Silicon wafer transfer machine for 12-inch silicon wafer polishing production line

Abstract

A silicon wafer transfer machine for a 12-inch silicon wafer polishing production line comprises a transfer groove, a plurality of driving mechanisms evenly distributed in the length direction are fixedly arranged in the transfer groove, one side of the transfer groove is fixedly connected with a supporting rod arranged upwards, the supporting rod is fixedly connected with an extension rod, and a water supply channel is formed in the middle of the extension rod. The tail end of the extension rod is fixedly connected with a sprayer, the carrier disc and the silicon wafer can pass through the lower portion of the sprayer in the moving process, the sprayer comprises a water guide tank communicated with the water supply channel, the lower portion of the water guide tank is fixedly connected with a water distribution box, and the outer wall of the water distribution box is provided with a plurality of drainage grooves communicated with the water guide tank. The 12-inch silicon wafer transfer device can transfer 12-inch silicon wafers, clean water is continuously used for washing the 12-inch silicon wafers in the transfer process, the clean water can fully cover the 12-inch silicon wafers after being dispersed by the water distribution box, the cleaning effect is guaranteed, and the surfaces of the 12-inch silicon wafers are prevented from being polluted.

Description

Technical Field

[0001] This utility model relates to the field of silicon wafer processing technology, specifically a silicon wafer transfer machine for a 12-inch silicon wafer polishing production line. Background Technology

[0002] Silicon wafers are a crucial material in the semiconductor industry. During production, the surface of silicon wafers requires polishing to ensure precision in subsequent processing. This polishing process involves multiple steps, many of which involve processing or transferring the wafer on a ceramic carrier tray. Transfer machines are frequently used between different steps to move the carrier tray and the wafer. In these transfer machines, to prevent surface contamination, cleaning water is continuously sprayed onto the wafer surface. Current technology primarily uses a water tap above the transfer tank to spray cleaning water, which is suitable for small wafers of 6 inches and below. However, for larger 12-inch wafers, it's difficult for the cleaning water to fully cover the surface, easily creating cleaning dead zones. Utility Model Content

[0003] To address the shortcomings of existing technologies, this invention provides a silicon wafer transfer machine for a 12-inch silicon wafer polishing production line. The machine is capable of transferring 12-inch silicon wafers and continuously rinsing them with clean water during the transfer process. The clean water is dispersed through a water distribution box to fully cover the 12-inch silicon wafers, ensuring a cleaning effect and preventing contamination of the 12-inch silicon wafer surface.

[0004] To achieve the above objectives, the specific solution adopted by this utility model is as follows: a silicon wafer transfer machine for a 12-inch silicon wafer polishing production line, including a transfer tank, a plurality of driving mechanisms uniformly distributed along the length direction are fixedly arranged in the transfer tank, the driving mechanisms are used to drive the carrier disk and silicon wafer to move in the transfer tank, a support rod is fixedly connected to one side of the transfer tank and an extension rod is fixedly connected to the support rod, the extension rod extends to the top of the transfer tank, and a water supply channel is opened in the middle of the extension rod, and a sprayer is fixedly connected to the end of the extension rod. The carrier disk and silicon wafer can pass under the sprayer during the movement. The sprayer includes a water guide tank connected to the water supply channel, a water distribution box is fixedly connected to the bottom of the water guide tank, and a plurality of drainage grooves connected to the water guide tank are opened on the outer wall of the water distribution box, and the distance between two adjacent drainage grooves gradually increases from top to bottom.

[0005] As a further optimization of the silicon wafer transfer machine for a 12-inch silicon wafer polishing production line, the water supply channel is connected to a socket, and the socket extends to the lower surface of the extension rod. The water guide box is connected to a connecting pipe, which is inserted into the socket and fixed.

[0006] As a further optimization of the silicon wafer transfer machine for a 12-inch silicon wafer polishing production line, the water distribution box includes a small end and a large end that are arranged opposite to each other. The small end of the water distribution box is set upward and fixedly connected to the water guide box. The drainage channel runs through the large end and the small end, and the large end of the water distribution box is open.

[0007] As a further optimization of the silicon wafer transfer machine for the 12-inch silicon wafer polishing production line mentioned above: the bottom of the drainage tank is provided with multiple drainage holes, which extend to the inside of the water distribution box.

[0008] As a further optimization of the silicon wafer transfer machine for a 12-inch silicon wafer polishing production line, the drive mechanism includes two parallel support bars fixedly disposed at the bottom of the transfer groove. The support bars include a first part and a second part perpendicular to each other. The first part is fixedly connected to the bottom of the transfer groove. At least two conveying rollers are rotatably connected between the second parts of the two support bars. The conveying rollers are used to support and drive the carrier disk.

[0009] As a further optimization of the silicon wafer transfer machine for a 12-inch silicon wafer polishing production line, the drive assembly includes at least one fixed block, on which at least two upwardly extending vertical plates are fixedly mounted, and on which support rollers are rotatably mounted, the support rollers cooperating with the conveyor rollers to support the carrier disk.

[0010] As a further optimization of the silicon wafer transfer machine for a 12-inch silicon wafer polishing production line, the second part is fixedly connected with at least two connecting plates, the connecting plates extend upward, and the upper end of the connecting plates is fixedly connected with a mounting plate parallel to the bottom of the transfer groove. All mounting plates connected to the same support bar are fixedly connected with a guide rod, and the guide rod extends along the length of the transfer groove, forming a channel for the carrier disk to pass through between the two guide rods.

[0011] As a further optimization of the silicon wafer transfer machine for a 12-inch silicon wafer polishing production line, the mounting plate is provided with a sliding groove extending along the width direction of the transfer groove, the guide rod is connected to the mounting plate by fastening bolts, and the fastening bolts pass through the sliding grooves, with fastening nuts fitted on the fastening bolts.

[0012] As a further optimization of the silicon wafer transfer machine for the 12-inch silicon wafer polishing production line mentioned above: a guide rod is fixedly connected to one end of the guide rod facing the material feeding direction of the carrier disk and the silicon wafer, and the distance between the two guide rods gradually decreases along the conveying direction of the carrier disk and the silicon wafer.

[0013] As a further optimization of the aforementioned wafer transfer machine for a 12-inch silicon wafer polishing production line: the end of the water supply channel is sealed by a cap.

[0014] Beneficial effects: This invention can transfer 12-inch silicon wafers and continuously rinse the 12-inch silicon wafers with clean water during the transfer process. After the clean water is dispersed by the water distribution box, it can fully cover the 12-inch silicon wafers, ensuring the cleaning effect and preventing the surface of the 12-inch silicon wafers from being contaminated. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0016] Figure 2 This is a schematic diagram showing the connection method between the mounting plate and the guide rod;

[0017] Figure 3 This is a schematic diagram of the water distribution box;

[0018] Figure 4 This is a schematic diagram of how the water supply channel is constructed.

[0019] Attached Figure Descriptions: 1-Transfer trough, 2-Support rod, 3-Extension rod, 4-Water supply channel, 5-Support bar, 6-Conveying roller, 7-Fixing block, 8-Upright plate, 9-Support roller, 10-Connecting plate, 11-Mounting plate, 12-Fasting bolt, 13-Guide rod, 14-Guide rod, 15-Slide groove, 16-Fasting nut, 17-Water guide box, 18-Connecting pipe, 19-Water distribution box, 20-Drainage trough, 21-Leakage hole, 22-End cap, 23-Insertion hole. Detailed Implementation

[0020] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0021] like Figure 1 and Figure 3As shown, a silicon wafer transfer machine for a 12-inch silicon wafer polishing production line includes a transfer tank 1. Multiple drive mechanisms evenly distributed along the length direction are fixedly installed inside the transfer tank 1. The drive mechanisms drive a carrier disk and silicon wafers to move within the transfer tank 1. A support rod 2 is fixedly connected to one side of the transfer tank 1, and an extension rod 3 is fixedly connected to the support rod 2. The extension rod 3 extends above the transfer tank 1, and a water supply channel 4 is provided in the middle of the extension rod 3. A sprayer is fixedly connected to the end of the extension rod 3. The carrier disk and silicon wafers can pass under the sprayer during movement. The sprayer includes a water guide tank 17 connected to the water supply channel 4. A water distribution box 19 is fixedly connected to the bottom of the water guide tank 17. Multiple drainage channels 20 connected to the water guide tank 17 are provided on the outer wall of the water distribution box 19, and the distance between adjacent drainage channels 20 gradually increases from top to bottom.

[0022] This invention is applicable to the polishing process of 12-inch silicon wafers. In use, between different steps in the polishing process, this invention is used to transfer the carrier disk and silicon wafer as a whole. Specifically, the carrier disk is placed on a drive mechanism, which drives the carrier disk and silicon wafer to move within the transfer tank 1. Meanwhile, cleaning water is continuously supplied to the sprayer via the water supply channel 4. After passing through the water supply channel 4, the cleaning water enters the water guide tank 17 and flows downwards onto the outer wall of the water distribution box 19. The water continues to flow downwards through the drain channels 20. Multiple drain channels 20 guide the cleaning water in different directions, thus evenly dispersing it outwards from the water distribution box 19. During the movement of the carrier disk, it passes under the sprayer, allowing the cleaning water to fall evenly onto the carrier disk, continuously rinsing the carrier disk and silicon wafer and preventing contamination of the silicon wafer surface. Because the cleaning water is dispersed by the water distribution box 19, the coverage area of ​​the cleaning water is larger, fully covering the 12-inch silicon wafer and avoiding dead corners.

[0023] This invention can transfer 12-inch silicon wafers and continuously rinse the 12-inch silicon wafers with clean water during the transfer process. After the clean water is dispersed by the water distribution box 19, it can fully cover the 12-inch silicon wafers, ensuring the cleaning effect and preventing the surface of the 12-inch silicon wafers from being contaminated.

[0024] like Figure 4 As shown, the specific connection between the water supply tank 17 and the water supply channel 4 is as follows: the water supply channel 4 is connected to a socket 23, and the socket 23 extends to the lower surface of the extension rod 3. The water supply tank 17 is connected to a connecting pipe 18, which is inserted into and fixed in the socket 23. After the connecting pipe 18 is inserted into the socket 23, it can be fixedly connected to the extension rod 3 at the edge by adhesive. After the adhesive dries, it can also fully seal the gap between the outer wall of the connecting pipe 18 and the inner wall of the socket 23, preventing clean water from leaking from the gap. Furthermore, the end of the water supply channel 4 is sealed by a cap 22.

[0025] The specific structure of the water distribution box 19 is as follows: The water distribution box 19 includes a small end and a large end arranged opposite to each other. The small end of the water distribution box 19 is set upward and fixedly connected to the water guide tank 17. The drainage channel 20 passes through the large end and the small end, and the large end of the water distribution box 19 is open. Furthermore, a water outlet is provided at the bottom of the side wall of the water guide tank 17, and the water outlet corresponds one-to-one with the drainage channel 20. The water outlet discharges the clean water in the water guide tank 17 into the drainage channel 20. Multiple drainage channels 20 are evenly distributed along the circumferential direction of the axis of the water distribution box 19, thereby fully and evenly dispersing the clean water.

[0026] To further ensure that the cleaning water is evenly distributed on the surface of the 12-inch silicon wafer and to fully guarantee the cleaning effect, multiple drainage holes 21 are provided at the bottom of the drainage channel 20, extending to the inner side of the water distribution box 19. By providing drainage holes 21, some cleaning water can enter the inner side of the water distribution box 19 through the drainage holes 21 and then fall directly onto the carrier tray. Based on this structure, cleaning water flows out from both the inner and outer sides of the water distribution box 19, resulting in a wider coverage area and better cleaning effect. It should also be noted that the input amount of cleaning water in the drainage channel 20 needs to be greater than the leakage amount from all the drainage holes 21 to ensure that cleaning water continues to flow out from the end of the drainage channel 20.

[0027] The specific structure of the drive mechanism is as follows: The drive mechanism includes two parallel support bars 5 fixedly disposed at the bottom of the transfer groove 1. Each support bar 5 includes a first part and a second part that are perpendicular to each other. The first part is fixedly connected to the bottom of the transfer groove 1. At least two conveying rollers 6 are rotatably connected between the second parts of the two support bars 5. The conveying rollers 6 are used to support and drive the carrier disk. In the drive mechanism, a driver such as a motor can be provided for at least one conveying roller 6. The driver drives the conveying roller 6 to rotate actively, thereby driving the carrier disk and the silicon wafer as a whole to move along the transfer groove 1.

[0028] Furthermore, to improve the stability of the carrier disk on the drive mechanism, the drive assembly includes at least one fixed block 7, on which at least two upwardly extending vertical plates 8 are fixedly mounted. Support rollers 9 are rotatably mounted on the vertical plates 8, and the support rollers 9 cooperate with the conveyor rollers 6 to support the carrier disk. The support rollers 9 do not need to rotate actively; they rotate passively during the movement of the carrier disk.

[0029] To restrict the movement direction of the carrier disk and prevent it from deviating and impacting the sidewall of the transfer groove 1, thus causing damage or wafer detachment, the second part is fixedly connected with at least two connecting plates 10. The connecting plates 10 extend upwards, and their upper ends are fixedly connected to mounting plates 11 parallel to the bottom of the transfer groove 1. All mounting plates 11 connected to the same support bar 5 are jointly fixedly connected to guide rods 13, which extend along the length of the transfer groove 1. A channel for the carrier disk to pass through is formed between the two guide rods 13. The two guide rods 13 cooperate to restrict the movement direction of the carrier disk, ensuring that the carrier disk can move along the length of the transfer groove 1.

[0030] like Figure 2 As shown, to broaden the scope of application of this invention and enable it to be used for the transfer of 8-inch silicon wafers, a groove 15 extending along the width of the transfer groove 1 is provided on the mounting plate 11. Guide rods 13 are connected to the mounting plate 11 by fastening bolts 12, which pass through the groove 15. A fastening nut 16 is fitted onto the fastening bolt 12. The distance between the two guide rods 13 can be changed by adjusting the position of the fastening bolt 12 in the groove 15, thus adapting it to the transfer of 8-inch silicon wafers. It should be noted that because cleaning water can flow downwards from both the inside and outside of the water distribution box 19, it can also fully cover the 8-inch silicon wafer.

[0031] To ensure that the carrier disk can enter the channel smoothly, a guide rod 14 is fixedly connected to one end of the guide rod 13 facing the material feeding direction of the carrier disk and silicon wafer, and the distance between the two guide rods 14 gradually decreases along the conveying direction of the carrier disk and silicon wafer.

[0032] The above description of the disclosed embodiments enables those skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A silicon wafer transfer machine for a 12-inch silicon wafer polishing production line, characterized in that, The transfer tank (1) includes a transfer tank (1) with multiple drive mechanisms evenly distributed along its length. The drive mechanisms are used to drive the carrier disk and silicon wafer to move within the transfer tank (1). One side of the transfer tank (1) is fixedly connected to an upwardly positioned support rod (2). The support rod (2) is fixedly connected to an extension rod (3). The extension rod (3) extends above the transfer tank (1) and a water supply channel (4) is provided in the middle of the extension rod (3). A sprayer is fixedly connected to the end of the extension rod (3). The carrier disk and silicon wafer can pass under the sprayer during the movement. The sprayer includes a water guide box (17) connected to the water supply channel (4). A water distribution box (19) is fixedly connected below the water guide box (17). Multiple drainage channels (20) connected to the water guide box (17) are provided on the outer wall of the water distribution box (19). The distance between two adjacent drainage channels (20) gradually increases from top to bottom.

2. A silicon wafer transfer machine for a 12-inch silicon wafer polishing production line as described in claim 1, characterized in that, The water supply channel (4) is connected to a socket (23), and the socket (23) extends to the lower surface of the extension rod (3). The water guide box (17) is connected to a connecting pipe (18), which is inserted into the socket (23) and fixed.

3. A silicon wafer transfer machine for a 12-inch silicon wafer polishing production line as described in claim 2, characterized in that, The water distribution box (19) includes a small end and a large end that are arranged opposite to each other. The small end of the water distribution box (19) is set upward and is fixedly connected to the water guide box (17). The drainage channel (20) passes through the large end and the small end, and the large end of the water distribution box (19) is open.

4. A silicon wafer transfer machine for a 12-inch silicon wafer polishing production line as described in claim 3, characterized in that, The bottom of the drainage trough (20) is provided with multiple water leakage holes (21), which extend to the inside of the water distribution box (19).

5. A silicon wafer transfer machine for a 12-inch silicon wafer polishing production line as described in claim 1, characterized in that, The driving mechanism includes two parallel support bars (5) fixedly disposed at the bottom of the transfer groove (1). The support bars (5) include a first part and a second part perpendicular to each other. The first part is fixedly connected to the bottom of the transfer groove (1). At least two conveying rollers (6) are rotatably connected between the second parts of the two support bars (5). The conveying rollers (6) are used to support and drive the carrier disk.

6. A silicon wafer transfer machine for a 12-inch silicon wafer polishing production line as described in claim 5, characterized in that, The driving mechanism includes at least one fixed block (7), on which at least two upwardly extending vertical plates (8) are fixedly mounted, and on which support rollers (9) are rotatably mounted, the support rollers (9) cooperating with the conveying rollers (6) to support the carrier disk.

7. A silicon wafer transfer machine for a 12-inch silicon wafer polishing production line as described in claim 5, characterized in that, The second part is fixedly connected with at least two connecting plates (10), the connecting plates (10) extend upward, and the upper end of the connecting plates (10) is fixedly connected with a mounting plate (11) that is parallel to the bottom of the transfer groove (1). All mounting plates (11) connected to the same support bar (5) are fixedly connected with a guide rod (13), and the guide rod (13) extends along the length direction of the transfer groove (1). A channel for the carrier disk to pass through is formed between the two guide rods (13).

8. A silicon wafer transfer machine for a 12-inch silicon wafer polishing production line as described in claim 7, characterized in that, The mounting plate (11) has a sliding groove (15) extending along the width direction of the transfer groove (1). The guide rod (13) is connected to the mounting plate (11) by a fastening bolt (12), and the fastening bolt (12) passes through the sliding groove (15). A fastening nut (16) is provided on the fastening bolt (12).

9. A silicon wafer transfer machine for a 12-inch silicon wafer polishing production line as described in claim 7, characterized in that, The guide rod (13) is fixedly connected to a guide rod (14) at one end facing the material feeding direction of the carrier disk and the silicon wafer, and the distance between the two guide rods (14) gradually decreases along the conveying direction of the carrier disk and the silicon wafer.

10. A silicon wafer transfer machine for a 12-inch silicon wafer polishing production line as described in claim 1, characterized in that, The end of the water supply channel (4) is sealed by a cap (22).

Images