Vacuum coating equipment for composite current collector

Abstract

The utility model discloses vacuum coating equipment for a composite current collector. The vacuum coating equipment comprises a vacuum chamber, an unwinding roller, a winding roller, evaporation equipment and magnetron sputtering equipment, the vacuum chamber is divided into an evaporation chamber and a magnetron sputtering chamber through a transition channel, the evaporation chamber and the magnetron sputtering chamber are communicated with each other, the unwinding roller and the evaporation equipment are arranged in the evaporation chamber, and the winding roller and the magnetron sputtering equipment are arranged in the magnetron sputtering chamber. A base film unwound by the unwinding roller passes through the transition channel after being evaporated with a conducting layer through the evaporation equipment in the evaporation chamber, and is wound on the winding roller after being sputtered with an anti-oxidation layer on the conducting layer through the magnetron sputtering equipment in the magnetron sputtering chamber. According to the utility model, evaporation and surface anti-oxidation treatment can be carried out on the base film in the same chamber, so that film material oxidation caused by transfer is avoided, and the product quality is improved.

Description

Technical Field

[0001] This utility model relates to the field of vacuum coating equipment technology, and in particular to a vacuum coating equipment with a composite current collector. Background Technology

[0002] In the fabrication process of composite current collectors used in lithium batteries, roll-to-roll vacuum coating equipment is typically required to deposit metal materials on both sides of a polymer base film, forming a "metal layer-base film-metal layer" sandwich structure for the composite current collector. The roll-to-roll vacuum coating equipment consists of a housing, a winding system, an evaporation source system, and a vacuum pump system. It can complete the continuous coating process of an entire roll of product within a vacuum chamber, after which the entire roll can be removed from the chamber. The winding system and evaporation source system are located within the chamber, and the vacuum level inside the housing is continuously maintained by the vacuum pump system.

[0003] Current vapor deposition equipment performs roll-to-roll coating within a single, enclosed chamber. The entire process—unwinding, vapor deposition, and rewinding—must be completed within a sealed vacuum chamber. If a composite current collector material that is easily oxidized is selected, a metal antioxidant layer must be added to the film surface. However, after the vapor deposition equipment finishes coating, the chamber needs to be opened to remove the film and place it in a sputtering machine to deposit the antioxidant layer. During the transfer process, the film surface comes into contact with air and oxidizes, resulting in an oxide layer between the antioxidant material and the vapor-deposited material. This makes the coating layer on the film surface prone to peeling off, making it difficult to complete the process of adding the metal antioxidant layer.

[0004] Therefore, there is a need to provide a vacuum coating device with a composite current collector to solve the above problems. Utility Model Content

[0005] To overcome the above-mentioned shortcomings, the purpose of this utility model is to provide a vacuum coating equipment for composite current collectors, which can perform vapor deposition and surface anti-oxidation treatment on the base film in the same chamber, avoid film material oxidation caused by transportation, and improve product quality.

[0006] To achieve the above objectives, the technical solution adopted by this utility model is: a vacuum coating equipment for composite current collectors, comprising a vacuum chamber, an unwinding roller, a winding roller, an evaporation equipment, and a magnetron sputtering equipment; the vacuum chamber is divided into two interconnected evaporation chambers and a magnetron sputtering chamber by a transition channel; the unwinding roller and the evaporation equipment are disposed in the evaporation chamber, and the winding roller and the magnetron sputtering equipment are disposed in the magnetron sputtering chamber; the base film unwound by the unwinding roller passes through the transition channel after a conductive layer is deposited by the evaporation equipment in the evaporation chamber, and then passes through the magnetron sputtering equipment in the magnetron sputtering chamber to sputter an anti-oxidation layer on the conductive layer before being wound onto the winding roller. This equipment can perform evaporation coating and surface anti-oxidation treatment on the base film in the same chamber, avoiding film oxidation caused by transportation and improving product quality.

[0007] Furthermore, the vacuum chamber has two opposing partition plates forming the transition channel, and at least one vacuum pump assembly is installed in the lower region of the transition channel. A transition channel is formed between the two partition plates within the vacuum chamber, allowing the base film to be wound through, thus preventing gas exchange and mutual interference between the evaporation chamber and the magnetron sputtering chamber. During equipment operation, the vacuum pump assembly remains continuously on to maintain a high vacuum level within the transition channel.

[0008] Furthermore, the top of the transition channel is provided with a channel inlet communicating with the evaporation chamber and a channel outlet communicating with the magnetron sputtering chamber. The height of the channel inlet is higher than that of the evaporation apparatus. The channel inlet is formed by the top of one partition plate and the top wall of the vacuum chamber, and the channel outlet is formed by the top of another partition plate and the top wall of the vacuum chamber. The presence of a channel inlet and outlet at the top of the transition channel, with the channel inlet higher than the evaporation apparatus, helps reduce the entry of metal vapor or other impurities formed in the evaporation chamber into the transition channel, preventing metal vapor or other impurities from diffusing into the magnetron sputtering chamber and affecting the magnetron sputtering apparatus.

[0009] Furthermore, a flattening roller is provided at both the channel inlet and the channel outlet. The flattening roller reduces wrinkles on the film surface during the evaporation process, ensuring that the base film entering the transition channel and the magnetron sputtering chamber remains flat.

[0010] Furthermore, the partition includes an openable access cover located in the center of the partition, facilitating cleaning and maintenance of the transition passage.

[0011] Furthermore, a cooling system is provided within the transition channel. The top of the cooling system is connected to the top of the inner wall of the vacuum chamber, while the bottom is suspended, forming a defined space with the bottom of the transition channel for the base film to pass through. The cooling system serves two purposes: firstly, it condenses water vapor within the transition channel, increasing the vacuum level; secondly, it cools the partition plate, allowing metal vapor to deposit on it and preventing its diffusion from affecting the magnetron sputtering chamber. It also reduces the impact of thermal radiation from the evaporation equipment on the magnetron sputtering equipment.

[0012] Furthermore, the bottom of the cooling system is lower than the vapor deposition apparatus. Increasing the cooling range of the cooling system increases the cooling area of ​​the partition plate, making it easier for the metal vapor generated by the vapor deposition apparatus to deposit on the partition plate, further reducing metal vapor diffusion.

[0013] Furthermore, the distance between the cooling system and the two partition plates is 300-600mm. This distance range further increases the cooling of the partition plates and improves the deposition effect of metal vapor.

[0014] Furthermore, at least one replaceable cleaning tank is provided at the bottom of the transition channel. Impurities or splashes that may occur during the vapor deposition process will fall into the cleaning tank for collection, reducing their impact on subsequent sputtering processes.

[0015] Furthermore, the vapor deposition equipment also includes a main drum 1, a main drum 2, and evaporation source system 1 and evaporation source system 2 located below them respectively. The base film unwound by the unwinding roller is sequentially wound around the main drum 1 and the main drum 2, and the first and second sides of the base film are coated by the evaporation source system 1 and the evaporation source system 2 respectively. Multiple guide rollers and flattening rollers are arranged between the unwinding roller and the main drum 1, and multiple guide rollers and flattening rollers are also arranged between the main drum 1 and the main drum 2. The main drum 1 and the main drum 2 are used to wind the base film released by the stretching unwinding roller so that the evaporation source system 1 and the evaporation source system 2 can perform vapor deposition operations on both sides of the base film respectively; the flattening roller can flatten the base film, release internal stress, and thus reduce wrinkles on the film surface, thereby improving the efficiency of vapor deposition; while the guide roller can provide guidance for the transfer of the base film released by the unwinding roller, so that it is transferred sequentially along the path of the vapor deposition chamber, the transition channel, and the magnetron sputtering chamber.

[0016] Evaporation source system one and evaporation source system two have the same structure and are located in the lower part of the evaporation chamber. Evaporation source system one and evaporation source system two include a wire feeding mechanism, an evaporation boat and an openable baffle. The baffle is located above the evaporation boat and the wire feeding mechanism. When it is necessary to evaporate the base film, the baffle can be opened.

[0017] The magnetron sputtering equipment also includes a coating roller one and a coating roller two, and both coating roller one and coating roller two are provided with a plurality of targets on their outer periphery;

[0018] Several vacuum pump sets are installed outside the vacuum chamber, corresponding to the evaporation chamber and the magnetron sputtering chamber. The vacuum pump sets are used to maintain the required vacuum level in each part.

[0019] The beneficial effects of this utility model are as follows: In this utility model, the vacuum chamber is divided into two connected spaces by a transition channel, which can be used for evaporation and anti-oxidation layer sputtering respectively. That is, the base film can be evaporated and surface anti-oxidation treatment can be performed in the same chamber. There is no need to open the chamber to transfer the evaporated base film to the magnetron sputtering equipment, which can effectively avoid the oxidation of the film material caused by the transfer, thereby improving the quality of the product. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the overall structure of an embodiment of the present utility model;

[0021] In the diagram: 1. Vacuum chamber; 2. Evaporation chamber; 3. Magnetron sputtering chamber; 4. Evaporation equipment; 41. Evaporation source system one; 411. Evaporation boat; 412. Wire feeding mechanism; 413. Baffle; 42. Evaporation source system two; 43. Main drum one; 44. Main drum two; 45. Unwinding roller; 5. Guide roller; 6. Flattening roller; 7. Transition channel; 71. Partition plate; 711. Inspection cover plate; 72. Channel inlet; 73. Channel outlet; 74. Vacuum pump group one; 75. Cooling system; 751. Cooling pipe; 76. Cleaning tank; 8. Vacuum pump group two; 9. Magnetron sputtering equipment; 91. Coating roller one; 92. Coating roller two; 93. Target material; 94. Rewinding roller; 10. Base film. Detailed Implementation

[0022] The preferred embodiments of the present invention will now be described in detail with reference to the accompanying drawings, so that the advantages and features of the present invention can be more easily understood by those skilled in the art, thereby making a clearer and more definite definition of the scope of protection of the present invention.

[0023] See appendix Figure 1 As shown in this embodiment, a vacuum coating device for a composite current collector is used. In the prior art, when the selected composite current collector material is easily oxidized, a metal anti-oxidation layer needs to be added to the surface of the base film 10 after evaporation. After the evaporation equipment 4 finishes coating, it needs to open the cavity to remove the film and place it in a sputtering machine to deposit the anti-oxidation layer. During the transfer process, the film surface comes into contact with air and oxidizes, resulting in an oxide layer between the anti-oxidation material and the evaporated material. The coating on the film surface is prone to peeling off, making it difficult to complete the process of adding the metal anti-oxidation layer.

[0024] Therefore, this application provides a vacuum coating device for a composite current collector, including a vacuum chamber 1; the vacuum chamber 1 is divided into two interconnected evaporation chambers 2 and a magnetron sputtering chamber 3 by a transition channel 7, that is, the evaporation chamber 2 and the magnetron sputtering chamber 3 are arranged in the same vacuum chamber 1. When the base film 10 needs to be coated with an anti-oxidation layer, the evaporated base film 10 can be transferred to the magnetron sputtering chamber 3 without opening the chamber, which can quickly coat the film surface.

[0025] Several vacuum pump sets 8 are installed outside the vacuum chamber 1, corresponding to the evaporation chamber 2 and the magnetron sputtering chamber 3, to maintain the required vacuum level in each part.

[0026] A transition channel 7 is provided between the vapor deposition chamber 2 and the magnetron sputtering chamber 3, which neither affects the transport of the base film 10 nor causes interference between the two chambers.

[0027] The unwinding roller 45 and the vapor deposition equipment 4 are disposed in the vapor deposition chamber 2, and the take-up roller 94 and the magnetron sputtering equipment 9 are disposed in the magnetron sputtering chamber 3. The base film 10 unwound by the unwinding roller 45 passes through the vapor deposition equipment 4 in the vapor deposition chamber 2 to deposit a conductive layer, then passes through the transition channel 7, and in the magnetron sputtering chamber 3, the magnetron sputtering equipment 9 sputters an anti-oxidation layer onto the conductive layer before winding it onto the take-up roller 94. This allows for sequential vapor deposition and anti-oxidation layer deposition of the base film 10, resulting in a simpler overall structure.

[0028] In some embodiments, the vapor deposition apparatus 4 further includes a first main drum 43, a second main drum 44, and an evaporation source system 41 and an evaporation source system 42 located below them, respectively. The base film 10 unwound by the unwinding roller 45 is sequentially wound around the first main drum 43 and the second main drum 44, and the first and second surfaces of the base film 10 are coated by the evaporation source system 41 and the second evaporation source system 42, respectively. The first main drum 43 and the second main drum 44 are used to wind the base film 10 released by the stretching unwinding roller 45, so that the evaporation source system 41 and the second evaporation source system 42 can perform vapor deposition operations on both sides of the base film 10, respectively.

[0029] In addition, multiple guide rollers 5 and flattening rollers 6 are arranged between the unwinding roller 45 and the first main drum 43, and multiple guide rollers 5 and flattening rollers 6 are also arranged between the first main drum 43 and the second main drum 44. The flattening rollers 6 can flatten the base film 10, release internal stress, and thus reduce wrinkles on the film surface, thereby improving the efficiency of vapor deposition. The guide rollers 5 can guide the transfer of the base film 10 released by the unwinding roller 45, so that it is transferred sequentially along the path of the vapor deposition chamber 2, the transition channel 7, and the magnetron sputtering chamber 3.

[0030] Evaporation source system 1 41 and evaporation source system 2 42 have the same structure and are located in the lower part of the evaporation chamber 2. Evaporation source system 1 41 includes a wire feeding mechanism 412, an evaporation boat 411, and an openable baffle 413, which is located above the evaporation boat 411 and the wire feeding mechanism 412. When it is necessary to evaporate the base film 10, the baffle 413 can be opened.

[0031] Specifically, when evaporation source system 1 41 and evaporation source system 2 42 are working, a constant voltage is applied to heat the evaporation boat 411 in the evaporation source system, and at the same time the wire feeding mechanism 412 starts to feed the wire, and the metal wire melts and evaporates on the evaporation boat 411; when the liquid surface of the metal wire melted and evaporated on the evaporation boat 411 is stable, the baffle 413 on the upper part of the evaporation boat 411 is opened to start the coating operation.

[0032] The flattening roller 6 and guide roller 5 work together to maintain a constant tension on the base film 10. The unwinding roller 45 releases the base film 10, and through the traction of the guide roller 5 and the flattening roller 6, the base film 10 winds around the main drum 43, with the side away from the main drum 43 facing the evaporation source system 41. The evaporation boat 411 can deposit a metal layer on the first side of the base film 10 facing it. As the guide roller 5 continues to traction, the base film 10 winds around the second main drum 44, with the side away from the second main drum 44 facing the second evaporation source system 42. The evaporation boat 411 can deposit a metal layer on the second side of the base film 10 facing it. That is, double-sided evaporation of the base film 10 is achieved through the first evaporation source system 41 and the second evaporation source system 42. After the double-sided evaporation is completed, the base film 10 enters the transition channel 7.

[0033] In some embodiments, the vacuum chamber 1 has two partition plates 71 arranged opposite to each other to form the transition channel 7, and a transition channel 7 is formed between the two partition plates 71 for the base film 10 to be wound through. Because the evaporation source system generates metal vapor in the lower part of the cavity during the vapor deposition process, and the metal vapor is prone to deposition and requires a high vacuum level, the transition channel 7 is designed with a U-shaped structure. The top of the transition channel 7 is provided with a channel inlet 72 communicating with the vapor deposition chamber 2 and a channel outlet 73 communicating with the magnetron sputtering chamber 3. The channel inlet 72 is formed by the top of one of the partition plates 71 and the top wall of the vacuum chamber 1, and the channel outlet 73 is formed by the top of another partition plate 71 and the top wall of the vacuum chamber 1. The height of the channel inlet 72 is higher than that of the vapor deposition equipment 4. The placement of the channel inlet 72 at the top helps to ensure the vacuum level near the evaporation source system, effectively reducing the impact on the evaporation source system, reducing the entry of metal vapor or other impurities into the transition channel 7, and preventing channel blockage. If the channel inlet 72 were placed at the bottom, metal vapor and impurities would easily deposit at the bottom of the transition channel 7, causing channel blockage. In addition, the height of the channel inlet 72 being higher than that of the vapor deposition equipment 4 makes it more difficult for metal vapor and impurities to enter the transition channel 7 and thus affect the magnetron sputtering chamber 3.

[0034] In some embodiments, the partition 71 includes an openable maintenance cover 711, which is located in the middle of the partition 71, making it convenient for staff to open the maintenance cover 711 to clean and maintain the transition channel 7.

[0035] At least one replaceable cleaning tank 76 is provided at the bottom of the transition channel 7. Impurities or splashes may occur during the coating process of the vapor deposition equipment 4. By setting the channel inlet 72 and channel outlet 73 at the top, the entry of production impurities into the transition channel 7 can be reduced. Even if some impurities enter the transition channel 7, they can fall into the cleaning tank 76. The cleaning tank 76 is used to collect the impurities or splashes, reducing the impact on the subsequent sputtering process.

[0036] In other embodiments, a flattening roller 6 is provided at both the channel inlet 72 and the channel outlet 73. After the base film 10 is double-sided vapor-deposited in the vapor deposition chamber 2, it is flattened and guided by the flattening roller 6 at the channel inlet 72 to the transition channel 7. Here, the flattening roller 6 flattens the base film 10, releasing internal stress and reducing wrinkles on the film surface. Then, it is flattened and guided by the flattening roller 6 at the channel outlet 73 to the magnetron sputtering chamber 3, so that the base film 10 entering the magnetron sputtering chamber 3 always remains flat. Several guide rollers 5 are also provided in the transition channel 7 to guide the base film 10.

[0037] Specifically, when setting the flattening roller 6, an arched structure is provided in the middle of the flattening roller 6 to ensure the flattening effect after the base film 10 is wound.

[0038] It should be noted that, while ensuring the normal traction of the base film 10 by the guide roller 5, the transition channel 7 minimizes its internal space to reduce the impact of the vacuum difference between the vapor deposition equipment 4 and the magnetron sputtering equipment 9.

[0039] A cooling system 75 is also provided inside the transition channel 7. The top of the cooling system 75 is connected to the top of the inner wall of the vacuum chamber 1, and the bottom is suspended, forming a defined space between the cooling system 7 and the bottom of the transition channel 7 for the base film 10 to pass through. The cooling system 75 serves two purposes: firstly, it condenses the water vapor in the transition channel 7 to increase the vacuum level inside the transition channel 7; secondly, it cools the partition plate 71, making it easier for the metal vapor generated by the vapor deposition equipment 4 to deposit on the partition plate 71, reducing the possibility of metal vapor diffusion, and mitigating the impact of the heat radiation from the vapor deposition equipment 4 on the magnetron sputtering equipment 9.

[0040] In some embodiments, the bottom of the cooling system 75 in the vacuum chamber 1 is lower than that of the vapor deposition equipment 4, which helps to increase the cooling range of the cooling system 75, thereby increasing the area of ​​the partition plate 71 that is cooled. The metal vapor generated by the vapor deposition equipment 4 is more easily deposited on the partition plate 71, reducing the possibility of metal vapor diffusion. In addition, the distance between the cooling system 75 and the two partition plates 71 is 300-600mm, for example, 300mm, 450mm, and 500mm. This distance further increases the cooling effect on the partition plate 71, improves the deposition effect of metal vapor on the partition plate 71, prevents metal vapor diffusion from affecting the magnetron sputtering chamber 3, and also reduces the impact of the heat radiation from the vapor deposition equipment 4 on the magnetron sputtering equipment 9.

[0041] Specifically, the cooling system 75 includes several cooling pipes 751, which are divided into cooling pipes 751 for the vapor deposition machine and cooling pipes 751 for the magnetron sputtering machine. One end of each cooling pipe 751 is connected to the vapor deposition equipment 4 and the magnetron sputtering equipment 9, respectively, and the other end is connected to an external chiller to stabilize the cooling temperature below -200°C. The cooling system 75 serves two purposes: firstly, it allows water vapor to condense inside the pipes, increasing the internal vacuum; secondly, it reduces the impact of heat radiation from the vapor deposition equipment 4 on the magnetron sputtering equipment 9.

[0042] It should be noted that all cooling water pipes contain refrigerant.

[0043] At least one vacuum pump assembly 74 is installed in the lower region of the transition channel 7. During equipment operation, the vacuum pump assembly 74 remains on throughout to maintain a high vacuum level inside the transition channel 7 and prevent gas exchange and mutual interference between the evaporation chamber 2 and the magnetron sputtering chamber 3.

[0044] It should be noted that vacuum pump group 74 and vacuum pump group 8 mentioned above have the same structure. Specifically, the vacuum pump group is one or more of the following: mechanical pump, diffusion pump, Roots pump, molecular pump, and maintenance pump.

[0045] The magnetron sputtering equipment 9 also includes a first coating roller 91, a second coating roller 92, and several guide rollers 5. Several targets 93 are disposed on the outer periphery of both the first coating roller 91 and the second coating roller 92. The base film 10, exiting through the channel outlet 73, is sequentially wound around the first coating roller 91 and the second coating roller 92 under the guidance of the guide rollers 5. The base film 10 wound around the first coating roller 91 and the second coating roller 92 is subjected to anti-oxidation treatment by the sputtering targets 93, and then wound up by the take-up roller 94 after the treatment is completed.

[0046] Specifically, when the base film 10 is wound onto the coating roller 91 and the coating roller 92, it is wound in an S-shape to ensure the tension of the base film 10, so that the sputtering is more uniform and the effect is better.

[0047] In some embodiments, coating roller 1 91 and coating roller 2 92 are arranged side by side, and sputtering target 93 is respectively arranged on the side of coating roller 1 91 and coating roller 2 92 that are far apart from each other.

[0048] It should be noted that vacuum chamber 1 maintains a high vacuum throughout the entire coating process.

[0049] The above embodiments are only for illustrating the technical concept and features of this utility model. Their purpose is to enable those skilled in the art to understand the content of this utility model and implement it. They cannot be used to limit the protection scope of this utility model. All equivalent changes or modifications made in accordance with the spirit and essence of this utility model should be covered within the protection scope of this utility model.

Claims

1. A vacuum coating apparatus for a composite current collector, characterized in that: The system includes a vacuum chamber, an unwinding roller, a winding roller, a vapor deposition equipment, and a magnetron sputtering equipment. The vacuum chamber is divided into two interconnected vapor deposition chambers and a magnetron sputtering chamber by a transition channel. The unwinding roller and the vapor deposition equipment are located in the vapor deposition chamber, and the winding roller and the magnetron sputtering equipment are located in the magnetron sputtering chamber. The base film unwound by the unwinding roller passes through the transition channel after a conductive layer is deposited by the vapor deposition equipment in the vapor deposition chamber, and then passes through the magnetron sputtering equipment in the magnetron sputtering chamber to sputter an anti-oxidation layer on the conductive layer before being wound onto the winding roller.

2. The vacuum coating equipment for a composite current collector according to claim 1, characterized in that: The vacuum chamber has two partition plates arranged opposite each other to form the transition channel, and at least one vacuum pump assembly is provided in the lower region of the transition channel.

3. The vacuum coating equipment for a composite current collector according to claim 2, characterized in that: The top of the transition channel is provided with a channel inlet communicating with the evaporation chamber and a channel outlet communicating with the magnetron sputtering chamber. The height of the channel inlet is higher than that of the evaporation equipment. The channel inlet is formed by the top of one of the partition plates and the top wall of the vacuum chamber, and the channel outlet is formed by the top of another partition plate and the top wall of the vacuum chamber.

4. The vacuum coating equipment for a composite current collector according to claim 3, characterized in that: A flattening roller is installed at both the inlet and outlet of the channel.

5. The vacuum coating equipment for a composite current collector according to claim 2, characterized in that: The partition includes an openable access cover located in the middle of the partition.

6. The vacuum coating equipment for a composite current collector according to claim 2, characterized in that: A cooling system is provided inside the transition channel. The top of the cooling system is connected to the top of the inner wall of the vacuum chamber, and the bottom is suspended, forming a defined space with the bottom of the transition channel for the base membrane to pass through.

7. The vacuum coating equipment for a composite current collector according to claim 6, characterized in that: The bottom of the cooling system is lower than the vapor deposition equipment.

8. The vacuum coating equipment for a composite current collector according to claim 6, characterized in that: The distance between the cooling system and the two partition plates is 300-600mm.

9. The vacuum coating equipment for a composite current collector according to claim 1, characterized in that: At least one replaceable cleaning tank is provided at the bottom of the interior of the transition channel.

10. The vacuum coating equipment for a composite current collector according to claim 1, characterized in that: The vapor deposition equipment also includes a main drum 1, a main drum 2, and an evaporation source system 1 and an evaporation source system 2 located below them respectively. The base film unwound by the unwinding roller is sequentially wound around the main drum 1 and the main drum 2, and the first and second sides of the base film are coated by the evaporation source system 1 and the evaporation source system 2 respectively. Multiple guide rollers and flattening rollers are arranged between the unwinding roller and the main drum 1, and multiple guide rollers and flattening rollers are also arranged between the main drum 1 and the main drum 2. The first evaporation source system and the second evaporation source system have the same structure and are located in the lower part of the evaporation chamber. The first evaporation source system and the second evaporation source system include a wire feeding mechanism, an evaporation boat and an openable baffle. The baffle is located above the evaporation boat and the wire feeding mechanism. The magnetron sputtering equipment also includes a coating roller one and a coating roller two, and both coating roller one and coating roller two are provided with a plurality of targets on their outer periphery; Several vacuum pump sets are installed outside the vacuum chamber corresponding to the evaporation chamber and the magnetron sputtering chamber.

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