Packaging base, composition board and electronic device

Abstract

The utility model relates to the technical field of electronic packaging, and discloses a packaging base, a composition board and an electronic device, the packaging base comprises an insulating substrate, a metal layer, an electrode pad and a plurality of electroplating wires; the insulating substrate comprises a substrate main body and a frame part, and the peripheral side wall of the substrate main body and the peripheral side wall of the frame part extend in the first direction to form an outer side wall; the plurality of electroplating wires are located in the insulating substrate, one end of each electroplating wire extends in the substrate main body and is connected with the electrode bonding pad, and the other end of each electroplating wire extends in the frame part and is exposed on the outer side wall to form an electroplating wire exposed part. The beneficial effects of the utility model are that the electroplating wiring is arranged far away from the surface of the segmentation groove, and the adjacent packaging bases can be conducted, so that the problem that the adjacent packaging bases are adhered in the segmentation groove area during electroplating due to the fact that the electroplating wiring is exposed out of the surface of the segmentation groove is avoided, and the production efficiency is improved.

Description

Technical Field

[0001] This utility model relates to the field of electronic packaging technology, and in particular to a packaging base, a combination board, and an electronic device. Background Technology

[0002] Packaging substrates are commonly used to encapsulate electronic components such as quartz crystals and semiconductor chips. The encapsulated components (such as semiconductor devices, temperature compensated oscillators (TCXO), tuning fork resonators, thermistor resonators, automotive components, general-purpose oscillators (OSC), pressure compensated oscillators (VCXO), etc.) are widely used in a wide variety of electronic devices.

[0003] The packaging substrate is typically fabricated on a large-size insulating substrate to obtain a packaging substrate assembly board composed of multiple packaging substrates. Electroplated wiring on the packaging substrate assembly board connects the conductive patterns on adjacent packaging substrates to achieve electroplating of all packaging substrates. After electroplating, the assembly board can be divided into individual packaging substrates using pre-set dividing slots.

[0004] However, when connecting two adjacent package bases, the current electroplated wiring often has some of the wiring exposed on the surface of the dividing groove. This causes the exposed wiring to stick together during the electroplating process, making it difficult to divide the composite board into individual package bases and reducing the production efficiency of the package bases. Utility Model Content

[0005] The purpose of this invention is to provide a packaging base, a combination board, and electronic devices, which allows the electroplated wiring to be positioned away from the surface of the dividing groove, and allows adjacent packaging bases to be conductive, thereby avoiding the problem of adjacent packaging bases sticking together in the dividing groove area during electroplating due to the electroplated wiring being exposed on the surface of the dividing groove, and improving production efficiency.

[0006] To achieve the above objectives, this utility model provides a packaging base, including an insulating substrate, a metal layer, electrode pads, and multiple electroplated wirings;

[0007] The insulating substrate includes a substrate body and a frame portion arranged sequentially in a first direction. The frame portion has a through groove. One end face of the substrate body and the side wall of the through groove form a mounting cavity. The end of the substrate body away from the frame portion has a first surface. The end of the frame portion away from the substrate body has a second surface. The outer peripheral side wall of the substrate body and the outer peripheral side wall of the frame portion extend in the first direction to form an outer side wall. One end of the outer side wall in the first direction is connected to the first surface through a dividing bevel, and / or the other end of the outer side wall in the first direction is connected to the second surface through a dividing bevel.

[0008] The metal layer is disposed around the mounting cavity on the second surface;

[0009] The electrode pads are located inside the mounting cavity;

[0010] Multiple electroplated wirings are located within the insulating substrate. One end of each electroplated wiring extends within the substrate body and connects to the electrode pads, while the other end extends within the frame and protrudes from the outer side wall to form an exposed portion of the electroplated wiring, which is used to connect to the electroplated wiring within an adjacent package base.

[0011] Furthermore, the length of the insulating substrate in the first direction is T, and the minimum distance between the end of the electroplated wiring exposed on the outer side wall and the second surface in the first direction is D1, where 0.1≤D1 / T≤0.5.

[0012] Furthermore, the minimum distance between the electroplated wiring and the first surface in the first direction is D2, and the length of the substrate body in the first direction is H1, 0.65≤D2 / H1≤0.95.

[0013] Furthermore, the overlapping area of ​​the electroplated wiring and the projection of the electrode pad on the first surface is A1, and the projected area of ​​the electrode pad on the first surface is A2, where 0.05≤A1 / A2≤0.35.

[0014] Furthermore, the angle between the tangent of the extension path of the end of the electroplated wiring that connects to the electrode pad and the first surface is θ, where θ ≤ 45°.

[0015] Furthermore, it also includes a plurality of external terminals, which are disposed on the first surface and spaced apart thereon, and the electrode pads are connected to one of the external terminals through through-hole conductors.

[0016] Furthermore, the electrode pad has a first area for connecting with the electroplated wiring, and the through-hole conductor and the projection of the first area on the first surface at least partially overlap.

[0017] Furthermore, the insulating substrate has intersecting first and second diagonals, and the insulating substrate has a first corner region and a third corner region disposed opposite each other in the extension direction of the first diagonal, and a second corner region and a fourth corner region disposed opposite each other in the extension direction of the second diagonal; a side region is provided between two adjacent corner regions;

[0018] Both the second corner region and the fourth corner region are provided with electroplated wiring for connection to the electrode pads; or,

[0019] Both the first corner region and the third corner region are provided with electroplated wiring for connecting the electrode pads; or,

[0020] The edge region is provided with electroplated wiring for connection to the electrode pads.

[0021] This utility model also provides a packaging base assembly plate, which is composed of a plurality of packaging bases as described above, wherein the electroplated wirings are interconnected between adjacent packaging bases, and the dividing bevels of adjacent packaging bases cooperate to form dividing grooves.

[0022] This utility model also provides an electronic device, including the packaging base described in any of the above claims, further including electronic components disposed in the mounting cavity, and a cover plate sealing the mounting cavity.

[0023] Compared with the prior art, the present invention provides a packaging base, a combination board, and electronic devices, which have the following advantages: the electroplated wiring is located inside the insulating substrate, with one end extending inside the substrate body and connecting to the electrode pads, and the other end extending inside the frame to the outer wall to form an exposed portion of the electroplated wiring, which is used to connect with the electroplated wiring in the adjacent insulating substrate, thereby realizing the electrical connection of the electrode pads on each packaging base in the combination board, thus making the internal circuit of the combined board conductive; at the same time, since the exposed portion of the electroplated wiring is set away from the dividing slope, the problem of adjacent packaging bases sticking together in the dividing groove area during electroplating is avoided because the electroplated wiring is exposed on the dividing groove surface, making it easier to divide the combination board into individual packaging bases and improving production efficiency. Attached Figure Description

[0024] Figure 1 This is a three-dimensional perspective view of the packaging base according to an embodiment of the present invention;

[0025] Figure 2 This is a front perspective view of the packaging base according to an embodiment of the present invention;

[0026] Figure 3 This is a top perspective view of the packaging base according to an embodiment of the present invention;

[0027] Figure 4 yes Figure 3 Sectional view at point AA;

[0028] Figure 5 This is a front view of the packaging base according to an embodiment of the present invention;

[0029] Figure 6 This is a top view of the packaging base according to an embodiment of the present invention;

[0030] Figure 7This is a schematic diagram showing the connection between two diagonally adjacent encapsulation bases in an embodiment of this utility model;

[0031] Figure 8 This is a three-dimensional view of the packaging base according to another embodiment of the present invention;

[0032] Figure 9 This is a perspective view of the packaging base according to another embodiment of the present invention;

[0033] Figure 10 This is a top-view perspective view of the packaging base according to another embodiment of the present invention;

[0034] Figure 11 This is a conductive pattern of the encapsulation base according to another embodiment of the present invention;

[0035] Figure 12 This is a three-dimensional view of the combined plate of the packaging base based on another embodiment of the present invention;

[0036] Figure 13 This utility model relates to the conductive pattern of a combined plate of a packaging base based on another embodiment;

[0037] Figure 14 This is a schematic diagram of the connection of the conductive patterns of the combined plate of the encapsulation base based on another embodiment of the present invention;

[0038] Figure 15 This is a top perspective view of the combined plate of the packaging base based on another embodiment of the present invention;

[0039] Figure 16 yes Figure 15 Sectional view at point BB.

[0040] In the figure, 1 is the insulating substrate; 100 is the mounting cavity; 101 is the outer wall; 102 is the dividing bevel; 11 is the substrate body; 111 is the first surface; 12 is the frame; 121 is the through groove; 122 is the second surface; 2 is the metal layer; 3 is the electrode pad; 31 is the through-hole conductor; 32 is the first region; 4 is the electroplated wiring; 41 is the exposed part of the electroplated wiring; 5 is the external terminal; 6 is the toroidal interconnect wiring; a is the first corner region; b is the second corner region; c is the third corner region; d is the fourth corner region; e is the edge region; X is the first direction. Detailed Implementation

[0041] The specific embodiments of this utility model will be described in further detail below with reference to the accompanying drawings and examples. The following examples are used to illustrate this utility model, but are not intended to limit its scope.

[0042] In the description of this utility model, it should be understood that the terms "upper", "lower", "front", "rear", "inner", "outer" and other terms used in this utility model to indicate the orientation or positional relationship are based on the positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and are not intended to indicate or imply that the device and element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0043] In the description of this utility model, it should be understood that the terms "first," "second," etc., are used to describe various information, but this information should not be limited to these terms. These terms are only used to distinguish information of the same type from each other. For example, without departing from the scope of this utility model, "first" information can also be referred to as "second" information, and similarly, "second" information can also be referred to as "first" information.

[0044] like Figures 1 to 16 As shown, a preferred embodiment of the present invention includes an insulating substrate 1, a metal layer 2, electrode pads 3, and multiple electroplated wirings 4. For ease of explanation, please refer to [reference needed]. Figure 1 The height direction of the insulating substrate 1 is defined as the first direction X. (See also...) Figure 1 , Figure 2 It is understood that the insulating substrate 1 includes a substrate body 11 and a frame portion 12 sequentially arranged in the first direction X. The frame portion 12 has a through groove 121. One end face of the substrate body 11 and the sidewall of the through groove 121 enclose a mounting cavity 100 for placing electronic components. The end of the substrate body 11 away from the frame portion 12 has a first surface 111, and the end of the frame portion 12 away from the substrate body 11 has a second surface 122. The first surface 111 and the second surface 122 are spaced apart in the first direction X. The outer peripheral sidewalls of the substrate body 11 and the outer peripheral sidewalls of the frame portion 12 extend in the first direction X to form an outer sidewall 101. One end of the outer sidewall 101 in the first direction X is connected to the first surface 111 via a dividing bevel 102, and / or the other end of the outer sidewall 101 in the first direction X is connected to the second surface 122 via the dividing bevel 102. Dividing bevels 102 arranged opposite to each other on adjacent packaging bases cooperate to form a dividing groove M, which is V-shaped.

[0045] A metal layer 2 is disposed around the mounting cavity 100 on the second surface 122. The metal layer 2 is used to weld to a cover plate (not shown, located above the metal layer 2) to seal the mounting cavity 100. Electrode pads 3 are disposed within the mounting cavity 100. To facilitate wiring communication between adjacent package substrates, multiple electroplated wirings 4 are located within the insulating substrate 1. One end of each electroplated wiring 4 extends within the substrate body 11 and connects to the electrode pads 3, while the other end extends within the frame portion 12 and protrudes from the outer side wall 101 to form an exposed electroplated wiring portion 41 for connection to the electroplated wiring 4 within adjacent package substrates. The electroplated wiring 4 is insulated from the metal layer 2. (See reference...) Figure 7 , Figure 8 as well as Figures 12 to 16 Adjacent packaging bases are electrically connected directly or indirectly through the electroplated wiring 4 exposed at the outer wall 101 via the electroplated wiring 4. Specifically, when the electroplated wiring 4 is located in a corner region, the electroplated wiring 4 between two adjacent corner packaging bases is indirectly electrically connected through the toroidal interconnection wiring 6 of one adjacent side packaging base. When the electroplated wiring 4 is located in an edge region, the electroplated wiring 4 between two adjacent side packaging bases can be directly electrically connected. Since the electroplated wiring exposed at the outer wall 101 is far from the dividing slope 102 provided at both ends, the electroplated wiring 4 will not be exposed on the surface of the dividing groove M, thereby avoiding the electroplated wiring 4 being exposed on the surface of the dividing groove M, which would cause adjacent packaging bases to stick together in the dividing groove M region during electroplating. This makes it easier to divide the composite board into individual packaging bases and improves production efficiency.

[0046] Furthermore, in order to facilitate the setting of the shape of the electroplated wiring 4, in this embodiment, the shape of the electroplated wiring 4 is a strip structure, which has good stability. At the same time, it is easy to increase the contact area with the electrode pad 3, which facilitates the conduction with the electrode pad 3 and the mutual conduction of the electroplated wiring 4 in adjacent packaging bases.

[0047] Furthermore, in some embodiments, to facilitate the rational arrangement of the electroplated wiring 4 within the insulating substrate 1 and reduce the difficulty of fabricating the encapsulation base, the length of the insulating substrate 1 in the first direction X is T, and the minimum distance between the exposed portion 41 of the electroplated wiring and the second surface 122 in the first direction X is D1, where 0.1 ≤ D1 / T ≤ 0.5. When D1 / T < 0.1, the exposed portion of the electroplated wiring 4 on the outer wall 101 is too close to the second surface 122. To avoid the electroplated wiring 4 being exposed in the dividing groove M, the depth of the dividing groove M needs to be reduced. A shallow dividing groove M is not conducive to dividing the encapsulation base assembly board into individual encapsulation bases, reducing production efficiency and accuracy. When D1 / T > 0.5, the exposed portion of the electroplated wiring 4 on the outer sidewall 101 is too far from the second surface 122, resulting in a larger overall size of the electroplated wiring 4, increasing the difficulty of manufacturing the packaging substrate. Simultaneously, it leads to uneven distribution of the electroplated wiring 4 within the insulating substrate 1, i.e., a significant difference in the distribution of the electroplated wiring 4 between the substrate body 11 and the frame portion 12. This causes local impedance abrupt changes within the insulating substrate 1, triggering signal reflection, crosstalk, or delay, thus affecting the performance of the packaging substrate. Preferably, in this embodiment, D1 / T = 0.3.

[0048] Furthermore, to facilitate the connection between the electrode pads 3 within the package substrate and external devices, refer to... Figures 1 to 12 The packaging substrate also includes multiple external terminals 5, which are disposed on the first surface 111 and spaced apart thereon. The electrode pads 3 are connected to one of the external terminals 5 through through-hole conductors 31. The number of external terminals 5 can be adjusted according to the actual design requirements of the packaging substrate.

[0049] Furthermore, see Figure 2 Parasitic capacitance is easily generated between one end of the electroplated wiring 4 located inside the substrate body 11 and the external terminal 5, causing signal interference caused by the parasitic capacitance to occur in the package substrate during practical applications. Therefore, the distance between the electroplated wiring 4 and the external terminal 5 is set. For details, please refer to [reference needed]. Figure 4 The minimum distance between the electroplated wiring 4 and the first surface 111 in the first direction X is D2, and the length of the substrate body 11 in the first direction X is H1, where 0.65 ≤ D2 / H1 ≤ 0.95. Preferably, in this embodiment, D2 / H1 = 0.8, which can effectively reduce the parasitic capacitance between the electroplated wiring 4 and the external terminal 5.

[0050] Furthermore, to increase the connection area between the electrode pad 3 and the electroplated wiring 4 and avoid poor contact, refer to... Figure 3The overlapping area of ​​the projections of the electroplated wiring 4 and the electrode pad 3 onto the first surface 111 is A1, and the projected area of ​​the electrode pad 3 onto the first surface 111 is A2, where 0.05 ≤ A1 / A2 ≤ 0.35. If A1 / A2 < 0.05, the connection area between the electroplated wiring 4 and the electrode pad 3 is too small, which can easily lead to poor contact and increased impedance. If A1 / A2 > 0.35, the parasitic capacitance between the electroplated wiring 4 and the electrode pad 3 increases, which can easily cause signal interference. Preferably, in this embodiment, A1 / A2 = 0.2, thereby ensuring good conductivity between the electroplated wiring 4 and the electrode pad 3 while reducing parasitic capacitance.

[0051] Furthermore, in order to ensure that the electroplated wiring 4 extends reasonably within the substrate body 11, and to avoid the distance between the electroplated wiring 4 and the first surface 111 and the bottom surface of the mounting cavity 100 being too small, thereby reducing the risk of cracking of the packaging base, and at the same time making the connection between the electroplated wiring 4 and the electrode pad 3 more reliable, the angle between the tangent of the extension path of the end of the electroplated wiring 4 connected to the electrode pad 3 and the first surface 111 is θ, where θ≤45°.

[0052] Furthermore, to ensure a more uniform distribution of the electroplated wiring 4 across the entire packaging substrate, improve current uniformity, and thus guarantee the uniformity of the electroplated layer thickness, reduce product warpage, thereby improving the uniformity of stress distribution during actual use and reducing the risk of cracking. For example... Figure 3 As shown, the electrode pad 3 has a first region 32 for connection with the electroplated wiring 4, and the through-hole conductor 31 at least partially overlaps with the projection of the first region 32 on the first surface 111. In some other embodiments, the through-hole conductor 31 may not overlap with the projection of the first region 32 on the first surface 111 (not shown in the figure). The area of ​​the first region 32 is less than or equal to A1.

[0053] In this embodiment, the insulating substrate 1 has a rectangular parallelepiped structure. To facilitate the reasonable arrangement of the electroplated wiring 4 within the insulating substrate 1, the insulating substrate 1 has intersecting first and second diagonals, dividing the four peripheral corner areas of the insulating substrate 1. (Refer to...) Figure 6 The insulating substrate 1 has a first corner region a and a third corner region c arranged opposite each other along the extension direction of the first diagonal, and a second corner region b and a fourth corner region d arranged opposite each other along the extension direction of the second diagonal. A side region e is provided between two adjacent corner regions. To facilitate the conduction of the electroplated wiring 4 between adjacent packaging bases, electroplated wiring 4 for connection to the electrode pads 3 is provided in both the second corner region b and the fourth corner region d, or electroplated wiring 4 for connection to the electrode pads 3 is provided in both the first corner region a and the third corner region c. That is, electroplated wiring 4 can be provided in any two opposite corner regions, and can be adaptively adjusted according to actual design requirements.

[0054] See Figure 6 , Figure 7 That is, adjacent package bases are connected in the diagonal extension direction, thereby realizing the electrical connection of the electrode pads 3 on the package bases in the composite board, and thus making the electroplated wiring 4 of the composite board formed by the package bases conductive. Since the electroplated wiring 4 is arranged opposite to each other on the diagonal, multiple electroplated wiring 4 are arranged in a centrally symmetrical manner on the insulating substrate 1.

[0055] In some other embodiments, to enable electrical conduction between any two adjacent package substrates via electroplated wiring 4, the insulating substrate 1 has intersecting first and second diagonals. The insulating substrate 1 has a first corner region a and a third corner region c arranged opposite each other along the extension direction of the first diagonal, and a second corner region b and a fourth corner region d arranged opposite each other along the extension direction of the second diagonal. A side region e is provided between two adjacent corner regions. Electroplated wiring 4 for connection to electrode pads 3 is provided within the side region e. When electroplated wiring 4 is provided within the side region e, the number can be four, i.e., four electroplated wiring 4 are arranged axially symmetrically on the insulating substrate 1. In this case, electrical conduction between any two adjacent package substrates can be achieved through the electroplated wiring 4. In some other embodiments, the number of electroplated wiring 4 can be two or three, i.e., electroplated wiring 4 can be provided within any two to three side regions e to achieve electrical connection between adjacent package substrates.

[0056] In some other embodiments, see Figures 8 to 16 The packaging base of this utility model also includes a toroidal interconnect wiring 6. The toroidal interconnect wiring 6 is located inside the frame. One end of the toroidal interconnect wiring 6 is connected to the metal layer 2, and the other end of the toroidal interconnect wiring 6 extends towards the outer wall 101 and forms a toroidal interconnect wiring exposed portion. In this embodiment, since the insulating substrate 1 is generally rectangular in shape and has four corner areas, there are two electroplated wirings 4, which are diagonally arranged on one diagonal line, that is, one conductive wiring is located in one corner area. Similarly, there are also two toroidal interconnect wirings 6, which are also diagonally arranged on the other diagonal line on the insulating substrate 1. The electroplated wirings 4 between adjacent packaging bases can be connected through the toroidal interconnect wiring 6 on the third packaging base. Specifically, as shown in the figure... Figure 15 As shown, the second package base B2 and the fourth package base B4 are arranged angularly adjacent. The electroplated wiring 4 between the second package base B2 and the fourth package base B4 can be connected by the toroidal wiring 6 on the first package base B1 and the second package base B3. To facilitate understanding of the two package bases being angularly adjacent, as shown... Figure 7 As shown, angular adjacency refers to the connection of two package bases at the corners on the same diagonal. To facilitate understanding, the two package bases are adjacent on one side, as shown below. Figure 12As shown, two adjacent encapsulation bases in the length and width directions of the composite board are edge-adjacent.

[0057] Furthermore, this utility model also provides a packaging base assembly plate, see reference. Figures 12 to 16 It is composed of multiple of the above-mentioned packaging bases arranged together. The adjacent packaging bases are provided with interconnected electroplated wiring 4, and the dividing slopes 102 of the adjacent packaging bases cooperate to form dividing grooves M.

[0058] Specifically, the encapsulation base assembly includes a first encapsulation base B1, a second encapsulation base B2, a third encapsulation base B3, and a fourth encapsulation base B4 arranged in a two-row, two-column configuration. The first encapsulation base B1 and the third encapsulation base B3 are diagonally positioned, as are the second encapsulation base B2 and the fourth encapsulation base B4. Adjacent encapsulation bases form a dividing groove M, which is composed of dividing bevels. Each encapsulation base has a first corner region a and a third corner region c, and a second corner region b and a fourth corner region d, which are positioned opposite each other. A side region e is provided between two adjacent corner regions.

[0059] Furthermore, see Figure 12 , Figure 15 Electroplated wiring 4 is provided in both the second corner region b and the fourth corner region d, and a toroidal interconnect wiring 6 is provided in the first corner region a; the electroplated wiring 4 of the fourth package base B4 is connected to the electroplated wiring 4 of the second package base B2, as shown below. Figure 15 As shown, when the plated wiring 4 of the fourth package base B4 and the second package base B2 are diagonally arranged, the connection is a point contact or line contact, resulting in high impedance and making electrical connection difficult. Therefore, the plated wiring 4 of the fourth package base B4 and the second package base B2 need to be indirectly electrically connected through the toroidal interconnect wiring 6 on the adjacent third package base (such as the first package base B1 or the third package base B3). That is, when the plated wiring 4 is located in the corner area, the plated wiring 4 of the two diagonally adjacent package bases need to be indirectly electrically connected through the toroidal interconnect wiring 6 of the third package base located in the corner area. When the plated wiring 4 is located in the edge area e, the plated wiring 4 of the two edge-adjacent package bases in the composite board are directly electrically connected.

[0060] Furthermore, this utility model also provides an electronic device, including the packaging base described in any of the above claims, further including electronic components disposed in the mounting cavity, and a cover plate (not shown in the figure) sealing the mounting cavity.

[0061] In summary, this utility model embodiment provides a packaging base and a combined board. The electroplated wiring 4 is located inside the insulating substrate 1, with one end extending inside the substrate body 11 and connecting to the electrode pad 3, and the other end extending inside the frame portion 12 away from the dividing slope 102 to the outer wall 101 for connection with the electroplated wiring 4 in the adjacent insulating substrate 1. This achieves electrical connection of the electrode pads 3 on each packaging base in the combined board, thereby making the internal circuit of the combined board conductive. At the same time, since the part of the electroplated wiring 4 exposed on the outer wall 101 is set away from the dividing slope 102, the problem of adjacent packaging bases sticking together in the dividing groove M area during electroplating is avoided due to the electroplated wiring 4 being exposed on the surface of the dividing groove M. This makes it easier to divide the combined board into individual packaging bases and improves production efficiency.

[0062] The above description is only a preferred embodiment of the present utility model. It should be noted that for those skilled in the art, several improvements and substitutions can be made without departing from the technical principles of the present utility model, and these improvements and substitutions should also be considered within the protection scope of the present utility model.

Claims

1. A packaging base, characterized in that: Includes an insulating substrate, a metal layer, electrode pads, and multiple electroplated wirings; The insulating substrate includes a substrate body and a frame portion arranged sequentially in a first direction. The frame portion has a through groove. One end face of the substrate body and the side wall of the through groove form a mounting cavity. The end of the substrate body away from the frame portion has a first surface. The end of the frame portion away from the substrate body has a second surface. The outer peripheral side wall of the substrate body and the outer peripheral side wall of the frame portion extend in the first direction to form an outer side wall. One end of the outer side wall in the first direction is connected to the first surface through a dividing bevel, and / or the other end of the outer side wall in the first direction is connected to the second surface through a dividing bevel. The metal layer is disposed around the mounting cavity on the second surface; The electrode pads are located inside the mounting cavity; Multiple electroplated wirings are located within the insulating substrate. One end of each electroplated wiring extends within the substrate body and connects to the electrode pads, while the other end extends within the frame and protrudes from the outer side wall to form an exposed portion of the electroplated wiring, which is used to connect to the electroplated wiring within an adjacent package base.

2. The packaging base as described in claim 1, characterized in that: The length of the insulating substrate in the first direction is T, and the minimum distance between the exposed electroplated wiring portion and the second surface in the first direction is D1, where 0.1≤D1 / T≤0.

5.

3. The packaging base as described in claim 1, characterized in that: The minimum distance between the electroplated wiring and the first surface in the first direction is D2, and the length of the substrate body in the first direction is H1, 0.65≤D2 / H1≤0.

95.

4. The packaging base as described in claim 1, characterized in that: The overlapping area of ​​the electroplated wiring and the projection of the electrode pad on the first surface is A1, and the projected area of ​​the electrode pad on the first surface is A2, where 0.05≤A1 / A2≤0.

35.

5. The packaging base as described in claim 1, characterized in that: The angle between the tangent of the extension path of the end of the electroplated wiring that connects to the electrode pad and the first surface is θ, where θ ≤ 45°.

6. The packaging base as described in claim 1, characterized in that: It also includes a plurality of external terminals, which are disposed on the first surface and spaced apart thereon, and the electrode pads are connected to one of the external terminals through through-hole conductors.

7. The packaging base as described in claim 6, characterized in that: The electrode pad has a first area for connecting to the electroplated wiring, and the through-hole conductor at least partially overlaps with the projection of the first area on the first surface.

8. The packaging base as described in claim 1, characterized in that: The insulating substrate has intersecting first and second diagonals. The insulating substrate has a first corner region and a third corner region arranged opposite each other in the extension direction of the first diagonal. The insulating substrate has a second corner region and a fourth corner region arranged opposite each other in the extension direction of the second diagonal. A side region is provided between two adjacent corner regions. Both the second corner region and the fourth corner region are provided with electroplated wiring for connection to the electrode pads; or, Both the first corner region and the third corner region are provided with electroplated wiring for connecting the electrode pads; or, The edge region is provided with electroplated wiring for connection to the electrode pads.

9. A packaging base assembly plate, comprising a plurality of packaging bases as described in any one of claims 1-8, characterized in that: The adjacent packaging bases are provided with interconnected electroplated wiring, and the dividing bevels of the adjacent packaging bases cooperate to form dividing grooves.

10. An electronic device comprising the packaging base according to any one of claims 1-8, characterized in that: It also includes electronic components disposed in the mounting cavity, and a cover plate that seals the mounting cavity.

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