Spraying assembly and semiconductor equipment

Abstract

The utility model discloses a spraying assembly and semiconductor equipment, and relates to the technical field of semiconductors, and the spraying assembly comprises a top plate, a spraying plate, an air inlet part and a pre-diffusion part. The air inlet piece is positioned above the top plate; the pre-diffusion piece is located between the top plate and the spraying plate, a plurality of diffusion holes are limited in the pre-diffusion piece, and a plurality of air inlet channels are connected between the pre-diffusion piece and the air inlet piece. According to the spraying assembly, gas flows into the pre-diffusion piece from the gas inlet piece through the gas inlet channel to be pre-diffused, the space size of the gas flowing through the pipeline can be reduced, and the flow speed is increased. Meanwhile, pre-diffusion is performed through the diffusion holes of the pre-diffusion piece, so that the flow velocity of the gas can be considered while the uniformity of the gas flowing out of the spraying plate is improved, and the process requirement is met.

Description

Technical Field

[0001] This application relates to the field of semiconductor technology, and more specifically, to a spray assembly and semiconductor device. Background Technology

[0002] In related fields, gases generated by chemical sources or reactants enter the space between the top plate and the spray plate of a spraying device after passing through a mixer. As the gas flows out of the spray plate, it diffuses due to the suction effect of the suction ring at the edge of the chamber. However, because the uniformity of the gas flow out of the spray plate cannot be guaranteed, the film thickness uniformity of the chip is poor.

[0003] Therefore, how to improve the uniformity of gas diffusion has become a technical problem that urgently needs to be solved by those skilled in the art. Utility Model Content

[0004] In view of this, the purpose of this application is to provide a spray assembly to improve the uniformity of gas diffusion.

[0005] Another object of this application is to provide a semiconductor device having the above-described spray assembly.

[0006] To achieve the above objectives, this application provides the following technical solution:

[0007] A spray assembly, comprising:

[0008] roof;

[0009] Sprayer plate;

[0010] An air intake is located above the top plate;

[0011] A pre-diffuser is located between the top plate and the spray plate. The pre-diffuser defines multiple diffusion holes, and multiple air intake channels are connected between the pre-diffuser and the air intake.

[0012] Optionally, in the above-mentioned spray assembly, the air intake component includes an air intake pipe and a connecting plate, and the connecting plate is connected to the air intake pipe and the air intake channel respectively.

[0013] Optionally, in the above-mentioned spray assembly, each of the air intake channels is evenly spaced along the circumference of the connecting plate.

[0014] Optionally, in the above-mentioned spray assembly, the air intake channel is inclinedly disposed between the connecting plate and the pre-diffuser, and the air intake channel is tapered.

[0015] Optionally, in the above-mentioned spray assembly, the two ends of the air intake channel are respectively connected to the edges of the connecting plate and the pre-diffuser.

[0016] Optionally, in the above-mentioned spray assembly, the air intake channel has a long and narrow structure.

[0017] Optionally, in the above-mentioned spray assembly, the spray plate is provided with a plurality of spray holes, and the diffuser holes are staggered with the spray holes.

[0018] Optionally, in the above-described spray assembly, the density of the spray holes is the same as the density of the diffuser holes; and / or,

[0019] The diameter of the spray hole is the same as the diameter of the diffuser hole.

[0020] Optionally, in the above-described spray assembly, the diffusion holes are uniformly arrayed on the pre-diffuser.

[0021] A semiconductor device comprising a spray assembly as described in any of the preceding claims.

[0022] The spray assembly provided in this application, by placing the air inlet above the top plate and the pre-diffuser between the top plate and the spray plate, and connecting the air inlet and the pre-diffuser through multiple air inlet channels, allows gas to flow into the pre-diffuser through the air inlet channels and undergo pre-diffusivity through the diffusion holes before flowing out through the spray plate. As can be seen from the above example, the spray assembly provided in this application, by having gas flow into the pre-diffuser through the air inlet channels from the air inlet for pre-diffusivity, can reduce the space required for gas to flow through the pipeline and increase the flow rate. Simultaneously, pre-diffusivity through the diffusion holes of the pre-diffuser can improve the uniformity of gas flow out of the spray plate while also considering the gas flow rate to meet process requirements.

[0023] The technical features mentioned above, those to be mentioned below, and those shown individually in the accompanying drawings can be combined arbitrarily, provided that the combined technical features are not contradictory. All feasible combinations of features are the technical content explicitly described herein. Any one of the multiple sub-features contained in the same statement can be applied independently, without necessarily being applied together with other sub-features. Attached Figure Description

[0024] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of this application. For those skilled in the art, other drawings can be obtained based on the provided drawings without creative effort.

[0025] Figure 1 This is a schematic diagram of the structure of the spray assembly provided in the embodiments of this application;

[0026] Figure 2This is a schematic diagram of the structure of the diffusion component provided in an embodiment of this application;

[0027] Figure 3 This is a schematic diagram of the structure of the pre-diffusion component provided in the embodiments of this application;

[0028] Figure 4 This is a top view of the pre-diffusion component provided in an embodiment of this application.

[0029] Among them, 100 is the air intake component, 1001 is the air intake pipe, 1002 is the connecting plate, 101 is the pre-diffuser component, 1011 is the diffuser hole, 1012 is the diffuser chamber, and 102 is the air intake channel.

[0030] 200 is the top plate, 201 is the spray plate, and 2011 is the spray hole. Detailed Implementation

[0031] The core of this application lies in providing a pre-diffusion structure to improve the uniformity of gas diffusion.

[0032] Another key aspect of this application is to provide a spray assembly having the aforementioned pre-diffusion structure.

[0033] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0034] In related fields, especially in the semiconductor industry, gases generated from chemical sources or reactants enter the space between the top plate and the spray plate of a spraying device after passing through a mixer. As the gas flows out of the spray plate, it diffuses due to the suction effect of the suction ring at the edge of the chamber. However, because the uniformity of the gas flow out of the spray plate cannot be guaranteed, the thin film thickness uniformity of the chip is poor.

[0035] Therefore, such as Figure 1 As shown in the figure, this application discloses a spray assembly, including an air inlet 100, a pre-diffuser 101, a top plate 200, and a spray plate 201.

[0036] Among them, such as Figure 1 As shown, the air intake component 100 can be disposed above the top plate 200, while the pre-diffuser component 101 can be located between the top plate 200 and the spray plate 201, and can be connected in a detachable manner for later maintenance or replacement. Furthermore, multiple air intake channels 102 are connected between the air intake component 100 and the pre-diffuser component 101, and... Figure 2As shown, the pre-diffuser 101 may have multiple diffusion holes 1011 formed on it, so that the gas generated by the chemical source or reactants can flow into the pre-diffuser 101 through the air inlet channel 102. This reduces the space required for the gas to flow through the pipeline, increases the flow rate, and allows for pre-diffusivity through the diffusion holes 1011. This improves the uniformity of the gas flow from the spray plate 201 while also considering the gas flow rate to meet process requirements. It should be noted that the chemical source or reactants can be solid, liquid, or gaseous chemical substances, which are not limited here.

[0037] For example, the pre-diffusion component 101 can be connected to the top plate 200 and the spray plate 201 respectively by fasteners such as bolts, or the pre-diffusion component 101 can be fixed between the top plate 200 and the spray plate 201 by detachable connection methods such as snap-fit ​​or plug-in. This is not limited here.

[0038] To ensure the sealing of the connection between the pre-diffuser 101 and the top plate 200 and the spray plate 201, a sealing gasket can be provided between the pre-diffuser 101 and the top plate 200, and also between the pre-diffuser 101 and the spray plate 201. This allows the sealing gasket to be squeezed and deformed when the pre-diffuser 101 is connected to the top plate 200 and the spray plate 201 by fasteners such as bolts, thereby achieving a sealing effect between the top plate 200 and the spray plate 201.

[0039] Of course, sealant can also be filled at the connection points between the pre-diffuser 101 and the top plate 200 and the spray plate 201 respectively to ensure the sealing of the connection between the pre-diffuser 101 and the top plate 200 and the spray plate 201 respectively.

[0040] For example, such as Figure 1 and Figure 2 As shown, the air intake component 100 may include an air intake pipe 1001 and a connecting plate 1002. The air intake pipe 1001 may include one, two or more, and the connecting plate 1002 may have a channel that matches the air intake pipe 1001, so that the connecting plate 1002 can be connected to the air intake pipe 1001 and the air intake channel 102 respectively, thereby allowing the gas generated by the chemical source or reactants to flow from the air intake pipe 1001 through the connecting plate 1002 and the air intake channel 102 into the pre-diffuser 101.

[0041] For example, the connecting plate 1002 of the air intake component 100 can be connected and fixed to the top plate 200 by bolts or other fasteners, and the air intake pipe 1001 can be inserted into the corresponding channel in the connecting plate 1002 to ensure that the air intake pipe 1001 is connected to the channel in the connecting plate 1002.

[0042] For example, in order to ensure the airtightness of the connection between the intake pipe 1001 and the connecting plate 1002, the inner diameter of the corresponding channel in the connecting plate 1002 can be slightly smaller than the outer diameter of the intake pipe 1001, so as to ensure the interference fit between the channel of the intake pipe 1001 and the connecting plate 1002, thereby ensuring the airtightness of the connection between the intake pipe 1001 and the connecting plate 1002.

[0043] Of course, a sealing gasket can also be installed at the connection position between the intake pipe 1001 and the inner channel of the connecting plate 1002 to ensure the sealing of the connection between the intake pipe 1001 and the connecting plate 1002.

[0044] For example, the flow cross-section of the inner channel of the connecting plate 1002 can be a constant cross-section, or it can be a gradually narrowing cross-section, thereby further increasing the resistance to reverse gas flow and reducing the occurrence of process gas backflow. At the same time, the inner diameter of the inlet channel 102 can be smaller than the inner diameter of the inlet pipe 1001, thereby further preventing process gas backflow.

[0045] For example, in order to ensure the flow rate and uniformity of the intake air, the channels inside the connecting plate 1002 can be inclined and arranged inside the connecting plate 1002 so that each channel can be distributed in a conical shape inside the connecting plate 1002, thereby ensuring the flow rate and uniformity of the intake air.

[0046] like Figure 2 As shown, the intake channel 102 can adopt a narrow and long structure, and each intake channel 102 can be evenly distributed along the circumference of the connecting plate 1002, so as to ensure the flow rate of the gas generated by the chemical source or reactant through the intake channel 102 with a smaller diameter, so as to meet the process requirements.

[0047] For example, such as Figure 2 As shown, the pre-diffuser 101 can have a circular cross-section, and the outer diameter of the connecting plate 1002 is smaller than the outer diameter of the pre-diffuser 101. At the same time, the air intake channel 102 can be inclinedly arranged between the connecting plate 1002 and the pre-diffuser 101. The angle between the air intake channel 102 and the bottom surface of the connecting plate 1002 can be between 90° and 180°, such as 120°, 135°, 150°, etc., so that the air intake channel 102 is distributed in a conical shape in the circumferential direction of the connecting plate 1002, thereby ensuring the uniformity of gas flow to the pre-diffuser 101 and ensuring the gas flow rate.

[0048] For example, such as Figure 2As shown, the air intake channel 102 can be formed by excavating within the top plate 200. For ease of understanding, the two ends of the air intake channel 102 are defined as the first end and the second end, respectively. The first end of the air intake channel 102 is the air intake end, and the second end is the air outlet end. The first end of the air intake channel 102 communicates with the channel within the connecting plate 1002 and is located at the edge of the connecting plate 1002. The second end of the air intake channel 102 is connected to the edge of the pre-diffuser 101 to ensure a large inclination angle of the air intake channel 102. This allows for pre-diffusing of the gas through the diffusion holes 1011 of the pre-diffuser 101 while maintaining the gas flow rate to meet process requirements.

[0049] For example, such as Figure 3 As shown, the pre-diffuser 101 can form a diffusion chamber 1012, and the diffusion hole 1011 is located at the bottom of the diffusion chamber 1012. The air inlet channel 102 communicates with the diffusion chamber 1012 of the pre-diffuser 101 and is located at the edge of the diffusion chamber 1012, so that the gas can flow into the diffusion chamber 1012 from the second end of the air inlet channel 102 and diffuse through the diffusion hole 1011 of the diffusion chamber 1012 to the space between the spray plate 201 and the pre-diffuser 101, and then be discharged through the spray plate 201. Thus, the gas can be pre-diffused through the diffusion hole 1011 of the pre-diffuser 101 while ensuring the gas flow rate to meet the process requirements.

[0050] To ensure the uniformity of gas discharge from the spray plate 201, such as Figure 1 As shown, there should be a certain gap between the spray plate 201 and the pre-diffuser 101, so that the gas can be pre-diffused from the diffusion hole 1011 of the diffusion chamber 1012 to the space between the spray plate 201 and the pre-diffuser 101, and then discharged through the spray plate 201, so as to ensure the uniformity of the gas discharged from the spray plate 201.

[0051] like Figure 1 and Figure 2 As shown, the spray plate 201 may be provided with multiple spray holes 2011, and the density of the diffusion holes 1011 may be the same as the density of the spray holes 2011, and the aperture of the diffusion holes 1011 may be the same as the aperture of the spray holes 2011. Simultaneously, the diffusion holes 1011 may be arranged in a uniform array on the pre-diffuser 101 to ensure the uniformity of gas diffusion. Furthermore, the diffusion holes 1011 and the spray holes 2011 may be staggered to prevent gas from directly passing through the diffusion holes 1011 of the pre-diffuser 101 into the chamber, thereby affecting the diffusion effect.

[0052] For example, such as Figure 2 and Figure 3As shown, multiple rows of diffuser holes 1011 can be distributed on the pre-diffuser 101, and the distance between each adjacent diffuser hole 1011 is equal to ensure the uniformity of gas diffusion. Similarly, multiple rows of spray holes 2011 can be distributed on the spray plate 201, and the distance between each adjacent spray hole 2011 is equal to ensure the uniformity of gas flow from the spray holes 2011. Furthermore, the spray holes 2011 and diffuser holes 1011 can be distributed with a transverse or longitudinal offset. The offset distribution means that the spray holes 2011 and diffuser holes 1011 can partially overlap or be completely separated.

[0053] Of course, such as Figure 4 As shown, the diffusion holes 1011 can also be distributed in a ring at equal intervals on the pre-diffusion member 101, and the spray holes 2011 can also be distributed in a ring at equal intervals on the spray plate 201.

[0054] like Figure 2 As shown, the gas enters the channel in the connecting plate 1002 through the air inlet pipe 1001 of the air inlet component 100, and flows to the pre-diffuser 101 through the air inlet channel 102. It is pre-diffused through the diffusion holes 1011 of the pre-diffuser 101, and flows out through multiple staggered spray holes 2011 on the spray plate 201. This can improve the uniformity of the gas flowing out of the spray plate 201, while also taking into account the gas flow rate to meet the process requirements.

[0055] In the above embodiments, the opening size, number and distribution of the spray holes 2011 and the diffuser holes 1011 can be set so that the gas can flow out of the spray plate 201 in a uniform or pressure gradient manner according to actual needs.

[0056] For example, the spray hole 2011 and the diffuser hole 1011 can be constant holes such as circular holes, square holes, and triangular holes, or they can be variable diameter holes such as tapered holes, which can further increase the resistance to reverse gas flow and reduce the occurrence of process gas backflow.

[0057] The spray assembly disclosed in this application involves placing an air inlet 100 above a top plate 200, and a pre-diffuser 101 located between the top plate 200 and the spray plate 201. The air inlet 100 and the pre-diffuser 101 are connected through multiple air inlet channels 102, so that gas can flow into the pre-diffuser 101 through the air inlet channels 102 and undergo pre-diffusivity through the diffusion holes 1011, and then flow out through the spray plate 201.

[0058] The spray assembly disclosed in this application pre-diffuses gas by having it flow from the inlet 100 through the inlet channel 102 into the pre-diffuser 101, thereby reducing the space required for gas flow through the pipeline and increasing the flow rate. Simultaneously, pre-diffusing through the diffusion holes 1011 of the pre-diffuser 101 improves the uniformity of gas flow from the spray plate 201 while also considering the gas flow rate to meet process requirements.

[0059] It should be noted that the spray components in the above embodiments are all located in a closed space to ensure the effect of gas diffusion.

[0060] This application also discloses a semiconductor device, including the spray assembly disclosed in the above embodiments. Therefore, the semiconductor device has all the technical effects of the above-mentioned spray assembly, which will not be repeated here.

[0061] It should be noted that the various embodiments in this specification are described in a progressive manner, with each embodiment focusing on the differences from other embodiments. The same or similar parts between the various embodiments can be referred to each other.

[0062] Hereinafter, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature.

[0063] Unless otherwise explicitly specified and limited, the terms "connected" and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of this utility model based on the specific circumstances.

[0064] This article uses specific examples to illustrate the principles and implementation methods of this utility model. The descriptions of the above embodiments are only for the purpose of helping to understand the core ideas of this utility model. It should be noted that for those skilled in the art, several improvements and modifications can be made to this utility model without departing from the principles of this utility model, and these improvements and modifications also fall within the protection scope of the claims of this utility model.

Claims

1. A spray assembly, characterized in that, include: Top plate (200); Sprayer plate (201); An air intake (100) is located above the top plate (200); A pre-diffuser (101) is located between the top plate (200) and the spray plate (201). The pre-diffuser (101) defines a plurality of diffuser holes (1011), and a plurality of air intake channels (102) are connected between the pre-diffuser (101) and the air intake (100).

2. The spray assembly according to claim 1, characterized in that, The air intake component (100) includes an air intake pipe (1001) and a connecting plate (1002), and the connecting plate (1002) is connected to the air intake pipe (1001) and the air intake channel (102) respectively.

3. The spray assembly according to claim 2, characterized in that, Each of the air intake channels (102) is evenly spaced along the circumference of the connecting plate (1002).

4. The spray assembly according to claim 2, characterized in that, The air intake channel (102) is inclined between the connecting plate (1002) and the pre-diffuser (101), and the air intake channel (102) is tapered.

5. The spray assembly according to claim 2, characterized in that, The two ends of the air intake channel (102) are respectively connected to the edges of the connecting plate (1002) and the pre-diffuser (101).

6. The spray assembly according to claim 1, characterized in that, The air intake channel (102) has a long and narrow structure.

7. The spray assembly according to claim 1, characterized in that, The spray plate (201) is provided with a plurality of spray holes (2011), and the diffuser holes (1011) are staggered with the spray holes (2011).

8. The spray assembly according to claim 7, characterized in that, The density of the spray holes (2011) is the same as the density of the diffuser holes (1011); and / or, The diameter of the spray hole (2011) is the same as the diameter of the diffuser hole (1011).

9. The spray assembly according to any one of claims 1 to 8, characterized in that, The diffusion holes (1011) are uniformly arrayed on the pre-diffusion member (101).

10. A semiconductor device, characterized in that, Includes the spray assembly as described in any one of claims 1 to 9.

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