Universal reinforced navigation module structure of upper frame type subrack or wall-mounted case and case

Abstract

The utility model provides a general reinforced navigation module structure of an upper frame type plug-in box or a wall-mounted case and the case, the general reinforced navigation module structure comprises a reinforced board card module, the reinforced board card module is provided with a reinforced heat-conducting plate, a PCB, a cover plate and a plugging assisting component, the PCB is clamped between the reinforced heat-conducting plate and the cover plate, and the PCB is clamped between the reinforced heat-conducting plate and the cover plate. The plugging-assisting component is installed on any side of the front end face of the reinforcing heat-conducting plate in a swinging mode. The front end of the case side guide rail is sequentially provided with a first limiting piece and a second limiting piece from front to back, and a concave part is limited between the first limiting piece and the second limiting piece; the insertion and extraction assisting component comprises a handle and a shifting piece, in the insertion or extraction process of the reinforcing board card module, the shifting piece applies thrust to the first limiting piece or the second limiting piece, and when the reinforcing board card module is in the insertion installation state, the shifting piece is contained in the concave part. According to the reinforced board card module, disassembly and assembly are promoted through the mutual exclusion force between the shifting piece and the first limiting piece and the second limiting piece, and therefore the insertion-assisting / pulling-assisting function of the reinforced board card module is achieved.

Description

Technical Field

[0001] This application relates to the field of chassis technology, and in particular to a universal ruggedized navigation module structure and chassis for rack-mounted or wall-mounted chassis. Background Technology

[0002] In most scenarios, printed circuit boards (PCBs) are installed in chassis for use. In real-world applications, a significant number of chassis operate in relatively harsh environments, such as high temperatures, severe vibrations, and corrosive salt spray conditions. To protect the PCBs within the chassis and extend their lifespan as much as possible, equipping them with ruggedized circuit board modules is one of the effective methods used in the chassis industry. Currently, manufacturers in this industry design ruggedized circuit board modules that consider the need to withstand harsh environmental challenges while also ensuring a certain degree of ease of disassembly and modularity.

[0003] Chinese invention patent application CN110733644A discloses a reinforced circuit board holder, in which a pull-out aid located on one side of the main frame solves the problems of insufficient human strength to directly pull out the circuit board and the potential damage to the circuit board caused by using tools. Chinese utility model patent CN219628149U discloses a circuit board housing, in which a pull-out aid component helps to smoothly pull the circuit board device from the main circuit board. However, in the prior art, the pull-out aids of circuit board holders / housings only assist in pulling out the board holder / housing, but do not play a role in facilitating insertion during the assembly process of inserting the board holder / housing. Utility Model Content

[0004] This application provides a universal rugged navigation module structure and chassis for rack-mounted or wall-mounted enclosures, which solves the problem that the existing technology can only rely on force to install rugged card modules, resulting in low installation efficiency. It realizes a universal rugged navigation module structure that can take into account the convenience of disassembly and installation at the same time.

[0005] According to a first aspect of this application, this application provides a universal ruggedized navigation module structure for rack-mounted or wall-mounted enclosures, comprising:

[0006] The ruggedized board module includes a ruggedized heat-conducting plate, a printed circuit board, a cover plate, and an insertion / removal aid, wherein the printed circuit board is sandwiched between the ruggedized heat-conducting plate and the cover plate, and the insertion / removal aid can be oscillatingly mounted to either side of the front end face of the ruggedized heat-conducting plate.

[0007] The chassis side rail includes a first limiting member and a second limiting member arranged sequentially from front to back at the front end of the chassis side rail, and a recess is defined between the first limiting member and the second limiting member.

[0008] The insertion and removal aid includes a handle and a lever. The lever is designed to apply a pushing force to a first or second limit member during the insertion or removal of the reinforcement plate module, and is accommodated in a recess when the reinforcement plate module is in the inserted installation state.

[0009] According to the universal ruggedized navigation module structure of the rack-mounted or wall-mounted chassis provided in this application, the ruggedized board module also includes locking strips arranged on both sides of the ruggedized heat-conducting plate, and the locking strips are deformable.

[0010] The chassis side rail also includes an upper end face and a lower end face, wherein the lower end face contacts the bottom surface on both sides of the reinforced heat-conducting plate;

[0011] When the locking bar shortens and expands, at least a portion of the locking bar tightly presses against the upper end face of the guide rail.

[0012] According to the universal rugged navigation module structure of the rack-mounted or wall-mounted chassis provided in this application, the locking bar is a slender member composed of several wedge-shaped segments arranged in sequence, wherein each pair of adjacent wedge-shaped segments are upside down relative to each other.

[0013] According to the universal ruggedized navigation module structure of the rack-mounted or wall-mounted chassis provided in this application, the locking strip is made of thermally conductive material.

[0014] According to the universal ruggedized navigation module structure of the rack-mounted or wall-mounted chassis provided in this application, the printed circuit board includes a heat dissipation element, which is arranged on the surface of the printed circuit board facing the ruggedized heat-conducting plate.

[0015] According to the universal ruggedized navigation module structure of the rack-mounted or wall-mounted chassis provided in this application, the ruggedized board module also includes a flexible thermal pad, which is filled between the heat dissipation element and the ruggedized thermal plate.

[0016] According to the universal ruggedized navigation module structure of the rack-mounted or wall-mounted chassis provided in this application, both the ruggedized heat-conducting plate and the cover plate are made of rust-proof aluminum.

[0017] According to the universal ruggedized navigation module structure of the rack-mounted or wall-mounted chassis provided in this application, the outer surfaces of the reinforced heat-conducting plate and the cover plate are treated with black anodizing.

[0018] According to the universal ruggedized navigation module structure of the rack-mounted or wall-mounted chassis provided in this application, the inner surfaces of the reinforced heat-conducting plate and the cover plate are chemically conductively oxidized.

[0019] According to the universal ruggedized navigation module structure of the rack-mounted or wall-mounted chassis provided in this application, the printed circuit board also includes a connector, which is in the form of a line replaceable modular (LRM) connector.

[0020] According to the universal ruggedized navigation module structure of the rack-mounted or wall-mounted chassis provided in this application, the ruggedized heat-conducting plate also includes several internally threaded mounting posts. The printed circuit board and the cover plate each include several through holes that correspond one-to-one with the internally threaded mounting posts so that they can pass through them, so that the printed circuit board and the cover plate are fixed to the ruggedized heat-conducting plate by corresponding bolts.

[0021] According to a second aspect of this application, this application also provides a chassis, which is a rack-mounted or wall-mounted chassis, including at least one universal ruggedized navigation module structure of the rack-mounted or wall-mounted chassis described in the first aspect of this application.

[0022] The universal rugged navigation module structure and chassis provided in this application, which are rack-mounted or wall-mounted, utilize the cooperation between the pusher of the insertion / removal aid and the first and second limiting members of the chassis side guide rail. Specifically, during the insertion process, the mutual repulsion between the pusher and the first limiting member facilitates the insertion and installation of the rugged board module, and during the removal process, the mutual repulsion between the pusher and the second limiting member facilitates the removal and disassembly of the rugged board module. This achieves a universal rugged navigation module structure in which the insertion / removal aid assists in both the insertion and removal processes. Furthermore, the universal ruggedized navigation module structure and chassis provided in this application, through the configuration of reinforced heat-conducting plates, flexible heat-conducting pads, and locking strips made of heat-conducting materials, on the one hand, provide a means of fixing the various components within the ruggedized board module and the chassis (especially the chassis side rails) relative to each other, thereby improving the rigidity and strength of the universal ruggedized navigation module structure; on the other hand, it provides more than one heat conduction path for the PCB, thereby improving the heat conduction capability of the universal ruggedized navigation module structure. Attached Figure Description

[0023] To more clearly illustrate the technical solutions in this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0024] Figure 1a and 1b These are, respectively, a perspective view and an exploded view of the ruggedized board module provided in this application.

[0025] Figure 2 This is a top view of the general-purpose ruggedized navigation module structure provided in this application, wherein only the corners with insertion and removal aids are shown for ease of description.

[0026] Figure 3 This is the main view of the general ruggedized navigation module structure provided in this application.

[0027] Figure 4 This is a rear perspective view of the ruggedized board module provided in this application.

[0028] Figure label:

[0029] 100. Reinforced board module; 110. Reinforced heat-conducting plate; 111. Insertion / removal aid component; 111a. Handle; 111b. Paddle; 111c. Rotating shaft; 112. Locking strip; 120. PCB; 121. Connector; 130. Cover plate; 140. Bolt; 200. Chassis side rail; 201. First limiting component; 202. Second limiting component; 203. Upper end face of the rail; 204. Lower end face of the rail. Detailed Implementation

[0030] The embodiments of this application will be described in further detail below with reference to the accompanying drawings and examples. The following examples are used to illustrate this application, but should not be used to limit the scope of this application.

[0031] In the description of the embodiments of this application, it should be noted that the terms "center," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the embodiments of this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application. In addition, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0032] In the description of the embodiments of this application, it should be noted that, unless otherwise explicitly specified and limited, the terms "connected" and "linked" should be interpreted broadly. For example, they can refer to fixed connections or detachable connections, wherein a fixed connection can include an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of this application based on the specific circumstances.

[0033] In the embodiments of this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0034] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of the embodiments of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0035] The following is combined Figures 1a to 4 This application describes the general-purpose ruggedized navigation module structure and chassis of the rack-mounted or wall-mounted enclosure.

[0036] The general-purpose ruggedized navigation module structure includes a ruggedized board module 100 and a chassis-side guide rail 200. For example... Figures 1a-1b The figures shown are perspective and exploded view of the ruggedized board module provided in this application, respectively. The ruggedized board module 100 includes a ruggedized heat-conducting plate 110, a PCB 120, a cover plate 130, and a plug-in / plug-out aid component 111. The PCB 120 is clamped between the ruggedized heat-conducting plate 110 and the cover plate 130. The plug-in / plug-out aid component 111 is swivelly mounted to either side of the front end face of the ruggedized heat-conducting plate 110 via a rotating shaft 111c. In this embodiment, the ruggedized heat-conducting plate 110 is provided with two plug-in / plug-out aid components 111, which are respectively arranged on the left and right sides of the front end face of the ruggedized heat-conducting plate 110.

[0037] Figure 2This is a top view of the general-purpose ruggedized navigation module structure provided in this application. It is conceivable that, to facilitate the insertion and installation of the PCB 120 and its associated ruggedized board module 100, pairs of guide rails are likely arranged on the chassis side, located on opposite sides of the chassis. For ease of description, only the corner where one of the insertion / removal aids 111 is provided is shown here; similarly, only the corresponding chassis-side guide rail 200 is shown. The chassis-side guide rail 200 includes a first limiting member 201 and a second limiting member 202 arranged sequentially from front to back at its front end. Thus, a recess is defined between the first limiting member 201 and the second limiting member 202. It can also be seen from the figure that the insertion / removal aid 111 includes a handle 111a and a lever 111b.

[0038] During the insertion of the ruggedized board module 100, the operator rotates the handle 111a counterclockwise around the rotation axis 111c, causing one side of the paddle 111b to abut against the first limiting member 201. The paddle 111b and the first limiting member 201 exert a first pushing force that repels each other, which facilitates the continued insertion of the ruggedized board module 100 into the chassis side rail 200. Conversely, during the removal of the ruggedized board module 100, the operator rotates the handle 111a clockwise around the rotation axis 111c, causing the other side of the paddle 111b to abut against the second limiting member 202. The paddle 111b and the second limiting member 202 exert a second pushing force that repels each other, which facilitates the removal of the ruggedized board module 100 from the chassis side rail 200. While the reinforced board module 100 is installed and in use, the lever 111b remains stationary in the recess, further holding the reinforced board module 100 in place without external intervention. For the insertion / removal aid 111 on the other side, the operation is performed in a symmetrical manner. Thus, a universal reinforced navigation module structure is achieved where the insertion / removal aid 111 assists in both insertion and removal processes.

[0039] Preferably, the ruggedized board module 100 can be sized using the Micro Telecommunications Computing Architecture (MTCA) standard. The MTCA standard architecture is compatible with the high performance and high bandwidth of the Advanced Telecommunications Computing Architecture (ATCA) and the flexibility of the Advanced Mezzanine Card (AMC), improving the integration of the ruggedized board module 100 while reducing the required space and size of the architecture. In particular, the ruggedized board module 100 eliminates the carrier board of the existing general-purpose board bracket / housing, further facilitating the application of AMC modules and enabling the ruggedized board module 100 to meet the application requirements of low-to-mid-range communication, navigation, or multimedia fields in industry, military, or medical applications. For example, the ruggedized board module 100 can be designed with a depth / length of 186 mm, a width of 148.5 mm, and a height of 29.5 mm.

[0040] For example, the reinforced heat-conducting plate 110 is provided with several internally threaded mounting posts (not shown), and the PCB 120 and cover plate 130 are each provided with several through holes corresponding to the internally threaded mounting posts so that they can pass through. The PCB 120 and cover plate 130 are then fixed to the reinforced heat-conducting plate 110 by corresponding bolts 140. With this configuration, during the assembly of the reinforced board module 100, the PCB 120 and cover plate 130 are aligned sequentially and placed on the reinforced heat-conducting plate 110, and the bolts 140 are tightened to complete the assembly process. Similarly, during the disassembly of the reinforced board module 100, the disassembly process can be easily completed by simply removing the bolts 140, significantly reducing the time and complexity required for assembly and disassembly. Furthermore, in this structure, the cover plate 130 is mainly used to cover and protect the PCB 120 and is not a primary load-bearing component; the reinforced heat-conducting plate 110 acts as the primary load-bearing component. Based on this, the stress distribution of the reinforced board module 100 was optimized, improving its overall rigidity and strength, and providing effective protection for the PCB 120 and other components.

[0041] Back Figures 1a-1b And refer to Figure 3The reinforced plate module 100 also includes locking strips 112 arranged on the left and right sides of the reinforced heat-conducting plate 110. Specifically, the left and right sides of the reinforced heat-conducting plate 110 are designed in a stepped shape, and the locking strips 112 are disposed on the stepped surfaces; furthermore, the locking strips 112 are made of deformable material. In this embodiment, the locking strips 112 are elongated members composed of a number of wedge-shaped segments arranged sequentially. These wedge-shaped segments are arranged such that every two adjacent wedge-shaped segments are inverted relative to each other, that is, the upper end face of one wedge-shaped segment is larger than its lower end face, and the lower end face of the other wedge-shaped segment is larger than its upper end face. The chassis side guide rail 200 includes an upper end face 203 and a lower end face 204, wherein the bottom surfaces of the left and right sides of the reinforced heat-conducting plate 110 rest on and contact the lower end face 204 of the guide rail. To lock the reinforcement plate module 100 in the chassis side guide rail 200, the operator can perform the following operation: compress the locking bar 112 along its length, causing the cross-section of the locking bar 112 perpendicular to its length to expand. Specifically, this manifests as an increase in the distance between the upper and lower end faces of each wedge segment. Based on the above-described structure of adjacent wedge segments being inverted, a portion of the wedge segment with a larger lower end face rests on the stepped surface of the reinforcement heat-conducting plate 110, while a portion of the wedge segment with a larger upper end face expands upwards accordingly until it tightly presses against the upper end face 203 of the guide rail. Based on the tension provided by the locking bar 112, the reinforcement plate module 100, especially the bottom surfaces on both sides of the reinforcement heat-conducting plate 110 and a portion of the upper end face of the locking bar 112, are clamped by the upper end face 203 and the lower end face 204 of the guide rail, thereby locking the reinforcement plate module 100. Moreover, based on the deformable properties of the locking bar 112, the connection between the reinforced board module 100 and the chassis side rail 200 also has considerable vibration isolation and buffering capabilities.

[0042] Continue to refer to Figure 3 The PCB 120 includes a heat dissipation element disposed on the surface of the PCB 120 facing the reinforced heat-conducting plate 110. In addition to the heat dissipation element on the PCB 120 being in close contact with the reinforced heat-conducting plate 110, a flexible thermally conductive pad (not shown in the figure) can be filled between the heat dissipation element and the reinforced heat-conducting plate 110 to eliminate the air gap between them, reduce the contact thermal resistance, and allow heat to be quickly transferred to the reinforced heat-conducting plate 110.

[0043] Preferably, the locking strip 112 can be made of a thermally conductive material, that is, it possesses both deformability and thermal conductivity. Thus, two parallel heat conduction paths can be formed between the heat dissipation element of the PCB 120 and the reinforced heat-conducting plate 110—on one hand, the heat dissipation element transfers heat to the reinforced heat-conducting plate 110, and then this heat is transferred from the bottom surfaces on both sides of the reinforced heat-conducting plate 110 to the lower end face 204 of the guide rail, and finally dissipates on the chassis side; on the other hand, the heat transferred to the reinforced heat-conducting plate 110 is transferred to the upper end face 203 of the guide rail through the thermally conductive locking strip 112, and finally dissipates on the chassis side. It should be noted that, similar to the force analysis described above, the cover plate 130 does not act as a heat-conducting element, but instead utilizes two parallel heat conduction paths for heat dissipation. This design shortens the heat conduction path and reduces thermal resistance, thereby improving heat dissipation efficiency.

[0044] The reinforced heat-conducting plate 110 and cover plate 130 in the reinforced board module 100 are both made of rust-resistant aluminum, such as 5A06 rust-resistant aluminum alloy. The surface treatment of aluminum alloys generally employs chemical conductive oxidation, which results in weak resistance to salt spray corrosion and shortens the service life of related components. Therefore, the outer surfaces of the reinforced heat-conducting plate 110 and cover plate 130 undergo black anodizing, giving them excellent wear resistance and salt spray resistance, making them particularly suitable for typical salt spray environments such as coastal areas. The inner surfaces of the reinforced heat-conducting plate 110 and cover plate 130 undergo chemical conductive oxidation, ensuring the conductivity of related components and achieving electromagnetic compatibility (EMC) design for the overall structure.

[0045] To further realize the modular and standardized design of the ruggedized board module 100, such as Figure 4 As shown, the connector 121 integrated onto the PCB 120 is an LRM connector. As the name suggests, the chassis side has a matching connector for inserting the PCB 120 into the chassis for use. This LRM connector has a metal cavity, providing high strength to ensure the electrical connection reliability of the ruggedized board module 100. The connector 121 can simultaneously integrate differential, power, RF, and optical signal transmission, resulting in higher integration and better suitability for BeiDou navigation products. Furthermore, because different types of LRM connectors have their own unique key numbering, the ruggedized board module 100 equipped with different LRM connectors thus has a mis-mating prevention function.

[0046] This application also provides a chassis, which can be in the form of a rack-mount or wall-mount chassis, wherein the chassis is provided with at least one general-purpose ruggedized navigation module structure as described above for rack-mount or wall-mount chassis. Various functional PCBs 120 and their corresponding ruggedized board modules 100 are inserted into the chassis along their respective chassis side rails 200 until the connectors 121 of the PCBs 120 are connected to the mating connectors of the chassis (in particular, its back panel). Subsequently, the relative positional relationship between the ruggedized board modules 100 and the chassis side rails 200 is locked by means of locking strips 112, ultimately ensuring that the chassis can operate normally.

[0047] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application.

Claims

1. A universal ruggedized navigation module structure for rack-mounted or wall-mounted enclosures, characterized in that, include: A ruggedized board module includes a ruggedized heat-conducting plate, a printed circuit board, a cover plate, and an insertion / removal aid, wherein the printed circuit board is clamped between the ruggedized heat-conducting plate and the cover plate, and the insertion / removal aid is swayably mounted to either side of the front end face of the ruggedized heat-conducting plate. The chassis side rail includes a first limiting member and a second limiting member arranged sequentially from front to back at the front end of the chassis side rail, and a recess is defined between the first limiting member and the second limiting member; The insertion / removal aid includes a handle and a lever. The lever is designed to apply a pushing force to the first or second limiting member during the insertion or removal process of the reinforcing plate module, and to be accommodated in the recess when the reinforcing plate module is in the insertion / removal state.

2. The universal ruggedized navigation module structure for rack-mounted or wall-mounted enclosures according to claim 1, characterized in that, The reinforced plate module also includes locking strips arranged on both sides of the reinforced heat-conducting plate, and the locking strips are deformable; The chassis side guide rail also includes an upper end face and a lower end face, wherein the lower end face of the guide rail is in contact with the bottom surfaces on both sides of the reinforced heat-conducting plate; When the locking bar shortens and expands, at least a portion of the locking bar tightly presses against the upper surface of the guide rail.

3. The universal ruggedized navigation module structure for rack-mounted or wall-mounted enclosures according to claim 2, characterized in that, The locking bar is an elongated member composed of several wedge-shaped segments arranged in sequence, wherein every two adjacent wedge-shaped segments are upside down relative to each other.

4. The universal ruggedized navigation module structure for rack-mounted or wall-mounted enclosures according to claim 2, characterized in that, The locking strip is made of thermally conductive material.

5. The universal ruggedized navigation module structure for rack-mounted or wall-mounted enclosures according to claim 1, characterized in that, The printed circuit board includes a heat dissipation element disposed on the surface of the printed circuit board facing the reinforced heat-conducting plate.

6. The universal ruggedized navigation module structure for rack-mounted or wall-mounted enclosures according to claim 5, characterized in that, The reinforced board module also includes a flexible thermal pad, which is filled between the heat dissipation element and the reinforced thermal plate.

7. The universal ruggedized navigation module structure for rack-mounted or wall-mounted enclosures according to claim 1, characterized in that, Both the reinforced heat-conducting plate and the cover plate are made of rust-resistant aluminum.

8. The universal ruggedized navigation module structure for rack-mounted or wall-mounted enclosures according to claim 7, characterized in that, The outer surfaces of the reinforced heat-conducting plate and the cover plate are subjected to black anodizing treatment.

9. The universal ruggedized navigation module structure for rack-mounted or wall-mounted enclosures according to claim 7, characterized in that, The inner surfaces of the reinforced heat-conducting plate and the cover plate are subjected to chemical conductive oxidation treatment.

10. The universal ruggedized navigation module structure for rack-mounted or wall-mounted enclosures according to claim 1, characterized in that, The printed circuit board also includes a connector, which is a field-replaceable modular connector.

11. The universal ruggedized navigation module structure for rack-mounted or wall-mounted enclosures according to claim 1, characterized in that, The reinforced heat-conducting plate also includes a plurality of internally threaded mounting posts. The printed circuit board and the cover plate each include a plurality of through holes corresponding to the internally threaded mounting posts so that they can pass through them, so that the printed circuit board and the cover plate are fixed to the reinforced heat-conducting plate by corresponding bolts.

12. A chassis, which is a rack-mount or wall-mounted chassis, characterized in that, It includes at least one general-purpose ruggedized navigation module structure of a rack-mounted or wall-mounted enclosure as described in any one of claims 1-11.

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