Movement module of rewinding machine
By designing the motion module of the wafer flipper, the problem of efficient transfer between wafer cassettes was solved, achieving precise wafer transfer and protection, and avoiding wafer damage and contamination.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- ZEHONG SEMICON EQUIP TECH (SUZHOU) CO LTD
- Filing Date
- 2025-04-18
- Publication Date
- 2026-05-12
AI Technical Summary
Existing wafer fabs are unable to achieve efficient transfer of wafers from one wafer cassette to another, resulting in difficulties in wafer movement.
设计了一种倒片机运动模组，包括机架、倒片机构、水平移动模块、竖直移动模块和检测模块，通过定位模块对晶圆盒进行定位，利用检测模块判断位置和存在晶圆，水平和竖直移动模块实现晶圆的精确传输。
It enables precise wafer transfer, avoids wafer loss and misoperation, improves wafer transfer efficiency, and protects wafer integrity.
Smart Images
Figure CN224234152U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of semiconductor processing equipment technology, specifically to a wafer flipping machine motion module. Background Technology
[0002] In the semiconductor manufacturing process, wafers often need to be processed. To adapt to different processing technologies and equipment, wafers need to be removed from one wafer cassette and placed into another wafer cassette using a wafer flipping machine.
[0003] For example, Chinese patent CN218730841U discloses a wafer flipping machine for wafer storage and retrieval. The wafer picking mechanism takes out and puts in the wafers placed in the cassette on the fixture. During the process of the wafer picking mechanism taking out and putting in the wafers from the cassette, the wafers are detected and scanned by the first code reading detection mechanism and the second code reading detection mechanism.
[0004] However, this device can only remove a wafer from one wafer cassette and put it back in its original position, making it difficult to remove and transfer wafers to another wafer cassette.
[0005] Based on this, this utility model designs a motion module for a film rewinding machine to solve the above problems. Utility Model Content
[0006] In view of the above-mentioned shortcomings of the existing technology, the present invention provides a motion module for a film rewinding machine.
[0007] To achieve the above objectives, this utility model provides the following technical solution:
[0008] A film rewinding machine motion module includes a frame, a film rewinding mechanism, and a positioning module;
[0009] The top of the frame is fixedly installed with a top cover plate, and an operation window is opened on the top cover plate; a film rewinding mechanism is installed inside the frame.
[0010] The wafer turning mechanism includes a horizontal moving module, a vertical moving module, and a detection module. A horizontal moving module is installed on one side of the frame, and two sets of vertical moving modules are installed on the other side of the frame to support the first wafer cassette and the second wafer cassette, respectively. A detection module for detecting the status of the first wafer cassette and the second wafer cassette is installed inside the frame.
[0011] The vertical moving module is equipped with a positioning module for positioning the first wafer cassette and the second wafer cassette.
[0012] Furthermore, the first wafer box has multiple slots for inserting wafers evenly spaced within it; and symmetrical slots are provided on the lower side of the first wafer box.
[0013] Furthermore, the second wafer cassette has multiple second slots for inserting wafers evenly spaced within it; and a protrusion is fixedly installed on the lower side of the second wafer cassette.
[0014] Furthermore, the horizontal movement module includes a first synchronous belt linear module, a second synchronous belt linear module, a moving stage, and a mechanical tray. The first synchronous belt linear module is fixedly installed inside the frame, the second synchronous belt linear module is fixedly installed at the moving end of the first synchronous belt linear module, the moving end of the second synchronous belt linear module is fixedly installed with a moving stage, and a mechanical tray for transferring wafers is fixedly installed on the moving stage.
[0015] Furthermore, the vertical movement module includes a ball screw linear module and a bracket. The ball screw linear module is fixedly installed inside the frame, and the moving end of the ball screw linear module is equipped with a bracket for supporting the first wafer cassette and the second wafer cassette.
[0016] Furthermore, the detection module includes fiber optic sensors, with fiber optic sensors symmetrically fixedly installed within the rack for detecting whether a wafer exists in the first and second slots of the alignment mechanical tray.
[0017] Furthermore, the detection module also includes a pressure sensor, which is mounted on the bracket to detect whether the first wafer cassette and the second wafer cassette are in place.
[0018] Furthermore, the positioning module includes a first limiting block, a second limiting plate, a boss, and a third limiting block. The first limiting block for limiting the left side of the first wafer cassette is symmetrically installed on the rear bracket, and the second limiting plate for limiting the first wafer cassette is symmetrically installed on the rear bracket. The boss for limiting the first wafer cassette is symmetrically installed on the rear bracket. The conformal groove for conforming to the bottom of the second wafer cassette is provided on the front bracket. The third limiting block is installed on the front bracket, and the third limiting block has a limiting groove for engaging with the boss.
[0019] Compared with the prior art, the advantages of this utility model are as follows: The first wafer cassette and the second wafer cassette are placed at the moving ends of two sets of vertical moving modules, and the positioning module on the vertical moving module positions the first wafer cassette and the second wafer cassette. A detection module determines whether the first wafer cassette and the second wafer cassette are in the correct positions. Then, the detection module determines whether there are wafers in the first wafer cassette and the second wafer cassette, avoiding wafer loss or misoperation. The horizontal moving module is activated to move the wafers in the first wafer cassette to the second wafer cassette, or, depending on the situation, the wafers in the second wafer cassette are already in the first wafer cassette, achieving bidirectional wafer flipping. After the wafer flipping is completed, the vertical moving module drives the first wafer cassette and the second wafer cassette to move vertically, facilitating continued wafer flipping. This operation is repeated until the wafers in the first wafer cassette are completely transferred to the second wafer cassette, or vice versa, completing the wafer flipping. Through the cooperation of the horizontal moving module, the vertical moving module, and the detection module, precise wafer transfer is achieved. Attached Figure Description
[0020] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0021] Figure 1 This utility model provides a three-dimensional motion module for a film rewinding machine. Figure 1 ;
[0022] Figure 2 This is a front view of a film rewinding machine motion module according to the present invention;
[0023] Figure 3 This utility model provides a three-dimensional motion module for a film rewinding machine. Figure 2 ;
[0024] Figure 4 This is a perspective view of the present invention after the frame obstruction has been removed;
[0025] Figure 5 A schematic diagram of the first limiting block, the third limiting block, and their connection structure;
[0026] Figure 6 This is a schematic diagram of the second wafer box structure;
[0027] Figure 7 This is a schematic diagram of the first wafer box structure;
[0028] Figure 8 This is a schematic diagram of the fixed support frame and its connection structure.
[0029] The labels in the diagram represent:
[0030] 1. Frame; 11. Top cover; 111. Operation window; 2. Wafer rewinding mechanism; 21. Horizontal movement module; 211. First synchronous belt linear module; 212. Second synchronous belt linear module; 213. Moving stage; 214. Mechanical tray; 22. Vertical movement module; 221. Ball screw linear module; 222. Bracket; 23. Detection module; 231. Fiber optic sensor; 232. Pressure sensor; 3. Positioning module; 31. First limit block; 32. Second limit plate; 33. Boss; 34. Third limit block; 35. Limiting groove; 4. First wafer box; 41. First slot; 42. Card slot; 5. Second wafer box; 51. Second slot; 52. Protrusion; 2221. Fixed support frame; 2222. Combination slot; 2223. Insert plate; 2224. Replaceable tray. Detailed Implementation
[0031] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. All other embodiments obtained by those skilled in the art based on the embodiments of this utility model without creative effort are within the scope of protection of this utility model.
[0032] The terms "left," "right," "front," "back," "up," and "down" used in the following description refer to the orientation from the perspective of the front view.
[0033] Example 1: In some embodiments, please refer to the accompanying drawings. Figures 1-4 A film rewinding machine motion module includes a frame 1, a film rewinding mechanism 2, and a positioning module 3;
[0034] The top of the frame 1 is fixedly installed with an upper cover plate 11, and an operation window 111 is provided on the upper cover plate 11; a film rewinding mechanism 2 is installed inside the frame 1.
[0035] like Figure 3 As shown, the wafer rewinding mechanism 2 includes a horizontal moving module 21, a vertical moving module 22, and a detection module 23. The horizontal moving module 21 is installed on one side of the frame 1, and two sets of vertical moving modules 22 are installed on the other side of the frame 1 to support the first wafer cassette 4 and the second wafer cassette 5 respectively. The detection module 23 for detecting the state of the first wafer cassette 4 and the second wafer cassette 5 is installed inside the frame 1.
[0036] The vertical moving module 22 is equipped with a positioning module 3 for positioning the first wafer box 4 and the second wafer box 5.
[0037] In this embodiment, when the wafer flopping machine's motion module is working normally, the first wafer cassette 4 and the second wafer cassette 5 are placed at the moving ends of the two sets of vertical moving modules 22, respectively. The positioning module 3 on the vertical moving module 22 positions the first wafer cassette 4 and the second wafer cassette 5. The detection module 23 determines whether the first wafer cassette 4 and the second wafer cassette 5 are in the correct positions. Then, the detection module 23 determines whether there are wafers in the first wafer cassette 4 and the second wafer cassette 5 to avoid wafer loss or misoperation. The horizontal moving module 21 is then activated to transfer the wafers in the first wafer cassette 4 to the second wafer cassette 5. Alternatively, the wafers in the second wafer cassette 5 can be transferred to the first wafer cassette 4 as needed, achieving bidirectional wafer flipping. After the wafer flipping is completed, the vertical movement module 22 drives the first wafer cassette 4 and the second wafer cassette 5 to move vertically, facilitating further wafer flipping. This operation is repeated until the wafers in the first wafer cassette 4 are completely transferred to the second wafer cassette 5, or the wafers in the second wafer cassette 5 are completely transferred to the first wafer cassette 4, completing the wafer flipping. Through the cooperation of the horizontal movement module 21, the vertical movement module 22, and the detection module 23, precise wafer transfer is achieved, preventing wafer contamination and damage in semiconductor manufacturing scenarios.
[0038] Example 2: In some embodiments, as a preferred embodiment of the present invention, such as... Figure 7 As shown, the first wafer box 4 has a plurality of first slots 41 for inserting wafers evenly spaced at equal intervals; the lower side of the first wafer box 4 has symmetrical slots 42.
[0039] like Figure 6 As shown, the second wafer box 5 has a plurality of second slots 51 for inserting wafers evenly spaced inside; a protrusion 52 is fixedly installed on the lower side of the second wafer box 5.
[0040] like Figure 4 and Figure 5 As shown, the horizontal moving module 21 includes a first synchronous belt linear module 211, a second synchronous belt linear module 212, a moving stage 213, and a mechanical tray 214. The first synchronous belt linear module 211 is fixedly installed inside the frame 1. The second synchronous belt linear module 212 is fixedly installed at the moving end of the first synchronous belt linear module 211. The moving end of the second synchronous belt linear module 212 is fixedly installed with the moving stage 213. The mechanical tray 214 for transferring wafers is fixedly installed on the moving stage 213.
[0041] The vertical moving module 22 includes a ball screw linear module 221 and a bracket 222. The ball screw linear module 221 is fixedly installed inside the frame 1. The moving end of the ball screw linear module 221 is equipped with a bracket 222 for supporting the first wafer box 4 and the second wafer box 5.
[0042] The detection module 23 includes an optical fiber sensor 231. Optical fiber sensors 231 are symmetrically fixedly installed in the frame 1 for detecting whether there is a wafer in the first slot 41 and the second slot 51 of the alignment mechanical tray 214.
[0043] The detection module 23 also includes a pressure sensor 232, and the bracket 222 is equipped with a pressure sensor 232 for detecting whether the first wafer box 4 and the second wafer box 5 are in place.
[0044] like Figure 5 As shown, the positioning module 3 includes a first limiting block 31, a second limiting plate 32, a boss 33, and a third limiting block 34. The first limiting block 31 for limiting the left side of the first wafer cassette 4 is symmetrically installed on the rear bracket 222. The second limiting plate 32 for limiting the first wafer cassette 4 is symmetrically installed on the rear bracket 222. The boss 33 for limiting the first wafer cassette 4 is symmetrically installed on the rear bracket 222. The front bracket 222 has a conforming groove for conforming to the bottom of the second wafer cassette 5. The third limiting block 34 is installed on the front bracket 222. The third limiting block 34 has a limiting groove 35 for engaging with the boss 52.
[0045] like Figure 8 As shown, the bracket 222 includes a fixed support frame 2221, a insert plate 2223, and a replaceable bracket 2224. The fixed support frame 2221 is fixedly installed on the moving end of the ball screw linear module 221. A combination slot 2222 is provided on the fixed support frame 2221. The insert plate 2223 is fixedly installed on the lower side of the replaceable bracket 2224. The insert plate 2223 is inserted into the combination slot 2222. The fixed support frame 2221 and the replaceable bracket 2224 are fixed by screws.
[0046] The first limiting block 31, the second limiting plate 32, and the boss 33 are fixedly installed on a replacement tray 2224, and the third limiting block 34 is fixedly installed on another replacement tray 2224; pressure sensors 232 are fixedly installed on each of the replacement trays 2224.
[0047] Multiple replaceable pallets 2224 are provided, and the positions of the first limiting block 31, the second limiting plate 32, the boss 33 and the third limiting block 34 on different replaceable pallets 2224 are different.
[0048] The first synchronous belt linear module 211, the second synchronous belt linear module 212, and the ball screw linear module 221 are all selected from commercially available mature equipment in this field.
[0049] In this embodiment, when the wafer rewinding mechanism 2 and the positioning module 3 are working normally, the first wafer cassette 4 is placed on a replacement tray 2224, and positioned by the first limiting block 31, the second limiting plate 32, the boss 33, and the slot 42, so that the first wafer cassette 4 is in a standard state; the second wafer cassette 5 is placed on another replacement tray 2224, and positioned by the third limiting block 34, the limiting groove 35, and the protrusion 52, so that the second wafer cassette 5 is in a standard state; the pressure transmission... Sensor 232 detects whether the first wafer cassette 4 and the second wafer cassette 5 are located on the replacement tray 2224; during use, fiber optic sensor 231 detects whether there are wafers in the first slot 41 and the second slot 51 of the alignment mechanical tray 214; when moving the wafer in the first slot 41 to the second slot 51, it should be ensured that there are wafers in the first slot 41 of the alignment mechanical tray 214 in the initial state, but no wafers in the second slot 51 of the alignment mechanical tray 214; the second synchronous belt linear module 212 moves via the moving stage 213 drives the mechanical tray 214 to move downwards towards the first slot 41. Then, the ball screw linear module 221 drives the fixed support frame 2221 and the replacement tray 2224 to move vertically, so that the wafer in the first slot 41 is supported by the mechanical tray 214. Then, the second synchronous belt linear module 212 drives the wafer to move out of the first slot 41 through the moving stage 213 and the mechanical tray 214. The first synchronous belt linear module 211 drives the second synchronous belt linear module 212, the moving stage 213 and the mechanical tray 214 to move, so that the machine... The wafer on the mechanical tray 214 is aligned with the second slot 51; the second synchronous belt linear module 212 drives the moving stage 213, the mechanical tray 214 and the wafer to insert into the second slot 51; then the ball screw linear module 221 drives the second wafer cassette 5 to move upward through the fixed support frame 2221 and the replaceable tray 2224, so that the second slot 51 supports the wafer, and then the second synchronous belt linear module 212 drives the moving stage 213 and the mechanical tray 214 to move out of the second slot 51; thus completing the wafer transfer.
[0050] Before use, the first wafer cassette 4 and the second wafer cassette 5 can be replaced with different storage containers according to the size of the wafer; at the same time, the replacement tray 2224 and the insert plate 2223 can be removed from the fixed support frame 2221 and replaced with a replacement tray 2224 that matches the first wafer cassette 4 and the second wafer cassette 5; so that the device can be used for wafers of different sizes.
[0051] The above embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although this utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions will not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this utility model.
Claims
1. A film rewinding machine motion module, comprising a frame (1), a film rewinding mechanism (2), and a positioning module (3), characterized in that: The top of the frame (1) is fixedly installed with an upper cover plate (11), and an operation window (111) is opened on the upper cover plate (11); a film rewinding mechanism (2) is installed inside the frame (1); The wafer rewinding mechanism (2) includes a horizontal moving module (21), a vertical moving module (22), and a detection module (23). The horizontal moving module (21) is installed on one side of the frame (1), and two sets of vertical moving modules (22) are installed on the other side of the frame (1) to support the first wafer cassette (4) and the second wafer cassette (5), respectively. The detection module (23) for detecting the status of the first wafer cassette (4) and the second wafer cassette (5) is installed inside the frame (1). The vertical moving module (22) is equipped with a positioning module (3) for positioning the first wafer cassette (4) and the second wafer cassette (5).
2. The film-turning machine motion module according to claim 1, characterized in that, The first wafer box (4) has a plurality of first slots (41) for inserting wafers evenly spaced inside; the lower side of the first wafer box (4) has symmetrical slots (42).
3. The film-turning machine motion module according to claim 2, characterized in that, The second wafer box (5) has a plurality of second slots (51) for inserting wafers evenly spaced inside; a protrusion (52) is fixedly installed on the lower side of the second wafer box (5).
4. The film-turning machine motion module according to claim 3, characterized in that, The horizontal moving module (21) includes a first synchronous belt linear module (211), a second synchronous belt linear module (212), a moving stage (213), and a mechanical tray (214). The first synchronous belt linear module (211) is fixedly installed inside the rack (1). The second synchronous belt linear module (212) is fixedly installed at the moving end of the first synchronous belt linear module (211). The moving end of the second synchronous belt linear module (212) is fixedly installed with the moving stage (213). The mechanical tray (214) for transferring wafers is fixedly installed on the moving stage (213).
5. The film-turning machine motion module according to claim 4, characterized in that, The vertical moving module (22) includes a ball screw linear module (221) and a bracket (222). The ball screw linear module (221) is fixedly installed inside the frame (1). The moving end of the ball screw linear module (221) is equipped with a bracket (222) for supporting the first wafer cassette (4) and the second wafer cassette (5).
6. The film-turning machine motion module according to claim 5, characterized in that, The detection module (23) includes an optical fiber sensor (231). The optical fiber sensor (231) is symmetrically fixedly installed in the frame (1) for detecting whether there is a wafer in the first slot (41) and the second slot (51) of the alignment mechanical tray (214).
7. The film-turning machine motion module according to claim 6, characterized in that, The detection module (23) also includes a pressure sensor (232), and a pressure sensor (232) for detecting whether the first wafer cassette (4) and the second wafer cassette (5) are in place is installed on the bracket (222).
8. The film-turning machine motion module according to claim 7, characterized in that, The positioning module (3) includes a first limiting block (31), a second limiting plate (32), a boss (33), and a third limiting block (34). The first limiting block (31) for limiting the left side of the first wafer box (4) is symmetrically installed on the rear bracket (222). The second limiting plate (32) for limiting the first wafer box (4) is symmetrically installed on the rear bracket (222). The boss (33) for limiting the first wafer box (4) is symmetrically installed on the rear bracket (222). The front bracket (222) is provided with a conforming groove for conforming to the bottom of the second wafer box (5). The third limiting block (34) is installed on the front bracket (222). The third limiting block (34) is provided with a limiting groove (35) for engaging with the boss (52).