Module aging test unit

Abstract

A module aging test unit relates to the technical field of power semiconductor module high temperature test, and comprises an outer frame assembly, a lifting platform assembly, a lifting driving assembly and a heating module assembly, and the outer frame assembly comprises an outer frame top plate, an outer frame bottom plate and outer frame side plates located at two sides. Linear guide rails are arranged on the inner sides of the two outer frame side plates respectively, the lifting platform assembly comprises a probe mounting plate, sliding blocks matched with the linear guide rails are arranged on the two sides of the probe mounting plate, and the lifting driving assembly comprises an upper mounting base, a lower mounting base, a speed reducer, a lead screw and a lead screw nut. The upper mounting seat and the lower mounting seat are respectively fixed at the middle positions of the outer frame top plate and the outer frame bottom plate; and the heating module assembly is used for fixing and heating the power semiconductor module. Through middle driving and guiding of the four guide rails in the circumferential direction, instability caused by a C-shaped cantilever structure of original equipment is avoided, the rigidity and stability of the whole equipment are improved, and meanwhile the repeated positioning precision of the equipment is improved.

Description

Technical Field

[0001] This utility model relates to the field of high-temperature testing technology for power semiconductor modules, and in particular to a module aging test unit. Background Technology

[0002] Power semiconductor modules are core components of power electronic systems. They are packaged from high-power semiconductor devices (such as IGBTs, MOSFETs, and thyristors) through specific circuit designs, enabling efficient power conversion and control. In high-reliability applications such as automotive and industrial control, power semiconductor modules must undergo high-temperature aging tests. Accelerated stress screening significantly improves product yield and lifespan, while power cycling tests and other methods are required for multi-dimensional reliability verification.

[0003] The existing testing equipment has the following core structure: a liftable platform with a probe plate mounted on top, a stage below for fixing and heating the power semiconductor module, and a lifting drive device on the side. The problems with this structure are: 1. The three parts form a C-shaped cantilever structure, which results in uneven stress on the equipment, overturning moment, and poor structural rigidity, which affects the repeatability of the probe plate when it is pressed down; 2. The existing lifting drive uses a cylinder as a power source, which can only realize two actions: opening and closing, and cannot make the probe plate stop at any position within its stroke. Utility Model Content

[0004] The purpose of this invention is to address the shortcomings of the existing technology and provide a modular aging test unit. By using a central drive and four circumferential guide rails, it avoids the instability caused by the original C-shaped cantilever structure, improves the overall rigidity and stability of the equipment, and also improves the repeatability of the equipment.

[0005] To achieve the above objectives, the technical solution adopted by this utility model is as follows:

[0006] A module aging test unit includes an outer frame assembly, a lifting platform assembly, a lifting drive assembly, and a heating module assembly.

[0007] The outer frame assembly includes an outer frame top plate, an outer frame bottom plate, and outer frame side plates located on both sides. Linear guide rails are respectively installed on the inner side of the two outer frame side plates. The outer frame top plate, outer frame bottom plate, and two outer frame side plates form a frame structure, and the linear guide rails are arranged vertically.

[0008] The lifting platform assembly includes a probe mounting plate. Two probe plate mounting positions are symmetrically arranged at the bottom of the probe mounting plate, and a probe plate is installed in each of the probe plate mounting positions. Slider blocks that cooperate with linear guide rails are arranged on both sides of the probe mounting plate.

[0009] The lifting drive assembly includes an upper mounting base, a lower mounting base, a reducer, a lead screw, and a lead screw nut. The upper and lower mounting bases are fixed at the middle positions of the top and bottom plates of the outer frame, respectively. The reducer is fixed on the upper mounting base and has a drive synchronous pulley at its output end. The lead screw passes through the middle of the probe mounting plate and its upper and lower ends are rotatably connected to the upper and lower mounting bases via bearings, respectively. A driven synchronous pulley is located at the upper end of the lead screw. The drive and driven synchronous pulleys are connected by a synchronous belt drive. The lead screw nut is fixedly connected to the probe mounting plate. When the reducer operates, it drives the drive synchronous pulley, driven synchronous pulley, and lead screw to rotate, thereby driving the lead screw nut and the lifting platform assembly to move vertically. Once the probe plate descends to the designated position and contacts the power semiconductor module, the aging test can begin. After the test is completed, the lifting platform assembly rises.

[0010] The heating module assembly is fixed on the outer frame base plate, and there are two of them, corresponding to the two probe plates in the lifting platform assembly, for fixing and heating the power semiconductor module.

[0011] Preferably, each outer frame side plate has two linear guide rails, and correspondingly, two sliders are provided on each side of the probe mounting plate. The four guide rails enable the left and right probe plates to have good stability and repeatability in vertical movement.

[0012] Preferably, limit sensors are installed at the upper and lower positions of one of the outer frame side plates, and slotted photoelectric sensors can be used.

[0013] Preferably, a top limiting post is provided at the bottom of the top plate of the outer frame, and a bottom limiting post is provided on the lower mounting base. There can be multiple top and bottom limiting posts, which are mechanical travel limits. By physically intercepting the lifting platform components, the maximum range of its upward and downward travel is forcibly limited to avoid collisions of mechanical parts or structural damage caused by loss of control.

[0014] Preferably, the bottom limiting post is provided with a removable hard limiting sleeve. The hard limiting sleeve is not used during normal operation, but is put on top of the bottom limiting post when needed to increase the height of the mechanical travel limit.

[0015] Preferably, a pull pin is provided on the probe mounting plate on the front side of the probe plate mounting position. The lower end of the pull pin passes through the probe mounting plate. After the probe plate is installed in the probe plate mounting position, it is locked and limited in the horizontal direction by the lower end of the pull pin. Pulling the pull pin upwards can unlock and remove the probe plate.

[0016] Preferably, the heating module assembly includes a heating module base plate, a heating plate, and a power semiconductor module carrier plate. The heating module base plate is fixed on the outer frame base plate, and the heating module base plate and the heating plate are connected at intervals by a certain number of heat dissipation support columns.

[0017] Preferably, the heating module base plate is provided with an air inlet, and a fan is installed below the air inlet, with the fan blowing air upwards from below to dissipate heat.

[0018] Preferably, the heating module base plate and the outer periphery of the heating plate are provided with an air duct housing.

[0019] Preferably, the number of heating plates and power semiconductor module carriers are multiple and arranged in a matrix, such as a 2*2 distribution, and the number of fans corresponds to the number of heating plates.

[0020] The advantages of this utility model are as follows: 1. This utility model avoids the instability caused by the original C-shaped cantilever structure of the equipment by using the intermediate drive and four circumferential guide rails, thereby improving the overall rigidity and stability of the equipment and also improving the repeatability of the equipment; 2. The servo geared motor, as a power source, can control the speed and stopping position of the probe plate, thus improving the flexibility of the equipment; 3. One motor, as a power source, can control the movement of the left and right probe plates simultaneously, compared to the existing equipment where one cylinder as a power source can only control one probe plate, thus saving one power source. Attached Figure Description

[0021] Figure 1 This is the front view of the present invention;

[0022] Figure 2 This is a perspective view of the present utility model;

[0023] Figure 3 The three-dimensional structure of the inner and outer frame components of this utility model Figure 1 ;

[0024] Figure 4 The three-dimensional structure of the inner and outer frame components of this utility model Figure 2 ;

[0025] Figure 5 The three-dimensional lifting platform component in this utility model Figure 1 ;

[0026] Figure 6 The three-dimensional lifting platform component in this utility model Figure 2 ;

[0027] Figure 7 This is a perspective view of the lifting drive assembly in this utility model;

[0028] Figure 8 This is a cross-sectional view of the lifting drive assembly in this utility model;

[0029] Figure 9 The three-dimensional representation of the heating module assembly in this utility model Figure 1 ;

[0030] Figure 10 The three-dimensional representation of the heating module assembly in this utility model Figure 2 ;

[0031] Figure 11 This is a front view of the heating module assembly in this utility model (with the air duct housing hidden).

[0032] Explanation of key component symbols in the diagram:

[0033] 10. Outer frame assembly; 11. Top plate of outer frame; 12. Bottom plate of outer frame; 13. Side plates of outer frame; 14. Linear guide rail; 15. Limit sensor; 16. Top limit post;

[0034] 20. Lifting platform assembly; 21. Probe mounting plate; 22. Probe plate mounting position; 23. Slider; 24. Hand pin;

[0035] 30. Lifting drive assembly; 31. Upper mounting base; 32. Lower mounting base; 33. Reducer; 34. Lead screw; 35. Lead screw nut; 36. Driving synchronous pulley; 37. Driven synchronous pulley; 38. Synchronous belt; 39. Bottom limit post; 310. Hard limit sleeve;

[0036] 40. Heating module assembly; 41. Heating module base plate; 42. Heating plate; 43. Power semiconductor module carrier board; 44. Heat dissipation support; 45. Fan; 46. Air duct housing. Detailed Implementation

[0037] To more clearly illustrate this utility model, the following description, in conjunction with the accompanying drawings, will provide further details.

[0038] Example 1: As Figure 1-2 As shown, a module aging test unit includes an outer frame assembly 10, a lifting platform assembly 20, a lifting drive assembly 30, and a heating module assembly 40.

[0039] Combination Figure 3-4 As shown, the outer frame assembly 10 includes an outer frame top plate 11, an outer frame bottom plate 12, and outer frame side plates 13 located on both sides. Linear guide rails 14 are respectively provided on the inner side of the two outer frame side plates 13.

[0040] Combination Figure 5-6 As shown, the lifting platform assembly 20 includes a probe mounting plate 21. Two probe plate mounting positions 22 are symmetrically arranged at the bottom of the probe mounting plate 21. Probe plates are respectively installed in the probe plate mounting positions 22. Slider blocks 23 that cooperate with the linear guide rail 14 are arranged on both sides of the probe mounting plate 21.

[0041] Combination Figure 7-8As shown, the lifting drive assembly 30 includes an upper mounting base 31, a lower mounting base 32, a reducer 33, a lead screw 34, and a lead screw nut 35 on the lead screw 34. The upper mounting base 31 and the lower mounting base 32 are respectively fixed at the middle positions of the top plate 11 and the bottom plate 12 of the outer frame. The reducer 33 is fixed on the upper mounting base 31 and has an active synchronous pulley 36 at its output end. The lead screw 34 passes through the middle of the probe mounting plate 21 and its upper and lower ends are rotatably connected to the upper mounting base 31 and the lower mounting base 32 respectively through bearings. A driven synchronous pulley 37 is provided at the upper end of the lead screw 34. The active synchronous pulley 36 and the driven synchronous pulley 37 are connected by a synchronous belt 38. The lead screw nut 35 is fixedly connected to the probe mounting plate 21.

[0042] Combination Figure 1-2 As shown, there are two heating module assemblies 40 fixed on the outer frame base plate 12, corresponding to the two probe plates in the lifting platform assembly 20, for fixing and heating the power semiconductor module.

[0043] Among them, a certain number of reinforcing ribs / plates can be installed on the bottom surface of the outer frame top plate 11 and the top surface of the probe mounting plate 21 to improve the structural strength.

[0044] Example 2: Combination Figure 3-6 As shown, based on Embodiment 1, each outer frame side plate 13 has two linear guide rails 14, and correspondingly, two sliders 23 are provided on both sides of the probe mounting plate 21.

[0045] Example 3: Combination Figure 3 As shown, based on Embodiment 1 or Embodiment 2,

[0046] Example 4: Combination Figure 3-4 As shown, based on Embodiment 1, Embodiment 2, or Embodiment 3, limit sensors 15 are respectively installed at the upper and lower positions of one of the outer frame side plates 13. A top limiting post 16 is provided at the bottom of the outer frame top plate 11.

[0047] Combination Figure 7-8 As shown, a bottom limiting post 39 is provided on the lower mounting base 32. A detachable rigid limiting sleeve 310 is provided on the bottom limiting post 39.

[0048] Example 5: Combination Figure 5-6 As shown, based on Embodiment 1, Embodiment 2, Embodiment 3 or Embodiment 4, a pull pin 24 is provided on the probe mounting plate 21 on the front side of the probe plate mounting position 22.

[0049] Example 6: Combination Figure 9-11As shown, based on the above embodiment, the heating module assembly 40 includes a heating module base plate 41, a heating plate 42, and a power semiconductor module carrier plate 43. The heating module base plate 41 is fixed on the outer frame base plate 12, and the heating module base plate 41 and the heating plate 42 are connected at intervals by a certain number of heat dissipation pillars.

[0050] The heating module base plate 41 is provided with an air inlet, and a fan 45 is installed below the air inlet. An air duct housing 46 is provided around the heating module base plate 41 and the heating plate 42. Furthermore, there are multiple heating plates 42 and power semiconductor module carrier boards 43 arranged in a matrix, and the number of fans 45 corresponds to the number of heating plates 42.

[0051] Example 7: Based on the above examples, an aging test device includes an electrical control cabinet and at least one rack. Multiple test units of this utility model can be installed on a rack, such as 1*2 units, 2*2 units, etc. The rack can be added according to actual needs.

[0052] The above description is only a specific embodiment of the present utility model, but the structural features of the present utility model are not limited thereto. The present utility model can be used in similar products. Any changes or modifications made by those skilled in the art within the scope of the present utility model are covered by the patent scope of the present utility model.

Claims

1. A module aging test unit, characterized in that: It includes an outer frame assembly (10), a lifting platform assembly (20), a lifting drive assembly (30), and a heating module assembly (40). The outer frame assembly (10) includes an outer frame top plate (11), an outer frame bottom plate (12), and outer frame side plates (13) located on both sides. Linear guide rails (14) are respectively provided on the inner side of the two outer frame side plates (13). The lifting platform assembly (20) includes a probe mounting plate (21). Two probe mounting positions (22) are symmetrically arranged at the bottom of the probe mounting plate (21). Probe plates are installed in the probe mounting positions (22) respectively. Slider blocks (23) that cooperate with the linear guide rail (14) are arranged on both sides of the probe mounting plate (21). The lifting drive assembly (30) includes an upper mounting base (31), a lower mounting base (32), a reducer (33), a lead screw (34), and a lead screw nut (35) on the lead screw (34). The upper mounting base (31) and the lower mounting base (32) are respectively fixed at the middle positions of the top plate (11) and the bottom plate (12) of the outer frame. The reducer (33) is fixed on the upper mounting base (31) and the output end is provided with an active synchronous pulley (36). The lead screw (34) passes through the middle of the probe mounting plate (21) and its upper and lower ends are respectively rotatably connected to the upper mounting base (31) and the lower mounting base (32) through bearings. The upper end of the lead screw (34) is provided with a driven synchronous pulley (37). The active synchronous pulley (36) and the driven synchronous pulley (37) are connected by a synchronous belt (38). The lead screw nut (35) is fixedly connected to the probe mounting plate (21). The heating module assembly (40) is fixed on the outer frame base plate (12) and there are two of them, corresponding to the two probe plates in the lifting platform assembly (20), and is used to fix and heat the power semiconductor module.

2. The module aging test unit according to claim 1, characterized in that: The number of linear guide rails (14) on each of the outer frame side plates (13) is two, and two sliders (23) are respectively provided on both sides of the corresponding probe mounting plate (21).

3. The module aging test unit according to claim 1, characterized in that: Limit sensors (15) are respectively installed at the upper and lower positions of one of the outer frame side plates (13).

4. The module aging test unit according to claim 3, characterized in that: The top plate (11) of the outer frame is provided with a top limiting post (16) at the bottom, and the lower mounting base (32) is provided with a bottom limiting post (39).

5. The module aging test unit according to claim 4, characterized in that: The bottom limiting post (39) is provided with a detachable hard limiting sleeve (310).

6. The module aging test unit according to claim 5, characterized in that: A pull pin (24) is provided on the probe mounting plate (21) on the front side of the probe mounting position (22).

7. A module aging test unit according to any one of claims 1-6, characterized in that: The heating module assembly (40) includes a heating module base plate (41), a heating plate (42) and a power semiconductor module carrier plate (43). The heating module base plate (41) is fixed on the outer frame base plate (12), and the heating module base plate (41) and the heating plate (42) are connected at intervals by a certain number of heat dissipation pillars.

8. The module aging test unit according to claim 7, characterized in that: An air inlet is provided on the bottom plate (41) of the heating module, and a fan (45) is installed below the air inlet.

9. The module aging test unit according to claim 8, characterized in that: The heating module base plate (41) and the heating plate (42) are provided with an air duct housing (46) on their outer periphery.

10. A module aging test unit according to claim 8, characterized in that: The number of heating plates (42) and power semiconductor module carriers (43) is multiple and arranged in a matrix, and the number of fans (45) corresponds to the number of heating plates (42).

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