Wafer clamping device
By designing a fixed part and a replacement part for the movable chuck pin, combined with a cross-shaped protrusion and groove structure, the problem of rapid wear of wafer chuck pins is solved, enabling quick replacement and efficient clamping, thereby improving production efficiency and wafer clamping stability.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- QINGDAO BESLAN SEMICONDUCTOR TECHNOLOGY CO LTD
- Filing Date
- 2025-05-19
- Publication Date
- 2026-05-12
AI Technical Summary
Existing wafer chuck pins wear out quickly, leading to reduced clamping capacity and the risk of scraping wafers. Regular replacement processes also affect production efficiency.
Design a wafer clamping device, including a movable chuck pin fixing part and a replacement part, which enables quick replacement through a cross-shaped protrusion and groove structure, and combined with a drive mechanism to drive the chuck pin to rotate, thereby enhancing connection stability and friction and improving clamping stability.
The replacement part for quick chuck pin replacement has been implemented, which improves production efficiency, avoids corrosion of the wafer rotary disk caused by chuck pin disassembly and assembly, reduces replacement costs, and enhances the stability and strength of wafer clamping.
Smart Images
Figure CN224234169U_ABST
Abstract
Description
Technical Field
[0001] This application relates to a wafer clamping device, belonging to the field of semiconductor processing technology. Background Technology
[0002] In integrated circuit manufacturing, multiple wet processing steps are involved. Wet processing involves immersing or rinsing the wafer with liquid chemicals such as acids, alkalis, and organic compounds to clean surface particles, remove reactive polymers, and etch surface films. As the requirements for process efficiency have increased, wet processing equipment has gradually shifted from early batch processing to single-wafer processing.
[0003] Because wafers are generally thin and the processing often involves the use of acids, alkalis, and organic solvents, the chuck pins used to hold the wafers wear out quickly. Wear reduces the clamping capacity of the chuck pins and poses a risk of scraping the wafer. Replacing conventional chuck pins requires downtime and individual disassembly and reassembly, impacting production efficiency. Utility Model Content
[0004] To address the aforementioned issues, this application proposes a wafer clamping device that can directly and quickly disassemble and replace parts of the chuck pins, saving steps and time in chuck pin replacement and improving production efficiency.
[0005] According to one aspect of this application, a wafer clamping device is provided, comprising:
[0006] A wafer rotating disk, wherein a circular hole is provided in the center of the wafer rotating disk and at least four mounting holes are provided in the circumferential direction;
[0007] A chuck pin is movably disposed within the mounting hole. The chuck pin includes a fixed part and a replacement part that engage with each other. The replacement part includes a chuck holder and a clamping member. The upper end surface of the clamping member is higher than the upper end surface of the chuck holder. The chuck holder and the clamping member are integrally formed and can rotate around the axis of the chuck holder. The upper surface of the chuck holder is used to support the wafer. The clamping member is used to clamp the wafer after rotating around the axis of the chuck holder.
[0008] A drive mechanism is provided for driving the wafer spool to rotate about its axis and for driving the chuck pin to rotate about the axis of the chuck holder.
[0009] Specifically, the wafer rotating disk includes an upper layer, a middle metal layer, and a lower layer; the upper layer is an isolation layer made of corrosion-resistant material; the middle metal layer is provided with a transmission mechanism that can be electrically connected to a drive mechanism to realize the rotation of the chuck pin; and the lower layer is provided with mounting holes for connection with the drive mechanism to realize motion control of the wafer rotating disk.
[0010] Optionally, the upper end of the fixing part is provided with a protrusion with a cross-shaped cross section, and the lower end of the replacement part is provided with a groove, the groove matching the shape of the protrusion of the fixing part.
[0011] Optionally, the height of the cross-shaped protrusion is 0.3 to 0.5 times the height of the replacement part.
[0012] Optionally, the cross-section of the protrusions of the fixing part in each direction is trapezoidal.
[0013] Optionally, friction strips are provided on the outer surfaces of the protrusions in each direction of the fixing part.
[0014] Optionally, the maximum distance between the chuck holder and the center of the wafer swivel disk is greater than the radius of the wafer.
[0015] Optionally, the chuck holder is provided with a number of smooth, dot-like protrusions.
[0016] Optionally, the side face of the clamping member has an angle with the vertical direction, the angle being 15 to 30°.
[0017] Optionally, the upper surface of the wafer rotating disk is a conical surface.
[0018] Optionally, the angle between the generatrix of the conical surface and the horizontal plane is 2 to 5°.
[0019] The beneficial effects that this application may produce include, but are not limited to:
[0020] 1. The wafer clamping device provided in this application, by setting the chuck pin as a fixed part and a replacement part, can quickly replace the replacement part when the replacement part is worn to a certain extent without disassembling and replacing the entire chuck pin. This not only improves work efficiency, but also avoids corrosion of the metal middle layer of the wafer rotating disk caused by the disassembly and assembly of the chuck pin, and also saves the material cost of the replacement part.
[0021] 2. The wafer clamping device provided in this application, by setting the connection structure between the chuck pin fixing part and the replacement part, sets the protrusion on the upper end of the fixing part and sets its cross section to a cross shape. Combined with the trapezoidal structure at the end of the cross shape and the friction strip, it not only improves the stability of the connection between the fixing part and the replacement part, but also improves the overall mechanical strength of the chuck pin, avoiding the problem of brittle fracture of the chuck pin as a whole or inside due to the wafer rotating disk.
[0022] 3. The wafer clamping device provided in this application improves the stability of wafer clamping by limiting the chuck tray surface and the side elevation angle features of the clamping member, and by increasing the friction and contact surface. Attached Figure Description
[0023] The accompanying drawings, which are included to provide a further understanding of this application and form part of this application, illustrate exemplary embodiments and are used to explain this application, but do not constitute an undue limitation of this application. In the drawings:
[0024] Figure 1 This is a front view schematic diagram of the wafer clamping device involved in the embodiments of this application;
[0025] Figure 2 This is a top view of the chuck pin involved in an embodiment of this application;
[0026] Figure 3 This is a top view of the fixing part involved in the embodiment of this application;
[0027] Figure 4 This is a front view schematic diagram of the fixing part involved in the embodiment of this application;
[0028] Figure 5 This is a top view schematic diagram of the wafer clamping device involved in the embodiments of this application;
[0029] List of components and reference numerals:
[0030] 1. Wafer rotating disk; 2. Chuck pin; 3. Fixing part; 4. Replacement part; 5. Chuck holder; 6. Clamping part; 7. Protrusion; 8. Friction strip; 9. Dot-shaped protrusion. Detailed Implementation
[0031] To more clearly illustrate the overall concept of this application, a detailed explanation is provided below with reference to the accompanying drawings.
[0032] To better understand the above-mentioned objectives, features, and advantages of this application, the application will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be noted that, unless otherwise specified, the embodiments and features described in these embodiments can be combined with each other.
[0033] Many specific details are set forth in the following description in order to provide a full understanding of this application. However, this application may also be implemented in other ways different from those described herein. Therefore, the scope of protection of this application is not limited to the specific embodiments disclosed below.
[0034] Furthermore, it should be understood in the description of this application that the terms "center," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.
[0035] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "a plurality of" means two or more, unless otherwise explicitly specified.
[0036] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a communication connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.
[0037] In this application, unless otherwise expressly specified and limited, the "above" or "below" of the second feature can mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. In the description of this specification, references to terms such as "an embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described can be combined in any suitable manner in one or more embodiments or examples.
[0038] The wafer clamping device in this application is only used to clamp the wafer during wafer cleaning, etching and other processes. Since the wafer needs to be rotated during the above-mentioned cleaning, etching and other processes, the wafer clamping device in this application can be connected to an additional drive mechanism. The drive mechanism drives the device to rotate so as to realize the processing of the wafer.
[0039] refer to Figure 1-5 This application discloses a wafer clamping device, comprising:
[0040] The wafer rotating disk 1 has a circular hole in the center and at least four mounting holes in the circumference.
[0041] The chuck pin 2 is movably disposed in the mounting hole. The chuck pin 2 includes a fixed part 3 and a replacement part 4 that are engaged with each other. The replacement part 4 includes a chuck holder 5 and a clamping member 6. The upper end surface of the clamping member 6 is higher than the upper end surface of the chuck holder 5. The chuck holder 5 and the clamping member 6 are integrally formed and can rotate around the axis of the chuck holder 5. The upper surface of the chuck holder 5 is used to support the wafer. After the clamping member 6 rotates around the axis of the chuck holder 5, it is used to clamp the wafer.
[0042] The drive mechanism is used to drive the wafer slewing disk 1 to rotate around its axis and can also drive the chuck pin 2 to rotate around the axis of the chuck holder 5.
[0043] In one embodiment, the upper end of the fixing part 3 is provided with a protrusion 7 with a cross-shaped cross section, and the lower end of the replacement part 4 is provided with a groove. The groove matches the shape of the protrusion 7 of the fixing part 3, and the protrusion 7 at the upper end of the fixing part 3 and the groove at the lower end of the replacement part 4 can be engaged. The cross-shaped protrusion 7 makes the force when the fixing part 3 and the replacement part 4 are engaged more dispersed, reducing stress concentration and improving the engagement strength. The protrusion 7 is provided at the upper end of the fixing part 3. Compared with the groove provided on the fixing part 3, it can reduce the accumulation of cleaning fluid and etching residue on the fixing part 3 and improve cleaning efficiency.
[0044] In one embodiment, the height of the cross-shaped protrusion 7 is 0.3 to 0.5 times the height of the replacement part 4. This can ensure connection stability while avoiding insufficient support and strength of the outer wall of the replacement part 4 due to excessive groove depth, thus preventing the replacement part 4 from cracking during the high-speed rotation of the wafer.
[0045] In one embodiment, the end cross-section of the protrusion 7 of the fixing part 3 in each direction is trapezoidal. The end of the protrusion 7 with the trapezoidal cross-section has an inclined surface that intersects with the centrifugal force when the wafer rotating disk 1 rotates inside the chuck pin 2 and at the contact point between the replacement part 4 and the fixing part 3. This can disperse the stress inside the chuck pin 2 when rotating, improve the overall strength of the chuck pin 2, and increase the stability of wafer clamping.
[0046] As one embodiment, friction strips 8 are provided on the outer surfaces of the protrusions 7 in each direction of the fixing part 3, which can increase the friction between the fixing part 3 and the replacement part 4 and improve the bonding strength between the two.
[0047] In one implementation, the maximum distance between the chuck holder 5 and the center of the wafer swivel disk 1 is greater than the radius of the wafer, providing a certain amount of space for the rotation of the chuck pin 2.
[0048] In one implementation, the chuck holder 5 is provided with several smooth dot-shaped protrusions 97, which can form frictional contact with the wafer surface during clamping, preventing the wafer from shifting when rotating at high speed. The smooth protrusions 7 can effectively disperse pressure, reduce damage to the wafer surface, and provide better clamping stability.
[0049] In one embodiment, the side face of the clamping member 6 has an angle of 15 to 30° with the vertical direction, which can increase the contact area between the clamping member 6 and the edge of the wafer and optimize the clamping stability. At the same time, the angle can be designed with a bevel so that the clamping member 6 can generate a certain lateral pressure during clamping, further enhancing the clamping effect.
[0050] As one implementation method, the upper surface of the wafer rotating disk 1 is a conical surface, which facilitates the discharge of cleaning liquid during the wafer cleaning process and prevents liquid accumulation on the wafer rotating disk 1 from contaminating the wafer.
[0051] As one implementation, the angle between the generatrix of the conical surface and the horizontal plane is 2 to 5°. This angle not only allows the cleaning liquid to drain quickly, but also prevents the stability of the chuck pin 2 from deteriorating or affecting the wafer due to the excessive height difference between the center and the outer periphery of the wafer rotating disk 1.
[0052] The wafer clamping device works as follows: the wafer is placed on the chuck tray 5 on the chuck pin 2, the drive mechanism drives the chuck pin 2 to rotate around the axis of the chuck tray 5 so that the clamping member 6 clamps the wafer, and the drive mechanism drives the wafer rotary disk 1 to rotate around its axis, thereby rotating the wafer and performing the rinsing operation.
[0053] During this process, the fixing part 3 and the replacement part 4 of the chuck pin 2 are engaged by the protrusion 7 and the groove provided thereon. The stability of the engagement is improved by the design of the cross-sectional shape of the protrusion 7, which prevents the chuck pin 2 from breaking or falling off during high-speed rotation. After the chuck pin 2 is worn to a certain extent, the replacement part 4 can be directly replaced, which improves production efficiency and wafer clamping stability.
[0054] The various embodiments in this specification are described in a progressive manner. Similar or identical parts between embodiments can be referred to mutually. Each embodiment focuses on describing the differences from other embodiments. In particular, the system embodiments are basically similar to the method embodiments, so the description is relatively simple; relevant parts can be referred to the descriptions in the method embodiments.
[0055] The above are merely embodiments of this application and are not intended to limit the scope of this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the scope of the claims of this application.
Claims
1. A wafer clamping device, characterized in that, include: A wafer rotating disk, wherein a circular hole is provided in the center of the wafer rotating disk and at least four mounting holes are provided in the circumferential direction; A chuck pin is movably disposed within the mounting hole. The chuck pin includes a fixed part and a replacement part that engage with each other. The replacement part includes a chuck holder and a clamping member. The upper end surface of the clamping member is higher than the upper end surface of the chuck holder. The chuck holder and the clamping member are integrally formed and can rotate around the axis of the chuck holder. The upper surface of the chuck holder is used to support the wafer. The clamping member is used to clamp the wafer after rotating around the axis of the chuck holder. A drive mechanism is provided for driving the wafer spool to rotate about its axis and for driving the chuck pin to rotate about the axis of the chuck holder.
2. The wafer clamping device according to claim 1, characterized in that, The upper end of the fixing part is provided with a protrusion with a cross-shaped cross section, and the lower end of the replacement part is provided with a groove, the groove matching the shape of the protrusion of the fixing part.
3. The wafer clamping device according to claim 2, characterized in that, The height of the cross-shaped protrusion is 0.3 to 0.5 times the height of the replacement part.
4. The wafer clamping device according to claim 2, characterized in that, The cross-section of the protrusions of the fixing part in each direction is trapezoidal.
5. The wafer clamping device according to claim 4, characterized in that, Friction strips are provided on the outer surface of the protrusions in each direction of the fixing part.
6. The wafer clamping device according to claim 1, characterized in that, The maximum distance between the chuck holder and the center of the wafer swivel disk is greater than the radius of the wafer.
7. The wafer clamping device according to claim 1, characterized in that, The chuck holder has several smooth, dot-like protrusions.
8. The wafer clamping device according to claim 1, characterized in that, The side face of the clamping member has an angle with the vertical direction, and the angle is 15° to 30°.
9. The wafer clamping device according to claim 1, characterized in that, The upper surface of the wafer rotating disk is a conical surface.
10. The wafer clamping device according to claim 9, characterized in that, The angle between the generatrix of the cone and the horizontal plane is 2 to 5 degrees.