Non-standard ultrathin copper plating carrier
By designing a non-standard ultra-thin copper substrate, using copper-plated silver H-shaped electrodes and polyetheretherketone (PEEK) substrates, the problems of current density fluctuation and plating solution turbulence in traditional substrates are solved, achieving uniform plating and rapid replacement.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SUZHOU IE TECH
- Filing Date
- 2025-06-11
- Publication Date
- 2026-05-15
AI Technical Summary
Traditional carriers use segmented electrodes, which leads to large fluctuations in current density, resulting in excessively thick edge plating or central plating defects. Furthermore, the reliance on rigid fixtures for positioning causes turbulent flow of the plating solution and long-term maintenance issues.
It adopts a non-standard ultra-thin copper-plated carrier, uses an integrated copper-plated silver-plated H-shaped electrode body and a polyetheretherketone carrier plate, combined with a polyoxymethylene side fixing block, to provide uniform contact pressure and insulation, form a ring conductive circuit, reduce current density differences, and facilitate replacement through a quick-locking structure.
It improves the uniformity of the coating, reduces the current density difference between the edge and the center, avoids turbulent flow of the plating solution, simplifies the carrier change process, and improves production efficiency.
Smart Images
Figure CN224243278U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of vehicle technology, specifically to a non-standard ultra-thin copper-plated vehicle. Background Technology
[0002] The ultra-thin copper plating process is a technology that deposits a copper layer with a thickness of 1-10μm on the surface of a workpiece through electroplating. Its core value lies in providing a high-precision conductive layer for high-end electronic components. The carrier is a support device used for substrates during the plating or coating process.
[0003] Traditional carriers often use segmented electrodes, resulting in a large contact area between the electrode and the workpiece and a dispersed conductive path. This leads to significant fluctuations in current density, causing excessively thick edge plating or missed plating in the center. Furthermore, current carriers often rely on rigid clamps for positioning, resulting in a large gap between the workpiece and the carrier. This gap can easily create turbulence in the plating solution, causing the edge plating thickness to be thinner than the center area. Moreover, replacing the carrier requires disassembling multiple sets of bolts, leading to long maintenance times for a single set. Therefore, a non-standard ultra-thin copper plating carrier is proposed to address the aforementioned problems. Utility Model Content
[0004] To address the aforementioned technical problems, a non-standard ultra-thin copper plating carrier is provided. This technical solution solves the problems mentioned in the background art, where traditional carriers often use segmented electrodes, resulting in large contact areas between the electrodes and the workpiece and dispersed conductive paths, leading to large fluctuations in current density and phenomena such as excessively thick edge plating or missed plating in the center. In addition, current carriers mostly rely on rigid clamps for positioning, resulting in large gaps between the workpiece and the carrier, which easily cause turbulence in the plating solution at the gaps, resulting in thinner edge plating than the center area. Furthermore, carrier replacement requires disassembling multiple sets of bolts, leading to long maintenance times for a single set.
[0005] To achieve the above objectives, the technical solution adopted by this utility model is as follows:
[0006] A non-standard ultra-thin copper plating carrier includes a carrier plate. Multiple side fixing blocks are fixedly connected to the front end, rear end, left end and right end of the carrier plate. The side fixing blocks are L-shaped. A first slot is opened at the bottom inner side of the side fixing block. A second slot is opened at the top end of the carrier plate. Electrode bodies are arranged inside the first slot and the second slot.
[0007] The electrode body includes an integrally formed outer electrode and an intermediate electrode. The outer electrode is snapped into the inside of the first slot, and the intermediate electrode is snapped into the inside of the second slot. The upper end of the outer electrode and the corresponding positions of the multiple side fixing blocks are all provided with through-holes.
[0008] Preferably, the upper end of the electrode body is higher than the upper end of the carrier plate.
[0009] Preferably, the upper end of the side fixing block is higher than the upper end of the electrode body.
[0010] Preferably, the electrode body is in the shape of a Chinese character 'Ri'.
[0011] Preferably, the carrier plate is made of polyether ether ketone.
[0012] Preferably, the electrode body is a copper-plated silver electrode.
[0013] Preferably, the side fixing block is made of polyoxymethylene.
[0014] The beneficial effects of the present utility model compared with the prior art are as follows:
[0015] This solution proposes a non-standard ultra-thin copper plating carrier. The electrode body is made of copper-plated silver material and is in the shape of a Chinese character 'Ri' formed integrally, which can reduce the current density difference between the edge and the center and improve the uniformity of the plating layer. The electrode body is quickly engaged with the side fixing block through the docking groove, facilitating replacement. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] Figure 1 is a schematic structural diagram of the present utility model;
[0017] Figure 2 is a schematic structural diagram of the carrier plate in the present utility model;
[0018] Figure 3 is a schematic structural diagram of the electrode body in the present utility model.
[0019] The reference numerals in the drawings are:
[0020] 1. Carrier plate; 2. Side fixing block; 3. First card slot; 4. Second card slot; 5. Electrode body; 501. Peripheral electrode; 502. Intermediate electrode; 503. Docking groove. DETAILED DESCRIPTION OF THE EMBODIMENTS
[0021] The following description is used to disclose the present utility model so that those skilled in the art can implement the present utility model. The preferred embodiments described below are only examples, and those skilled in the art can think of other obvious variations.
[0022] Referring to Figures 1-3 as shown, a non-standard ultra-thin copper plating carrier includes a carrier plate 1. A plurality of side fixing blocks 2 are fixedly connected to the front end, rear end, left end and right end of the carrier plate 1. The side fixing blocks 2 are in an L shape. A first card slot 3 is opened at the inner bottom end of the side fixing block 2. A second card slot 4 is opened at the upper end of the carrier plate 1. An electrode body 5 is arranged inside the first card slot 3 and the second card slot 4;
[0023] Among them, the electrode body 5 includes an integrally formed peripheral electrode 501 and an intermediate electrode 502. The peripheral electrode 501 is snap-fitted inside the first card slot 3, and the intermediate electrode 502 is snap-fitted inside the second card slot 4. Docking grooves 503 are respectively and penetratingly formed at corresponding positions between the upper end of the peripheral electrode 501 and the plurality of side fixing blocks 2.
[0024] Further, the size of the carrier can be customized according to the size of the workpiece to be copper-plated as required.
[0025] Further, the upper end of the electrode body 5 is higher than the upper end of the carrier plate 1, so that there is a certain space relative to the carrier plate 1 after the workpiece is placed, avoiding the retention of the electrolyte.
[0026] Further, the upper end of the side fixing block 2 is higher than the upper end of the electrode body 5, providing space for the subsequent placement of the workpiece.
[0027] Further, the carrier plate 1 is made of polyether ether ketone. Polyether ether ketone has excellent acid and alkali resistance and extremely high volume resistivity. The carrier plate 1 made of it can provide high-strength insulation, effectively blocking the interference of stray current on the coating, ensuring that the current is only transmitted through the electrode body 5, and improving the uniformity of the coating thickness.
[0028] Further, the electrode body 5 is in a shape of a Chinese character 'Ri'.
[0029] Further, the electrode body 5 is a copper-plated silver electrode. The copper base material has a high conductivity, and the silver-plated layer on the surface can reduce the contact resistance and enhance the antioxidant ability. The 'Ri'-shaped annular conductive circuit can reduce the current density difference between the edge and the center, improving the uniformity of the coating.
[0030] Further, when the carrier is in use, the workpiece is placed on the upper end of the electrode body 5. The four side edges of the workpiece are respectively abutted against the side fixing blocks 2 on the periphery of the carrier plate 1. The side fixing blocks 2 are made of polyoxymethylene. Polyoxymethylene has an elastic modulus and excellent insulation. The side fixing blocks 2 made of it can provide elastic pressure, adapt to the dimensional tolerance of the workpiece, and at the same time avoid electrochemical reactions with the acidic plating solution, improving the corrosion resistance of the carrier.
[0031] Working principle: When in use, the workpiece is placed on the electrode body 5. The L-shaped side fixing blocks 2 can provide uniform contact pressure to fix the workpiece. The 'Ri'-shaped electrode body 5 forms an annular conductive circuit, and the current flows synchronously from the peripheral electrode 501 and the intermediate electrode 502 to the workpiece, which can reduce the current density difference between the edge and the center, improving the uniformity of the coating. The elastic deformation of the side fixing blocks 2 can absorb the微小形变 generated by the workpiece due to temperature changes, avoiding the coating cracking caused by stress concentration. The electrode body 5 is quickly snap-fitted with the side fixing blocks 2 through the docking grooves 503, facilitating replacement.
[0032] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claimed utility model. The scope of protection of this utility model is defined by the appended claims and their equivalents.
Claims
1. A non-standard ultra-thin copper-plated carrier, characterized in that, It includes a carrier board (1), and a plurality of side fixing blocks (2) are fixedly connected to the front end, rear end, left end and right end of the carrier board (1). The side fixing blocks (2) are L-shaped, and a first card slot (3) is opened at the inner bottom end of the side fixing blocks (2). A second card slot (4) is opened at the upper end of the carrier board (1). An electrode body (5) is arranged inside the first card slot (3) and the second card slot (4). Among them, the electrode body (5) includes an integrally formed peripheral electrode (501) and an intermediate electrode (502). The peripheral electrode (501) is clamped inside the first card slot (3), and the intermediate electrode (502) is clamped inside the second card slot (4). Through docking slots (503) are opened at corresponding positions of the upper end of the peripheral electrode (501) and the plurality of side fixing blocks (2).
2. The non-standard ultra-thin copper-plated carrier according to claim 1, characterized in that: The upper end of the electrode body (5) is higher than the upper end of the carrier board (1).
3. A non-standard ultra-thin copper-plated carrier according to claim 1, characterized in that: The upper end of the side fixing block (2) is higher than the upper end of the electrode body (5).
4. A non-standard ultra-thin copper-plated carrier according to claim 1, characterized in that: The electrode body (5) is in the shape of a Chinese character 'ri'.
5. A non-standard ultra-thin copper-plated carrier according to claim 1, characterized in that: The carrier board (1) is made of polyether ether ketone.
6. A non-standard ultra-thin copper-plated carrier according to claim 1, characterized in that: The electrode body (5) is a copper-plated silver electrode.
7. A non-standard ultra-thin copper-plated carrier according to claim 1, characterized in that: The side fixing block (2) is made of polyoxymethylene.