Miniature temperature sensor composite packaging structure

Abstract

The utility model discloses a composite packaging structure of a miniature temperature sensor, which relates to the technical field of temperature sensors, and comprises an outer shell, a temperature sensing element, a temperature sensor, a temperature sensor and a temperature sensor, the supporting frame is arranged on the peripheral side of the temperature sensing element and fixed to the inner wall of the outer shell; and the packaging filler is filled in the outer shell and used for completely wrapping the temperature sensing element therein, and the packaging filler is also filled in the second positioning groove. According to the utility model, the packaging filler and the connecting pins form a mechanical occlusion structure, so that the connecting pins are effectively prevented from loosening or falling off in the use process, and the service life of the temperature sensing element is prolonged. And the stability of the whole structure is improved, stable connection of the two can be achieved without welding, and the production process is simplified.

Description

Technical Field

[0001] This utility model relates to the field of temperature sensor technology, and in particular to a composite packaging structure for a miniature temperature sensor. Background Technology

[0002] Miniature temperature sensors are tiny devices that can sense and measure temperature changes and convert temperature information into output signals. They are usually made of silicon semiconductor materials and have a wide range of applications, from precise measurement of human body temperature in medical devices to real-time monitoring of equipment temperature in industrial production and control of chip temperature in electronic devices.

[0003] Currently, encapsulating temperature sensing elements through packaging structures can meet the needs in terms of physical protection, environmental isolation, and insulation safety. However, when encapsulating temperature sensing elements, their connection pins need to be brought out from the packaging structure. Traditionally, the connection pins are fixed to the temperature sensing element by soldering. The soldering process requires precise control of temperature, time, and soldering position, which demands high operator skills and has relatively high soldering equipment costs, making the production process complex. Therefore, there is an urgent need to design a micro temperature sensor composite packaging structure to solve the above problems. Utility Model Content

[0004] The purpose of this invention is to address the shortcomings of existing technologies by proposing a composite packaging structure for a miniature temperature sensor. Its advantage lies in creating a mechanical interlocking structure between the packaging filler and the connecting pins, effectively preventing the connecting pins from loosening or falling off during use.

[0005] To achieve the above objectives, the present invention adopts the following technical solution:

[0006] A composite packaging structure for a miniature temperature sensor includes:

[0007] The outer casing has a filling port on its top, and a sealing assembly is installed inside the filling port. The temperature sensing element is installed inside the outer casing.

[0008] A support frame is disposed around the temperature sensing element and fixed to the inner wall of the housing.

[0009] Encapsulation filler is filled inside the housing to completely encapsulate the temperature sensing element, and the encapsulation filler is also filled into the second positioning groove.

[0010] The above technical solutions enable the encapsulation filler and the connecting pins to form a mechanical interlocking structure, effectively preventing the connecting pins from loosening or falling off during use, improving the overall structural stability, and achieving a stable connection between the two without soldering, thus simplifying the production process.

[0011] The present invention is further configured such that metal wires are fixed at both ends of the bottom of the temperature sensing element, and the bottom of the metal wires are connected to connecting pins. Two pin outlet holes are opened at the bottom of the housing for the connecting pins to pass through, and multiple annular second positioning grooves are opened on the top of the outer wall of the connecting pins.

[0012] The above technical solution ensures the stability of the connection pins by using the locking action of the sealing filler and the second positioning groove.

[0013] The present invention is further configured such that each of the connecting pins has a connecting socket at its top for inserting a metal wire, and the inner diameter of the connecting socket is adapted to the outer diameter of the metal wire.

[0014] The above technical solutions facilitate the connection between the pins and the metal wires.

[0015] The present invention is further provided that the surface of the portion of the connecting pin extending out of the housing is provided with a gold-plated layer.

[0016] The above technical solutions enable the connection pins to have better corrosion resistance and conductivity, thus extending their service life.

[0017] The present invention is further configured such that the sealing assembly includes a filling port opened on the top of the outer shell for inserting a temperature sensing element, and a sealing groove is provided on the top of the filling port. An encapsulation cap is inserted into the inner wall of the sealing groove and the inner wall of the filling port. The outer wall size of the encapsulation cap is smaller than the inner wall size of the filling port. The encapsulation filler is filled into the gap between the outer wall of the encapsulation cap and the inner wall of the filling port. A first positioning groove in the shape of a square is opened at the bottom of the outer wall of the encapsulation cap, and the encapsulation filler is also filled into the first positioning groove.

[0018] The above technical solutions form a multi-layered sealing structure, enhancing the sealing performance of the outer casing, effectively preventing harmful substances from the external environment from entering the interior, and ensuring the normal operation of the temperature sensing element.

[0019] The present invention is further configured such that the encapsulation cover is designed to be hollow.

[0020] The above technical solutions reduce thermal resistance interference and indirectly help the heat inside the sensor dissipate through the outer casing.

[0021] The present invention is further configured such that heat dissipation grooves are provided at equal intervals on all four outer walls of the outer shell, and the heat dissipation grooves are square, with the positions of the heat dissipation grooves corresponding to the positions of the temperature sensing elements.

[0022] The above technical solutions increase the surface area of ​​the outer casing, helping to dissipate the heat generated by the temperature sensing element during operation.

[0023] The present invention is further configured such that reinforcing ribs are fixedly arranged at equal intervals on the inner walls of the outer shell, and the positions of the reinforcing ribs correspond to the positions of the heat dissipation grooves, and the reinforcing ribs are integrally formed with the outer shell.

[0024] The above technical solutions enhance the structural strength of the outer shell, making it less susceptible to damage when subjected to external impacts or compression.

[0025] The beneficial effects of this utility model are as follows:

[0026] 1. This application provides multiple annular second positioning grooves on the outer wall of the connecting pins, which allow the encapsulation filler to fully fill them, forming a mechanical interlocking structure. This effectively prevents the connecting pins from loosening or falling off during use, improves the stability of the overall structure, and achieves a stable connection between the two without welding. This simplifies the production process, reduces the requirements for operator skills and welding equipment, and reduces the risk of connection failures caused by improper welding.

[0027] 2. The encapsulation filler in this application uses epoxy resin material with excellent thermal conductivity and good sealing properties, which can completely encapsulate the temperature sensing element. This ensures that the external temperature can be quickly and accurately transferred to the temperature sensing element, guaranteeing measurement accuracy and response speed. It can also effectively isolate external moisture, dust and other impurities, preventing them from interfering with or damaging the sensing element. Four support frames are set in the housing to stably support the temperature sensing element and keep it in a suitable position inside the housing, reducing the impact of positional displacement on temperature sensing during the encapsulation process and further ensuring measurement accuracy.

[0028] 3. In this application, the heat dissipation grooves on the outer walls of the housing correspond to the positions of the temperature sensing elements, which can increase the contact area between the housing and the outside world, help the heat generated by the sensor during operation to dissipate in time, and avoid affecting its performance and service life due to excessive temperature. Furthermore, the reinforcing ribs on the inner walls of the housing corresponding to the heat dissipation grooves can significantly improve the structural strength of the housing, making it less susceptible to damage when subjected to external impact or compression.

[0029] 4. This application forms a multi-layer sealing structure by inserting the encapsulation cover into the filling port and the sealing groove, and filling the gap between the encapsulation cover and the filling port with encapsulation filler, which further enhances the sealing performance of the housing, effectively prevents harmful substances in the external environment from entering the interior, and ensures the normal operation of the temperature sensing element. Attached Figure Description

[0030] Figure 1 This is a perspective view of a composite packaging structure for a miniature temperature sensor proposed in this utility model;

[0031] Figure 2 This is a front cross-sectional view of a micro temperature sensor composite packaging structure proposed in this utility model;

[0032] Figure 3 This is a cross-sectional view of the outer shell of a composite packaging structure for a miniature temperature sensor proposed in this utility model;

[0033] Figure 4 This is a schematic diagram of the encapsulation cover and the first positioning groove structure of a micro temperature sensor composite packaging structure proposed in this utility model;

[0034] Figure 5 This is a schematic diagram of the second positioning groove and connection socket structure of a miniature temperature sensor composite packaging structure proposed in this utility model.

[0035] In the diagram: 1. Outer shell; 2. Heat dissipation groove; 3. Encapsulation cover; 4. Connecting pin; 5. Encapsulation filler; 6. Metal wire; 7. Support frame; 8. Temperature sensing element; 9. Reinforcing rib; 10. Filler opening; 11. Sealing groove; 12. Pin outlet; 13. First positioning groove; 14. Second positioning groove; 15. Connecting socket; 16. Gold plating layer. Detailed Implementation

[0036] The technical solution of this utility model will be further described in detail below with reference to specific embodiments.

[0037] Reference Figures 1-5 This utility model provides a composite packaging structure for a miniature temperature sensor, including a housing 1, a support frame 7, and a packaging filler 5. The housing 1 has a filling port 10 at its top, and a capping assembly is disposed within the filling port 10. A temperature sensing element 8, which is a high-precision thermistor, is disposed inside the housing 1. The support frame 7 is disposed around the temperature sensing element 8 and fixed to the inner wall of the housing 1.

[0038] The encapsulation filler 5 fills the interior of the housing 1 to completely encapsulate the temperature sensing element 8. The encapsulation filler 5 is made of epoxy resin material with excellent thermal conductivity and good sealing performance. The encapsulation filler 5 is also filled into the second positioning groove 14. Metal wires 6 are fixed at both ends of the bottom of the temperature sensing element 8, and the bottom of the metal wires 6 is connected to the connecting pins 4. The bottom of the housing 1 has two pin outlet holes 12 for the connecting pins 4 to pass through. The top of the outer wall of the connecting pins 4 has multiple annular second positioning grooves 14. The top of the connecting pins 4 has a connecting socket 15 for the metal wires 6 to be inserted. The inner diameter of the connecting socket 15 is adapted to the outer diameter of the metal wires 6. The encapsulation filler 5 fully fills the second positioning groove 14, so that it forms a mechanical interlocking structure with the connecting pins 4, effectively preventing the connecting pins 4 from loosening or falling off during use, improving the stability of the overall structure, and achieving a stable connection between the two without welding, simplifying the production process.

[0039] To improve the corrosion resistance and conductivity of connection pin 4, refer to Figure 5 The connecting pin 4 is made of stainless steel, and the part of the connecting pin 4 extending out of the housing 1 is provided with a gold-plated layer 16. The gold-plated layer 16 gives the connecting pin 4 good corrosion resistance and conductivity, extends its service life, and enables it to adapt to more complex environments.

[0040] To facilitate the filling and sealing of the filler 5 and maintain the airtightness of the outer casing 1, refer to Figures 1-4 The sealing assembly includes a filling port 10 on the top of the housing 1 for inserting the temperature sensing element 8, and a sealing groove 11 on the top of the filling port 10. An encapsulation cap 3 is inserted into the inner wall of the sealing groove 11 and the inner wall of the filling port 10. The outer wall dimensions of the encapsulation cap 3 are smaller than the inner wall dimensions of the filling port 10. The encapsulation filler 5 is filled into the gap between the outer wall of the encapsulation cap 3 and the inner wall of the filling port 10. A square first positioning groove 13 is formed at the bottom of the outer wall of the encapsulation cap 3, and the encapsulation filler 5 is also filled into the first positioning groove 13. The encapsulation cap 3 is designed to be hollow. Both the housing 1 and the encapsulation cap 3 are made of high-strength, high-temperature resistant ceramic material with good insulation properties. The encapsulation cap 3 is inserted into the filling port 10 and the sealing groove 11, so that the encapsulation filler 5 fills the gap between the encapsulation cap 3 and the filling port 10, forming a multi-seal structure, enhancing the sealing performance of the housing 1, effectively preventing harmful substances in the external environment from entering the interior, and ensuring the normal operation of the temperature sensing element 8.

[0041] To increase the contact area between the outer shell 1 and the outside environment, refer to Figure 1The outer walls of the outer casing 1 are provided with equally spaced heat dissipation grooves 2, and the heat dissipation grooves 2 are square. The position of the heat dissipation grooves 2 corresponds to the position of the temperature sensing element 8. The heat dissipation grooves 2 increase the surface area of ​​the outer casing 1, which helps the heat generated by the temperature sensing element 8 during operation to dissipate in time and avoid affecting its performance and service life due to excessive temperature.

[0042] To enhance the structural strength of the outer shell 1, refer to Figure 2 and Figure 3 The inner walls of the outer shell 1 are fixed with equally spaced reinforcing ribs 9, and the positions of the reinforcing ribs 9 correspond to the positions of the heat dissipation grooves 2. The reinforcing ribs 9 are integrally formed with the outer shell 1. The reinforcing ribs 9 can significantly improve the structural strength of the outer shell 1, making it less prone to damage when subjected to external impact or extrusion.

[0043] Working principle: The temperature sensing element 8 is placed into the housing 1 through the filling port 10 and supported by the support frame 7. Then, the connecting pin 4 is inserted into the housing 1 through the pin outlet 12, so that the metal wire 6 at the bottom of the temperature sensing element 8 is inserted into the connecting socket 15 to achieve connection. Next, the encapsulation filler 5 is filled. The encapsulation filler 5 enters the housing 1 and wraps the temperature sensing element 8 and the connecting pin 4, so that the encapsulation filler 5 enters the second positioning groove 14 to form a mechanical fixation for the connecting pin 4 without soldering.

[0044] Next, the encapsulation cover 3 is inserted into the filling port 10 and the sealing groove 11. The first positioning groove 13 at the bottom of its outer wall is also filled with the encapsulation filler 5 to enhance the connection stability between the encapsulation cover 3 and the outer shell 1. At the same time, the encapsulation filler 5 fills the gap between the outer wall of the encapsulation cover 3 and the inner wall of the filling port 10 to achieve a seal. Furthermore, the reinforcing ribs 9 on the inner wall of the outer shell 1 correspond to the positions of the heat dissipation groove 2 to enhance the structural strength of the outer shell 1.

[0045] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.

Claims

1. A composite packaging structure for a miniature temperature sensor, characterized in that, include: The outer shell (1) has a filling port (10) at the top and a sealing assembly is provided inside the filling port (10). The temperature sensing element (8) is located inside the outer shell (1). The support frame (7) is disposed on the periphery of the temperature sensing element (8) and fixed to the inner wall of the outer shell (1); Encapsulation filler (5) is filled inside the outer shell (1) to completely encapsulate the temperature sensing element (8), and the encapsulation filler (5) is also filled into the second positioning groove (14).

2. The composite packaging structure for a miniature temperature sensor according to claim 1, characterized in that, The temperature sensing element (8) has metal wires (6) fixed at both ends of its bottom, and the bottom of the metal wires (6) is connected to a connecting pin (4). The bottom of the outer shell (1) has two pin outlet holes (12) for the connecting pins (4) to pass through, and the top of the outer wall of the connecting pins (4) has multiple annular second positioning grooves (14).

3. The composite packaging structure for a miniature temperature sensor according to claim 2, characterized in that, Each of the connection pins (4) has a connection socket (15) for inserting a metal wire (6) at its top, and the inner diameter of the connection socket (15) is compatible with the outer diameter of the metal wire (6).

4. The miniature temperature sensor composite packaging structure according to claim 3, characterized in that, The connecting pin (4) has a gold-plated layer (16) on the part of the surface extending out of the housing (1).

5. The composite packaging structure for a miniature temperature sensor according to claim 1, characterized in that, The sealing assembly includes a filling port (10) opened on the top of the outer shell (1) for the temperature sensing element (8) to be inserted, and a sealing groove (11) is provided on the top of the filling port (10). A sealing cap (3) is inserted into the inner wall of the sealing groove (11) and the inner wall of the filling port (10). The outer wall size of the sealing cap (3) is smaller than the inner wall size of the filling port (10). The sealing filler (5) is filled into the gap between the outer wall of the sealing cap (3) and the inner wall of the filling port (10). A square first positioning groove (13) is opened at the bottom of the outer wall of the sealing cap (3), and the sealing filler (5) is also filled into the first positioning groove (13).

6. The composite packaging structure for a miniature temperature sensor according to claim 5, characterized in that, The encapsulation cover (3) is designed to be hollow.

7. The composite packaging structure for a miniature temperature sensor according to claim 1, characterized in that, The outer walls of the outer casing (1) are provided with equally spaced heat dissipation grooves (2), and the heat dissipation grooves (2) are square. The position of the heat dissipation grooves (2) corresponds to the position of the temperature sensing element (8).

8. The composite packaging structure for a miniature temperature sensor according to claim 7, characterized in that, The outer shell (1) has reinforcing ribs (9) that are evenly distributed on all four sides of its inner wall. The position of the reinforcing ribs (9) corresponds to the position of the heat dissipation groove (2). The reinforcing ribs (9) and the outer shell (1) are integrally formed.

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