Solar cell module

By setting through holes and embedding an adhesive film in the encapsulation structure layer, the stress distribution is changed, which solves the problem of solar cell module breakage during bending and improves reliability and lifespan.

CN224234078UActive Publication Date: 2026-05-12SHENZHEN DELUSHI OPTOELECTRONICS TECH CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
SHENZHEN DELUSHI OPTOELECTRONICS TECH CO LTD
Filing Date
2025-04-30
Publication Date
2026-05-12

AI Technical Summary

Technical Problem

Existing solar cell modules are prone to bending due to external forces during transportation or installation, which can lead to breakage of the encapsulation structure layer, affecting reliability and lifespan.

Method used

Through-holes are made on the upper and lower surfaces of the encapsulation structure layer to change the stress distribution, reduce local stress concentration, and enhance the connection by embedding the adhesive film layer into the through-holes, thereby improving flexibility and stress resistance.

Benefits of technology

有效减少封装结构层在弯曲过程中的开裂和断裂风险,提升使用可靠性和寿命,增强对电池片的保护。

✦ Generated by Eureka AI based on patent content.

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    Figure CN224234078U_ABST
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Abstract

The utility model relates to the technical field of solar cells, in particular to a solar cell module, which comprises a backboard structure layer and a cell arranged on the upper surface of the backboard structure layer, a first packaging structure layer is arranged on the upper surface of the cell, and a front panel structure layer is arranged on the upper surface of the first packaging structure layer. The first packaging structure layer is provided with a plurality of through holes penetrating the upper and lower surfaces of the first packaging structure layer. Compared with the prior art; by arranging the through hole in the first packaging structure layer, the stress distribution of the first packaging structure layer can be changed through the through hole in the bending process of the first packaging structure layer, so that the stress is redistributed around the hole to relieve the phenomenon of stress concentration, thereby facilitating more uniform deformation of the first packaging structure layer during bending, and improving the reliability of the packaging structure layer. The local overhigh stress of the first packaging structure layer is reduced, it is ensured that the first packaging structure layer is not cracked or fractured due to the overlarge stress in the bending process, the use reliability of the solar cell module is improved, and the service life of the solar cell module is prolonged.
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Description

Technical Field

[0001] This utility model relates to the field of solar cell technology, and in particular to a solar cell module. Background Technology

[0002] In related technologies, a solar cell module includes at least a backsheet structure layer, solar cells disposed on the upper surface of the backsheet structure layer, and an encapsulation structure layer for encapsulating the solar cells in the backsheet structure layer. The encapsulation structure layer is usually made of a double-coated fluorine-containing structural plate or a trifluorocarbon coated plate. However, during transportation or installation, the solar cell module is inevitably bent due to external forces. The bending resistance of the encapsulation structure layer is generally low. When the solar cell module is bent to a certain extent, the encapsulation structure layer is prone to breakage. At this time, the encapsulation structure layer not only fails to isolate external gases and liquids, but also poses a risk of puncturing the solar cells, which seriously limits the reliability and service life of the solar cell module.

[0003] Therefore, a new technical solution needs to be researched to address the above problems. Utility Model Content

[0004] In view of this, the present invention addresses the deficiencies of the existing technology, and its main purpose is to provide a solar cell module that effectively solves the technical defects of low reliability and low service life of existing solar cell modules.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: a solar cell module, comprising a backsheet structure layer and a solar cell disposed on the upper surface of the backsheet structure layer, wherein a first encapsulation structure layer is disposed on the upper surface of the solar cell, and a front panel structure layer is disposed on the upper surface of the first encapsulation structure layer; the first encapsulation structure layer is provided with a plurality of through holes penetrating its upper and lower surfaces.

[0006] The beneficial effects of the solar cell module provided in this application are that, compared with the prior art;

[0007] Firstly, by providing through holes penetrating the upper and lower surfaces of the first encapsulation structure layer, the stress distribution of the first encapsulation structure layer can be changed through the through holes during the bending process, so that the stress is redistributed around the holes, thereby alleviating the stress concentration phenomenon. This helps the first encapsulation structure layer to deform more evenly during bending, reducing the presence of excessively high local stress in the first encapsulation structure layer. This ensures that the first encapsulation structure layer will not crack or break due to excessive stress during bending, enabling the first encapsulation structure layer to provide reliable isolation from external gases and liquids for the solar cell, thereby improving the reliability and service life of the solar cell module.

[0008] Secondly, by setting through holes, the total mass of the first packaging structure layer can be reduced, thereby reducing the inertial force required for the first packaging structure layer during bending and making it easier to bend and deform; moreover, by setting through holes, the flexibility of the first packaging structure layer can be improved, so that when the first packaging structure layer is bent as a whole, local areas can more flexibly adapt to the strain requirements during the bending process.

[0009] As a preferred embodiment, the through-hole includes at least a first row of through-holes and a second row of through-holes, the first row of through-holes and the second row of through-holes being arranged along the longitudinal spacing of the first packaging structure layer;

[0010] The first row of through holes has multiple first through holes arranged along the lateral spacing of the first encapsulation structure layer, and the second row of through holes has multiple second through holes arranged along the lateral spacing of the front panel structure layer. The multiple first through holes and the multiple second through holes are arranged alternately.

[0011] As a preferred embodiment, a second through hole is located between two first through holes, and the second through hole and the two first through holes are arranged in an equilateral triangle structure.

[0012] As a preferred option, the through hole can be any one of the following: round hole, rectangular hole, oblong hole, diamond hole, hexagonal hole, cross hole, triangular hole, oval hole, figure-eight hole, or plum blossom hole.

[0013] As a preferred embodiment, the first thickness of the first encapsulation structure layer is between 0.05mm and 0.35mm, the first diameter of the through hole is between 0.5mm and 2.0mm, and the first hole edge distance between the two through holes is 1mm to 5mm.

[0014] As a preferred embodiment, when the first thickness of the first encapsulation structure layer is 0.15mm-0.27mm, the first diameter of the through hole is 1.3mm, and the first hole edge distance between the two through holes is 3mm.

[0015] As a preferred embodiment, the backsheet structure layer and the battery cell are bonded together by an adhesive film layer, the first encapsulation structure layer and the battery cell are bonded together by an adhesive film layer, and the front panel structure layer and the first encapsulation structure layer are bonded together by an adhesive film layer.

[0016] The adhesive film layer located above and below the first encapsulation structure layer can be embedded in the through hole after being hot-melted and bonded.

[0017] Compared with existing technologies, embedding the plastic of the adhesive film layer into the through-holes makes the connection between the adhesive film layer and the first encapsulation structure layer more secure, providing stronger support and constraint during bending. This helps to improve the shape integrity of the solar cell module during bending and reduces the risk of delamination or cracking during bending. Moreover, when the first encapsulation structure layer is bent, the plastic embedded in the through-holes can play a supporting and buffering role, which can further improve the first encapsulation structure layer's resistance to stress concentration during bending and further enhance its bending performance stability.

[0018] As a preferred option, the backsheet structural layer is any one of the following: double-coated fluorinated structural backsheet, trifluorocarbon coated structural backsheet, single-sided fluorinated structural backsheet, glass fiber reinforced polypropylene structural backsheet, epoxy glass fiber prepreg structural backsheet, or acrylic powder coated glass fiber structural backsheet.

[0019] As a preferred embodiment, the first encapsulation structure layer and the front panel structure layer are any one of a double-coated fluorinated backplate, a trifluorocarbon coated backplate, and a single-sided fluorinated backplate.

[0020] As a preferred option, the film layer is any one of transparent EVA film, white EVA film, conventional POE film, co-extruded POE film, or acrylic film. Attached Figure Description

[0021] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0022] Figure 1 This is a schematic diagram of the layered structure of the solar cell module provided in the embodiments of this application;

[0023] Figure 2 yes Figure 1 A top view of the first encapsulation structure layer in the solar cell module shown;

[0024] Figure 3 yes Figure 1 The diagram shows an exploded view of the three-dimensional structure of a solar cell module.

[0025] The following are the labeling elements in the figure:

[0026] 100. Solar cell module;

[0027] 10. Backsheet structural layer; 20. Solar cell; 30. First encapsulation structural layer; 31. First through-hole; 32. Second through-hole; 40. Front panel structural layer; 50. Adhesive film layer;

[0028] h1, first thickness; a1, first diameter; a2, first hole edge distance. Detailed Implementation

[0029] To make the technical problems, technical solutions, and beneficial effects to be solved by this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and are not intended to limit the scope of this application.

[0030] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on or indirectly on that other component. When a component is referred to as being "connected to" another component, it can be directly connected to or indirectly connected to that other component.

[0031] It should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0032] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0033] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments.

[0034] Please refer to the following: Figures 1 to 3 The solar cell module 100 provided in the embodiments of this application will now be described. The solar cell module 100 includes: a backsheet structure layer 10, solar cells 20, a first encapsulation structure layer 30, and a front panel structure layer 40.

[0035] The battery cell 20, the first encapsulation structure layer 30, and the front panel structure layer 40 are stacked on the upper surface of the back panel structure layer 10 from bottom to top. The first encapsulation structure layer 30 is provided with multiple through holes penetrating its upper and lower surfaces. The through holes are used to form new stress dispersion points inside the first encapsulation structure layer 30, so that the stress of the first encapsulation structure layer 30 can be evenly distributed in various parts of the first encapsulation structure layer 30, thereby reducing the degree of local stress concentration and improving the overall deformation capacity of the plate during bending.

[0036] Specifically, in the first aspect, by providing through holes through the upper and lower surfaces of the first encapsulation structure layer 30, the stress distribution of the first encapsulation structure layer 30 can be changed through the through holes during the bending process of the first encapsulation structure layer 30, so that the stress is redistributed around the holes, thereby alleviating the stress concentration phenomenon. This helps the first encapsulation structure layer 30 to deform more uniformly during bending, reducing the local excessive stress in the first encapsulation structure layer 30, and ensuring that the first encapsulation structure layer 30 will not crack or break due to excessive stress during bending. This enables the first encapsulation structure layer 30 to provide reliable isolation of external gases and liquids for the solar cell 20, improving the reliability and service life of the solar cell module 100.

[0037] Secondly, by providing through holes, the total mass of the first packaging structure layer 30 can be reduced, thereby reducing the inertial force required for the first packaging structure layer 30 during bending and making it easier to bend and deform. Moreover, by providing through holes, the flexibility of the first packaging structure layer 30 can be improved, so that when the first packaging structure layer 30 is bent as a whole, local areas can more flexibly adapt to the strain requirements during the bending process.

[0038] Thirdly, the through-holes enhance the flexibility of the first encapsulation layer 30, giving it better resistance to microcracks. This effectively prevents microcracks in flexible photovoltaic modules during production, transportation, installation, and in extreme environments such as hail and strong winds, thereby improving the power generation capacity and extending the lifespan of the photovoltaic modules.

[0039] In some embodiments, the through holes include at least a first row of through holes and a second row of through holes, the first row of through holes and the second row of through holes being arranged along the longitudinal spacing of the first encapsulation structure layer 30; the first row of through holes has a plurality of first through holes 31 arranged along the lateral spacing of the first encapsulation structure layer 30, the second row of through holes has a plurality of second through holes 32 arranged along the lateral spacing of the front panel structure layer 40, and the plurality of first through holes 31 and the plurality of second through holes 32 are arranged alternately.

[0040] It is understandable that when the through-hole system also includes a third and fourth row of through-holes, the through-holes in the third row are not staggered with those in the first row; similarly, the through-holes in the fourth row are not staggered with those in the second row. Alternatively, it can be understood that odd-numbered rows of through-holes are staggered with even-numbered rows, but two odd-numbered rows are not staggered, and two even-numbered rows are not staggered.

[0041] Preferably, a second through hole 32 is located between two first through holes 31, and the second through hole 32 and the two first through holes 31 are arranged in an equilateral triangle structure. By arranging the two first through holes 31 and the second through hole 32 into an equilateral triangle structure, the spacing between the first through holes 31 and the second through hole 32 can be made uniform, which helps to improve the uniformity of stress distribution and allows the first encapsulation structure layer 30 to have consistent bending performance in all parts during bending.

[0042] Furthermore, the through hole can be any of the following shapes: round, rectangular, oblong, diamond, hexagonal, cross, triangular, oval, figure-eight, or plum blossom. The shape of these through holes can be adapted to meet actual production needs.

[0043] In other embodiments, the first thickness h1 of the first encapsulation structure layer 30 is between 0.05 mm and 0.35 mm, the first diameter a1 of the through hole is between 0.5 mm and 2.0 mm, and the first hole edge distance a2 between the two through holes is between 1 mm and 5 mm.

[0044] For example, when the first thickness h1 of the first encapsulation structure layer 30 is 0.15mm-0.27mm, the first diameter a1 of the through hole is 1.3mm, and the first hole edge distance a2 of the two through holes is 3mm.

[0045] Understandably, based on the first thickness h1 of the first encapsulation layer 30, if the first diameter a1 of the through-hole is larger, then the first hole distance a2 between the two through-holes needs to be larger; conversely, based on the first thickness h1 of the first encapsulation layer 30, if the first diameter a1 of the through-hole is smaller, then the first hole distance a2 needs to be smaller. In other words, by selectively changing the diameter of the through-hole and the distance a2 between the two through-holes according to the thickness of the first encapsulation layer 30, the stress distribution of the first encapsulation layer 30 is altered using through-holes while maintaining overall rigidity. This allows the first encapsulation layer 30 to deform more uniformly when bent, reducing excessive local stress and preventing damage due to excessive stress, thus improving the encapsulation effect and protection performance of the battery cell 20.

[0046] In other embodiments, the back panel structure layer 10 and the battery cell 20 are bonded together by an adhesive film layer 50, the first encapsulation structure layer 30 and the battery cell 20 are bonded together by an adhesive film layer 50, and the front panel structure layer 40 and the first encapsulation structure layer 30 are bonded together by an adhesive film layer 50.

[0047] Specifically, the film layer 50 is any one of transparent EVA film, white EVA film, conventional POE film, co-extruded POE film, or acrylic film.

[0048] More specifically, there are several solar cells 20, and these solar cells 20 can be arranged in a horizontal and vertical array. These solar cells 20 can be connected in series or in parallel via flexible flat cables. This is a conventional design method for those skilled in the art, and will not be described in detail here.

[0049] Preferably, the adhesive film layer 50 located above and below the first encapsulation structure layer 30, after being heat-melted bonded, allows the plastic of the adhesive film layer 50 to be embedded in the through-hole. Compared with the prior art, by embedding the plastic of the adhesive film layer into the through-hole, the connection between the adhesive film layer and the first encapsulation structure layer can be made more secure, providing stronger support and constraint during bending. This helps to improve the shape integrity of the solar cell module during bending and reduces the risk of delamination or cracking during bending. Moreover, when the first encapsulation structure layer is bent, the plastic embedded in the through-hole can play a supporting and buffering role, further improving the first encapsulation structure layer's resistance to stress concentration during bending and further enhancing its bending performance stability.

[0050] In other embodiments, the backsheet structural layer 10 is any one of a double-coated fluorinated structural backsheet, a trifluorocarbon coated structural backsheet, a single-sided fluorinated structural backsheet, a glass fiber reinforced polypropylene structural backsheet, an epoxy glass fiber prepreg structural backsheet, or an acrylic powder coated glass fiber structural backsheet.

[0051] Specifically, the double-coated fluorinated structural backsheet uses PET polyester film as the intermediate layer, with fluorinated materials, such as PVDF (polyvinylidene fluoride) or FEVE (ethylene fluoride vinyl ether copolymer), coated on both sides, and then dried and cured to form a film. The double-coated fluorinated structural backsheet offers excellent weather resistance, effectively resisting the corrosion of the backsheet by environmental factors such as ultraviolet radiation, high temperature, and humidity, thereby extending its service life; good electrical insulation performance ensures the safety of the photovoltaic module during long-term use; and it also has a certain degree of moisture barrier performance, preventing moisture from entering the module and causing corrosion of the cells and welds.

[0052] The trifluorocarbon coated backsheet consists of three layers: an outer trifluorocarbon coating, a middle PET polyester film, and an inner layer typically made of EVA or other adhesive materials. The outer trifluorocarbon coating exhibits excellent weather resistance and strong UV reflection and absorption capabilities, effectively blocking UV damage to the middle PET layer and the inner materials. It also possesses good water repellency and stain resistance, preventing dust and dirt from easily adhering to the backsheet surface and maintaining good insulation performance. Furthermore, it offers a degree of abrasion and corrosion resistance.

[0053] A single-sided fluorinated backsheet consists of an outer fluorinated material (such as PVF, PVDF, or THV), a middle PET matrix, and an inner EVA or other adhesive material. The outer fluorinated material provides excellent weather resistance, effectively resisting damage from environmental factors such as ultraviolet radiation, high temperatures, and humidity, and protecting the middle PET layer from aging. The middle PET layer provides the mechanical and insulation properties of the backsheet. The inner material primarily serves to bond with the encapsulation materials inside the module. Compared to double-sided fluorinated backsheets, its cost is relatively lower.

[0054] Fiberglass reinforced polypropylene structural backsheets are primarily composed of fiberglass as the reinforcing material, combined with polypropylene resin. They possess high mechanical strength and rigidity, effectively resisting external mechanical impacts and pressures, providing excellent support and protection for photovoltaic modules. They also exhibit good chemical corrosion resistance and dimensional stability; their insulation properties are excellent, and they have low water absorption, which can, to some extent, prevent moisture intrusion.

[0055] Epoxy fiberglass prepreg structural backsheets are made with epoxy resin as the matrix material and fiberglass cloth as the reinforcing material. They are manufactured through a prepreg process where epoxy resin is impregnated into the fiberglass cloth, followed by curing. They possess excellent mechanical properties, including high strength, high modulus, and good impact resistance, effectively protecting photovoltaic modules from external mechanical damage. They also exhibit good electrical insulation properties and heat resistance, maintaining stable performance over a wide temperature range.

[0056] Acrylic powder-coated fiberglass structural backsheets are made by uniformly coating acrylic powder onto the surface of fiberglass cloth using electrostatic spraying and other processes, followed by curing. The outer acrylic powder coating has good weather resistance and UV resistance, which can resist UV damage to the fiberglass cloth to a certain extent; it also has good chemical corrosion resistance and abrasion resistance; the fiberglass cloth provides the backsheet with high strength and good insulation properties.

[0057] In some embodiments, the first encapsulation structure layer 30 and the front panel structure layer 40 are any one of a double-coated fluorinated backplane, a trifluorocarbon coated backplane, or a single-sided fluorinated backplane. That is, the first encapsulation structure layer 30 and the front panel structure layer 40 have the same structure as when the backplane structure layer 10 adopts a double-coated fluorinated backplane, a trifluorocarbon coated backplane, or a single-sided fluorinated backplane, except that the first encapsulation structure layer 30 is provided with a through-hole structure.

[0058] It should be noted that the structural layer and the encapsulating film layer located above the solar cell are both transparent layered structures.

[0059] The above are merely preferred embodiments of the present utility model, and only specifically describe the technical principles of the present utility model. These descriptions are only for explaining the principles of the present utility model and should not be construed as limiting the scope of protection of the present utility model in any way. Based on this explanation, any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present utility model, as well as other specific embodiments of the present utility model that can be conceived by those skilled in the art without creative effort, should be included within the scope of protection of the present utility model.

Claims

1. A solar cell module, comprising a backsheet structure layer (10) and solar cells (20) disposed on the upper surface of the backsheet structure layer (10), characterized in that, The upper surface of the battery cell (20) is provided with a first encapsulation structure layer (30), and the upper surface of the first encapsulation structure layer (30) is provided with a front panel structure layer (40); the first encapsulation structure layer (30) is provided with a plurality of through holes penetrating its upper and lower surfaces.

2. The solar cell module according to claim 1, characterized in that, The through holes include at least a first row of through holes and a second row of through holes, the first row of through holes and the second row of through holes being arranged along the longitudinal spacing of the first encapsulation structure layer (30); The first row of through holes has multiple first through holes (31) arranged along the lateral spacing of the first encapsulation structure layer (30), and the second row of through holes has multiple second through holes (32) arranged along the lateral spacing of the front panel structure layer (40). The multiple first through holes (31) and the multiple second through holes (32) are arranged alternately.

3. The solar cell module according to claim 2, characterized in that, A second through hole (32) is located between two first through holes (31), and the second through hole (32) and the two first through holes (31) are arranged in an equilateral triangle structure.

4. The solar cell module according to any one of claims 1-3, characterized in that, A through hole can be any of the following: round, rectangular, oval, diamond, hexagonal, cross, triangular, oval, figure-eight, or plum blossom.

5. The solar cell module according to any one of claims 1-3, characterized in that, The first thickness (h1) of the first encapsulation structure layer (30) is between 0.05 mm and 0.35 mm, the first diameter (a1) of the through hole is between 0.5 mm and 2.0 mm, and the first hole edge distance (a2) of the two through holes is between 1 mm and 5 mm.

6. The solar cell module according to claim 5, characterized in that, When the first thickness (h1) of the first encapsulation structure layer (30) is 0.15mm-0.27mm, the first diameter (a1) of the through hole is 1.3mm, and the first hole edge distance (a2) of the two through holes is 3mm.

7. The solar cell module according to claim 1, 2, 3, or 6, characterized in that, The back panel structure layer (10) and the battery cell (20) are bonded together by an adhesive film layer (50), the first encapsulation structure layer (30) and the battery cell (20) are bonded together by an adhesive film layer (50), and the front panel structure layer (40) and the first encapsulation structure layer (30) are bonded together by an adhesive film layer (50). After the adhesive film layer (50) located above and below the first encapsulation structure layer (30) is hot-melted and bonded, the plastic of the adhesive film layer (50) can be embedded in the through hole.

8. The solar cell module according to claim 7, characterized in that, The back panel structure layer (10) is any one of the following: double-coated fluorine-containing structural back panel, trifluorocarbon coated structural back panel, single-sided fluorine-containing structural back panel, glass fiber reinforced polypropylene structural back panel, epoxy glass fiber prepreg structural back panel, or acrylic powder coated glass fiber structural back panel.

9. The solar cell module according to claim 7, characterized in that, The first encapsulation structure layer (30) and the front panel structure layer (40) are any one of a double-coated fluorine-containing structure backplate, a trifluorocarbon coating structure backplate, and a single-sided fluorine-containing structure backplate.

10. The solar cell module according to claim 7, characterized in that, The adhesive film layer (50) is any one of transparent EVA film, white EVA film, POE film, co-extruded POE film or acrylic film.