Multi-interface high-precision circuit board

Abstract

The utility model provides a multi-interface high-precision circuit board, which comprises a board body, positioning holes and a pin group, and the four corners of the board body are provided with the positioning holes. A plurality of through holes are formed in the heat collection layer and are arranged in a honeycomb shape, the heat dissipation area of the heat collection layer is large, fans can be arranged above and below the heat collection layer, high-speed air flow can quickly pass through the through holes, the heat collection layer can quickly dissipate heat, and a plurality of first interfaces and second interfaces can quickly dissipate heat; the multi-interface circuit board is good in heat dissipation performance, not prone to heat accumulation and capable of effectively preventing heat accumulation. By means of efficient heat conduction and heat dissipation design, heat on the circuit board can be taken away rapidly, and heat accumulation is avoided. Therefore, the temperature of the circuit board can be reduced, and the stability and reliability of the circuit can be improved. The good heat dissipation performance can ensure that the circuit board can work normally in a high-temperature environment, so that the performance and the stability of the whole system are improved.

Description

Technical Field

[0001] This utility model relates to the field of precision circuit board technology, and in particular to a high-precision circuit board with multiple interfaces. Background Technology

[0002] While multi-interface circuit boards can connect more devices or connectors, they suffer from shortcomings in heat dissipation. This is because a multi-interface design requires more connectors and components to be arranged on the circuit board, and these connectors and components generate heat during operation. The dense interface leads to heat concentration in a limited space, increasing the difficulty of heat dissipation.

[0003] Complex wiring: The wiring of high-precision circuit boards is usually very complex, requiring careful design of line width, line spacing, and routing direction. Complex wiring can cause heat to accumulate in localized areas, making it difficult to dissipate. Utility Model Content

[0004] The purpose of this invention is to at least solve one of the aforementioned technical defects.

[0005] Therefore, one objective of this utility model is to propose a multi-interface high-precision circuit board to solve the problems mentioned in the background art and overcome the shortcomings of the existing technology.

[0006] To achieve the above objectives, one embodiment of the present invention provides a multi-interface high-precision circuit board, including a board body, positioning holes, and a pin assembly. Positioning holes are provided at the four corners of the board body, and a pin assembly is fixedly connected to the edge of the top surface of the board body.

[0007] A chip is installed in the middle of the top surface of the board;

[0008] Several first interfaces are installed at the other edge of the top surface of the plate, and the several first interfaces are arranged side by side as a group;

[0009] Several second interfaces are installed at the other edge of the top surface of the plate, and the several second interfaces are arranged side by side as a group;

[0010] The top surfaces of the first interface and the second interface are covered with conductive heat pipes, and the bottom surfaces of the conductive heat pipes are attached to the top surfaces of the first interface and the second interface through a layer of silicone grease.

[0011] The conductive tape descends after passing through the first interface and extends in a stepped manner to the top surface of the second interface;

[0012] The end of the heat-conducting tape extends above the plate, and a heat-collecting layer is fixedly connected to the end of the heat-conducting tape. The heat-collecting layer has several through holes arranged in a honeycomb pattern.

[0013] Preferably, in any of the above embodiments, the substrate of the plate is epoxy resin, and the top surface of the plate is covered with an insulating layer.

[0014] The above technical solution is adopted: This precision PCB circuit board consists of a board body, pin group, chip, various components on the board, multiple first interfaces, and multiple second interfaces.

[0015] The components on the board are fixed to the board body by first inserting pins and then soldering.

[0016] Preferably, of any of the above solutions, the first interface is a network port or a USB port, and the height of the first interface is greater than the height of the second interface.

[0017] Preferably, of any of the above solutions, the second interface is a TYPE-C port, and the material of the conductive tape is polyimide.

[0018] The above technical solution utilizes a circuit board with the following core structure: a heat-conducting tape, a silicone grease layer, a heat-collecting layer, and vias. First, the heat-conducting tape is attached extensively to the top surfaces of the first and second interfaces via the silicone grease layer. The heat-conducting tape is made of thermally conductive and insulating material. After passing the first interface, the tape descends and extends in a stepped fashion to the top surface of the second interface. Combined with the silicone grease layer, this effectively conducts away the heat generated when the first and second interfaces are mated with connectors. This design maximizes the capture of heat generated during connector mating. The heat is then uniformly conducted to the heat-collecting layer, which has several vias arranged in a honeycomb pattern. The heat-collecting layer has a large heat dissipation area, allowing fans to be placed above and below it. High-speed airflow quickly passes through the vias, enabling rapid heat dissipation from the heat-collecting layer and consequently, from the numerous first and second interfaces. This prevents the circuit board from overheating due to its multiple interfaces, resulting in excellent heat dissipation performance and preventing heat buildup. Through efficient heat conduction and heat dissipation design, heat on the circuit board is rapidly dissipated, avoiding heat accumulation. This helps reduce the temperature of the circuit board and improves the stability and reliability of the circuit. Good heat dissipation performance can ensure that the circuit board can work normally in high-temperature environments, thereby improving the performance and stability of the entire system.

[0019] Preferably, in any of the above embodiments, the heat collection layer is located on the side of the plate, the thickness of the heat collection layer is greater than the thickness of the heat conduction cable, and the material of the heat collection layer is polyimide.

[0020] Preferably, the through hole is a regular hexagon in shape, as described in any of the above schemes.

[0021] Compared with the prior art, the advantages and beneficial effects of this utility model are as follows:

[0022] This high-precision multi-interface circuit board utilizes a combination of heat-conducting tape, silicone grease layer, heat-collecting layer, and vias. The heat-conducting tape, made of thermally conductive and insulating material, adheres extensively to the top surfaces of the first and second interfaces via the silicone grease layer. After passing the first interface, the tape descends in a stepped fashion to the top surface of the second interface. Together with the silicone grease layer, it effectively conducts away the heat generated when the first and second interfaces mate with the connectors. This design maximizes the capture of heat generated during connector mating. The heat is then uniformly directed to the heat-collecting layer, which features several vias arranged in a honeycomb pattern. The large heat dissipation area of ​​the heat-collecting layer allows for the placement of fans above and below it, enabling high-speed airflow through the vias for rapid heat dissipation. This, in turn, facilitates rapid heat dissipation from the numerous first and second interfaces, preventing the entire multi-interface circuit board from overheating. This efficient heat conduction and dissipation design ensures that heat on the circuit board is quickly dissipated, preventing heat buildup. This contributes to lowering the circuit board's temperature and improving circuit stability and reliability. Good heat dissipation performance can ensure that the circuit board can work normally in high-temperature environments, thereby improving the performance and stability of the entire system.

[0023] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0024] The above and / or additional aspects and advantages of this utility model will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:

[0025] Figure 1 This is a first-view structural schematic diagram of the present invention;

[0026] Figure 2 This is a structural schematic diagram of the present invention from a second perspective;

[0027] Figure 3 This is a structural schematic diagram of the present invention from a third-view perspective;

[0028] Figure 4 This is a schematic diagram of the heat collection layer of this utility model.

[0029] In the diagram: 1-board body, 2-positioning hole, 3-pin group, 4-chip, 5-first interface, 6-second interface, 7-heating tape, 8-silicone grease layer, 9-heat collection layer, 10-through hole. Detailed Implementation

[0030] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain this utility model, and should not be construed as limiting this utility model.

[0031] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0032] like Figure 1-4 As shown, this multi-interface high-precision circuit board includes a board body 1, positioning holes 2, and pin groups 3. Positioning holes 2 are provided at the four corners of the board body 1, and pin groups 3 are fixedly connected to the edge of the top surface of the board body 1.

[0033] Chip 4 is installed in the middle of the top surface of board 1;

[0034] Several first interfaces 5 are installed at the other edge of the top surface of the plate 1, and the several first interfaces 5 are arranged side by side as a group;

[0035] Several second interfaces 6 are installed at the other edge of the top surface of the plate 1, and the several second interfaces 6 are arranged side by side as a group;

[0036] The top surfaces of the first interface 5 and the second interface 6 are covered with a heat-conducting tape 7, and the bottom surface of the heat-conducting tape 7 is attached to the top surfaces of the first interface 5 and the second interface 6 through a silicone grease layer 8.

[0037] The heat-conducting tape 7 descends after passing through the first interface 5 and extends in a stepped manner to the top surface of the second interface 6;

[0038] The end of the heat-conducting tape 7 extends above the plate 1. The end of the heat-conducting tape 7 is fixedly connected to the heat-collecting layer 9. Several through holes 10 are opened on the heat-collecting layer 9, and the through holes 10 are arranged in a honeycomb pattern.

[0039] Example 1: The substrate of board 1 is epoxy resin, and the top surface of board 1 is covered with an insulating layer. This precision PCB circuit board consists of board 1, pin group 3, chip 4, various components on the board, multiple first interfaces 5, and multiple second interfaces 6.

[0040] The components on the board are fixed to the board body 1 by first inserting pins and then soldering. The first interface 5 is a network port or a USB port, and the height of the first interface 5 is greater than the height of the second interface 6. The second interface 6 is a Type-C port, and the material of the heat exchange cable 7 is polyimide.

[0041] Example 2: The heat collection layer 9 is located on the side of the plate 1. The thickness of the heat collection layer 9 is greater than the thickness of the heat conduction tape 7. The material of the heat collection layer 9 is polyimide. The through hole 10 is hexagonal in shape.

[0042] The working principle of this utility model is as follows:

[0043] This board enables electrical connections and functional integration of electronic components through a combination of wiring and insulating materials. On this board, various interfaces are interconnected via conductive paths, forming a complex circuit network.

[0044] When an external device or signal source is connected to this board through the interface, current and signals will flow along a predetermined conductive path to perform various functions, such as data transmission, signal processing, and power distribution.

[0045] Compared with the prior art, the present invention has the following advantages:

[0046] This high-precision multi-interface circuit board utilizes a combination of a heat-conducting tape 7, a silicone grease layer 8, a heat-collecting layer 9, and through-holes 10. The heat-conducting tape 7, attached to the top surfaces of the first interface 5 and the second interface 6 via the silicone grease layer 8, is made of thermally conductive and insulating material. After passing the first interface 5, the heat-conducting tape 7 descends and extends in a stepped manner to the top surface of the second interface 6. Together with the silicone grease layer 8, it effectively conducts away the heat generated when the first interface 5 and the second interface 6 are connected to the connector. This design maximizes the capture of heat generated during connector connection. The heat is then uniformly conducted to the heat-collecting layer 9, which has several through-holes 10 arranged in a honeycomb pattern. The heat-collecting layer 9 has a large heat dissipation area, allowing fans to be placed above and below it. High-speed airflow quickly passes through the through-holes 10, enabling rapid heat dissipation from the heat-collecting layer 9 and consequently, from the numerous first interfaces 5 and the second interface 6. This prevents the multi-interface circuit board from overheating, resulting in excellent heat dissipation performance, minimal heat accumulation, and effective prevention of heat buildup. Through efficient heat conduction and heat dissipation design, heat on the circuit board can be quickly dissipated, preventing heat buildup. This helps reduce the circuit board temperature, improving circuit stability and reliability. Good heat dissipation performance ensures the circuit board can operate normally in high-temperature environments, thereby enhancing the performance and stability of the entire system.

Claims

1. A high-precision circuit board with multiple interfaces, characterized in that, It includes a plate (1), positioning holes (2), and a pin assembly (3). The four corners of the plate (1) are provided with positioning holes (2), and the pin assembly (3) is fixedly connected to the edge of the top surface of the plate (1). A chip (4) is installed in the middle of the top surface of the plate (1); Several first interfaces (5) are installed at the other edge of the top surface of the plate (1), and the several first interfaces (5) are arranged side by side as a group; Several second interfaces (6) are installed at the other edge of the top surface of the plate (1), and the several second interfaces (6) are arranged side by side as a group; A heat-conducting tape (7) is attached to the top surface of the first interface (5) and the second interface (6), and the bottom surface of the heat-conducting tape (7) is attached to the top surface of the first interface (5) and the second interface (6) through a silicone grease layer (8); The conductive tape (7) descends after passing through the first interface (5) and extends in a stepped manner to the top surface of the second interface (6); The end of the heat-conducting tape (7) extends above the plate (1), and a heat-collecting layer (9) is fixedly connected to the end of the heat-conducting tape (7). A number of through holes (10) are opened on the heat-collecting layer (9), and the through holes (10) are arranged in a honeycomb pattern.

2. The high-precision circuit board with multiple interfaces as described in claim 1, characterized in that: The substrate of the plate (1) is epoxy resin, and the top surface of the plate (1) is covered with an insulating layer.

3. A high-precision circuit board with multiple interfaces as described in claim 2, characterized in that: The first interface (5) is a network port or a USB port, and the height of the first interface (5) is greater than the height of the second interface (6).

4. A high-precision circuit board with multiple interfaces as described in claim 3, characterized in that: The second interface (6) is a TYPE-C port, and the material of the conductive tape (7) is polyimide.

5. A high-precision circuit board with multiple interfaces as described in claim 4, characterized in that: The heat collection layer (9) is located on the side of the plate (1), and the thickness of the heat collection layer (9) is greater than the thickness of the heat conduction tape (7). The material of the heat collection layer (9) is polyimide.

6. A high-precision circuit board with multiple interfaces as described in claim 5, characterized in that: The through hole (10) is hexagonal in shape.

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