Bonding copper wire surface treatment polishing machine

Abstract

The utility model discloses a bonding copper wire surface treatment polishing machine which comprises a base, the top of the base is provided with two movable plates, the movable plates are connected with the base through a driving assembly, the driving assembly can adjust the distance between the two movable plates, and the top of each movable plate is fixedly provided with a driving motor. According to one embodiment of the invention, by arranging the movable plates, the driving motors, the polishing rollers and the driving assemblies, when the polishing device is used and the distance between the two polishing rollers needs to be adjusted to polish bonding copper wires with different diameter sizes, a worker can enable the two movable plates to drive the two driving motors to move face to face or back to back through the driving assemblies; according to the bonding copper wire polishing device, the two polishing rollers can be made to be close to or far away from each other, the distance between the two polishing rollers is adjusted, bonding copper wires of different diameter sizes can be polished conveniently, the problem that the polishing effect is poor or the bonding copper wires are broken is solved, and the applicability of the device is improved.

Description

Technical Field

[0001] This utility model relates to the field of polishing equipment technology, and more specifically, to a surface treatment polishing machine for bonded copper wires. Background Technology

[0002] Currently, the connection between semiconductor electronic chips and external lead frames in integrated circuits is mostly accomplished by bonding wires, also known as wire bonding. The process involves using a bonding device to hold the bonding wire through a special ceramic nozzle, leaving a certain length of the wire exposed at the end. Then, an external arc discharge melts the end of the bonding wire into a spherical shape. The ceramic nozzle then presses the spherical bonding wire onto the electrode of the electronic chip. Finally, by moving the bonding device, the other end of the bonding wire is connected to the external lead frame by friction. After encapsulation with plastic resin, the process is complete. Copper wire is a good raw material for bonding wires. To improve the quality of the copper wire bonding products, a polishing machine is needed to polish the copper wires.

[0003] However, existing technologies have some problems: when polishing bonded copper wires, existing polishing machines usually use two polishing rollers that rotate on both sides of the bonded copper wires to perform the polishing work. However, the polishing rollers on existing polishing machines are often limited by the fixed mechanical structure design, making it difficult to adjust the spacing. Therefore, they do not have the function of adjusting according to different sizes of bonded copper wires. This can easily lead to poor polishing results if the polishing force is too small, or to breakage of the bonded copper wires if the polishing force is too large. Therefore, we propose a surface treatment polishing machine for bonded copper wires. Utility Model Content

[0004] One objective of this invention is to provide a new technical solution for a surface treatment polishing machine for bonded copper wires.

[0005] According to a first aspect of the present invention, a surface treatment polishing machine for bonding copper wire is provided, comprising a base, two movable plates disposed on the top of the base, the movable plates being connected to the base via a drive assembly, the drive assembly being capable of adjusting the distance between the two movable plates, a drive motor being fixedly mounted on the top of the movable plates, a rotating shaft being fixedly sleeved on the output shaft of the drive motor, a polishing roller being fixedly connected to the top of the rotating shaft, and columns being fixedly mounted on both sides of the top of the base, with guide rollers rotatably connected to the columns.

[0006] Optionally, the drive assembly includes a hydraulic cylinder, which is fixedly installed at the bottom of the base. A push-pull rod is fixedly connected to the telescopic end of the hydraulic cylinder. A through hole is provided on the base below the movable plate. A vertical rod is fixedly connected to the bottom of the movable plate. The bottom of the vertical rod passes through the through hole and extends to the bottom of the base. An inclined rod is fixedly installed on the push-pull rod, and the other end of the inclined rod passes through the vertical rod.

[0007] Optionally, the top of the base is fixedly mounted with guide rails located on both sides of the through hole, and the movable plate is slidably connected to the guide rails.

[0008] Optionally, a frame located to the left of the movable plate is fixedly installed on the top of the base, and round rollers are provided on both the upper and lower sides of the inner wall of the frame. The round rollers are connected to the frame through a buffer assembly.

[0009] Optionally, the buffer assembly includes a damping rod, which is fixedly mounted on the frame. The other end of the damping rod is fixedly connected to a mounting bracket. The roller is rotatably connected to the mounting bracket. A spring is movably sleeved on the outer surface of the damping rod, and the two ends of the spring are respectively fixedly connected to the frame and the mounting bracket.

[0010] Optionally, the diagonal bar has a cylindrical shape and its outer surface is coated with a lubricating layer.

[0011] According to one embodiment of this disclosure, by setting up a movable plate, a drive motor, a polishing roller, and a drive assembly, when it is necessary to adjust the distance between the two polishing rollers to polish bonding copper wires of different diameters, the operator can use the drive assembly to make the two movable plates drive the two drive motors to move towards or away from each other, thereby making the two polishing rollers move closer or further apart, thus adjusting the distance between the two polishing rollers. This facilitates the polishing of bonding copper wires of different diameters, avoids problems such as poor polishing effect or broken bonding copper wires, and improves the applicability of the device.

[0012] Other features and advantages of the present invention will become clear from the following detailed description of exemplary embodiments of the present invention with reference to the accompanying drawings. Attached Figure Description

[0013] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments of the present invention and, together with their description, serve to explain the principles of the present invention.

[0014] Figure 1 This is a schematic diagram of the overall structure of a surface treatment polishing machine for bonding copper wires in one embodiment;

[0015] Figure 2 This is a top view schematic diagram of a surface treatment polishing machine for bonding copper wires in one embodiment;

[0016] Figure 3 This is a cross-sectional view of the base of a surface treatment polishing machine for bonding copper wires in one embodiment.

[0017] Figure 4 This is a schematic diagram of the bottom structure of a surface treatment polishing machine for bonding copper wires in one embodiment;

[0018] Figure 5 This is a side view of a surface treatment polishing machine for bonding copper wires in one embodiment.

[0019] The following are marked in the diagram: 1. Base; 2. Movable plate; 3. Drive motor; 4. Rotating shaft; 5. Polishing roller; 6. Column; 7. Guide roller; 8. Hydraulic cylinder; 9. Push-pull rod; 10. Through hole; 11. Vertical rod; 12. Diagonal rod; 13. Guide rail; 14. Frame; 15. Circular roller; 16. Damping rod; 17. Mounting bracket; 18. Spring. Detailed Implementation

[0020] Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that, unless otherwise specifically stated, the relative arrangement, numerical expressions, and values ​​of the components and steps set forth in these embodiments do not limit the scope of the present invention.

[0021] The following description of at least one exemplary embodiment is merely illustrative and is in no way intended to limit the invention or its application or use.

[0022] Techniques, methods, and equipment known to those skilled in the art may not be discussed in detail, but where appropriate, such techniques, methods, and equipment should be considered part of the specification.

[0023] In all the examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not as limitations. Therefore, other examples of exemplary embodiments may have different values.

[0024] like Figures 1-5 As shown, a surface treatment polishing machine for bonding copper wire includes a base 1. Two movable plates 2 are provided on the top of the base 1. The movable plates 2 are connected to the base 1 through a drive assembly. The drive assembly can adjust the distance between the two movable plates 2. A drive motor 3 is fixedly installed on the top of the movable plates 2. A rotating shaft 4 is fixedly sleeved on the output shaft of the drive motor 3. A polishing roller 5 is fixedly connected to the top of the rotating shaft 4. Columns 6 are fixedly installed on both sides of the top of the base 1. Guide rollers 7 are rotatably connected to the columns 6.

[0025] The aforementioned surface treatment polishing machine for bonding copper wires includes a driving component comprising a hydraulic cylinder 8, which is fixedly installed at the bottom of a base 1. A push-pull rod 9 is fixedly connected to the telescopic end of the hydraulic cylinder 8. A through hole 10 is provided on the base 1 below a movable plate 2. A vertical rod 11 is fixedly connected to the bottom of the movable plate 2. The bottom of the vertical rod 11 passes through the through hole 10 and extends to the bottom of the base 1. A diagonal rod 12 is fixedly installed on the push-pull rod 9, and the other end of the diagonal rod 12 passes through the vertical rod 11.

[0026] By activating the hydraulic cylinder 8, the push-pull rod 9 can drive the inclined rod 12 to move left or right, thereby enabling the two vertical rods 11 to drive the two movable plates 2 to move towards or away from each other. This, in turn, enables the two drive motors 3 to drive the two polishing rollers 5 to move closer or further away, thereby adjusting the distance between the two polishing rollers 5. This allows for the polishing of bonding copper wires of different diameters, improving the applicability of the device.

[0027] The aforementioned surface treatment polishing machine for bonding copper wires has a base 1 with guide rails 13 fixedly installed on the top of the base 1 on both sides of the through hole 10, and a movable plate 2 slidably connected to the guide rails 13.

[0028] The aforementioned surface treatment polishing machine for bonding copper wires has a frame 14 fixedly installed on the top of the base 1, located to the left of the movable plate 2. Circular rollers 15 are provided on both the upper and lower sides of the inner wall of the frame 14, and the circular rollers 15 are connected to the frame 14 via a buffer assembly.

[0029] The aforementioned surface treatment polishing machine for bonding copper wires includes a buffer assembly comprising a damping rod 16, which is fixedly mounted on a frame 14. The other end of the damping rod 16 is fixedly connected to a mounting bracket 17. A circular roller 15 is rotatably connected to the mounting bracket 17. A spring 18 is movably sleeved on the outer surface of the damping rod 16, and both ends of the spring 18 are fixedly connected to the frame 14 and the mounting bracket 17, respectively.

[0030] At least three damping rods 16 are provided. Two can be provided at the bottom of the inner wall of the frame 14, and one can be provided at the top of the inner wall between the two damping rods 16 at the bottom. During polishing, the bonding copper wire passes through the three rollers 15. With the cooperation of the damping rods 16 and the springs 18, the rollers 15 can provide good support and guidance for the bonding copper wire, thereby ensuring the stability and tension of the bonding copper wire during polishing, so as to ensure a good polishing effect.

[0031] The surface treatment polishing machine for bonding copper wire described above has a cylindrical appearance for the inclined rod 12, and the outer surface of the inclined rod 12 is coated with a lubricating layer.

[0032] By coating the outer surface of the diagonal bar 12 with a lubricating layer, the movement of the diagonal bar 12 and the vertical bar 11 can be made smoother.

[0033] Working principle and usage process of this utility model:

[0034] First, the operator places the device between the unwinding roller and the winding roller of the bonding copper wire, allowing the bonding copper wire to pass between the guide roller 7, the circular roller 15, and the two polishing rollers 5. Then, the operator adjusts the distance between the two polishing rollers 5 according to the diameter of the bonding copper wire: by activating the hydraulic cylinder 8, the push-pull rod 9 can drive the inclined rod 12 to move left or right, thereby causing the two vertical rods 11 to drive the two movable plates 2 to move towards or away from each other, which in turn causes the two drive motors 3 to drive the two polishing rollers 5 to move closer or further away, thus adjusting the distance between the two polishing rollers 5. This allows for polishing of bonding copper wires of different diameters. After adjusting to the appropriate distance, the drive motors 3 can be activated, causing the two polishing rollers 5 to rotate and polish the bonding copper wire during the winding process.

[0035] Although specific embodiments of the present invention have been described in detail by way of examples, those skilled in the art should understand that the above examples are for illustrative purposes only and are not intended to limit the scope of the present invention. Those skilled in the art should understand that modifications can be made to the above embodiments without departing from the scope and spirit of the present invention. The scope of the present invention is defined by the appended claims.

Claims

1. A surface treatment polishing machine for bonded copper wires, comprising a base (1), characterized in that: The base (1) has two movable plates (2) on its top. The movable plates (2) are connected to the base (1) by a drive assembly. The drive assembly can adjust the distance between the two movable plates (2). A drive motor (3) is fixedly installed on the top of the movable plates (2). A rotating shaft (4) is fixedly sleeved on the output shaft of the drive motor (3). A polishing roller (5) is fixedly connected to the top of the rotating shaft (4). Columns (6) are fixedly installed on both sides of the top of the base (1). Guide rollers (7) are rotatably connected to the columns (6).

2. The surface treatment and polishing machine for bonding copper wire according to claim 1, characterized in that: The drive assembly includes a hydraulic cylinder (8), which is fixedly installed at the bottom of the base (1). A push-pull rod (9) is fixedly connected to the telescopic end of the hydraulic cylinder (8). A through hole (10) is provided on the base (1) below the movable plate (2). A vertical rod (11) is fixedly connected to the bottom of the movable plate (2). The bottom of the vertical rod (11) passes through the through hole (10) and extends to the bottom of the base (1). A diagonal rod (12) is fixedly installed on the push-pull rod (9). The other end of the diagonal rod (12) passes through the vertical rod (11).

3. The surface treatment and polishing machine for bonding copper wires according to claim 1, characterized in that: The base (1) is fixedly mounted with guide rails (13) on both sides of the through hole (10), and the movable plate (2) is slidably connected to the guide rails (13).

4. The surface treatment and polishing machine for bonding copper wires according to claim 1, characterized in that: A frame (14) located to the left of the movable plate (2) is fixedly installed on the top of the base (1). Circular rollers (15) are provided on both the upper and lower sides of the inner wall of the frame (14). The circular rollers (15) are connected to the frame (14) through a buffer assembly.

5. The surface treatment and polishing machine for bonding copper wires according to claim 4, characterized in that: The buffer assembly includes a damping rod (16), which is fixedly mounted on the frame (14). The other end of the damping rod (16) is fixedly connected to a mounting bracket (17). The roller (15) is rotatably connected to the mounting bracket (17). A spring (18) is movably sleeved on the outer surface of the damping rod (16). The two ends of the spring (18) are fixedly connected to the frame (14) and the mounting bracket (17) respectively.

6. The surface treatment polishing machine for bonded copper wire according to claim 2, characterized in that: The inclined rod (12) has a cylindrical appearance, and the outer surface of the inclined rod (12) is coated with a lubricating layer.

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