causes significant economic losses for customers.

[0003] Therefore, there is an urgent need for a ball-mounting device that can simultaneously weld balls of different diameters and materials on the same substrate, in order to solve the technical bottlenecks and economic losses caused by traditional ball-mounting methods.

[0004] It should be noted that the above introduction to the technical background is only for the purpose of providing a clear and complete explanation of the technical solutions of this application and facilitating understanding by those skilled in the art. It should not be assumed that these technical solutions are known to those skilled in the art simply because they have been described in the background section of this application. Utility Model Content

[0005] In view of the shortcomings of the prior art described above, the purpose of this utility model is to provide a ball-planting device to solve the problems of product abnormalities and economic losses caused by multiple reflows in the prior art, while reducing the packaging difficulty and improving work efficiency.

[0006] To achieve the above objectives, this utility model provides a bulb-planting device, which includes:

[0007] A vacuum platform, wherein the vacuum is used to adsorb the chip;

[0008] Multiple independent moving modules, the number of which N≥2, are located above the vacuum platform and include a ball groove, a nozzle, and a moving mechanism; the nozzle is connected to the ball groove, located below the ball groove, and fixed to the moving mechanism through the ball groove; the moving mechanism includes an X-axis drive device, a Y-axis drive device, and a Z-axis drive device.

[0009] A first control unit communicates with the independent moving module and is used to control the displacement of the independent moving module.

[0010] Optionally, both the ball groove and the nozzle are provided with a detachable mechanism, which enables quick disassembly via a snap-fit ​​or threaded connection.

[0011] Optionally, the nozzle may have a variety of different sizes, and the angle of the nozzle may be adjustable.

[0012] Optionally, the working areas of the multiple independent moving modules may be distributed in one or a combination of symmetrical, annular, fan-shaped, or irregular distributions, and together cover the entire top of the chip.

[0013] Optionally, the ball-planting device further includes a second control unit, which includes a valve and a pressure control mechanism connected to the ball groove. The pressure control mechanism is connected to the nozzle and adjusts the ball-spraying air pressure at the nozzle through the valve. The second control unit is connected to the first control unit and is used to coordinately control the gas pressure of the nozzle and the movement of the independent moving module.

[0014] Optionally, the X-axis drive device, the Y-axis drive device, and the Z-axis drive device are connected to the ball groove via a lead screw drive mechanism or a belt drive mechanism.

[0015] Optionally, the moving mechanism supports multi-axis linkage control, which can simultaneously control the movement of the X-axis drive device, the Y-axis drive device, and the Z-axis drive device.

[0016] Optionally, the drive device includes one or more of a motor, linear motor, piezoelectric driver, stepper motor, servo motor or electromagnetic driver.

[0017] Optionally, the first control unit further includes a safety distance calculation module for calculating the position coordinates and actual safety distance of the multiple independent moving modules to ensure that the independent moving modules do not interfere with each other.

[0018] Optionally, multiple independent mobile modules can work simultaneously, cooperating through the first control unit to ensure that they do not interfere with each other.

[0019] This invention provides a ball-mounting device, including a vacuum platform, independent moving modules, and a first control unit. The vacuum platform holds the chip. The independent moving module is equipped with a ball groove, a nozzle, and a moving mechanism. The nozzle is fixed to the moving mechanism via the ball groove. The moving mechanism consists of an X-axis drive, a Y-axis drive, and a Z-axis drive, supporting multi-axis linkage control. It can load solder balls of different diameters and materials and precisely spray the balls using gas pressure. The second control unit coordinates and adjusts the nozzle gas pressure, enabling multiple solder ball mounting operations to be completed in a single reflow. The device integrates a safety distance calculation module to ensure that the modules do not interfere with each other, improving stability and safety. The working areas of the multiple independent moving modules are distributed in various ways, collectively covering the entire area above the chip. This device is compatible with large-size, high-warpage, small-ball, and small-pitch packaged products, effectively avoiding the impact of multiple reflows on product performance and structure, and improving packaging efficiency and quality. Attached Figure Description

[0020] Figure 1 The diagram shown is a structural schematic of the ball-planting device of this utility model.

[0021] Figure 2 The diagram shows a symmetrical distribution of welding balls achieved by the ball-planting device of this utility model.

[0022] Figure 3 The diagram shows a fan-shaped distribution of welding balls achieved by the ball-planting device of this utility model.

[0023] Figure 4 The diagram shows a ring-shaped distribution of welding balls achieved by the ball-planting device of this utility model.

[0024] Explanation of reference numerals in the attached figures

[0025] 100 Vacuum Platform

[0026] 200 chips

[0027] 300 camera module

[0028] 400 Independent Mobile Modules

[0029] 410 nozzle

[0030] 420 ball groove

[0031] 421 Welding Ball

[0032] 430 Mobile Agency

[0033] 431 X-axis drive unit

[0034] 432 Y-axis drive unit

[0035] 433 Z-axis drive unit

[0036] 500 First Control Unit

[0037] 600 Second Control Unit

[0038] 610 Valve Detailed Implementation

[0039] The following specific examples illustrate the implementation of this utility model. Those skilled in the art can easily understand other advantages and effects of this utility model from the content disclosed in this specification. This utility model can also be implemented or applied through other different specific embodiments, and various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of this utility model.

[0040] It should be noted that the illustrations provided in this embodiment are only schematic representations of the basic concept of this utility model. Therefore, the drawings only show the components related to this utility model and are not drawn according to the actual number, shape and size of the components. In actual implementation, the form, quantity and proportion of each component can be arbitrarily changed, and the layout of the components may also be more complex.

[0041] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0042] See Figure 1 This embodiment provides a ball-planting device, which includes: a vacuum platform 100, multiple independent moving modules 400, and a first control unit 500.

[0043] The number of independent moving modules 400 is N≥2. Each independent moving module 400 is located above the vacuum platform 100 and includes a ball groove 420, a nozzle 410, and a moving mechanism 430. The nozzle 410 is connected to the ball groove 420, located below the ball groove 420, and fixed to the moving mechanism 430 through the ball groove 420. The moving mechanism 430 includes an X-axis drive device 431, a Y-axis drive device 432, and a Z-axis drive device 433.

[0044] The first control unit 500 communicates with the plurality of independent moving modules 400 and is used to control the displacement of the independent moving modules 400.

[0045] Specifically, the vacuum platform 100 is used to adsorb and fix the chip 200, ensuring that the chip 200 remains stable during the welding process and preventing welding position deviation due to movement. The vacuum platform 100 is also equipped with a vacuum pressure gauge to detect whether the chip 200 is being adsorbed. In other embodiments, the vacuum platform 100 can also communicate with the first control unit 500 to start or stop the vacuum adsorption function according to control commands.

[0046] Furthermore, in the independent mobile module 400, see... Figure 1 The ball groove 420 is used to store solder balls 421 of different sizes and materials, providing solder to the nozzle 410. The nozzle 410 is connected below the ball groove 420 and sprays the solder balls 421 onto the pads of the chip 200 by adjusting the gas pressure (such as nitrogen). The precision and gas pressure control of the nozzle 410 directly affect the spraying effect of the solder balls 421. The X-axis drive device 431, the Y-axis drive device 432, and the Z-axis drive device 433 are used to precisely control the position of the independent moving module 400 in three-dimensional space, ensuring that the nozzle 410 can accurately align with the pads on the chip 200. In addition, the ball placement area of ​​the chip can be efficiently covered by the effective combination of the working areas of multiple independent moving modules 400, achieving precise ball placement.

[0047] Furthermore, the independent moving module 400 receives instructions from the first control unit 500 to achieve precise displacement control. The first control unit 500 communicates with the independent moving module 400, receiving real-time data and sending control commands. The first control unit 500 also includes a camera module 300, which is used to measure the warpage of the chip 200 in real time. A high-precision camera monitors the warpage of the chip 200 in real time and acquires the position data of the nozzle 410, providing feedback to the first control unit 500. Based on the data provided by the camera module 300, the first control unit 500 calculates the displacement requirements of the independent moving module 400 and controls the moving mechanism 430 to ensure precise positioning of the nozzle 410. Simultaneously, the first control unit 500 coordinates the workflow of each module to ensure efficient and stable operation of the entire system.

[0048] Furthermore, the height adjustment function is crucial for achieving high-precision ball placement. The first control unit 500 can dynamically control the Z-axis drive device 433 to adjust the Z-axis height based on the height differences of the pads on different chips 200, thereby adjusting the height of the nozzle 410 to ensure that the solder balls 421 are accurately sprayed onto the pads. This effectively avoids soldering defects caused by inconsistent heights, such as inaccurate solder ball spraying, poor pad contact, or solder ball accumulation. In other embodiments, this height adjustment mechanism can also be combined with the camera module 300 to monitor the pad positions of the chip 200 in real time, further optimizing the accuracy and stability of the ball placement process. For example, if the next ball placement pad is not on the same horizontal line as the previous one, the first control unit 500 will control the Z-axis drive device 433 to adjust its height based on the warpage and height of the chip 200 measured by the camera module 300, ensuring that the nozzle 410 is at the same height distance from each pad when spraying the balls. This automated height adjustment and visual feedback system not only improves the accuracy of ball planting but also reduces manual intervention, thereby increasing production efficiency and product quality.

[0049] As an example, both the ball groove 420 and the nozzle 410 are provided with a detachable mechanism (not labeled), which allows for quick disassembly via a snap-fit ​​or threaded connection.

[0050] Specifically, the detachable mechanism enhances the flexibility and adaptability of the ball-planting device, allowing for easy replacement and maintenance of the ball groove 420 and the nozzle 410. The snap-fit ​​connection enables quick replacement of the ball groove 420 and the nozzle 410, significantly reducing equipment downtime and improving maintenance efficiency. Simultaneously, the detachable design facilitates maintenance and cleaning, extending the equipment's lifespan. Furthermore, when the ball groove 420 needs to be replaced with the solder ball 421, the remaining solder balls can be recycled and reused, thereby reducing costs. This detachable mechanism design not only improves the flexibility and adaptability of the ball-planting device but also reduces equipment maintenance costs and downtime through rapid replacement and resource recycling, while simultaneously enhancing the equipment's versatility.

[0051] As an example, the nozzle 410 has a variety of different sizes, and the angle of the nozzle 410 is adjustable.

[0052] Specifically, the nozzle 410 is available in various sizes to accommodate solder balls of different diameters and different packaging process requirements. The adjustable angle α of the nozzle ranges from 0° to 180°, and precise angle adjustment is achieved through a built-in fine-tuning mechanism. This design allows the nozzle 410 to flexibly adjust its spray direction according to the specific soldering position and chip layout, thereby improving the accuracy and efficiency of ball placement. Furthermore, the size and angle adjustment functions of the nozzle 410 also support precise operations in complex packaging structures. For example, in small-pitch packaging structures, where the solder joint spacing is extremely small and the soldering precision requirements are extremely high, the multiple size options and precise angle adjustment capabilities of the nozzle 410 allow it to adapt to solder balls of different diameters and closely spaced solder joints, avoiding mutual interference between solder balls and ensuring precise soldering of each solder joint. For high-warpage packaging structures, the nozzle 410, through its angle adjustment function, flexibly adjusts the spray direction to ensure that the solder ball 421 falls precisely in the predetermined position. This allows the device to handle ball placement tasks for high-warpage, small-ball, and small-pitch packaging products, further enhancing its versatility and adaptability.

[0053] As an example, the working areas of the multiple independent moving modules 400 may be distributed in a symmetrical, annular, fan-shaped, or irregular manner, or in combination thereof, and the working areas of the multiple independent moving modules 400 together cover the entire top of the chip 200.

[0054] Specifically, the distribution patterns include, but are not limited to, symmetrical distribution, annular distribution, fan-shaped distribution, and irregular distribution. Symmetrical distribution emphasizes the mirror arrangement of the working areas on the central axis or symmetry plane of the chip 200. This distribution pattern helps ensure the balance and uniformity of the ball-planting process and is particularly suitable for the symmetrical structure of the chip 200. Figure 2 The solder balls 421 implemented by this device are distributed in two independent areas. The solder balls 421 have two sizes and are symmetrical to each other. Each ball is placed by two different independent moving modules 400. The fan-shaped distribution divides the working area into several fan-shaped areas. This distribution can be customized according to the specific area requirements of the chip 200 to achieve precise local ball placement operation. Figure 3 The solder balls 421 implemented by this device are distributed in three independent fan-shaped areas. The solder balls 421 have three sizes and cover the entire chip 200. The ring-shaped distribution arranges the working area around the center of the chip 200 in a ring shape, which is suitable for the special packaging requirements of the edge or center area of ​​the chip 200 and can effectively improve the ball placement accuracy in the edge area. Figure 4The solder balls 421, as shown in the diagram, are distributed in an interlaced area. These solder balls come in three sizes and are arranged in a ring shape, with each of the three independent moving modules 400 responsible for ball placement. An irregular distribution allows for flexible adjustment of the working areas of each independent moving module 400 according to the actual structure and process requirements of the chip 200, adapting to the packaging needs of complex shapes or non-standard layouts. The distribution is not limited to this; it can also be a combination of the various distribution forms described above. In this device, the working areas of multiple independent moving modules 400 can cooperate seamlessly, collectively covering the entire surface of the chip 200, ensuring the comprehensiveness and accuracy of the ball placement operation, thereby significantly improving packaging efficiency and quality.

[0055] As an example, the ball-planting device further includes a second control unit 600, which includes a valve 610 connected to the ball groove 420 and a pressure control mechanism (not identified). The pressure control mechanism is connected to the nozzle 410 and adjusts the ball-spraying air pressure at the nozzle 410 through the valve 610. The second control unit 600 is connected to the first control unit 500 and is used to coordinate the control of the gas pressure of the nozzle 410 and the movement of the independent moving module 400.

[0056] For details, please refer to Figure 1 When the nozzle 410 moves to the designated ball-planting position, the gas pressure control mechanism controls the gas pressure of the nozzle 410 to reach a set value. The gas can be one or a combination of nitrogen, argon, or helium. At this time, the second control unit 600 controls the valve 610 to open, and the nozzle 410 begins to spray balls onto the pads of the chip 200. When the nozzle 410 leaves the ball-planting position, the gas pressure control mechanism controls the gas pressure of the nozzle 410 to decrease, and the second control unit 600 controls the valve 610 to close, stopping the nozzle 410 from spraying balls. The valve 610 precisely controls the gas flow rate by adjusting its opening, thereby affecting the gas pressure at the nozzle 410 to ensure the stability and consistency of the ball-planting process. The gas pressure control mechanism adjusts the gas pressure of the nozzle 410 in real time according to instructions and can provide real-time feedback of gas pressure data, achieving dynamic adjustment.

[0057] Furthermore, the second control unit 600 is closely connected to the first control unit 500, achieving coordinated control through data interaction. The first control unit 500 can calculate the required air pressure and displacement commands based on the warpage of the chip 200 and the position data of the nozzle 410 provided by the camera module 300, and send these commands to the second control unit 600. The second control unit 600 then adjusts the opening of the valve 610 and the output of the air pressure control mechanism in real time to ensure precise matching between the air pressure of the nozzle 410 and the movement of the independent moving module 400, thereby achieving high-precision positioning of the nozzle 410 aligned with the solder pad.

[0058] The aforementioned collaborative control mechanism improves the accuracy and efficiency of solder ball placement. By precisely controlling the air pressure of the nozzle 410 and the displacement of the independent moving module 400, it can be ensured that each solder ball 421 accurately lands on the predetermined pad position, reducing soldering defects and improving product quality. Simultaneously, this mechanism can flexibly adapt to the needs of solder ball placement of different sizes and complexities, meeting the requirements of various chip 200 packaging scenarios by adjusting air pressure and motion parameters. This collaborative control mechanism reduces adjustment time and errors, effectively lowering production costs and improving production efficiency. Therefore, this technology ensures that the solder balls 421 can be accurately sprayed onto the pads of the chip 200.

[0059] Furthermore, the valve 610 includes one of the following: a pneumatic valve, a hydraulic valve, a solenoid valve, a safety valve, and a manual valve. The valve 610 uses a solenoid valve to control the switch via electromagnetic force, making it suitable for automated control systems and enabling remote control and programmed operation. Of course, in other embodiments, the valve 610 can also be selected according to different needs, such as a pneumatic valve, a hydraulic valve, a safety valve, or a manual valve. Naturally, the type of valve 610 is not limited to this; selecting a suitable type of valve 610 can improve the system's flexibility, reliability, and safety, while optimizing the efficiency and accuracy of the ball-planting process.

[0060] As an example, the X-axis drive device 431, the Y-axis drive device 432, and the Z-axis drive device 433 are connected to the ball groove 420 via a lead screw drive mechanism or a belt drive mechanism.

[0061] Specifically, the X-axis drive device 431 drives the independent moving module 400 to move left and right according to the ball spacing, and the Y-axis drive device 432 drives the independent moving module 400 to move back and forth according to the ball spacing; the Z-axis is adjusted up and down according to the warp of the chip 200 or the height difference of the pads on the chip 200. The X-axis drive device 431, the Y-axis drive device 432, and the Z-axis drive device 433 are usually equipped with high-precision drive devices that can convert the rotational motion of the motor into linear motion through a lead screw or belt, thereby achieving precise position adjustment of the nozzle 410 in the X, Y, and Z directions. Due to its high precision and stability, the lead screw drive mechanism is suitable for applications requiring high positioning accuracy, while the belt drive mechanism is suitable for scenarios with rapid movement and frequent start-stop operations due to its lightweight and high dynamic performance. Through this precise displacement control, the ball-planting device can ensure that the nozzle 410 can be accurately aligned with the pads on the chip 200, achieving high-precision ball-planting operation.

[0062] As an example, the moving mechanism 430 supports multi-axis linkage control and can simultaneously control the movement of the X-axis drive device 431, the Y-axis drive device 432 and the Z-axis drive device 433.

[0063] For details, please refer to Figure 1 The multi-axis linkage control technology ensures the precise positioning and trajectory control of the nozzle 410 in three-dimensional space by accurately coordinating the movement of each axis. During the ball-planting process, the X-axis drive device 431 and the Y-axis drive device 432 are responsible for moving the nozzle 410 on the horizontal plane to align it with different pad positions; while the Z-axis drive device 433 is responsible for adjusting the height of the nozzle 410 to ensure that the distance between the nozzle 410 and the pad remains consistent. Multi-axis linkage control can be programmed to simultaneously control the movement of multiple coordinate axes (such as X, Y, and Z axes), enabling movement of complex curved surfaces and spatial curves, thereby improving the accuracy and efficiency of ball-planting.

[0064] As an example, the drive device includes one or more of a motor, linear motor, piezoelectric driver, stepper motor, servo motor or electromagnetic driver.

[0065] Specifically, in this embodiment, a servo motor is used as the driving device to achieve precise position control. Of course, in other embodiments, the motor and the linear motor are suitable for applications requiring continuous motion, providing stable power output; the piezoelectric actuator, with its high precision and fast response characteristics, is suitable for precise control at the micro-nano scale; and the electromagnetic actuator, with its fast response speed and flexible control characteristics, is suitable for applications requiring rapid start-stop and frequent switching. By rationally selecting and combining these driving devices, the flexibility, adaptability, and operational accuracy of the ball-planting device can be significantly improved, meeting the needs of ball-planting devices of different sizes and complexities.

[0066] As an example, the first control unit 500 also includes a safety distance calculation module (unidentified) for calculating the position coordinates and actual safety distance of the multiple independent moving modules 400 to ensure that the independent moving modules 400 do not interfere with each other.

[0067] Specifically, the first control unit 500 is equipped with the camera module 300 to collect position data and transmit the data to the first control unit 500 in real time. The safe distance calculation module processes the coordinate data through a data fusion algorithm to dynamically calculate the actual safe distance between each of the independent moving modules 400. When the actual safe distance approaches the safe threshold, the first control unit 500 automatically adjusts the movement trajectory or speed of the independent moving modules 400 to ensure that the distance between the modules remains within a safe range and to avoid potential interference. If the distance is still below the threshold after adjustment, the system will issue an alarm. The warning mechanism can be implemented through sound, light, or visual cues to prompt the operator to take manual intervention to ensure the safe operation of the system.

[0068] As an example, multiple independent mobile modules 400 can work simultaneously, cooperating through the first control unit 500 to ensure that they do not interfere with each other.

[0069] In this embodiment, there are two independent mobile modules 400. Here, "two" is a specific example of "multiple," but it does not limit other embodiments to having three or more independent mobile modules 400. See also... Figure 1Taking the X-axis movement direction as an example, the two independent moving modules 400 (M1 and M2) can work simultaneously. M1 corresponds to the X1, Y1, and Z1 axes, and M2 corresponds to the X2, Y2, and Z2 axes. When M1 and M2 move to a close position, the safety distance calculation module will feed back the actual safety distance between M1 and M2 according to the set safety threshold distance, and adjust the movement trajectory or speed of the modules through the first control unit 500. For example, when M1 and M2 move to the safety threshold distance, the first control unit 500 will issue the following logical instructions based on the data from the safety distance calculation module: M2 will automatically return to the X2 axis origin; after M1 finishes its work, M1 will return to the X1 axis origin position, and M2 will continue working on the remaining work area from the previous position; after the chip 200 finishes its work, each axis will return to its respective origin position, waiting for the next chip 200 to enter the vacuum platform 100 to continue its work. The first control unit 500 can also issue other logical instructions to enable the multiple independent moving modules 400 to work collaboratively without interfering with each other. Of course, the working mechanism on the Y-axis or Z-axis is the same as described above, and will not be detailed here.

[0070] Of course, in some other embodiments, there are three or more independent moving modules 400. Through the control of the safety distance calculation module and the first control unit 500, multiple independent moving modules 400 can work collaboratively, significantly improving the ball-planting efficiency. The multi-axis linkage control technology precisely controls the movement trajectory and speed of multiple independent moving modules 400, and can also dynamically allocate work according to task requirements, optimizing overall performance. The combination of the safety distance calculation module and the dynamic adjustment mechanism effectively avoids collisions between multiple independent moving modules 400, ensuring stable system operation and enhancing the flexibility and reliability of the ball-planting device in complex operating scenarios.

[0071] Furthermore, this design allows for the simultaneous soldering of solder balls 421 with different diameters and materials on the same large-size, high-warpage substrate, enabling ball placement and reflow operations to be completed in one go, further improving the adaptability and efficiency of ball placement.

[0072] In this embodiment, through advanced design and control technology, the device can complete a variety of complex ball-mounting tasks. On the one hand, it can complete the soldering of solder balls 421 with different diameters and materials on the same substrate, meeting diverse packaging requirements. On the other hand, it can also handle larger substrates or chips, while adapting to warped substrates, ensuring the spatial position of the nozzle 410 is adjusted on substrates with a certain warp, ensuring the accuracy of ball mounting. Thus, the device is compatible with ball mounting tasks for large-size, high-warp, small-ball, and small-pitch packaged products, effectively avoiding the functional failure of the chip 200 caused by repeated high-temperature reflow, thereby significantly improving the performance and yield of the chip 200 and reducing the risk of chip 200 scrap. In some embodiments, the combined safety distance calculation module and dynamic adjustment mechanism ensure that multiple independent moving modules 400 do not interfere with each other when working collaboratively, while multi-axis linkage control technology precisely controls the movement trajectory and speed of each module, further optimizing the efficiency and accuracy of the ball mounting process.

[0073] In summary, this utility model provides a ball-mounting device, including a vacuum platform, multiple independent moving modules, and a first control unit. The vacuum platform holds the chip, and each independent moving module is equipped with a ball groove, a nozzle, and a moving mechanism. The nozzle is fixed to the moving mechanism via the ball groove. The moving mechanism consists of an X-axis drive device, a Y-axis drive device, and a Z-axis drive device, supporting multi-axis linkage control. It can load solder balls of different diameters and materials and precisely spray the balls using gas pressure. The second control unit coordinates and adjusts the nozzle gas pressure, enabling multiple solder ball mounting operations to be completed in a single reflow. The device integrates a safety distance calculation module to ensure that the modules do not interfere with each other, improving stability and safety. The working areas of the multiple independent moving modules are distributed in various ways, collectively covering the entire area above the chip. This device is compatible with large-size, high-warpage, small-ball, and small-pitch packaged products, effectively avoiding the impact of multiple reflows on product performance and structure, and improving packaging efficiency and quality. This utility model effectively overcomes the various shortcomings of existing technologies and has high industrial application value.

[0074] The above embodiments are merely illustrative of the principles and effects of this utility model and are not intended to limit the scope of this utility model. Any person skilled in the art can modify or alter the above embodiments without departing from the spirit and scope of this utility model. Therefore, all equivalent modifications or alterations made by those skilled in the art without departing from the spirit and technical concept disclosed in this utility model should still be covered by the claims of this utility model.

Claims

1. A bulb planting device, characterized in that, include: Vacuum platform, used for adsorbing chips; Multiple independent moving modules, the number of which N≥2, are located above the vacuum platform and include a ball groove, a nozzle, and a moving mechanism; the nozzle is connected to the ball groove, located below the ball groove, and fixed to the moving mechanism through the ball groove; the moving mechanism includes an X-axis drive device, a Y-axis drive device, and a Z-axis drive device. A first control unit communicates with the plurality of independent moving modules and is used to control the displacement of the independent moving modules.

2. The bulb-planting device according to claim 1, characterized in that: Both the ball groove and the nozzle are equipped with a detachable mechanism, which allows for quick disassembly via a snap-fit ​​or threaded connection.

3. The bulb-planting device according to claim 1, characterized in that: The nozzle is available in various sizes and the angle of the nozzle is adjustable.

4. The bulb-planting device according to claim 1, characterized in that: The working areas of the multiple independent moving modules are distributed in one or a combination of symmetrical, annular, and fan-shaped distributions, and together cover the entire top of the chip.

5. The bulb-planting device according to claim 1, characterized in that: The ball-planting device further includes a second control unit, which includes a valve and a pressure control mechanism connected to the ball groove. The pressure control mechanism is connected to the nozzle and adjusts the ball-spraying pressure at the nozzle through the valve. The second control unit is connected to the first control unit and is used to coordinately control the gas pressure of the nozzle and the movement of the independent moving module.

6. The bulb-planting device according to claim 1, characterized in that: The X-axis drive device, the Y-axis drive device, and the Z-axis drive device are connected to the ball groove via a lead screw drive mechanism or a belt drive mechanism.

7. The bulb-planting device according to claim 1, characterized in that: The moving mechanism supports multi-axis linkage control, and can simultaneously control the movement of the X-axis drive device, the Y-axis drive device, and the Z-axis drive device.

8. The bulb-planting device according to claim 1, characterized in that: The drive device includes one or more of the following: motor, linear motor, piezoelectric driver, stepper motor, servo motor, or electromagnetic driver.

9. The bulb-planting device according to claim 1, characterized in that: The first control unit also includes a safety distance calculation module, which is used to calculate the position coordinates and actual safety distance of the multiple independent moving modules to ensure that the independent moving modules do not interfere with each other.

10. The bulb-planting device according to claim 1, characterized in that: Multiple independent mobile modules can work simultaneously, cooperating through the first control unit to ensure that they do not interfere with each other.

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