Manipulator clamping device for scribing machine

Abstract

The utility model relates to the technical field of wafer scribing machines, and discloses a mechanical arm material clamping device for a scribing machine, which comprises a material taking assembly and a linear module for driving the material taking assembly to move to take materials, a feeding assembly is arranged on one side of the material taking assembly, the linear module drives the feeding assembly to move to a feeding station, and the linear module drives the feeding assembly to move to the feeding station. The feeding assembly clamps a wafer workpiece and feeds the wafer workpiece to the material taking station, the feeding assembly after feeding is completed rotates and is stored to the position above the material taking assembly, and the material taking assembly is driven by the linear module to move to the material taking station to take the wafer workpiece. According to the utility model, through the arrangement of the feeding assembly, the device can adapt to wafer workpieces with different sizes, and the wafer workpieces in the box station can be rapidly and flexibly taken out and fed to the material taking station; and by arranging the material taking assembly, the device can adapt to wafer workpieces of various sizes, high-precision taking and placing are achieved, and manual errors are effectively reduced.

Description

Technical Field

[0001] This utility model relates to the field of wafer dicing machine technology, specifically to a robotic arm clamping device for a dicing machine. Background Technology

[0002] In the current booming semiconductor industry, the scale of chip manufacturing is constantly expanding, placing extremely stringent demands on the production efficiency and precision of wafer dicing machines. Before a wafer moves from the wafer cassette station to the dicing machine's worktable for processing, the wafer workpieces in the wafer cassette need to be transported to a predetermined loading position so that the subsequent unloading robot can pick them up. Traditional grinding wheel dicing machines use mechanical devices to automatically transport wafer workpieces from the wafer cassette station to the loading position, which improves efficiency to some extent, but lacks flexibility and has a relatively complex structural design. They can only adapt to wafers of specific specifications. When dealing with wafers of different sizes and shapes and diverse dicing processes, frequent adjustments or replacements of the devices are required, which not only makes the process cumbersome but also easily leads to a loss of precision. Utility Model Content

[0003] To address the shortcomings of existing technologies, this utility model provides a robotic arm clamping device for dicing machines, which solves the problems of poor flexibility, complex structural design, limited applicability, cumbersome execution process, and inefficiency in existing grinding wheel dicing machines for feeding and unloading wafer workpieces.

[0004] To achieve the above objectives, this utility model is implemented through the following technical solution: a robotic gripper for a dicing machine, comprising a material picking component and a linear module for driving the material picking component to move and pick up materials. A feeding component is installed on one side of the material picking component. The linear module drives the feeding component to move to the loading station. The feeding component picks up the wafer workpiece and feeds it to the material picking station. After feeding is completed, the feeding component rotates and is stored above the material picking component. The material picking component moves to the material picking station under the drive of the linear module to pick up the wafer workpiece.

[0005] Preferably, the feeding assembly includes a rotary cylinder, a rotary arm fixedly connected to the piston end of the rotary cylinder, a mounting block fixedly disposed between the rotary arms, upper and lower cylinders fixedly disposed on the end face of the mounting block, and feeding grippers fixedly disposed on the piston ends of the upper and lower cylinders. A gripper block matching the feeding gripper extends from one side of the mounting block.

[0006] Preferably, one side of the material handling component is fixedly connected to the rotary cylinder via a mounting base, a photoelectric sensor is fixedly mounted on the rotary arm, and a photoelectric switch matching the photoelectric sensor is fixedly mounted on the mounting base.

[0007] Preferably, a buffer is arranged on the mounting base, and the buffer is located between the rotary cylinder and the material handling assembly.

[0008] Preferably, the material handling assembly includes a material handling cylinder, a connecting plate driven by the material handling cylinder, and a plurality of vacuum suction cups adjustablely arranged on the connecting plate. The connecting plate has mounting grooves that match the vacuum suction cups, and an air pipe connector is arranged on the upper part of the vacuum suction cup.

[0009] Preferably, the movable seat of the linear module is fixedly connected to a connecting seat, and the material picking cylinder is fixedly installed on the connecting seat through a connecting frame. The linear module is equipped with photoelectric components and a buffer block.

[0010] This utility model has the following beneficial effects:

[0011] The robotic arm clamping device of this dicing machine, through its feeding components, can adapt to wafer workpieces of different sizes, quickly and flexibly remove wafer workpieces from the bin and load them to the loading position; through its picking components, it can adapt to wafer workpieces of various sizes, achieving high-precision picking and placing, and effectively reducing human error. Attached Figure Description

[0012] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0013] Figure 2 This is a schematic diagram showing the disassembled structure of the main parts of this utility model;

[0014] Figure 3 This is a schematic diagram of the layout structure of the feeding component and the picking component of this utility model.

[0015] In the diagram: 1. Linear module; 2. Connector; 3. Connector frame; 4. Mounting base; 5. Feeding assembly; 51. Rotary cylinder; 52. Rotary arm; 53. Mounting block; 54. Upper and lower cylinders; 55. Feeding gripper; 56. Photoelectric sensor; 57. Photoelectric switch; 6. Picking assembly; 61. Picking cylinder; 62. Connecting plate; 63. Mounting slot; 64. Vacuum suction cup; 7. Buffer component. Detailed Implementation

[0016] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0017] Please see Figure 1This utility model provides a technical solution: a robotic gripper for a dicing machine, including a picking component 6 and a linear module 1 that drives the picking component 6 to move and pick up materials. A feeding component 5 is installed on one side of the picking component 6. The linear module 1 drives the feeding component 5 to move to the loading station. The feeding component 5 picks up the wafer workpiece and feeds it to the picking station. After feeding is completed, the feeding component 5 rotates and is stored above the picking component 6. The picking component 6 moves to the picking station under the drive of the linear module 1 to pick up the wafer workpiece.

[0018] like Figure 2 and 3 As shown, in this embodiment, the feeding assembly 5 includes a rotary cylinder 51, a rotary arm 52 fixedly connected to the piston end of the rotary cylinder 51, a mounting block 53 fixedly disposed between the rotary arms 52, an upper and lower cylinder 54 fixedly disposed on the end face of the mounting block 53, and a feeding gripper 55 fixedly disposed on the piston end of the upper and lower cylinder 54. A gripper block matching the feeding gripper 55 extends from one side of the mounting block 53.

[0019] In this design, after the upper and lower cylinders 54 drive the feeding gripper 55 to accurately grip and transfer the wafer workpiece to the unloading station, the rotary cylinder 51 plays a crucial role. The rotary cylinder 51 drives the rotary arm 52 to rotate upward in a clockwise direction, effectively preventing the feeding gripper from colliding with other modules during the loading and unloading process, thus eliminating potential safety hazards during equipment operation.

[0020] Meanwhile, in conventional wafer clamping processes, the loading jaws are typically driven by linear movement (in this case, the X-axis direction) to grip the wafers. This solution, however, significantly shortens the travel distance in the X-axis direction by altering the spatial position of the loading jaws. The entire rotary loading process, by reducing unnecessary movement paths, greatly improves workpiece transport efficiency, optimizes the overall production process, and ensures the smoothness and stability of the semiconductor wafer dicing machine's loading operation.

[0021] In this embodiment, one side of the material handling component 6 is fixedly connected to the rotary cylinder 51 via the mounting base 4. A photoelectric sensor 56 is fixedly mounted on the rotating arm 52, and a photoelectric switch 57 matching the photoelectric sensor 56 is fixedly mounted on the mounting base 4. Figure 2 and 3 As shown, in order to ensure that the rotating arm 52 and its loading grippers and other components operate stably within the specified stroke, a photoelectric switch 57 is set up to provide timely feedback on the position of the components through sensing signals, and to accurately limit the loading grippers, effectively avoiding malfunctions caused by overtravel.

[0022] In this embodiment, a buffer 7 is arranged on the mounting base 4, and the buffer 7 is located between the rotary cylinder 51 and the material handling assembly 6. (Refer to...) Figure 2 and 3As shown, the buffer 7 ensures that the loading pawl and other components on the rotating arm 52 do not easily collide with the material handling assembly 6 when they are operating before and after feeding.

[0023] In this embodiment, the material handling component 6 includes a material handling cylinder 61, a connecting plate 62 driven by the material handling cylinder 61, and a plurality of vacuum suction cups 64 adjustablely arranged on the connecting plate 62. The connecting plate 62 has mounting grooves 63 that match the vacuum suction cups 64, and an air pipe connector is connected to the upper part of each vacuum suction cup 64. Figure 2 and 3 As shown, the vacuum chuck 64 vacuum adsorption method can uniformly and efficiently adsorb wafer workpieces, ensuring the stability of the workpieces during the picking and unloading process, and avoiding damage caused by mechanical clamping.

[0024] Specifically, multiple air paths are set according to the number of vacuum chucks 64, and different vacuum chucks 64 are ventilated separately. By using separate air paths in conjunction with a vacuum generator, it is ensured that the negative pressure value of each vacuum chuck 64 can stably adsorb the wafer workpiece, which improves the efficiency of picking up and unloading to a certain extent.

[0025] In this technical solution, the position of the vacuum suction cup 64 can be freely adjusted, which is suitable for clamping steel rings of different sizes such as 6 inches, 8 inches, and 12 inches. This can improve the versatility of the equipment, enhance production flexibility, reduce human error, optimize the production process, and achieve cost reduction and efficiency improvement.

[0026] In this embodiment, the movable seat of the linear module 1 is fixedly connected to the connecting seat 2, the material picking cylinder 61 is fixedly installed on the connecting seat 2 through the connecting frame 3, and the linear module 1 is equipped with photoelectric components and buffer blocks.

[0027] In this design, the material handling component 6 moves linearly along the X-axis via the linear module 1. To ensure stable operation of the material handling component 6 within its specified stroke, photoelectric components are installed at both ends of the guide rail in the linear module 1. These components provide timely feedback on the position of the movable seat via sensing signals, precisely limiting its movement and effectively preventing malfunctions caused by overtravel. Considering the potential inertial impact during movement, buffer blocks are also provided at both ends of the guide rail in the linear module 1. When the movable seat reaches its limit position, the buffer blocks absorb and disperse the impact force, providing cushioning protection for the moving material handling component 6, reducing wear on mechanical parts, and preventing structural damage to the machine due to collisions, thereby ensuring the stability and service life of the equipment.

[0028] It should be noted that, in this document, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitation, the phrase "comprising an element defined as..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0029] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A robotic gripper for a dicing machine, comprising a material-grabbing component and a linear module for driving the material-grabbing component to move and pick up materials, characterized in that: A feeding component is installed on one side of the picking component. The linear module drives the feeding component to move to the loading station. The feeding component clamps the wafer workpiece and feeds it to the picking station. After feeding is completed, the feeding component rotates and is stored above the picking component. The picking component moves to the picking station under the drive of the linear module to pick up the wafer workpiece.

2. The robotic gripper for a dicing machine according to claim 1, characterized in that: The feeding assembly includes a rotary cylinder, a rotary arm fixedly connected to the piston end of the rotary cylinder, a mounting block fixedly disposed between the rotary arms, upper and lower cylinders fixedly disposed on the end face of the mounting block, and feeding grippers fixedly disposed on the piston ends of the upper and lower cylinders. A gripper block matching the feeding gripper extends from one side of the mounting block.

3. The robotic gripper for a dicing machine according to claim 2, characterized in that: One side of the material handling assembly is fixedly connected to the rotary cylinder via a mounting base. A photoelectric sensor is fixedly mounted on the rotary arm, and a photoelectric switch matching the photoelectric sensor is fixedly mounted on the mounting base.

4. The robotic gripper for a dicing machine according to claim 3, characterized in that: A buffer is arranged on the mounting base, and the buffer is located between the rotary cylinder and the material handling assembly.

5. The robotic gripper for a dicing machine according to claim 2 or 3, characterized in that: The material handling assembly includes a material handling cylinder, a connecting plate driven by the material handling cylinder, and multiple vacuum suction cups adjustablely arranged on the connecting plate. The connecting plate has mounting grooves that match the vacuum suction cups, and an air pipe connector is connected to the upper part of the vacuum suction cup.

6. The robotic gripper for a dicing machine according to claim 5, characterized in that: The linear module's movable seat is fixedly connected to a connecting seat, and the material-picking cylinder is fixedly mounted on the connecting seat via a connecting frame. The linear module is equipped with photoelectric components and a buffer block.

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